ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

Transcription

1 ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

2 ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Techniques for low emission and susceptibility Edited by Sonia Ben ~hia', Mohamed ~amdani~ and Etienne ~icard' ' INSA-LESIA, Toulouse, France * ESEO, Angers, France Q - Springer

3 Editors: Sonia Ben Dhia, INSA-LESIA, Toulouse, France Mohamed Ramdani, ESEO, Angers, France Etienne Sicard, INSA-LESIA, Toulouse, France Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility Library of Congress Control Number: ISBN e-isbn ISBN Printed on acid-free paper. O 2006 Springer Science+Business Media, Inc. All rights reserved. This work may not be translated or copied in whole or in part without the written'permission of the publisher (Springer Science+Business Media, Inc., 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now know or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks and similar terms, even if the are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed in the United States of America SPIN

4 Dedication To our children Camille Cyrine Daniel Sadri Selma Soumaya

5 Contents Contributing authors Preface Acknowledgements Chapter 1 - Basic Concepts in EMC for ICs Chapter 2 - Historical Review and State-of-the-art Chapter 3 - Fundamentals and Theory Chapter 4 - Measurement Methods - EMC Modeling Chapter 6 - Case Studies Chapter 7 - Guidelines Appendix A - Useful Tables Appendix B - Companion CD-ROM Glossary Index ix xi... Xlll

6 Contributing Authors Author Affiliation Contribution to Sttphane Baffreau Sandeep Bakshi Sonia Ben Dhia Sebastia Bota Lahoucine Bouhouch Alexandre Boyer Mart Coenen Franqois de Daran Bernard DCmoulin Bernd Deutschmann Jean-Marc Dienot M'Hamed Drissi Kazuhiko Eguchi Franco Fiori Saburo Hojo Todd H.Hubing Kouji Ichikawa Eugeni Isern CCcile LabussiBre. FrCdCric Laffont Enrique Lamoureux Jean-Luc Levant Christophe Lochot Christian Marot Olivier Maurice Mohamed MCdiouni Shinichiro Mitani Richard Perdriau Mohamed Ramdani Miquel Roca Bob Ross IUT, Tarbes, France Philips, Eindhoven, Netherlands INSA, Toulouse, France UIB Palma, Spain ENSA, Agadir, Maroc INSA, Toulouse, France Philips, Eindhoven, Netherlands Valeo, CrCteil, France University of Lille, France AMS, Unterpremstaetten, Austria IUT, Tarbes, France INSA, Rennes, France Aichi Institute of Technology, Japan Politecnico di Torino, Italia Renesas Technology, Japan Univ. of Missouri Rolla, USA DENSO, Japan UIB Palma, Spain Freescale, Toulouse, France Valeo, France EADSICCR, Toulouse, France ATMEL, Nantes, France Freescale, Toulouse,France Siemens VDO, Toulouse, France EADSICCR, Suresnes, France ENSA, Agadir, Maroc Hitachi Ltd, Japan ESEO, Angers, France ESEO, Angers, France UIB Palma, Spain Teraspeed Consulting Group, USA,6,7 Chapter 4 Chapter 3,4,5,6,CD Chapter 6 CD Chapter 4,6,7,CD Chapter 3,4 Chapter 4 Chapter 7 Chapter 1,2 Chapter 6 Chapter 4, CD,CD Chapter 6 Chapter 33 Chapter 4 Chapter 4 Chapter 6,6,CD Chapter 3, 5

7 Electromagnetic Compatibility Of Integrated Circuits Author Affiliation Contribution to Etienne Sicard INSA, Toulouse, France Chapter 1,2,3,7,CD Gilles Sicard TIMA, Grenoble, France Chapter 7 Amaury Soubeyran EADSICCR, Suresnes, France CD Thomas Steinecke Infineon, Munich, Germany Chapter 6 Bertrand Vrignon ST Microelectronics, Crolles, France,6 Osami Wada Kyoto University, Japan,6

8 Preface The project of writing a book on electromagnetic compatibility of integrated circuits took form and substance during the international workshop EMC Compo 2004 in Angers, France, and led to this present work. More than thirty contributors to the workshop have been asked to participate the book chapters, according to their expertise. The editors gathered the technical contributions and did their best to build self-consistent chapters related to the major hot topics of this field, namely the measurements methods, the modeling approaches, and the design techniques for low emission. Several test cases have been gathered into a specific chapter. The technical contents of this document are intended to help IC designers and electronics system designers reduce the parasitic emission as well as susceptibility to radio-frequency interference. This book is a unique collection of information focused on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with indepth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented. The companion CD-ROM includes software illustrating key aspects of the book and a collection of demo tools applicable to EMC analysis of ICs.

9 Acknowledgements We would like our early colleagues of the IERSET project in Toulouse as well as the partners from the European MEDEA project "EMC Workbench" and "Mesdie" for their support throughout the development of test circuits and design methodologies for improved EMC. We would like to thank Joseph-Georges Ferrante, Werner John for provided their continuous support over the last ten years. Productive technical discussions with the French UTE standardization group, the authors and contributors to EMC Compo 02 in Toulouse, France and EMC Compo 04 in Angers, France, are also gratefully acknowledged. Special thanks are due to technical contributors to the companion CD- ROM, to our colleagues at INSA and ESEO who always supported our research work, to numerous professors, students and engineers who patiently built the technical contents of the book and gave valuable comments and suggestions. Also, we would like to thank Marie-Agnes Detourbe, John Kerr and Langis Roy for having carefully reviewed the manuscript. Finally we would like to acknowledge our biggest debt to our parents and to our companion for their constant support.