Modeling the Radiated Emission of Micro-controllers

Size: px
Start display at page:

Download "Modeling the Radiated Emission of Micro-controllers"

Transcription

1 Modeling the Radiated Emission of Micro-controllers Etienne Sicard Christian MAROT André PEYRE LAVIGNE Claude HUET Etienne SICARD AUTOMOTIVE SA 1

2 Contents 1. Context of the study 2. System design methodology for EMC 3. The IERSET project on EMC for ICs 4. Core emission model 5. Emission model with Ios 6. Emission model in TEM cell 7. Conclusion 2

3 1. Context of the study µm, 2 metal layers Up to 100,000 devices on a chip CPU frequency 50MHz 0.12µm, 6 metal Up to 200,000,000 devices CPU frequency 1GHz IC 40 pins 10 years of evolution 1000 pins 3

4 1. Context of the study Voltage & Current Scaled current Current di/dt di/dt Voltage Voltage supply decreases Current amplitude keeps constant Faster switching Stronger di/dt di/dt Time Increased EMC problems 4

5 1. Context of the study Low parasitic emission is a key argument dbµv Supplier A FM RF GSM Not EMC compliant 60 40dB 10dB Supplier B Probably EMC compliant Ultimate target MHz 5

6 1. Context of the study Example for automotive Interference with local RF & Bluetooth links 433 MHz, 2.5GHz Parasites internal devices (ABS) Similar EMC problems in aerospace Interference with mobile phone 900, 1800,1900MHz 6

7 2. System Design Methodology for EMC Obsolete Design Methodology System on chip specification DESIGN Architectural Design Design Entry Design Architect FABRICATION Version n Version n EMC Measurements Compliance? + 6 months + $$$$$$$$ NO GO GO EMC compliant 7

8 1. 2. System Context Design of the study Methodology for EMC Obsolete Design Methodology db peaks frequency PCB design Prototype board EMC scan Electromagnetic incompatibility found too late 8

9 2. System Design Methodology for EMC Target Design Methodology System on chip specification Training Architecture Guidelines Tools DESIGN Architectural Design Design Entry Design Architect Design Guidelines IC Models EMC Simulations Compliance? GO FABRICATION EMC compliant 9

10 2. System Design Methodology for EMC Target Design Methodology With IBIS With IBIS and core model PCB design Wrong prediction of the radiated emission Good forecast of radiated emission A core model is mandatory for accurate emission prediction 10

11 2. The IERSET project European Research Centre on Electronics for Transportation identifies and co-ordinate co-operative research. Project EMC for ICs AIRBUS AUTOMOTIVE SA TOULOUSE Objectives Definition and validation of a model to be used in PCB CAD tools to guarantee the EMC of electronic systems One model from 1MHz to 1GHz, for conducted and radiated emission 11

12 2. The IERSET project ICEM (Integrated Circuit Electromagnetic compatibility Model) Draft standard Commitee Draft for Voting Technical work at IERSET Toulouse, France UTE France 02/2001 ICEM Cookbook version 1.c aug / /

13 2. The IERSET project ICEM presentations Presentation Presentation Presentation Presentation Presentation Paper IEEE Pack. Paper IEEE EMC IBIS summit Munich IEC 93 Singapoure IBIS meeting EMC compo Pres. to Mentor Toulouse Pres to Zuken CEM 02 Grenoble Date 02 Paris IBIS meeting IEC 93 EMC Europe 03/01 09/01 01/02 03/02 09/02 13

14 4. Core Emission Model ICEM includes a simple core model, not handled by IBIS External VDD Rvdd Lvdd dbµv Peak harmonics Cd Cb Ib Secondary resonance 40 Primary resonance External VSS Rvss Lvss Basic parameters IC model Cd, Ib Advanced param. R,L,Cb Measurements Simulation Cd, Ib All parameters 1 10 f (MHz)

15 4. Core Emission Model Current generator estimation Physical Transistor level (Spice) Interpolated Transistor level (Powermill) Gate level Activity Huge simulation Limited to analog blocks Difficult adaptation to usual tools Limited to 1 M devices Simple, not limited Fast Not very accurate Activity ( nb nodes) Activity of D60 CPU based on Verilog simulations over 1 clock cycle (125ns): Number of nodes switching in the same ns D60 CPU Equivalent Current generator Ib time (ns)

16 5. Emission Model with IOs Validation for a 16 bit micro-controller dbµv in conducted mode Within 10dB, but I/Os not handled Measurement (Conducted 1W) Simulation (PSPICE) EMC model 1 10 f (MHz) Comparison between simulation and measurement on a 16 bit micro-controller 16

17 5. Emission Model with IOs Add IBIS I/O data Core VDD Rvdd Lvdd I/O VDD Cd Cb Ib Cio I/O Core VSS Rvss Lvss Zsub I/O VSS Zsub: basically a 1-10Ω serial resistance Cio : decoupling capacitance for IO supply IO block: reuse of IBIS 17

18 5. Emission Model with IOs Validation IO modify the spectrum at high frequencies (>300MHz) 18

19 6. Emission in TEM cell Proposed model: capacitance & inductance coupling To PCB Lpackage Cdie_gnd Chip under test 50 Ω 50 Ω KCoupling Cdie_septum PCB Chip under test Lseptum Receiver 19

20 6. Emission in TEM cell Validation for the core alone Model fits correctly up to 400MHz At high frequencies, close from noise floor 20

