NanoZEIT. The Nanoelectronics Center of the Faculty of Electrical and Computer Engineering at Technische Universitaet Dresden
|
|
- Valentine Phillip Haynes
- 6 years ago
- Views:
Transcription
1 Faculty of Electrical and Computer Engineering NanoZEIT The Nanoelectronics Center of the Faculty of Electrical and Computer Engineering at Technische Universitaet Dresden Dresden, October 20 th, 2010
2 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary TU Dresden, NanoZeit Folie 2 von 19
3 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary TU Dresden, NanoZeit Folie 3 von 19
4 Motivation Dresden is one of the top Micro-/Nanoelectronic sites in Europe This is true for Industry, Research as well as Academia At Technische Universitaet Dresden a significant portion of research is dedicated to novel Micro- and Nanoelectronic Systems It is important to align these activities, especially for those that deal with technology and technology related subjects The experimental infrastructure is becoming more and more expensive Synergies have to be used The topics are becoming more and more complex Requires close cooperation of different fields TU Dresden, NanoZeit Folie 4 von 19
5 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary TU Dresden, NanoZeit Folie 5 von 19
6 Goals in the short to medium timeframe the nanoelectronic center plans Connect the existing research Start a demonstration project Enable the partners to attack more complex research topics by using an interdisciplinary approach Provide a common contact point within the university and for external contacts Increase public awareness of Material/Technology/Device and Circuit oriented Nanoelectronic research at the Faculty of Electrical and Computer Engineering at Technische Universitaet Dresden. TU Dresden, NanoZeit Folie 6 von 19
7 Goals As a long term goal the center envisions to setup a common infrastructure to make most efficient use of the limited resources Coordinated project offers to industry Setup a formal structure to each the above mentioned goals TU Dresden, NanoZeit Folie 7 von 19
8 How to reach the Goals? Start with a core team based on material, technology and device expertise (see participants) to enable an effective setup of the structures Postpone formal aspect to a later stage in order to focus on scientific topics Broaden and connect already existing activities rather than to start completely new activities Complement and strengthen other existing and starting activities like DRESDEN concept especially SAC-II TU Dresden, Präsentationsname XYZ Folie 8 von XYZ
9 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary
10 Participants Prof. J. Bartha Prof. F. Ellinger Prof. W.J. Fischer Prof. G. Gerlach Prof. H. Lakner Prof. T. Mikolajick Prof. A. Richter Prof. R. Schüffny Chair of semiconductor technology / IHM Chair of Circuit Design and Network Theory Chair of Microsystem Technology / IHM Chair of Solid State Electronics Chair of Optoelectronics /IHM Chair of Nanoelectronic Materials /IHM / NaMLab Chair of Polymer Microsystems / IHM Chair of highly parallel VLSI Systems and Neuromicroelectronics Prof. K. Wolter Chair of electronics packaging TU Dresden, NanoZeit Folie 10 von 19
11 Scientific Scope of Participants Devices Materials and Technology Microsystems NanoZEIT The Nanoelectronics Center of the Faculty of Electrical and Computer Engineering at Technische Universitaet Dresden Circuit Design TU Dresden, NanoZeit Folie 11 von 19
12 Location and Interaction Thin Film Technolkogy: Materials Unit processes Moduls/ Devices Electronics packaging Special technologies The Nanoelectronics Center of the Faculty of Electrical and Computer Engineering at Technische Universitaet Dresden Dresden SAC II Planned technology bui uilding NaMLab Cleanroom IHM Mierdel Bau Nötnitzer Str. Physik Materialwissen -schaft FZD, IFW, FhG,, etc. Barkhausen Bau TU Dresden, NanoZeit Folie 12 von 19
13 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary TU Dresden, NanoZeit Folie 13 von 19
14 Offers Research, Training and Consulting on: Materials for Semiconductor Devices Semiconductor Technology Semiconductor Devices Semiconductor Circuits Packaging Microsystems Coordinated offers including the interaction of two or more of the above fields with a single contact point TU Dresden, NanoZeit Folie 14 von 19
