Education in Microelectronics Technology

Transcription

1 Education in Microelectronics Ivan Szendiuch Brno University of, Faculty of Electrical Engineering and Communication, Department of Microelectronics Údolní 53, Brno , Czech Republic, Abstract This paper deals with presentation of some new aspects in study program of Microelectronics on Faculty of Electrical Engineering and Communication in Brno University of. Microelectronics technology education makes a part of new study program that was there introduced in last years. This study program consists from three levels, Bachelor, Master and Doctorate degree. Microelectronics technology that makes the fix part of this program is more and more popular among students too. Some fundamental remarks concerning microelectronics technology education process including steady development of curriculum are shown in this paper. The paper results a sum of both, theoretical and practical experience of authors in the area of microelectronic technology learning which were obtained during last twenty years in the education sector as well in the research and management activities kept with some companies. In this paper is presented complete Microelectronics technology education program at Brno University of. There is significant emphasis on area of actual development in interconnection and packaging area as well in the whole assembly sector. Very important part makes practical education in the microelectronics lab, which was positive valuated also by awarding of author by IMAPS insan Jose in the end of the past year. The quality of teaching at Brno University of is guaranteed by accreditation procedures, one at the national level by the Czech Ministry of Education, another by the European Association for Education FEANI. Introduction Electronics technology makes very important part of the electrical engineering science. This fact is closed to the increasing importance of the technological integration, where its impact is always stronger not only on production and on equipments, but on design, processes as well on their use, and handling including liquidation too. That means fundamentals of electrical engineering are important for all electric engineering education branches, and also for some other too. Development of semiconductor chips has made enormous strong progress in the end of last century. The same situation didn t set by assembly technology processes in. That means the assembly technology is necessary to push more intensive to achieve the same technical level as by semiconductor chips, both from point of view of complex electronic system. There are reasons to distinguish electronics technology focused on chip and on system. This first concerning all what is related to chip design and chip production, and the second is in brief branch of assembly technology. Electronics assembly technology is one of the emerging domains in manufacturing engineering. There has been an emerging global focus on this domain in both academia and industry due to its enormous application potential. There is a need to explore innovative courses including laboratory modules. Of course in the microelectronics technology education there are comprised many formerly independent areas, as material engineering, system engineering, computer practical, thermal management, process management, quality management etc. This paper shows system of study at Faculty of Electrical Engineering and Communication (FEEC) in Brno University of, where bachelor, master and doctorate study is presented with focus on Electronics Assembly education.

2 Basic arrangement of study system There are three levels of study program at the FEEC in Brno University of, which are bachelor, master and doctorate study. Bachelor s study program has nominal length of study 3 years. It is organized for education of operational specialist in electronics/electric branch. There are five branch destination dedicated to electric, electronic, communication and control area, which are: - Electronics and Communication, - Automation and Measurement, - Teleinformatics, - Power Electrics, - Microelectronics and. Just last one known as Microelectronics and is somewhat more presented in this paper. This study program is aimed to modern microelectronics technology study, based on application of technology integration impact and development (Fig. 1). RD Selling Use Customer Service Liquidation Development of Process Quality Environment Cost Development of Product Integration Development of Equipment FIGURE 1: TERM TECHNOLOGICAL INTEGRATION Attention is aimed to design, technology and application of electronics products, including microelectronics packaging and interconnection area. Electric materials and processes including their reliability and quality form a part of this program too. Products of this study specialization are bachelors with knowledge in design and manufacturing in the branch of microelectronics technology, especially in integrated circuits, electronic equipments and instruments including complete systems and production lines. Master study program follows up immediately after bachelor study as shown in the Figure 1. This study program has two years program concentrated to microelectronics engineer education. More complex offer of subjects in opposite to bachelor study program gives enough possibilities to students for their specialization. Theoretical and practical knowledge from design and technology microelectronics including packaging makes main part of this study program. The subjects offer gives a wide opportunity to all students to make their own choice to reach final professional profile. Subjects are generally divided in two parts: - Special (oriented to student professional profile), - General (oriented to general skills). The group of special subjects includes three stages - basic (fundamental), main (principal) and super-structural. There is other segmentation of subjects that are put in order as: - Compulsory, - To select. The group of subjects to select is involved in three parts, which are: - Special subjects from own branch, - Special subjects from other branch, - Universal subjects.