21 6. Emission in TEM cell Validation for the core & IOs Model fits correctly up to 800MHz At high frequencies, IO effects dominate 21

22 Conclusion Technology scale down illustrated More complex chips increase parasitic emission An EMC model for Ics is mandatory A simple model has been proposed Satisfactory prediction of conducted emission Prediction of the core emission in TEM investigated Model proposal standardized by UTE (ICEM) Presentation and promotion to CAD & IC providers 22

Advances on the ICEM model for Emission of Integrated Circuits

Advances on the ICEM model for Emission of Integrated Circuits Advances on the ICEM model for Emission of Integrated Circuits Sébastien Calvet sebastien.calvet@motorola.com sebastien.calvet@insa-tlse.fr http://intrage.insa-tlse.fr/~etienne Christian MAROT André PEYRE

More information

Using ICEM Model Expert to Predict TC1796 Conducted Emission

Using ICEM Model Expert to Predict TC1796 Conducted Emission Using ICEM Model Expert to Predict TC1796 Conducted Emission E. Sicard (1), L. Bouhouch (2) (1) INSA-GEI, 135 Av de Rangueil 31077 Toulouse France (2) ESTA Agadir, Morroco Contact : etienne.sicard@insa-toulouse.fr

More information

MPC 5534 Case study. E. Sicard (1), B. Vrignon (2) Toulouse France. Contact : web site :

MPC 5534 Case study. E. Sicard (1), B. Vrignon (2) Toulouse France. Contact : web site : MPC 5534 Case study E. Sicard (1), B. Vrignon (2) (1) INSA-GEI, 135 Av de Rangueil 31077 Toulouse France (2) Freescale Semiconductors, Toulouse, France Contact : etienne.sicard@insa-toulouse.fr web site

More information

Electrical Characterization of a 64 Ball Grid Array Package

Electrical Characterization of a 64 Ball Grid Array Package EMC Europe - Hamburg, 8 th September 008 Summary Electrical Characterization of a 64 Ball Grid Array A. Boyer (), E. Sicard (), M. Fer (), L. Courau () () LATTIS - INSA of Toulouse - France () ST-Microelectronics

More information

EMI Reduction on an Automotive Microcontroller

EMI Reduction on an Automotive Microcontroller EMI Reduction on an Automotive Microcontroller Design Automation Conference, July 26 th -31 st, 2009 Patrice JOUBERT DORIOL 1, Yamarita VILLAVICENCIO 2, Cristiano FORZAN 1, Mario ROTIGNI 1, Giovanni GRAZIOSI

More information

First Practical Experiences with ICEM (IC Emission) Models in ECAD Analysis Tools

First Practical Experiences with ICEM (IC Emission) Models in ECAD Analysis Tools First Practical Experiences with ICEM (IC Emission) Models in ECAD Analysis Tools Hirohiko Matsuzawa Zuken Inc Yokohama/Japan Ralf Brüning, Michael Schäder Zuken EMC Technology Center Paderborn/Germany

More information

Paper submitted to Microelectronics Journal, special issue EMC Compo 02

Paper submitted to Microelectronics Journal, special issue EMC Compo 02 Paper submitted to Microelectronics Journal, special issue EMC Compo 02 REGINA Test mask : Research on EMC Guidelines for INtegrated Automotive circuits C. Lochot (a), *, S. Calvet (a), S. Ben Dhia (b),

More information

Impact of NFSI on the clock circuit of a Gigabit Ethernet switch

Impact of NFSI on the clock circuit of a Gigabit Ethernet switch Impact of NFSI on the clock circuit of a Gigabit Ethernet switch Massiva Zouaoui, Etienne Sicard, Henri Braquet, Ghislain Rudelou, Emmanuel Marsy and Gilles Jacquemod CONTENTS 1. Context 2. Objectives

More information

Todd Hubing. Clemson University. Cabin Environment Communication System. Controls Airbag Entertainment Systems Deployment

Todd Hubing. Clemson University. Cabin Environment Communication System. Controls Airbag Entertainment Systems Deployment Automotive Component Measurements for Determining Vehicle-Level Radiated Emissions Todd Hubing Michelin Professor of Vehicular Electronics Clemson University Automobiles are Complex Electronic Systems

More information

Power- Supply Network Modeling

Power- Supply Network Modeling Power- Supply Network Modeling Jean-Luc Levant, Mohamed Ramdani, Richard Perdriau To cite this version: Jean-Luc Levant, Mohamed Ramdani, Richard Perdriau. Power- Supply Network Modeling. INSA Toulouse,

More information

EMI Modeling of a 32-bit Microcontroller in Wait Mode

EMI Modeling of a 32-bit Microcontroller in Wait Mode EMI Modeling of a 32-bit Microcontroller in Wait Mode Jean-Pierre Leca 1, 2 Nicolas Froidevaux 1 Henri Braquet 2 Gilles Jacquemod 2 1 STMicroelectronics ZI de Rousset, France Contact: jean-pierre.leca@st.com

More information

Course Introduction. Content 16 pages. Learning Time 30 minutes

Course Introduction. Content 16 pages. Learning Time 30 minutes Course Introduction Purpose This course discusses techniques for analyzing and eliminating noise in microcontroller (MCU) and microprocessor (MPU) based embedded systems. Objectives Learn what EMI is and