15 The Future Define first demonstration project Define a common virtual lab environment Establish a common lab infrastructure If first phase is successful: include other activites of TU Dresden Establish a clear communication structure and single contact point for external comntacts TU Dresden, NanoZeit Folie 15 von 19
16 Outline Motivation Goals Participants and Scientific Scope Offers and Plans for the Future Summary TU Dresden, NanoZeit Folie 16 von 19
17 Summary NanoZeit is a new consortium of Professors from TU Dresden working in the field of Materials, Technology, Devices and Circuits for Micro- and Nanoelectronics. The three main goals are better scientific alignment better transparency to the outside world better use of synergies by using common infrastructure TU Dresden, NanoZeit Folie 17 von 19
18 Further Schedule Microsystems Technology (Chair: G. Gerlach) 11:00 Sensors: Feelings made of Silicon 11:30 Silicon based Photonic Microsystems 12:00 PolyMEMS: Plastics in Action 12:30 Lunch break 13:00 Using Ink-Jet Printing and Nanoimprinting for Microsystems Circuit Design (Chair: J. W. Bartha) 13:30 Mixed Signal VLSI-Design: Advanced Digital and Neuromorphic Circuits 14:00 High Speed Integrated Circuit Design 14:30 Break Technology and Packaging (Chair: H. Lakner) 15:00 Packaging for System Integration 15:30 Technology for Nano- and Micro Structures 16:00 Material Research for Electronic Devices 16:30 Termination of the event! G. Gerlach H. Lakner A. Richter R. Kirchner C. Mayr F. Ellinger K. Wolter J. Bartha T.Mikolajick TU Dresden, NanoZeit Folie 18 von 19
Microelectronics. Photovoltaics. Applications Smart Systems. Software Network thinking growing together. Content
you re welcome! Content x X X X X X X Hibitions Silicon Saxony e. V. as Europe s largest trade association of the semiconductor, photovoltaic, software and smart systems industries unites commercial enterprises,
More informationOrganic and flexible Electronics in Saxony www.invest-in-saxony.com WElCOME Organic electronics are based on the discovery that specific organic materials possess semiconducting properties. Functional
More informationSaxony the Organic Electronics State
Saxony the Organic Electronics State Page 1 Agenda 1. History 2. The situation today: a major cluster in Europe 3. Saxony a dynamic place to be 4. OES at your service 5. Why to join Page 2 Downtown Dresden
More informationICT Micro- and nanoelectronics technologies
EPoSS Proposers' Day, 2 Feb 2017, Brussels ICT 31-2017 Micro- and nanoelectronics technologies Eric Fribourg-Blanc, Henri Rajbenbach, Andreas Lymberis European Commission DG CONNECT (Communications Networks,
More informationFRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS. Application Area. Quality of Life
FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS Application Area Quality of Life Overlay image of visible spectral range (VIS) and thermal infrared range (LWIR). Quality of Life With extensive experience
More informationCarinthia continues to expand Villach as a microelectronics research cluster
Pressemitteilung CTR Carinthian Tech Research AG Mag Birgit Rader-Brunner 01.02.2017 http://idw-online.de/de/news667249 Forschungs- / Wissenstransfer, Wissenschaftspolitik Chemie, Elektrotechnik, Physik
More informationOne-Stop-Shop for. Research Fab Microelectronics Germany
Fraunhofer Group for Microelectronics One-Stop-Shop for Technologies and Systems Research Fab Microelectronics Germany The entire added-value chain for microelectronics and nanoelectronics from a single
More informationNanotechnology, the infrastructure, and IBM s research projects
Nanotechnology, the infrastructure, and IBM s research projects Dr. Paul Seidler Coordinator Nanotechnology Center, IBM Research - Zurich Nanotechnology is the understanding and control of matter at dimensions
More informationPICASSO Project. Towards new avenues in EU-US ICT collaboration. First meeting of the PICASSO Expert Groups Washington DC, May 20, 2016
PICASSO Project Towards new avenues in EU-US ICT collaboration 5G, Big Data, Internet of Things and Cyber Physical Systems for smart cities, smart transport and smart energy First meeting of the PICASSO
More informationClusters in EUREKA > 2
Clusters in EUREKA > 2 Source: EUREKA 25 year overview (2011) EUREKA clusters, status end 2011: 120 running projects with a total effort of more than 15000 PY and a total budget of more than 2 B Labelled