3 General point of view on complete system with introduction of main subjects for education in Microelectronics is designed in Figure 2. Joining to research and industry in conjunction with thesis presentation is very important step that determining efficiency and quality of educational process. From Research Center : From Industry - engineers, experts - technical requests - research results - marketing results conferences, seminars, workshops Final project defence and examination Eco-design Environmental Management SPC Quality and Reliability Optoelectronics Nanoelectronics Material engineering -conductors -dielectrics and insulators -semiconductors -polymers etc. Microsystems PackagingWLP Interconnection and Packaging MCM,MSM vs. SOC, SOP Microelectronic Assembly Technologies Thick and Thin Films M onolithic Integrated Circuits Production ASIC and Custom circuits Chemistry - procesess of synthesis/ analysis - chemical properties, compositions and reactions System Engineering Production Process SM T, LTCC etc. Thermal Management Physics - electricity - optics - solid state - heat - mechanics Design of Electronic Instruments and Systems Circuits Theory -analog -digital -memories -microprocessors RF/M icrovawe and Wireless M athematics.- numerical analysis - operational matematics - statistics. CAD, CAM Computer Graphics and Modeling Operating Systems Software Engineering Essential on Computer HW/SW - programming and usage of computers - computer organization and architecture FIGURE 2: GENERAL SCHEMA OF KNOWLEDGE IN MICROELECTRONICS AREA WITH IMPACT ON TECHNOLOGY Basic Aspects in Microelectronics Assembly Education Microelectronics technology becomes highly interdisciplinary area. There are many formerly independent areas, as system engineering, computer practical, thermal management, quality management etc. It is very important the fact, that the development of each new product needs an integral approach of issues, where are three basic factors influencing valuation - technical, economical and qualitative. All are joined and closed together in the different way through lot of concrete factors that have to be validated carefully. Some new activities are implemented to achieve optimal solution, as for example DFM (Design for Manufacture). The core of each electronic system is made by integrated circuits (IC) crated from one or more semiconductor chips. For the longest time, the focus was on the chip making it smaller, faster, more powerful and more efficient (improving performance and complexity). There are many IC performances and designs as well as many types of packages. Packaging was a long time simple and manufacturers easily designed the integrated circuits, packaged them in different sizes and sold them. Because semiconductor chips making all the time a big progress, their packaging, connection and handling it must follow the same. Today chips are produced in various performances, as for example bare, flip and last time packaged already on wafer (wafer level packaging). That is reason for rise of packaging and interconnection area, which is actually in strong development period. Circuit and system designers must have a thorough knowledge of IC packaging and all of options before deciding on a package type for their products, to reach competitive quality level and reducing cost.

4 Electronics Components Semiconductor Structures IC s Design Microsystems Analog and Digital Circuits Packaging and Interconnect PCB and SMT FIGURE 3: THE MAIN PARTS OF MICROELECTRONICS ASSEMBLY TECHNOLOGY SECTOR More complex point of view on Microelectronics educational sector, which is ensured from Department of Microelectronics, is shown in Figure 3. Microelectronics and Packaging area is designed as Microsystems technology. Developed Program for Microelectronics Assembly The basic framework of the subject was established with the support of survey results obtained from about twenty small and medium enterprises suggest that the manufacturing process aspects of the modern microelectronics technology are very significant field for not only research, development and production, but also for services and users, especially acting in certain management level. Therefore, the following framework for Microelectronics Assembly was recommended to give the basic knowledge in this branch: - Introduction to Electronics technology, Hardware and Impact of Technological Integration - What are the Semiconductor Chips and its Performance in context of Packaging - Passive Elements including Embedded, its Performance and Selection - Substrates, Organic and Inorganic, Polymer - Thick Thin Film Technologies and HIC s, including their Non-conventional Applications - Assembly Technologies for Electronic Equipments and Systems SMT, LTCC etc. - The Electronic Packaging - Fundamentals of Electrical Design and Thermal Management - Hardware for PC and Interconnection Issue, MCM, WLP etc. - Soldering as decisive Operation for Electronic Systems Reliability - Electronics Production Process and SPC, Statistical Fundamentals and Tools - Quality Engineering and TQM, Directives in Electronics WEEE, RoHS, EuP, CE - Life Cycle Assessment, Eco-design and Electronics Impact on Environment This matter is arranged in twelve sections (Fig. 4), which concern many activities that must mostly technicians and engineer tray to solve in their daily praxis. The matter of the single section is partly independent from any special knowledge and is created as complex whole, which can by used without any others. On the other hand all single section makes the basic view on one part of microelectronics assembly technology, short known hardware. This program is arranged in two levels, for Bachelor study (Microelectronics and Components), and for Master study (Modern Microelectronics Technologies). Both courses are organized in one semester period with weakly program consisting from one theoretical lesson (2,5 hours) and lab lesson (2 hours). The lab curriculum is organized on the basis of non-vacuum technologies, where thick film and surface mount technology make carrying structure for good part of exercises. That means the basic production line for thick film technology and for surface mount technology including some test and measurement equipments make good basis for flexible arrangement of the single lab exercises. In more diploma thesis and research projects are made in this lab as well.

