Cypress Semiconductor Package Qualification Report
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1 ackage Qualification Report QT# VERSION 1.0 December LD QFN (Quad Flat No-Lead) (unch Version, 10x10mm) NidAu, MSL3, 260 C Reflow Amkor-Korea (L) CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Miguel Maldonaldo Sabbas Daniel rincipal Reliability Engineer Quality Engineering Director (408) (408)
2 QT# , V LD QFN (10x10 mm), NidAu, MSL3, 260C Reflow age 2 of 6 ACKAGE QUALIFICATION HISTORY QUAL REORT DESCRITION OF QUALIFICATION UROSE 72-LD QFN (10x10mm), (unch Version), NidAu, MSL3, 260C Reflow assembled at Amkor-Korea (L) DATE COM. Dec 05
3 QT# , V LD QFN (10x10 mm), NidAu, MSL3, 260C Reflow age 3 of 6 ackage Designation: ackage Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Oxygen Rating Index: Lead Frame Material: MAJOR ACKAGE INFORMATION USED IN THIS QUALIFICATION Lead Finish, Composition / Thickness: Die Backside reparation Method/Metallization: Die Separation Method: Die Attach Supplier: LY72 72-Lead Quad Flat No Lead (QFN) 10 x 10mm, unch Version Sumitomo G700FG V-O per UL94 NA Copper NidAu Backgrind Saw Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation Wire Bond Method: Wire Material/Size: Thermal Resistance Theta JA C/W: ackage Cross Section Yes/No: Thermosonic Au. 1.0mil 21.8 C/W N/A Assembly rocess Flow: Name/Location of Assembly (prime) facility: Amkor-Korea (L) ELECTRICAL TEST / FINISH DESCRITION Test Location: CML-R Fault Coverage: 100%
4 QT# , V LD QFN (10x10 mm), NidAu, MSL3, 260C Reflow age 4 of 6 RELIABILITY TESTS ERFORMED ER SECIFICATION REQUIREMENT Stress/Test Temperature Cycle ressure Cooker Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C recondition: JESD22 Moisture Sensitivity MSL3 121 C, 100%RH 192 Hrs, 30 C/60%RH+3IR-Reflow, 260 C+0, -5 C recondition: JESD22 Moisture Sensitivity MSL3 130 C, 3.63V, 85% RH 192 Hrs, 30 C/60%RH+3IR-Reflow, 260 C+0, -5 C recondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30 C/60%RH+3IR-Reflow, 260 C+0, -5 C Result /F Acoustics Microscopy Cypress Spec Ball Shear Cypress Spec Bond ull Cypress Spec Die Shear Cypress Spec Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) 2,200V JESD22, Method A114-B 2,200V MIL-STD-883, Method V Cypress Spec External Visual Cypress Spec / High Temperature Storage 150 C, no bias Internal Visual Cypress Spec hysical Dimension Cypress Spec Solderability Cypress Spec Thermal Shock 125C, -55C Cypress Spec Wetting Balance Cypress Spec X-ray Cypress Spec
5 QT# , V LD QFN (10x10 mm), NidAu, MSL3, 260C Reflow age 5 of 6 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY28447LFXC (7C828447A) KOREA-L COM 15 0 CY28447LFXC (7C828447A) KOREA-L COM 15 0 CY28447LFXC (7C828447A) KOREA-L COM 15 0 STRESS: BALL SHEAR CY28447LFXC (7C828447A) KOREA-L COM 10 0 STRESS: BOND ULL CY28447LFXC (7C828447A) KOREA-L COM 10 0 STRESS: DIE SHEAR CY28447LFXC (7C828447A) KOREA-L COM 15 0 STRESS: EXTERNAL VISUAL CY28447LFXC (7C828447A) KOREA-L COM 15 0 STRESS: INTERNAL VISUAL CY28447LFXC (7C828447A) KOREA-L COM 15 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY28447LFXC (7C828447A) KOREA-L COM 9 0 STRESS: ESD-HUMAN BODY CIRCUIT ER JESD22, METHOD A114-B, 2,200V CY28447LFXC (7C828447A) KOREA-L COM 9 0 STRESS: ESD-HUMAN BODY CIRCUIT ER MIL STD 883, METHOD 3015, 2,200V CY28447LFXC (7C828447A) KOREA-L COM 3 0 STRESS: HIGH TEMERATURE STORAGE, 150C, no bias CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, RE COND 192 HR 30C/60%RH, MSL3 CY28447LFXC (7C828447A) KOREA-L STRESS: RESSURE COOKER TEST, (121C, 100%RH), RE COND 192 HR 30C/60%RH, MSL3 CY28447LFXC (7C828447A) KOREA-L
6 QT# , V LD QFN (10x10 mm), NidAu, MSL3, 260C Reflow age 6 of 6 Reliability Test Data QT #: Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HYSICAL DIMENSION CY28447LFXC (7C828447A) KOREA-L COM 5 0 STRESS: SOLDERABILITY CY28447LFXC (7C828447A) KOREA-L COM 5 0 STRESS: TC COND. C 65C TO 150C, RE COND 192 HR 30C/60%RH, MSL3 CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L STRESS: WETTING BALANCE CY28447LFXC (7C828447A) KOREA-L COM 5 0 CY28447LFXC (7C828447A) KOREA-L COM 5 0 CY28447LFXC (7C828447A) KOREA-L COM 5 0 STRESS: THERMAL SHOCK COND. B 55C TO 125C CY28447LFXC (7C828447A) KOREA-L CY28447LFXC (7C828447A) KOREA-L STRESS: X-RAY CY28447LFXC (7C828447A) KOREA-L COM 15 0
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COPYRIGHT 2013 LED ENGIN. ALL RIGHTS RESERVED. LZ1-00R500 (1.0 08/23/13)
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COPYRIGHT 2017 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00R408 (1.3-05/10/17)
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