Product Change Notification - GBNG-14WQIZ459
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1 Product Change Notification - GBNG-14WQIZ459 Date: 07 Sep 2018 Product Category: 8-bit Microcontrollers; Capacitive Touch Sensors Affected CPNs: Notification subject: CCB Initial Notice: Qualification of MMT as a new assembly site for selected Atmel products of 19.6K, 35.4K and 35.5K wafer technologies available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire. Notification text: PCN Status: Initial notification. PCN Type: Manufacturing Change Microchip Parts Affected: Please open one of the icons found in the Affected CPNs section above. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and.xls) Description of Change: Qualification of MMT as a new assembly site for selected Atmel products of 19.6K, 35.4K and 35.5K wafer technologies available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire. Pre Change: Assembled at ANAC assembly site with punched as a singulation method, using palladium coated copper (PdCu) bond wire. Post Change: Assembled at MMT assembly site with sawn as a singulation method, using palladium coated copper wire with gold flash (CuPdAu) bond wire Pre and Post Change Summary: Pre Change Post Change Assembly Site Amkor Assembly & Test (Shanghai) Co., LTD (ANAC) Microchip Technology Thailand (Branch)(MMT) Wire material PdCu CuPdAu Die attach material Molding compound material G700 G700 Lead frame material C194 C194 Singulation method Punched Sawn Impacts to Data Sheet: Yes. POD change. Change Impact: None Reason for Change: To improve on-time delivery performance by qualifying MMT as a new assembly site. Change Implementation Status: In Progress
2 Estimated Qualification Completion Date: August 2018 Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts. Time Table Summary: Initial PCN Issue Date Qual Report Availability Final PCN Issue Date August 2018 Workweek X X X Method to Identify Change: Traceability code Qualification Plan: Please open the attachments included with this PCN labeled as PCN_#_Qual Plan. Revision History: August 20, 2018: Issued initial notification. September 07, 2018: Re-issued initial notification to reflect POD change in Impacts to Data Sheet section. CN Attachment(s): PCN_GBNG-14WQIZ459_Qual Pan.pdf Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at sign into mymicrochip to open the mymicrochip home page, then select a profile option from the left navigation bar. To opt out of future offer or information s (other than product change notification s), click here to go to microchipdirect and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services."
3 QUALIFICATION PLAN SUMMARY PCN #: GBNG-14WQIZ459 Date: April 19, 2018 Qualification of MMT as a new assembly site in selected Atmel products of 19.6K, 35.4K and 35.5K wafer technologies available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire.
4 Purpose: Qualification of MMT as a new assembly site in selected Atmel products of 19.6K, 35.4K and 35.5K wafer technologies available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire. CCB No.: 3370 Assembly site MMT Misc. BD Number BDM rev. A MP Code (MPC) 35473QRXBQUL Part Number (CPN) ATMEGA328P-MNR Paddle size 150x150 mils Material C194 Surface Bare Cu on paddle Lead-Frame Treatment BOT Process Etched Lead-lock Yes Part Number Lead Plating Matte Tin Bond Wire Material Au Die Attach Part Number 3280 MC Part Number G700LTD PKG Type VQFN PKG Pin/Ball Count 32 PKG width/size 5x5x0.9mm Die Thickness 11 mils Die Die Size x mils Fab Process (site) 35.4K/MCSO
5 Test Name Conditions Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions Standard Pb-free Solderability Backward Solderability Wire Bond Pull - WBP J-STD-002; Perform 8 hour steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing. Standard Pb-free: Matte tin/ NiPdAu finish, SAC solder, wetting temp 245 C for both SMD & through hole packages. J-STD-002; Perform 8 hours steam aging for Matte tin finish and 1 hour steam aging for NiPdAu finish prior to testing > 95% lead coverage > 95% lead coverage Backward: Matte tin/ NiPdAu finish, SnPb solder, wetting temp 215 C for SMD. Mil. Std fails after TC 5 5 MPHL MPHL Standard Pb-free solderability is the requirement. SnPb solderability (backward solderability- SMD reflow soldering) is required for any plating related changes and highly recommended for other package BOM changes. 5 MMT/MPHL 30 bonds from a minimum of 5 devices. Wire Bond Shear - WBS CDF-AEC-Q MMT/MPHL 30 bonds from a minimum of 5 devices. Wire Sweep MMT Required for any reduction in wire bond thickness. Physical Measure per JESD22 B100 and MMT Dimensions B108 External Visual Mil. Std /2010 All devices prior to submission for qualification testing 0 3 ALL 0 5 MMT/MPHL
6 Test Name Conditions Sample Size Min. Qty of Spares per Lot (should be properly marked) Qty of Lots Total Units Fail Accept Qty Est. Dur. Days Test Site Special Instructions HTSL (High Temp Storage Life) +175 C for 504 hours. Electrical test pre and post stress at +25 C and hot temp MPHL Preconditioning - Required for surface mount devices +150 C Bake for 24 hours, moisture loading requirements per MSL level + 3X reflow at peak reflow temperature per Jedec-STD-020D for package type; Electrical test pre and post stress at +25 C. 260 C MPHL Spares should be properly identified. 77 parts from each lot to be used for HAST, Autoclave, Temp Cycle test. HAST +130 C/85% RH for 96 hours. Electrical test pre and post stress at +25 C and hot temp MPHL Spares should be properly identified. Use the parts which have gone through Pre-conditioning. Unbiased HAST +130 C/85% RH for 96 hrs. Electrical test pre and post stress at +25 C MPHL Spares should be properly identified. Use the parts which have gone through Pre-conditioning. Temp Cycle -65 C to +150 C for 500 cycles. Electrical test pre and post stress at hot temp; 3 gram force WBP, on 5 devices from 1 lot, test following Temp Cycle stress MPHL Spares should be properly identified. Use the parts which have gone through Pre-conditioning.
