12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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1 12500 TI Boulevard, MS 8640, Dallas, Texas PCN# Qualification of RFAB as an additional wafer fab site option for select devices in the LBC8 process technology Change Notification / Sample Request Date: September 29, 2017 To: PREMIER FARNELL PCN Dear Customer: This is an announcement of a change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. We request you acknowledge receipt of this notification within 30 days of the date of this notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change. If you require samples or additional data to support your evaluation, please request within 30 days. The proposed first ship date is indicated on page 3 of this notification, unless customer agreement has been reached on an earlier implementation of the change. This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager (PCN_ww_admin_team@list.ti.com). Sincerely, PCN Team SC Business Services
2 Attachment: 1 Products Affected: The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available. DEVICE LM536253QRNLTQ1 LM53625LQRNLTQ1 CUSTOMER PART NUMBER null null Technical details of this Product Change follow on the next page(s).
3 PCN Number: PCN Date: Sep 29, 2017 Qualification of RFAB as an additional wafer fab site option for select devices in LBC8 Title: process technology Customer Contact: PCN Manager Dept: Quality Services Proposed 1 st Estimated Sample Date provided at Ship Date: Mar 29, 2018 Availability: sample request. Change Type: Assembly Site Assembly Process Assembly Materials Design Electrical Specification Mechanical Specification Test Site Packing/Shipping/Labeling Test Process Wafer Bump Site Wafer Bump Material Wafer Bump Process Wafer Fab Site Wafer Fab Materials Wafer Fab Process Part number change PCN Details Description of Change: This change notification is to announce the qualification of RFAB as an additional wafer fab site option for the LBC8 devices listed in the product affected section of this document. Current Sites Additional Sites Current Fab Bump Wafer Additional Fab Bump Wafer Fab Site Process Site Diameter Fab Site Process Site Diameter DP1DM5 LBC8 DBUMP 200 mm RFAB LBC8 Clark-BP 300 mm Qual details are provided in the Qual Data Section. Reason for Change: Continuity of Supply Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative): None Changes to product identification resulting from this PCN: Current: Chip Site Chip Site Origin Code (20L) Chip Site Country Code (21L) Chip Site City DP1DM5 DM5 USA Dallas New: Chip Site Chip Site Origin Code (20L) Chip Site Country Code (21L) Chip Site City RFAB RFB USA Richardson Sample product shipping label (not actual product label) Product Affected: LM536253QRNLRQ1 LM53625LQRNLRQ1 LM536353QRNLRQ1 LM53635LQRNLRQ1 LM536253QRNLTQ1 LM53625LQRNLTQ1 LM536353QRNLTQ1 LM53635LQRNLTQ1 LM536255QRNLRQ1 LM53625MQRNLRQ1 LM536355QRNLRQ1 LM53635MQRNLRQ1
4 LM536255QRNLTQ1 LM53625MQRNLTQ1 LM536355QRNLTQ1 LM53635MQRNLTQ1 LM53625AQRNLRQ1 LM53625NQRNLRQ1 LM53635AQRNLRQ1 LM53635NQRNLRQ1 LM53625AQRNLTQ1 LM53625NQRNLTQ1 LM53635AQRNLTQ1 LM53635NQRNLTQ1
5 For questions regarding this notice, s can be sent to the regional contacts shown below, or you can contact your local Field Sales Representative. Location USA Europe Asia Pacific Japan
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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12500 TI Boulevard, MS 8640, Dallas, Texas 75243
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Ship Date: Jan 11, 2019 Availability:
PCN Number: 20181004002.1 PCN Date: Oct 11, 2018 Title: Transfer of select LFAST devices from GFAB to SFAB Wafer Fab site Customer Contact: PCN Manager Dept: Quality Services Proposed 1 st Estimated Sample
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DATA SHEET CURRENT SENSOR - LOW TCR PE Series - Wide Terminal 5%, 1%, 0.5%
Product specification December 03, 2018 V.0 Supersedes Date of Mar. 06, 2003 DATA SHEET CURRENT SENSOR - LOW TCR PE Series - Wide Terminal 5%, 1%, 0.5% RoHS compliant & Halogen free Product specification
Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November
Pierre Brondeau Vice President, Business Group Executive Electronic Materials Regional Director - Europe Lehman Brothers Conference Call November 2006 Forward Looking Statement The presentation today may