More informationCase Study: the HTA Alliance
Case Study: the HTA Alliance Dr. CEO 4-Labs S.A Jean Frederic Clerc VP Carnot Institutes VP CEA-DRT 8-Oct-09 Page 0 Context Europe has a leading position in embedded systems, & embedded systems are more
More informationHermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
More informationHorizon2020 Information Days on Public-Private Partnerships
Horizon2020 Information Days on ublic-rivate artnerships Brokerage event 16 October 2015 SNELLFACT (SENSOR NETWORKS FOR LARGE SCALE FAULT DIAGNOSIS, CONTROL AND MONITORING) RICCARDO FERRARI R.FERRARI@TUDELFT.NL
More informationNanoFabrication Kingston. Seminar and Webinar January 31, 2017 Rob Knobel Associate Professor, Dept. of Physics Queen s University
NanoFabrication Kingston Seminar and Webinar January 31, 2017 Rob Knobel Associate Professor, Dept. of Physics Queen s University What is NFK? It s a place, an team of experts and a service. The goal of
More informationFRAUNHOFER GROUP FOR MICROELECTRONICS ONE-STOP-SHOP FOR TECHNOLOGIES AND SYSTEMS
FRAUNHOFER GROUP FOR MICROELECTRONICS ONE-STOP-SHOP FOR TECHNOLOGIES AND SYSTEMS The entire added-value chain for microelectronics and nanoelectronics from a single provider The Research Fab Microelectronics
More informationUsing Ink-Jet Printing and Nanoimprinting for Microsystems
Faculty of Electrical and Computer Engineering Institute of Semiconductor and Microsystems Technology Using Ink-Jet Printing and Nanoimprinting for Microsystems R. Kirchner*, A. Türke, W.-J. Fischer Institute
More informationLithography Session. EUV Lithography optics current status and outlook. F. Roozeboom Professor TU Eindhoven & TNO-Holst Centre, Eindhoven, Netherlands
Lithography Session F. Roozeboom Professor TU Eindhoven & TNO-Holst Centre, Eindhoven, Netherlands Fred Roozeboom is a Professor at Eindhoven University of Technology, The Netherlands and Senior Technical
More informationFront to Back Alignment and Metrology Performance for Advanced Packaging
Lithography Session F. Roozeboom Professor TU Eindhoven & TNO-Holst Centre, Eindhoven, Netherlands Fred Roozeboom is a Professor at Eindhoven University of Technology, The Netherlands and Senior Technical
More informationF r a u n h o F e r I n s t I t u t e F o r P h o t o n I c M I c r o s y s t e M s I P M s MEMS report 3 / C o n t E n t S
Fraunhofer Institute for Photonic Microsystems IPMS MEMS report 3 / 2017 Contents New Horizon 2020 Project PhasmaFood Sensor Meets RFID: Coupled with Sensors, RFID Solutions will Optimize Future Work Processes
More informationCanada s National Design Network. Community Research Innovation Opportunity
Canada s National Design Network Community Research Innovation Opportunity Over the past five years, more than 7000 researchers in the National Design Network have benefited from industrial tools, technologies,
More informationNanostencil Lithography and Nanoelectronic Applications
Microsystems Laboratory Nanostencil Lithography and Nanoelectronic Applications Oscar Vazquez, Marc van den Boogaart, Dr. Lianne Doeswijk, Prof. Juergen Brugger, LMIS1 Dr. Chan Woo Park, Visiting Professor
More informationUniversity of California, Berkeley Department of Mechanical Engineering. ME 290R Topics in Manufacturing, Fall 2014: Lithography
University of California, Berkeley Department of Mechanical Engineering ME 290R Topics in Manufacturing, Fall 2014: Lithography Class meetings: TuTh 3.30 5pm in 1165 Etcheverry Tentative class schedule
More informationJOINT NEWS RELEASE. Partnership with Fujikura in photonic crystal CDC device
JOINT NEWS RELEASE Japanese multinational companies extend presence in Singapore through research collaborations with IME IME scores a hat-trick with Fujikura, Mitsui and Seiko in photonics, MEMs and IC
More informationMaterials and Device Solutions Beyond Moore
Materials and Device Solutions Beyond Moore Prof. Dr.- Ing. T. Mikolajick Scientific Director NaMLab GmbH Chair of Nanoelectronic Materials, IHM, TU Dresden Thomas.Mikolajick@namlab.com Thomas.Mikolajick@tu-dresden.de
More informationPress release II / 2017 Dresdner scientists print tomorrow s world
Press release II / 2017 Dresdner scientists print tomorrow s world The Fraunhofer IWS Dresden and Technische Universität Dresden inaugurated their jointly operated Center for Additive Manufacturing Dresden
More informationSUNY Poly in a New Era