7 GBNG-14WQIZ459 - CCB Init 35.4K and 35.5K wafer technologies available in 32L VQFN package u Affected Catalog Part Numbers(CPN) AT42QT1110-MUR AT42QT11C12-MUR AT42QT1244-MU AT42QT1244-MUR AT42QT1245-MU AT42QT1245-MUR AT42QT2100-MUR AT42QT4160-MUR ATMEGA168-20MQ ATMEGA168-20MQR ATMEGA168-20MU ATMEGA168-20MUR ATMEGA168A-MU ATMEGA168A-MUR ATMEGA168P-20MQ ATMEGA168P-20MQR ATMEGA168P-20MU ATMEGA168P-20MUR ATMEGA168PA-MN ATMEGA168PA-MNR ATMEGA168PA-MU ATMEGA168PA-MUA1 ATMEGA168PA-MUR ATMEGA168PA-MUR431 ATMEGA168PA-MURA1 ATMEGA168PV-10MU ATMEGA168PV-10MUR ATMEGA168PV-10MUR455 ATMEGA168V-10MQ ATMEGA168V-10MQR ATMEGA168V-10MQR610 ATMEGA168V-10MU ATMEGA168V-10MUR ATMEGA168V-10MUR598 ATMEGA328-MU ATMEGA328-MUR ATMEGA328P-MN ATMEGA328P-MNR ATMEGA328P-MU ATMEGA328P-MUR ATMEGA48-20MU ATMEGA48-20MUR
8 ATMEGA48A-MU ATMEGA48A-MUR ATMEGA48P-20MU ATMEGA48P-20MUR ATMEGA48PA-MN ATMEGA48PA-MNR ATMEGA48PA-MU ATMEGA48PA-MUR ATMEGA48PA-MURA5 ATMEGA48PV-10MU ATMEGA48PV-10MUR ATMEGA48V-10MU ATMEGA48V-10MUR ATMEGA48V-10MUR173 ATMEGA48V-10MUR348 ATMEGA48V-10MURA3 ATMEGA8-16MU ATMEGA8-16MUR ATMEGA88-20MU ATMEGA88-20MUR ATMEGA88-20MURA4 ATMEGA88A-MU ATMEGA88A-MUR ATMEGA88P-20MU ATMEGA88P-20MUR ATMEGA88PA-MN ATMEGA88PA-MNR ATMEGA88PA-MU ATMEGA88PA-MUR ATMEGA88PA-MURA06 ATMEGA88PA-MURA6 ATMEGA88PV-10MU ATMEGA88PV-10MUR ATMEGA88V-10MU ATMEGA88V-10MUR ATMEGA88V-10MUR360 ATMEGA88V-10MUR378 ATMEGA88V-10MUR379 ATMEGA88V-10MURA1 ATMEGA8A-MN ATMEGA8A-MNR ATMEGA8A-MU ATMEGA8A-MUR ATMEGA8A-MURA7 ATMEGA8L-8MU ATMEGA8L-8MUA4 ATMEGA8L-8MUR
9 ATMEGA8L-8MURA3 ATMEGA8L-8MURA5 ATTINY26-16MQR ATTINY26-16MU ATTINY26-16MUR ATTINY261A-MF ATTINY261A-MFR ATTINY261A-MFRA0 ATTINY261A-MN ATTINY261A-MNR ATTINY261A-MU ATTINY261A-MUR ATTINY26L-8MU ATTINY26L-8MUR ATTINY28L-4MU ATTINY28L-4MUR ATTINY28V-1MU ATTINY28V-1MUR ATTINY461-20MU ATTINY461-20MUR ATTINY461-20MUR437 ATTINY461-20MUR553 ATTINY461A-MU ATTINY461A-MUR ATTINY461V-10MU ATTINY461V-10MUR ATTINY48-MU ATTINY48-MUR ATTINY48-MUR522 ATTINY48-MUR547 ATTINY861-20MU ATTINY861-20MUR ATTINY861-20MUR430 ATTINY861A-MU ATTINY861A-MUR ATTINY861V-10MU ATTINY861V-10MUR ATTINY88-MU ATTINY88-MUR ATTINY88-MURA1 QT60160-ISG QT60240-ISG
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