More information

Development and Validation of a Microcontroller Model for EMC

Development and Validation of a Microcontroller Model for EMC Development and Validation of a Microcontroller Model for EMC Shaohua Li (1), Hemant Bishnoi (1), Jason Whiles (2), Pius Ng (3), Haixiao Weng (2), David Pommerenke (1), and Daryl Beetner (1) (1) EMC lab,

More information

An analog to digital converter ICIM-CI model based on design

An analog to digital converter ICIM-CI model based on design An analog to digital converter ICIM-CI model based on design Jean-Baptiste Gros 1, Geneviève Duchamp 1, Alain Meresse, Jean-Luc Levant 2, Christian Marot 3 1 Université Bordeaux1, Laboratoire IMS 2 ATMEL,

More information

IC-Emc User's Manual

IC-Emc User's Manual IC-Emc User's Manual Etienne SICARD www.ic-emc.org March 2005 2005-03-21 p 1/65 Copyright ISBN 2-87649-048-X Published by INSA TOULOUSE, France, 2005 INSA 135 Av de Rangueil 31077 Toulouse FRANCE Contact:

More information

Effect of Aging on Power Integrity of Digital Integrated Circuits

Effect of Aging on Power Integrity of Digital Integrated Circuits Effect of Aging on Power Integrity of Digital Integrated Circuits A. Boyer, S. Ben Dhia Alexandre.boyer@laas.fr Sonia.bendhia@laas.fr 1 May 14 th, 2013 Introduction and context Long time operation Harsh

More information

ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS MEASUREMENT, MODELLING AND DESIGN TECHNIQUES I. EMC ISSUES

ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS MEASUREMENT, MODELLING AND DESIGN TECHNIQUES I. EMC ISSUES TOULOUSE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS MEASUREMENT, MODELLING AND DESIGN TECHNIQUES Etienne SICARD Professor INSA/DGEI University of Toulouse 31077 Toulouse - France Etienne.sicard@insa-toulouse.fr

More information

Characterization of Integrated Circuits Electromagnetic Emission with IEC

Characterization of Integrated Circuits Electromagnetic Emission with IEC Characterization of Integrated Circuits Electromagnetic Emission with IEC 61967-4 Bernd Deutschmann austriamicrosystems AG A-8141 Unterpremstätten, Austria bernd.deutschmann@ieee.org Gunter Winkler University

More information

EMI Modeling of a 32-bit Microcontroller in Wait Mode

EMI Modeling of a 32-bit Microcontroller in Wait Mode EMI Modeling of a 32-bit Microcontroller in Wait Mode Jean-Pierre Leca 1,2, Nicolas Froidevaux 1, Henri Braquet 2, Gilles Jacquemod 2 1 STMicroelectronics, 2 LEAT, UMR CNRS-UNS 6071 BMAS 2010 San Jose,

More information

Engineering the Power Delivery Network

Engineering the Power Delivery Network C HAPTER 1 Engineering the Power Delivery Network 1.1 What Is the Power Delivery Network (PDN) and Why Should I Care? The power delivery network consists of all the interconnects in the power supply path

More information

Todd H. Hubing Michelin Professor of Vehicular Electronics Clemson University

Todd H. Hubing Michelin Professor of Vehicular Electronics Clemson University Essential New Tools for EMC Diagnostics and Testing Todd H. Hubing Michelin Professor of Vehicular Electronics Clemson University Where is Clemson University? Clemson, South Carolina, USA Santa Clara Valley

More information

TECHNICAL REPORT: CVEL AN IMPROVED MODEL FOR REPRESENTING CURRENT WAVEFORMS IN CMOS CIRCUITS

TECHNICAL REPORT: CVEL AN IMPROVED MODEL FOR REPRESENTING CURRENT WAVEFORMS IN CMOS CIRCUITS TECHNICAL REPORT: CVEL-06-00 AN IMPROVED MODEL FOR REPRESENTING CURRENT WAVEFORMS IN CMOS CIRCUITS Yan Fu, Gian Lorenzo Burbui 2, and Todd Hubing 3 University of Missouri-Rolla 2 University of Bologna

More information

Decoupling capacitor uses and selection

Decoupling capacitor uses and selection Decoupling capacitor uses and selection Proper Decoupling Poor Decoupling Introduction Covered in this topic: 3 different uses of decoupling capacitors Why we need decoupling capacitors Power supply rail

More information

Evaluation of Package Properties for RF BJTs

Evaluation of Package Properties for RF BJTs Application Note Evaluation of Package Properties for RF BJTs Overview EDA simulation software streamlines the development of digital and analog circuits from definition of concept and estimation of required

More information

Predicting Module Level RF Emissions from IC Emissions Measurements using a 1 GHz TEM or GTEM Cell A Review of Related Published Technical Papers 1

Predicting Module Level RF Emissions from IC Emissions Measurements using a 1 GHz TEM or GTEM Cell A Review of Related Published Technical Papers 1 Predicting Module Level RF Emissions from IC Emissions Measurements using a 1 GHz TEM or GTEM Cell A Review of Related Published Technical Papers 1 Jame P. Muccioli, Jastech EMC Consulting, LLC, P.O. Box

More information

Radiated Emission of a 3G Power Amplifier

Radiated Emission of a 3G Power Amplifier Radiated Emission of a 3G Power Amplifier C. Dupoux (1), S. A. Boulingui (2), E. Sicard (3) (1) Freescale Semiconductors, Toulouse, France (2) IUT GEII, Tarbes, France (3) INSA-GEI, 135 Av de Rangueil

More information

Course Introduction Purpose Objectives Content Learning Time

Course Introduction Purpose Objectives Content Learning Time Course Introduction Purpose This course discusses techniques for analyzing and eliminating noise in microcontroller (MCU) and microprocessor (MPU) based embedded systems. Objectives Learn about a method

More information

Novel Modeling Strategy for a BCI set-up applied in an Automotive Application

Novel Modeling Strategy for a BCI set-up applied in an Automotive Application Novel Modeling Strategy for a BCI set-up applied in an Automotive Application An industrial way to use EM simulation tools to help Hardware and ASIC designers to improve their designs for immunity tests.