SUNY Poly in a New Era Bahgat Sammakia Interim President, SUNY Polytechnic Institute SUNY Poly in a New Era Overview SUNY Poly is recognized as a global leader in advanced electronics Research and Development,
More informationDTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production
DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark
More informationSmart Components and Smart Systems Integration
Smart Components and Smart Systems Integration in the ICT Work Programme 2011-2012 Francisco Javier Bonal Georg Kelm Francisco Ibáñez Information Event Brussels, 11 October 2010 1 Smart Systems and Smart
More informationNational Centre for Flexible Electronics
National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances
More informationRecent Developments in Multifunctional Integration. Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD
Recent Developments in Multifunctional Integration Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD Founding Participants 2 One-Stop-Shop for developments from wafer technologies
More informationAccelerating Scale Up of Large Area Electronics
Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved. Who are CPI? CPI is a UK technology innovation
More informationMEMS REPORT 3 / 2018 FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS
FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS MEMS REPORT 3 / 2018 CONTENTS Next Made in Dresden Chip Generation Improved Treatment of Common Arterial Calcification Disease with Intelligent Catheters
More informationADVANCING KNOWLEDGE. FOR CANADA S FUTURE Enabling excellence, building partnerships, connecting research to canadians SSHRC S STRATEGIC PLAN TO 2020
ADVANCING KNOWLEDGE FOR CANADA S FUTURE Enabling excellence, building partnerships, connecting research to canadians SSHRC S STRATEGIC PLAN TO 2020 Social sciences and humanities research addresses critical
More informationCODE OF INNOVATION CREATING TOMORROW S SOLUTIONS
CREATING TOMORROW S SOLUTIONS TABLE OF CONTENTS Principles 1 Innovation through R&D 2 Collaborations 3 Innovation Awards 4 Patents 5 Innovation Management 6 Innovation Environment 7 Contacts 2 from 7 PRINCIPLES
More informationNSERC Summer Project 1 Helping Improve Digital Camera Sensors With Prof. Glenn Chapman (ENSC)
NSERC Summer 2016 Digital Camera Sensors & Micro-optic Fabrication ASB 8831, phone 778-782-319 or 778-782-3814, Fax 778-782-4951, email glennc@cs.sfu.ca http://www.ensc.sfu.ca/people/faculty/chapman/ Interested
More informationHorizon Work Programme Leadership in enabling and industrial technologies - Introduction
EN Horizon 2020 Work Programme 2018-2020 5. Leadership in enabling and industrial technologies - Introduction Important notice on the Horizon 2020 Work Programme This Work Programme covers 2018, 2019 and
More informationTailor-made R&D Services: Our Areas of Application
One-Stop-Shop for Technologies and Systems Tailor-made R&D Services: Our Areas of Application Digital Industry: More than Developing Products The traditional industry sector is undergoing a rapid transition
More informationConsortium Capabilities
Consortium Capabilities The driver in advanced materials development is to create products with competitive advantages. Products must continuously become faster, lighter and cheaper and must provide additional
More informationResearch Strategy of the TU Ilmenau
Research Strategy of the TU Ilmenau Preamble The TU Ilmenau has a strong position as a research university and is very much committed to fundamental and applied research in specifically identified areas
More informationWelcome to OFC 2016-
OFC 2016-Report from the Exhibition Floor Welcome to OFC 2016- PETRA s activities at OFC started with a press release posted on March 19, 2016, in the Exhibitors News. The release was optimally timed such
More informationThe Role of the EU Regions in Supporting Robotics
The Role of the EU Regions in Supporting Robotics Brussels, 30 October2013 Robotics and the PPP initiative Ir. Sébastien Mortier Research Programme Officer Unit "New Forms of Production" Industrial Technologies,
More informationSPECIAL MORNING SESSION
AGENDA SPECIAL MORNING SESSION 10:00 am 10:15 am RESEARCH IMPROV: THE MISSING E Dr. Yildirim Hurmuzlu, ME Professor and Event Chair Vester Hughes Auditorium, Caruth Hall 10:15 am 10:30 am REMARKS Dr. Marc
More informationAn Information Technology Initiative on. High Aspect Ratio Microsystems Computer-Aided Engineering (HARMCAE) Point of Contact