5 LCA,Eco-design and impact of electrical products on Environment Introduction to Electronics Hardware and Impact of Technological What are the Semiconductor Chips and its Packaging Quality Engineering and TQM, Directives WEEE, RoHS,EuP,CE Passive Elements including Embedded, its Performance in Context of Packaging Electronics Production Process and SPC, Statistic Fundamentals Soldering as decisive Operation for Electronic Systems Reliability Hardware for PC and Interconnection Issue, MCM, WLP etc. Electronics Assembly Program The Electronic Packaging - Fundamentals of Electrical Design and Thermal Management Substrates, Organic and Inorganic, Polymer Thick Thin Film Technologies and HIC s, including their Nonconventional applications Assembly Technologies for Electronic Equipments and Systems- SMT, LTCC.. FIGURE 4: MAIN TOPICS OF MICROELECTRONICS ASSEMBLY TECHNOLOGY EDUCATION Lab with Virtual Program Support Inseparable part of the Microelectronics Assembly education is experimental education program that makes a fix part of bachelor, master and doctorate study. Experimental parts of education run in microelectronics technology lab, which is systematically developed more than twenty years. This lab is based on non-vacuum technology processes where thick films, SMT and packaging equipments make the main part of lab arrangement. Students pass here the complete non-vacuum thick film process, starting with design of own layout and continuing with realization of patterns by screen printing and their measurement. Both, bare die and SMD components can be mount in this lab. For example there are four different reflow soldering equipments to use as well as YAG laser or various pick and place placers including flip-chip mounting. Equipments for packaging as dispensers and fluidization are inseparable part of lab too. Optimizing and simulation by ANSYS, Flowmeric and ANSOFT form the next part of this experimental part. Development of the lab is supported by diploma and PhD thesis. Some new parts are formed by eco-design and reliability investigation exercises. The whole education process in Microelectronics is supported by e-learning, which was developed in Microelectronics Department at BUT. The module is based on web content technologies (HTML, CSS, PHP and Macromedia Flash). The virtual lab module shows microelectronic technologies in process in continuity with lab equipments. It is provided mainly by Flash based multimedia content (2D/3D interactive animations and pictures) accessible via internet. User will be able to study these processes alive. There is possibility to change input parameters and see how this will affect final result. Animations are supplied with description of appropriate technology process. Some examples are shown in Figure 5 that shows frames of selected microelectronic technologies animations. This e-learning program describes technologies and processes concerning following technologies: Thick film technology Thin film technology PWB manufacturing SMT technology Packaging and HDI technology Thermal management and ANSYS modelling

6 Internal module handles students agenda who attend courses at Department of Microelectronics, FEEC, BUT. The agenda contains these parts: - laboratory reports control part, - test examination part, - forums related with themes of Virtual laboratory module, - other study materials related with microelectronic technologies, - administration related parts, - etc. Users will dispose different types of access rights. A) B) C) D) E) FIGURE 5: EXAMPLES OF ANIMATION: A), B) ULTRASONIC WIRE BONDING C), D) SMD PICK AND PLACE E) VAPOUR PHASE SOLDERING

7 Conclusion Electronics is one of the emerging domains in manufacturing engineering. There exists an strong global focus on this domain in both academia and industry due to its enormous application potential. In this context, there is a need for pushing steady this area. That asks make innovative course and laboratory modules which will introduce these emerging concepts and techniques to engineering students. These must be innovated permanently according to microelectronics technology development abroad the world. It was discovered from students that the virtual environments enabled students with different learning approaches to learn at their own pace. It allowed the students to virtually experiment and learn as well as provided them a more interactive environment to ask questions about specific problems and new solutions. In more the combination theory praxis - virtual environment allows to gain a better understanding of this matter and related issues in a shorter time. As strong development in electric/electronic industry sector is accompanied with strategically changes, as well fundamental changes must be applied in educational system too. This matter has a general validity due to increasing effect of electronics technology on ambient and environment (PC, mobile phones, TV sets, various types of recorders, cameras, players etc.). For managers in the each level and people in leading positions is necessary to understand basic principles and functions of electronics hardware, to be able make decisions and to lead discussion with collaborators. Acknowledgement Funding for this research was obtained through grant project from the Czech Ministry of Education (MSM MIKROSYN New Trends in Microelectronic Systems and Nanotechnologies ) and in collaboration with couple of electronics production companies (Pbt, Guliver, Tyco etc.) which operating in Brno region territory as well with some foreign companies (Aurel, Rehm, etc.). Their involvement and assistance is gratefully acknowledged. References [1] Tummala, R.: Fundamentals of Microsystems Packaging, McGraw-Hill, New York, London, Sydney, Madrid, Lisbon, Milan, San Juan, Seoul, Mexico City, Toronto, 2001 [2] Haag, S., Forbín,T.: Assessing Corporate Reinvestment in Engineering Education: University- Industry Collaboration, ICEE 2005 Proceedings, Vol. 2, p , Gliwice, Poland, July 25-29,2005 [3] Vasko, C., Szendiuch,I., Novotny,M.: Virtual Laboratory of Microelectronic Mounting and Packaging, Proc. International Conference on Engineering Education, 3 7 September, 2007, Coimbra [4] ECTS European Credit Transfer and Accumulation System, [5] Květoň, K., Základy e-learningu Ostrava, University of Ostrava, 2004, 1 st edition,61 pp, ISBN [6] Szendiuch, I.: Some New Aspects in Microelectronics Assembly Education, 53 rd ECTC, International Workshop on Micro-systems Packaging Education, New Orleans, May 27, 2003, p [7] Szendiuch, I.: Importace of Eco-design Implementation in Engineering Education, Innovations 2007, World Innovations in Engineering Education and Research, Chapter 5, p 55-63, INEER, Bergell House Publishing, USA, 2007