More information

20. Electromagnetic Compatibility for Integrated Circuits

20. Electromagnetic Compatibility for Integrated Circuits 20. Electromagnetic Compatibility for Integrated Circuits E. Sicard 1, C. Marot 2, J. Y. Fourniols 3, and M. Ramdani 4 1 INSA/DGEI, 135 Av de Rangueil 31077 Toulouse - France E-mail: etienne.sicard@insa-tlse.fr

More information

Modeling and Simulation of Powertrains for Electric and Hybrid Vehicles

Modeling and Simulation of Powertrains for Electric and Hybrid Vehicles Modeling and Simulation of Powertrains for Electric and Hybrid Vehicles Dr. Marco KLINGLER PSA Peugeot Citroën Vélizy-Villacoublay, FRANCE marco.klingler@mpsa.com FR-AM-5 Background The automotive context

More information

An alternative approach to model the Internal Activity of integrated circuits.

An alternative approach to model the Internal Activity of integrated circuits. An alternative approach to model the Internal Activity of integrated circuits. N. Berbel, R. Fernández-García, I. Gil Departament d Enginyeria Electrònica UPC Barcelona Tech Terrassa, SPAIN nestor.berbel-artal@upc.edu

More information

AN-1011 APPLICATION NOTE

AN-1011 APPLICATION NOTE AN-111 APPLICATION NOTE One Technology Way P.O. Box 916 Norwood, MA 262-916, U.S.A. Tel: 781.329.47 Fax: 781.461.3113 www.analog.com EMC Protection of the AD715 by Holger Grothe and Mary McCarthy INTRODUCTION

More information

Heat sink. Insulator. µp Package. Heatsink is shown with parasitic coupling.

Heat sink. Insulator. µp Package. Heatsink is shown with parasitic coupling. X2Y Heatsink EMI Reduction Solution Summary Many OEM s have EMI problems caused by fast switching gates of IC devices. For end products sold to consumers, products must meet FCC Class B regulations for

More information

Top Ten EMC Problems

Top Ten EMC Problems Top Ten EMC Problems presented by: Kenneth Wyatt Sr. EMC Consultant EMC & RF Design, Troubleshooting, Consulting & Training 10 Northern Boulevard, Suite 1 Amherst, New Hampshire 03031 +1 603 578 1842 www.silent-solutions.com

More information

Relationship Between Signal Integrity and EMC

Relationship Between Signal Integrity and EMC Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?

More information

Open Archive Toulouse Archive Ouverte (OATAO)

Open Archive Toulouse Archive Ouverte (OATAO) Open Archive Toulouse Archive Ouverte (OATAO) OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible. This is an author-deposited

More information

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies 1 Definitions EMI = Electro Magnetic Interference EMC = Electro Magnetic Compatibility (No EMI) Three Components

More information

Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas

Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas CST North American Automotive Workshop Investigation of Electromagnetic Field Coupling from DC-DC Buck Converters to Automobile AM/FM Antennas Patrick DeRoy, CST of America, Framingham, Massachusetts,

More information

Comparison of IC Conducted Emission Measurement Methods

Comparison of IC Conducted Emission Measurement Methods IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 52, NO. 3, JUNE 2003 839 Comparison of IC Conducted Emission Measurement Methods Franco Fiori, Member, IEEE, and Francesco Musolino, Member, IEEE

More information

The water-bed and the leaky bucket

The water-bed and the leaky bucket The water-bed and the leaky bucket Tim Williams Elmac Services Wareham, UK timw@elmac.co.uk Abstract The common situation of EMC mitigation measures having the opposite effect from what was intended, is

More information

Analogue circuit design for RF immunity

Analogue circuit design for RF immunity Analogue circuit design for RF immunity By EurIng Keith Armstrong, C.Eng, FIET, SMIEEE, www.cherryclough.com First published in The EMC Journal, Issue 84, September 2009, pp 28-32, www.theemcjournal.com

More information

Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design

Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design Bruce Archambeault, Ph.D. Doug White Personal Systems Group Electromagnetic Compatibility Center of Competency

More information

Guidance and Declaration - Electromagnetic Compatibility (EMC) for the Delfi PTS ii Portable Tourniquet System

Guidance and Declaration - Electromagnetic Compatibility (EMC) for the Delfi PTS ii Portable Tourniquet System Guidance and Declaration - Electromagnetic Compatibility (EMC) for the Delfi TS ii ortable Tourniquet System Guidance and manufacturer s declaration electromagnetic emissions The TS ii ortable Tourniquet

More information

7. EMV Fachtagung. EMV-gerechtes Filterdesign. 23. April 2009, TU-Graz. Dr. Gunter Winkler (TU Graz) Dr. Bernd Deutschmann (Infineon Technologies AG)