An Information Technology Initiative on High Aspect Ratio Microsystems Computer-Aided Engineering (HARMCAE) Point of Contact Michael C. Murphy, Mechanical Engineering, Ph: 578-5921, email:murphy@me.lsu.edu
More information» Facing the Smart Future «
Industrie 4.0 Internet of Things» Facing the Smart Future «Smart Products, Production and Services Internet of Services Industrial Internet Digital Manufacturing Call for Partners: Consortium Study Our
More informationReducing MEMS product development and commercialization time
Reducing MEMS product development and commercialization time Introduction Fariborz Maseeh, Andrew Swiecki, Nora Finch IntelliSense Corporation 36 Jonspin Road, Wilmington MA 01887 www.intellisense.com
More informationA Research and Innovation Agenda for a global Europe: Priorities and Opportunities for the 9 th Framework Programme
A Research and Innovation Agenda for a global Europe: Priorities and Opportunities for the 9 th Framework Programme A Position Paper by the Young European Research Universities Network About YERUN The
More informationЗдра вствуйте, това рищи!
Manufacturing of Smart Objects by Printing Technologies Здра вствуйте, това рищи! Moscow / RUS, June 05, 2013 Reinhard R. Baumann Chemnitz University of Technology Chair of Digital Printing Fraunhofer
More informationFuture and Emerging Technologies. Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science
Future and Emerging Technologies Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science FET in Horizon 2020 Excellent Science pillar in H2020 European Research
More informationRESEARCH FAB MICROELECTRONICS GERMANY (FMD) The Virtual Institute for Combined Microelectronic Research and Development
RESEARCH FAB MICROELECTRONICS GERMANY (FMD) The Virtual Institute for Combined Microelectronic Research and Development Mircoelectronic development trends Micro- and Nanoelectronics are key enabling technologies
More informationresearch in the fields of nanoelectronics
FRAUNHOFEr center Nanoelectronic Technologies research in the fields of nanoelectronics 1 contents Fraunhofer CNT in Profile 3 Competence Areas Analytics 4 Functional Electronic Materials 5 Device & Integration
More informationWork package 4: Towards a virtual foundry
D4.5 WP4 September 2014 COLAE: Commercialization Clusters of OLAE Work package 4: Towards a virtual foundry Public Final Report COLAE 2013 Project name: Commercialization Clusters of OLAE Acronym: COLAE
More informationSilicon Austria Labs SAL. The Austrian Research Center for Electronic Based Systems
Silicon Austria Labs SAL The Austrian Research Center for Electronic Based Systems What is Silicon Austria Labs Silicon Austria Labs is Austria s Research Center for Electronic Based Systems (EBS) Applied
More informationEU Research project proposals (call for Finnish companies)
EU Research project proposals (call for Finnish companies) 11th EEMELI Workshop 29 th August 2012 Jukka Hast Research Professor VTT Technical Research Centre of Finland 04/10/2012 2 General ICT theme work
More informationScientific Highlights 2016
Scientific Highlights 2016 Science and Technology Sector Schools and Faculties Faculty of Science Louvain School of Engineering (EPL) Faculty of Architecture, Architectural Engineering and Urban Planning
More informationFacing the Future: Additive Manufacturing SECOND ROUND. Call for Partners: Consortium Study. Our partners:
Facing the Future: Additive Manufacturing SECOND ROUND Call for Partners: Consortium Study Our partners: Additive Manufacturing: The New Industrial Revolution? Motivation Costs for additive manufactured
More informationIntroduction to IEEE CAS Publications
Introduction to IEEE CAS Publications Gianluca Setti 12 1 Dep. of Engineering (ENDIF) University of Ferrara 2 Advanced Research Center on Electronic Systems for Information Engineering and Telecommunications
More informationWork Package 73. Second Report on Dissemination and Promotion of Project results. Deliverable D73.5
ICT-STREPT-247710 Interconnection Technologies for Flexible Systems Work Package 73 Second Report on Dissemination and Promotion of Project results Responsible Partner: Contributors: Dissemination Level:
More informationwith sensors which see, taste and feel for machines, thus facilitating safe operation or even stand-alone operation of these devices.
