High Voltage Standard Rectifier

Transcription

1 High oltage Standard ectifier M I FA A.24 F Single Diode Part number DNAEMPZ Backside: anode 3 4 Features / Advantages: Applications: Package: TO-263 (D2Pak-H) Planar passivated chips ery low leakage current ery low forward voltage drop Improved thermal behaviour Diode for main rectification For single and three phase bridge configurations Industry standard outline ohs compliant Epoxy meets UL 94-0 High creepage distance between terminals 203 IXYS all rights reserved 20325a

2 ectifier Symbol SM M I I Definition T 25 C T 50 C atings min. typ. max. 20 F forward voltage drop I A T 25 C.26 F T C C thermal resistance junction to case 0.7 K/W FA max. non-repetitive reverse blocking voltage reverse current I F Conditions I F 60 A A I F 60 A T 25 C max. repetitive reverse blocking voltage T 25 C F0 threshold voltage T 75 C 0.83 for power loss calculation only r F slope resistance 3.4 mω thjc thch average forward current thermal resistance case to heatsink rectangular d 0.5 P tot total power dissipation T C 25 C 20 W I FSM max. forward surge current t 0 ms; (50 Hz), sine T 45 C 370 A t 8,3 ms; (60 Hz), sine 0 0 A t 0 ms; (50 Hz), sine T 50 C 35 A t 8,3 ms; (60 Hz), sine 0 3 A I²t value for fusing t 0 ms; (50 Hz), sine T 45 C 685 A²s t 8,3 ms; (60 Hz), sine A²s t 0 ms; (50 Hz), sine T 50 C 495 A²s t 8,3 ms; (60 Hz), sine A²s T 50 C C J junction capacitance 700 ; f MHz T 25 C 7 T 75 C Unit µa ma A K/W pf 203 IXYS all rights reserved 20325a

3 Package TO-263 (D2Pak-H) atings Symbol Definition Conditions min. typ. max. Unit I MS MS current per terminal 35 A T virtual junction temperature C T op operation temperature C T stg storage temperature C Weight.5 g F C mounting force with clip N d Spp/App d Spb/Apb creepage distance on surface striking distance through air terminal to terminal terminal to backside mm mm Product Marking Part number Part No. Logo Assembly Line Date Code Assembly Code XXXXXXXXX IXYS Zyyww D N A EM PZ Diode High oltage Standard ectifier (> 2000) Current ating [A] Single Diode everse oltage [] TO-263AB (D2Pak) (2H) Ordering Standard Part Number Marking on Product Delivery Mode Quantity Code No. DNAEMPZ DNAEMPZ Tape & eel Similar Part Package oltage class DNAEPZ TO-263AB (D2Pak) (2H) DNAEPA TO-220AC DNAEFE DNAEIY i4-pac (2H) TO-262 (I2Pak) (2H) Equivalent Circuits for Simulation * on die level T 75 C I ectifier max threshold voltage max slope resistance * 0.2 mω 203 IXYS all rights reserved 20325a

4 Outlines TO-263 (D2Pak-H) E e 3 2x e L W D c2 A L 0.92 (0.4) A2 A c mm (Inches) H 2x b2 4 E Supplier Option D D2 2x b Dim. Millimeter Inches min max min max A A A2 typ typ b b c c D D D E E e e 2,54 BSC ,00 BSC 0.69 H L L W typ. typ All dimensions conform with and/or within JEDEC standard. 3.8 (0.50).78 (0.07) 3.05 (0.20) 9.02 (0.355) 2.54 (0.00) ecommended min. foot print IXYS all rights reserved 20325a

5 ectifier I F I FSM 250 T 45 C I 2 t T 45 C [A] 20 [A] 200 [A 2 s] T 50 C T 50 C T 50 C T 25 C T 25 C F [] Fig. Forward current versus voltage drop per diode 50 Hz, 80% M t [s] t [ms] Fig. 2 Surge overload current Fig. 3 I 2 t versus time per diode 50 P tot 20 [W] 0 dc thka 0.6 K/W 0.8 K/W.0 K/W 2.0 K/W 4.0 K/W 8.0 K/W I F(A)M 20 [A] 0 dc I F(A)M [ A] Tamb [ C] 0.8 Fig. 4 Power dissipation vs. direct output current & ambient temperature T C [ C] Fig. 5 Max. forward current versus case temperature 0.6 Z thjc 0.4 [K/W] 0.2 Constants for Z thjc calculation: i thi (K/W) t i (s) t [ms] Fig. 6 Transient thermal impedance junction to case 203 IXYS all rights reserved 20325a

6 Mouser Electronics Authorized Distributor Click to iew Pricing, Inventory, Delivery & Lifecycle Information: IXYS: DNAEMPZ