7. EMV Fachtagung. EMV-gerechtes Filterdesign. 23. April 2009, TU-Graz. Dr. Gunter Winkler (TU Graz) Dr. Bernd Deutschmann (Infineon Technologies AG) 7. EMV Fachtagung 23. April 2009, TU-Graz EMV-gerechtes Filterdesign Dr. Gunter Winkler (TU Graz) Dr. Bernd Deutschmann (Infineon Technologies AG) Page 1 Agenda Filter design basics Filter Attenuation

More information

Chip and Package-Level Wideband EMI Analysis for Mobile DRAM Devices

Chip and Package-Level Wideband EMI Analysis for Mobile DRAM Devices DesignCon 216 Chip and Package-Level Wideband EMI Analysis for Mobile DRAM Devices Jin-Sung Youn, Samsung Electronics Inc. jinsung.youn@samsung.com, youn.jinsung75@gmail.com Jieun Park, Samsung Electronics

More information

Chapter 16 PCB Layout and Stackup

Chapter 16 PCB Layout and Stackup Chapter 16 PCB Layout and Stackup Electromagnetic Compatibility Engineering by Henry W. Ott Foreword The PCB represents the physical implementation of the schematic. The proper design and layout of a printed

More information

Signal Integrity, Part 1 of 3

Signal Integrity, Part 1 of 3 by Barry Olney feature column BEYOND DESIGN Signal Integrity, Part 1 of 3 As system performance increases, the PCB designer s challenges become more complex. The impact of lower core voltages, high frequencies

More information

IBIS Present and Future

IBIS Present and Future IBIS Present and Future Bob Ross (Past Chair, EIA IBIS Open Forum) 7th IEEE Workshop on Signal Propagation on Interconnects Hotel Garden, Siena, Italy May 11-14, 2003 Page 1 IBIS and Outline IBIS Input/Output

More information

AP Scalable Pads. XC166 Microcontroller Family. Microcontrollers. Electrical Specification of Scalable Output Drivers in 250nm CMOS Technology

AP Scalable Pads. XC166 Microcontroller Family. Microcontrollers. Electrical Specification of Scalable Output Drivers in 250nm CMOS Technology Application Note, V1.1, September 26 AP1699 Scalable Pads Electrical Specification of Scalable Output Drivers in 2nm CMOS Technology XC166 Microcontroller Family Microcontrollers Never stop thinking. Edition

More information

Application of Generalized Scattering Matrix for Prediction of Power Supply Noise

Application of Generalized Scattering Matrix for Prediction of Power Supply Noise Application of Generalized Scattering Matrix for Prediction of Power Supply Noise System Level Interconnect Prediction 2010 June 13, 2010 K. Yamanaga (1),K. Masu (2), and T. Sato (3) (1) Murata Manufacturing

More information

Use of on-chip sampling sensor to evaluate conducted RF disturbances propagated inside an integrated circuit

Use of on-chip sampling sensor to evaluate conducted RF disturbances propagated inside an integrated circuit Use of on-chip sampling sensor to ealuate conducted RF disturbances propagated inside an integrated circuit M. Deobarro 1, 2 (PhD-2) B. Vrignon 1, S. Ben Dhia 2, A. Boyer 2 1 Freescale Semiconductor 2

More information

From IC characterization to system simulation by systematic modeling bottom up approach

From IC characterization to system simulation by systematic modeling bottom up approach From IC characterization to system simulation by systematic modeling bottom up approach Frédéric Lafon, François de Daran VALEO VIC, Rue Fernand Pouillon, 944 Creteil Cedex, France, frederic.lafon@valeo.com

More information

Application Note Receivers MLX71120/21 With LNA1-SAW-LNA2 configuration

Application Note Receivers MLX71120/21 With LNA1-SAW-LNA2 configuration Designing with MLX71120 and MLX71121 receivers using a SAW filter between LNA1 and LNA2 Scope Many receiver applications, especially those for automotive keyless entry systems require good sensitivity

More information

Signal integrity means clean

Signal integrity means clean CHIPS & CIRCUITS As you move into the deep sub-micron realm, you need new tools and techniques that will detect and remedy signal interference. Dr. Lynne Green, HyperLynx Division, Pads Software Inc The

More information

Automated Near-Field Scanning to Identify Resonances

Automated Near-Field Scanning to Identify Resonances Automated Near-Field Scanning to Identify Resonances Muchaidze, Giorgi (1), Huang Wei (2), Jin Min (1), Shao Peng (2), Jim Drewniak (2) and David Pommerenke (2) (1) Amber Precision Instruments Santa Clara,

More information

COMMON REGULATORY OBJECTIVES FOR WIRELESS LOCAL AREA NETWORK (WLAN) EQUIPMENT PART 2 SPECIFIC ASPECTS OF WLAN EQUIPMENT

COMMON REGULATORY OBJECTIVES FOR WIRELESS LOCAL AREA NETWORK (WLAN) EQUIPMENT PART 2 SPECIFIC ASPECTS OF WLAN EQUIPMENT COMMON REGULATORY OBJECTIVES FOR WIRELESS LOCAL AREA NETWORK (WLAN) EQUIPMENT PART 2 SPECIFIC ASPECTS OF WLAN EQUIPMENT 1. SCOPE This Common Regulatory Objective, CRO, is applicable to Wireless Local Area

More information

EUA2011A. Low EMI, Ultra-Low Distortion, 2.5-W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION FEATURES APPLICATIONS

EUA2011A. Low EMI, Ultra-Low Distortion, 2.5-W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION FEATURES APPLICATIONS Low EMI, Ultra-Low Distortion, 2.5-W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION The EUA2011A is a high efficiency, 2.5W mono class-d audio power amplifier. A new developed filterless PWM