BMBF project KoSiF started - companies and researchers working together on flexible and autonomous sensor systems Sensory films - smart skin for machines Page 1 of 10 In industrial products as well as
More informationVLSI. at IIT Delhi Placements Placement Brochure. Department of Electrical Engineering. Department of Computer Science and Engineering
VLSI at IIT Delhi Placements 2009-10 http://web.iitd.ac.in/~ee/~iec/ http://web.iitd.ac.in/~vdtt/ Department of Electrical Engineering Department of Computer Science and Engineering Center for Applied
More informationTriple i - The key to your success
Triple i - The key to your success The needs and challenges of today s world are becoming ever more demanding. Standards are constantly rising. Creativity, reliability and high performance are basic prerequisites
More informationScience2Society Boosting innovation efficiency across Europe
Science2Society Boosting innovation efficiency across Europe BESTPRAC workshop September 20th, 2017 Brussels Bert Pluymers bert.pluymers@kuleuven.be This project has received funding from the European
More informationMultinationals in Israel High-Tech R&D and Manufacturing
Multinationals in Israel High-Tech R&D and Manufacturing August 29, 2010 Prof. Yitzhak (Tsahi) Birk Head, CCIT Overview of the EE Department Vital Statistics Faculty members: 45 Technical & Administrative
More informationG450C. Global 450mm Consortium at CNSE. Michael Liehr, General Manager G450C, Vice President for Research
Global 450mm Consortium at CNSE Michael Liehr, General Manager G450C, Vice President for Research - CNSE Overview - G450C Vision - G450C Mission - Org Structure - Scope - Timeline The Road Ahead for Nano-Fabrication
More informationWelcome to ESE Research Interviews 2017
Dear prospective research student: Welcome to ESE Research Interviews 2017 Thank you for applying for a research student position in our department. The interview s w ill be held on June 5-9, 2017, in
More informationRethinking the role of Social Sciences and Humanities (SSH) in Horizon 2020: toward a reflective and generative perspective
THE EU FRAMEWORK PROGRAMME FOR RESEARCH AND INNOVATION Horizon 2020 Societal Challenge 6: "Europe in a changing world : inclusive, innovative and reflective society" Rethinking the role of Social Sciences
More informationS-BPM ONE 2009 Constitutional convention
S-BPM ONE 2009 Constitutional convention Karlsruhe, October 22nd 2009 Host: Prof. Dr. D. Seese, KIT, Institute AIFB INSTITUTE OF APPLIED INFORMATICS AND FORMAL DESCRIPTION METHODS (AIFB) KIT University
More informationMOBY-DIC. Grant Agreement Number Model-based synthesis of digital electronic circuits for embedded control. Publishable summary
MOBY-DIC Grant Agreement Number 248858 Model-based synthesis of digital electronic circuits for embedded control Report version: 1 Due date: M24 (second periodic report) Period covered: December 1, 2010
More informationPrinted Electronics - Quo Vadis? What is Printed Electronics et Quo Vadis?