More information

Conducted EMI Simulation of Switched Mode Power Supply

Conducted EMI Simulation of Switched Mode Power Supply Conducted EMI Simulation of Switched Mode Power Supply Hongyu Li #1, David Pommerenke #2, Weifeng Pan #3, Shuai Xu *4, Huasheng Ren *5, Fantao Meng *6, Xinghai Zhang *7 # EMC Laboratory, Missouri University

More information

Course Introduction. Content: 19 pages 3 questions. Learning Time: 30 minutes

Course Introduction. Content: 19 pages 3 questions. Learning Time: 30 minutes Course Introduction Purpose: This course discusses techniques that can be applied to reduce problems in embedded control systems caused by electromagnetic noise Objectives: Gain a basic knowledge about

More information

Susceptibility Analysis of an Operational Amplifier Using On-Chip Measurement

Susceptibility Analysis of an Operational Amplifier Using On-Chip Measurement Susceptibility Analysis of an Operational Amplifier Using On-Chip Measurement He Huang, Alexandre Boyer, Sonia Ben Dhia, Bertrand Vrignon To cite this version: He Huang, Alexandre Boyer, Sonia Ben Dhia,

More information

Reliable World Class Insights Your Silicon Valley Partner in Simulation ANSYS Sales, Consulting, Training & Support

Reliable World Class Insights Your Silicon Valley Partner in Simulation ANSYS Sales, Consulting, Training & Support www.ozeninc.com info@ozeninc.com (408) 732 4665 1210 E Arques Ave St 207 Sunnyvale, CA 94085 Reliable World Class Insights Your Silicon Valley Partner in Simulation ANSYS Sales, Consulting, Training &

More information

User manual. P1601, P1602 / P1702 set. Magnetic field: P1601, Electric field: P1702

User manual. P1601, P1602 / P1702 set. Magnetic field: P1601, Electric field: P1702 User manual Probe set for RF field measurements on ICs P1601, P1602 / set Magnetic field: P1601, 1602 Electric field: Copyright June 2015 LANGER GmbH For use with spectrum analyser 2015.07.03 User manual

More information

AltiumLive 2017: Component selection for EMC

AltiumLive 2017: Component selection for EMC AltiumLive 2017: Component selection for EMC Martin O Hara Victory Lighting Ltd Munich, 24-25 October 2017 Component Selection Passives resistors, capacitors and inductors Discrete diodes, bipolar transistors,

More information

A 0 Ohm substitution current probe is used to measure the emission in the power supply of an integrated circuit

A 0 Ohm substitution current probe is used to measure the emission in the power supply of an integrated circuit , pp.43-47 http://dx.doi.org/10.14257/astl.2013.28.08 A 0 Ohm substitution current probe is used to measure the emission in the power supply of an integrated circuit Fayu Wan *1, Qi Liu 2, Jian Shen 2,

More information

BIRD 74 - recap. April 7, Minor revisions Jan. 22, 2009

BIRD 74 - recap. April 7, Minor revisions Jan. 22, 2009 BIRD 74 - recap April 7, 2003 Minor revisions Jan. 22, 2009 Please direct comments, questions to the author listed below: Guy de Burgh, EM Integrity mail to: gdeburgh@nc.rr.com (919) 457-6050 Copyright

More information

Improve Performance and Reliability with Flexible, Ultra Robust MEMS Oscillators

Improve Performance and Reliability with Flexible, Ultra Robust MEMS Oscillators Field Programmable Timing Solutions Improve Performance and Reliability with Flexible, Ultra Robust MEMS Oscillators Reference timing components, such as resonators and oscillators, are used in electronic

More information

Decoupling capacitor placement

Decoupling capacitor placement Decoupling capacitor placement Covered in this topic: Introduction Which locations need decoupling caps? IC decoupling Capacitor lumped model How to maximize the effectiveness of a decoupling cap Parallel

More information

Design Considerations for Highly Integrated 3D SiP for Mobile Applications

Design Considerations for Highly Integrated 3D SiP for Mobile Applications Design Considerations for Highly Integrated 3D SiP for Mobile Applications FDIP, CA October 26, 2008 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr Contents I. Market and future direction

More information

Characterization and modelling of EMI susceptibility in integrated circuits at high frequency

Characterization and modelling of EMI susceptibility in integrated circuits at high frequency Characterization and modelling of EMI susceptibility in integrated circuits at high frequency Ignacio Gil* and Raúl Fernández-García Department of Electronic Engineering UPC. Barcelona Tech Colom 1, 08222

More information

Design of EMI Filters for DC-DC converter

Design of EMI Filters for DC-DC converter Design of EMI Filters for DC-DC converter J. L. Kotny*, T. Duquesne**, N. Idir** Univ. Lille Nord de France, F-59000 Lille, France * USTL, F-59650 Villeneuve d Ascq, France ** USTL, L2EP, F-59650 Villeneuve

More information

A DESIGN EXPERIMENT FOR MEASUREMENT OF THE SPECTRAL CONTENT OF SUBSTRATE NOISE IN MIXED-SIGNAL INTEGRATED CIRCUITS

A DESIGN EXPERIMENT FOR MEASUREMENT OF THE SPECTRAL CONTENT OF SUBSTRATE NOISE IN MIXED-SIGNAL INTEGRATED CIRCUITS A DESIGN EXPERIMENT FOR MEASUREMENT OF THE SPECTRAL CONTENT OF SUBSTRATE NOISE IN MIXED-SIGNAL INTEGRATED CIRCUITS Marc van Heijningen, John Compiet, Piet Wambacq, Stéphane Donnay and Ivo Bolsens IMEC

More information

EMC review for Belle II (Grounding & shielding plans) PXD DEPFET system

EMC review for Belle II (Grounding & shielding plans) PXD DEPFET system EMC review for Belle II (Grounding & shielding plans) PXD DEPFET system Outline 1. Introduction 2. Grounding strategy Implementation aspects 3. Noise emission issues Test plans 4. Noise immunity issues

More information

Course Introduction. Content 15 pages. Learning Time 30 minutes

Course Introduction. Content 15 pages. Learning Time 30 minutes Course Introduction Purpose This course discusses techniques for analyzing and eliminating noise in microcontroller (MCU) and microprocessor (MPU) based embedded systems. Objectives Learn about how packaging

More information

Data Sheet. ACFF-1024 ISM Bandpass Filter ( MHz) Description. Features. Specifications. Functional Block Diagram.

Data Sheet. ACFF-1024 ISM Bandpass Filter ( MHz) Description. Features. Specifications. Functional Block Diagram. ACFF-124 ISM Bandpass Filter (241 2482 MHz) Data Sheet Description The Avago ACFF-124 is a miniaturized Bandpass Filter designed for use in the 2.4 GHz Industrial, Scientific and Medical (ISM) band. The

More information

Chip Package - PC Board Co-Design: Applying a Chip Power Model in System Power Integrity Analysis

Chip Package - PC Board Co-Design: Applying a Chip Power Model in System Power Integrity Analysis Chip Package - PC Board Co-Design: Applying a Chip Power Model in System Power Integrity Analysis Authors: Rick Brooks, Cisco, ricbrook@cisco.com Jane Lim, Cisco, honglim@cisco.com Udupi Harisharan, Cisco,

More information

Rohde & Schwarz EMI/EMC debugging with modern oscilloscope. Ing. Leonardo Nanetti Rohde&Schwarz

Rohde & Schwarz EMI/EMC debugging with modern oscilloscope. Ing. Leonardo Nanetti Rohde&Schwarz Rohde & Schwarz EMI/EMC debugging with modern oscilloscope Ing. Leonardo Nanetti Rohde&Schwarz EMI debugging Agenda l The basics l l l l The idea of EMI debugging How is it done? Application example What

More information

QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY BUS SUPPLY QPI CONVERTER

QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY BUS SUPPLY QPI CONVERTER QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY EMI control is a complex design task that is highly dependent on many design elements. Like passive filters, active filters for conducted noise require careful

More information

Automotive EMC. IEEE EMC Society Melbourne Chapter October 13, 2010 By Mark Steffka IEEE EMCS Distinguished Lecturer

Automotive EMC. IEEE EMC Society Melbourne Chapter October 13, 2010 By Mark Steffka IEEE EMCS Distinguished Lecturer Automotive EMC IEEE EMC Society Melbourne Chapter October 13, 2010 By Mark Steffka IEEE EMCS Distinguished Lecturer Email: msteffka@ieee.org IEEE 1 Automotive Systems Past and Present Today s vehicles

More information

Automotive Systems Past and Present

Automotive Systems Past and Present Automotive EMC IEEE EMC Society Eastern North Carolina Section February 9, 2010 By Mark Steffka IEEE EMCS Distinguished Lecturer Email: msteffka@ieee.org IEEE 1 Automotive Systems Past and Present Today

More information

Design for Guaranteed EMC Compliance

Design for Guaranteed EMC Compliance Clemson Vehicular Electronics Laboratory Reliable Automotive Electronics Automotive EMC Workshop April 29, 2013 Design for Guaranteed EMC Compliance Todd Hubing Clemson University EMC Requirements and

More information

P603-1 / P750 set. RF conducted measurement IEC

P603-1 / P750 set. RF conducted measurement IEC User manual Probe set set RF conducted measurement IEC 61967-4 Copyright July 2016 LANGER GmbH 2016.07.28 User manual P603-1+P750 GM CS Kö.doc Table of contents: Page 1 General description 3 2 P603-1 probe

More information

FM Radio Transmitter & Receiver Modules

FM Radio Transmitter & Receiver Modules FM Radio Transmitter & Receiver Modules T5 / R5 Features Miniature SIL package Fully shielded Data rates up to 128kbits/sec Range up to 300 metres Single supply voltage Industry pin compatible QFMT5-434

More information

IC Decoupling and EMI Suppression using X2Y Technology

IC Decoupling and EMI Suppression using X2Y Technology IC Decoupling and EMI Suppression using X2Y Technology Summary Decoupling and EMI suppression of ICs is a complex system level engineering problem complicated by the desire for faster switching gates,

More information

Electromagnetic and Radio Frequency Interference (EMI/RFI) Considerations For Nuclear Power Plant Upgrades

Electromagnetic and Radio Frequency Interference (EMI/RFI) Considerations For Nuclear Power Plant Upgrades Electromagnetic and Radio Frequency Interference (EMI/RFI) Considerations For Nuclear Power Plant Upgrades November 9, 2016 Presented to: Presented by: Chad Kiger EMC Engineering Manager ckiger@ams-corp.com