Printed Electronics - Quo Vadis? Emil J.W. List Institute of Solid State Physics Graz University of Technology NanoTecCenter Weiz Forschungsgesellschaft mbh Agenda Introduction Motivation What is Printed
More informationDivision of Academic Affairs Technology Fee Project Proposal 2014
Project Proposal Type Division of Academic Affairs Technology Fee Project Proposal 2014 Proposal Deadline: Tuesday, January 21, 2014 Instructional Technology Enhancement Project (ITEP) Focused projects
More informationPhotonics and Materials Engineering in the Center for Physical Sciences and Technology. Prof. Dr. Gintaras Valušis, Director of the Center
Photonics and Materials Engineering in the Center for Physical Sciences and Technology Prof. Dr. Gintaras Valušis, Director of the Center Contents Notes of Lithuanian science structure Center for Physical
More informationGLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS
GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS SMC057C August Margareth Gagliardi Project Analyst ISBN: 1-62296-338-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481
More informationMULTIMEDIA TOOL FOR UNDERSTANDING AND EXPLAINING MICROSYSTEMS
MULTIMEDIA TOOL FOR UNDERSTANDING AND EXPLAINING MICROSYSTEMS PHILIPPE FISCHER and MARCEL ECABERT, FSRM, Neuchâtel, Switzerland MICHEL BERGER, mib génie logiciel, Neuchâtel, Switzerland ERIC MOUNIER, YOLE
More informationFacts and Figures. RESEARCH TEACHING INNOVATION. KIT The Research University in the Helmholtz Association
Facts and Figures RESEARCH TEACHING INNOVATION KIT The Research University in the Helmholtz Association www.kit.edu Strong Science: 367 Professors Attractive Workplace: 9297 Employees Excellent Training:
More informationMINAM 2.0. Industrial and Regional Clusters in MINAM 2.0. Christine Neuy, MST BW e.v. / MicroTEC Südwest
MINAM 2.0 Industrial and Regional Clusters in MINAM 2.0 Christine Neuy, MST BW e.v. / MicroTEC Südwest Content Role of Clusters in MINAM 2.0 Benefits for Clusters in MINAM 2.0 Good Practice from MINAM
More informationStairway to Excellence
Stairway to Excellence Cohesion Policy and the Synergies with the Research and Innovation Funds Example of Synergies Research in novel materials with unusual electromagnetic properties - Institute of Electronic
More informationDistributed Artificial Intelligence Laboratory. Future in touch. at CeBIT 2014 on March, 10th to 14th, Hall 9, Booth A 44
EN Distributed Artificial Intelligence Laboratory Future in touch at CeBIT 2014 on March, 10th to 14th, Hall 9, Booth A 44 Distributed Artificial Intelligence Laboratory The DAI-Labor and the associated
More informationARTEMIS Industry Association
The innovation strategy is to strengthen the application contexts, based upon offers your R&I members Go to to apply for More members make the is an excellent members enjoy Members are able to join the
More informationYole Developpement. Developpement-v2585/ Publisher Sample
Yole Developpement http://www.marketresearch.com/yole- Developpement-v2585/ Publisher Sample Phone: 800.298.5699 (US) or +1.240.747.3093 or +1.240.747.3093 (Int'l) Hours: Monday - Thursday: 5:30am - 6:30pm
More informationMEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016
MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 A*STAR S IME KICKS OFF CONSORTIA TO DEVELOP ADVANCED PACKAGING SOLUTIONS FOR NEXT-GENERATION INTERNET OF THINGS APPLICATIONS AND HIGH-PERFORMANCE WIRELESS
More informationUniversität Dresden, Germany.
Solid State Lighting From Technology to Marketplace Apr 13 2010 The Bahen Centre for Information Technology Room 1160, 40 St. George St., Toronto AGENDA 8:00-9:00 Registration 9:00-9:15 Welcome Address:
More informationDTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production
DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark
More informationMichael P. Ridley, Director. NYSTAR High Performance Computing Program
NYSTAR High Performance Computing Program Michael P. Ridley, Director NYSTAR High Performance Computing Program David A. Paterson, Governor Edward Reinfurt, Executive Director Outline 1 Program Goals 2
More informationCourse Outcome of M.Tech (VLSI Design)
Course Outcome of M.Tech (VLSI Design) PVL108: Device Physics and Technology The students are able to: 1. Understand the basic physics of semiconductor devices and the basics theory of PN junction. 2.
More informationDigitising European Industry. Strengthening competitiveness in digital technologies value chains and platforms
Digitising European Industry Strengthening competitiveness in digital technologies value chains and platforms #DigitiseEU Peter Droell and Khalil Rouhana European Commission DG RTD and DG CONNECT Pan-European
More informationThe VDL high tech ecosystem. ET industry update VDL Science & Technology, Hans Priem
The VDL high tech ecosystem ET industry update VDL Science & Technology, Hans Priem VDL Groep Established in 19 countries > 90 operating companies > 16,000 employees, privately owned Turnover > 5 billion
More informationEnergy & Space. International Presentations
Energy & Space International Presentations 2012-2013 Advanced Electronics 3D Printed Circuit Boards 3D Printed Circuit Boards for Solder-Free Printable Electronics 4x4 Vehicles Arduino WiFi Android Controllers
More informationOpen Innovation to Manage Risks in Technology The Business of Breakthroughs
Open Innovation to Manage Risks in Technology The Business of Breakthroughs Janos Veres, Program Manager 2016 PARC, All rights reserved. PARC Legacy: A Storied History of Inventing the Future 1970 1973
More informationThe Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics
The Department of Advanced Materials Engineering Materials and Processes in Polymeric Microelectronics 1 Outline Materials and Processes in Polymeric Microelectronics Polymeric Microelectronics Process
More informationCITATION OF PRESIDENT S SCIENCE AND TECHNOLOGY MEDAL 2012 WINNER
CITATION OF PRESIDENT S SCIENCE AND TECHNOLOGY MEDAL 2012 WINNER Professor Dim-Lee Kwong Executive Director, Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR) For his
More informationImplementability of the Identity Management Part in Pfitzmann/Hansen s Terminology for a Complex Digital World
Faculty of Computer Science, Institute of Architecture of Systems, Chair of Data Security and Data Protection Implementability of the Identity Management Part in Pfitzmann/Hansen s Terminology for a Complex
More informationAn Overview the Electrical, Communications and Cyber Systems (ECCS) Division
An Overview the Electrical, Communications and Cyber Systems (ECCS) Division Samir El-Ghazaly Division Director, ECCS Engineering Directorate National Science Foundation Arlington, VA ECCS Mission Address
More informationNanomanufacturing and Fabrication
Nanomanufacturing and Fabrication Matthew Margolis http://www.cnm.es/im b/pages/services/im ages/nanofabrication%20laboratory_archivos/im age007.jpg What we will cover! Definitions! Top Down Vs Bottom
More informationIHP Innovations for High Performance Microelectronics
IHP Innovations for High Performance Microelectronics IHP - Innovations for High Performance Microelectronics in Frankfurt (Oder) is known for internationally acknowledged research at the highest level.
More informationTwenty years of Ibero American Science and Education Consortium (ISTEC): Past, Present and Future of a Collaborative Work
Twenty years of Ibero American Science and Education Consortium (ISTEC): Past, Present and Future of a Collaborative Work Authors: Marisa De Giusti, Comisión de Investigaciones Científicas de la provincia
More informationEUROSOI+- FP of 38 30/06/ FINAL PUBLISHABLE SUMMARY REPORT
EUROSOI+- FP7-216373 3 of 38 30/06/2011 1. FINAL PUBLISHABLE SUMMARY REPORT EUROSOI+- FP7-216373 4 of 38 30/06/2011 EUROSOI+- FP7-216373 5 of 38 30/06/2011 The main and last objective of EUROSOI Network
More informationCall for Papers EUKO 2016
Communication and Technology - EUKO 2016, Dresden 1/6 Call for Papers EUKO 2016 VII. Interdisciplinary Symposium European Cultures in Business and Corporate Communication Europäische Kulturen in der Wirtschaftskommunikation
More informationSILICON EUROPE THE LEADERS FOR INNOVATIVE ELECTRONICS & SOFTWARE TECHNOLOGIES
011 1111 1 0000 0000 01 1011 1111 111 1010 1101 001 0111 1111 100 1101 0010 00 SILICON EUROPE THE LEADERS FOR INNOVATIVE ELECTRONICS & SOFTWARE TECHNOLOGIES WHAT CAN DO FOR YOU? A one-stop shop for creative
More informationFrom vision to growth: Role of research in building world-class excellence in future added value electronics
From vision to growth: Role of research in building world-class excellence in future added value electronics Antti Vasara, CEO VTT Technical Research Centre of Finland Ltd Contents 1. VTT in short 2. Our
More informationAre innovative sensor concepts included in the funding programmes of the EU and Germany? Dr. Bernhard Ruf, VDI/VDE-IT
Are innovative sensor concepts included in the funding programmes of the EU and Germany? Dr. Bernhard Ruf, VDI/VDE-IT VDI/VDE IT: Who we are? Company Employees: ca. 270 Turnover (2012): 24,8 Mio. Share
More informationIs it possible to shape a university's research portfolio and to develop synergies between top down and bottom up approaches?
Is it possible to shape a university's research portfolio and to develop synergies between top down and bottom up approaches? Peter Skalicky, Rector Vienna University of Technology Conference of Rectors
More information