More information

T est POST OFFICE BOX 1927 CUPERTINO, CA TEL E P H ONE (408) FAX (408) ARIES ELECTRONICS

T est POST OFFICE BOX 1927 CUPERTINO, CA TEL E P H ONE (408) FAX (408) ARIES ELECTRONICS G iga T est L abs POST OFFICE BOX 1927 CUPERTINO, CA 95015 TEL E P H ONE (408) 524-2700 FAX (408) 524-2777 ARIES ELECTRONICS BGA SOCKET (0.80MM TEST CENTER PROBE CONTACT) Final Report Electrical Characterization

More information

BIODEX MULTI- JOINT SYSTEM

BIODEX MULTI- JOINT SYSTEM BIODEX MULTI- JOINT SYSTEM CONFORMANCE TO STANDARDS 850-000, 840-000, 852-000 FN: 18-139 5/18 Contact information Manufactured by: Biodex Medical Systems, Inc. 20 Ramsey Road, Shirley, New York, 11967-4704

More information

OPEN TEM CELLS FOR EMC PRE-COMPLIANCE TESTING

OPEN TEM CELLS FOR EMC PRE-COMPLIANCE TESTING 1 Introduction Radiated emission tests are typically carried out in anechoic chambers, using antennas to pick up the radiated signals. Due to bandwidth limitations, several antennas are required to cover

More information

Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier

Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier He Huang, Alexandre Boyer, Sonia Ben Dhia, Bertrand Vrignon To cite this version: He Huang, Alexandre Boyer, Sonia

More information

PART TOP VIEW V EE 1 V CC 1 CONTROL LOGIC

PART TOP VIEW V EE 1 V CC 1 CONTROL LOGIC 19-1331; Rev 1; 6/98 EVALUATION KIT AVAILABLE Upstream CATV Driver Amplifier General Description The MAX3532 is a programmable power amplifier for use in upstream cable applications. The device outputs

More information

APPLICATION NOTE 735 Layout Considerations for Non-Isolated DC-DC Converters

APPLICATION NOTE 735 Layout Considerations for Non-Isolated DC-DC Converters Maxim > App Notes > AUTOMOTIVE GENERAL ENGINEERING TOPICS POWER-SUPPLY CIRCUITS PROTOTYPING AND PC BOARD LAYOUT Keywords: printed circuit board, PCB layout, parasitic inductance, parasitic capacitance,

More information

Predicting and Controlling Common Mode Noise from High Speed Differential Signals

Predicting and Controlling Common Mode Noise from High Speed Differential Signals Predicting and Controlling Common Mode Noise from High Speed Differential Signals Bruce Archambeault, Ph.D. IEEE Fellow, inarte Certified Master EMC Design Engineer, Missouri University of Science & Technology

More information

SN W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION FEATURES APPLICATIONS. Typical Application Circuit

SN W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION FEATURES APPLICATIONS. Typical Application Circuit 2.6W Mono Filterless Class-D Audio Power Amplifier DESCRIPTION The SN200 is a 2.6W high efficiency filter-free class-d audio power amplifier in a.5 mm.5 mm wafer chip scale package (WCSP) that requires

More information

T + T /13/$ IEEE 236. the inverter s input impedances on the attenuation of a firstorder

T + T /13/$ IEEE 236. the inverter s input impedances on the attenuation of a firstorder Emulation of Conducted Emissions of an Automotive Inverter for Filter Development in HV Networks M. Reuter *, T. Friedl, S. Tenbohlen, W. Köhler Institute of Power Transmission and High Voltage Technology

More information

Characterization of medical devices electromagnetic immunity to environmental RF fields.

Characterization of medical devices electromagnetic immunity to environmental RF fields. Characterization of medical devices electromagnetic immunity to environmental RF fields. INTRODUCTION The diffusion of personal communication devices and radio communication systems has strongly increased

More information

LF to 4 GHz High Linearity Y-Mixer ADL5350

LF to 4 GHz High Linearity Y-Mixer ADL5350 LF to GHz High Linearity Y-Mixer ADL535 FEATURES Broadband radio frequency (RF), intermediate frequency (IF), and local oscillator (LO) ports Conversion loss:. db Noise figure:.5 db High input IP3: 25

More information

Powered Traction Unit OPERATION MANUAL

Powered Traction Unit OPERATION MANUAL Powered Traction Unit OPERATION MANUAL CONTENTS Symbols Safety precautions Symbol for CAUTION Symbol for CONSULT INSTRUCTIONS FOR USE Symbol for SERIAL NUMBER Symbol for CATALOGUE NUMBER Symbol for AUTHORISED

More information

OnBoard SMD WLAN antenna

OnBoard SMD WLAN antenna Page 1 Rev 1.6 Application note and implementation guideline OnBoard SMD WLAN antenna Patent: SE537042 + Pending Page 2 Rev 1.6 Table of contents 1. General... 3 2. Intended applications... 3 3. Technical

More information

EMC of Analog Integrated Circuits

EMC of Analog Integrated Circuits Jean-Michel Redoute Michiel Steyaert EMC of Analog Integrated Circuits ^J Springer Contents 1. INTRODUCTION 1 1 The pioneers of wireless communication 1 2 Evolution of awareness of electromagnetic compatibility

More information

BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises

BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises I. EXERCISE NO 1 - Spot the PCB design errors Spot the six design errors in

More information

Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs

Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs Marc Veljko Thomas Tomasevic, Alexandre Boyer, Sonia Ben Dhia To cite this version: Marc Veljko Thomas Tomasevic,

More information