Low Voltage 1:15 Differential ECL/PECL Clock Divider and Fanout Buffer

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1 Freescale Semiconductor Technical Data Low Voltage 1:15 Differential ECL/PECL Clock Divider and Fanout Buffer The is a bipolar monolithic differential clock fanout buffer. Designed for most demanding clock distribution systems, the supports various applications that require the distribution of precisely aligned differential clock signals. Using SiGe technology and a fully differential architecture, the device offers very low skew outputs and superior digital signal characteristics. Target applications for this clock driver is high performance clock distribution in computing, networking and telecommunication systems. Rev 4, 04/2005 LOW-VOLTAGE 1:15 DIFFERENTIAL ECL/PECL CLOCK DIVIDER AND FANOUT DRIVER Features 15 differential ECL/PECL outputs (4 output banks) 2 selectable differential ECL/PECL inputs Selectable 1 or 2 frequency divider 130 ps maximum device skew Supports DC to 3 GHz input frequency Single 3.3 V, 3.3 V, 2.5 V or 2.5 V supply Standard 52-lead LQFP package with exposed pad for enhanced thermal characteristics Supports industrial temperature range Pin and function compatible to the MC100EP lead Pb-free Package Available Functional Description TB SUFFIX 52-LEAD LQFP PACKAGE EXPOSED PAD CASE 1336A-01 AE SUFFIX 52-LEAD LQFP PACKAGE Pb-FREE PACKAGE CASE 1336A-01 The is designed for low skew clock distribution systems and supports clock frequencies up to 3 GHz. The CLK0 and CLK1 inputs can be driven by ECL or PECL compatible signals. Each of the four output banks of two, three, four and six differential clock output pairs can be independently configured to distribute the input frequency or 2 of the input frequency. The FSELA, FSELB, FSELC, FSELD, and CLK_SEL are asychronous control inputs. Any changes of the control inputs require a MR pulse for resynchronization of the 2 outputs. For the functionality of the MR control input, see Figure 5. Functional Diagram. In order to meet the tight skew specification of the device, both outputs of a differential output pair should be terminated, even if only one output is used. In the case where not all ten outputs are used, the output pairs on the same package side as the parts being used on that side should be terminated. The can be operated from a single 3.3 V or 2.5 V supply. As most other ECL compatible devices, the supports positive (PECL) and negative (ECL) supplies. The is pin and function compatible to the MC100EP222. Freescale Semiconductor, Inc., All rights reserved.

2 FSELA CLK0 CLK0 0 1 QA0 QA1 QC0 QC0 QC1 QC1 QC2 QC2 QC3 QC3 NC NC CLK1 CLK1 CLK_SEL FSELB FSELC MR QB0 QB1 QB2 QC0 QC1 QC2 QC3 QD0 QD1 QD2 QD3 QB2 QB2 QB1 QB1 QB0 QB0 QA1 QA1 QA0 QA QD0 QD0 QD1 QD1 QD2 QD2 QD3 QD3 QD4 QD4 QD5 QD5 FSELD QD4 QD5 MR FSELA FSELB CLK0 CLK0 CLK_SEL CLK1 CLK1 V BB FSELC FSELD V BB Figure 1. Logic Diagram Figure Lead Package Pinout (Top View) Table 1. Function Table Control Pin 0 1 FSELA (asynchronous) 1 2 FSELB (asynchronous) 1 2 FSELC (asynchronous) 1 2 FSELD (asynchronous) 1 2 CLK_SEL (asynchronous) CLK0 CLK1 MR (asynchronous) Active Reset. Q X = L and Q X = H. 2 Freescale Semiconductor

3 Table 2. Pin Configurations Pin I/O Type Description CLK0, CLK0 Input ECL/PECL Differential reference clock signal input CLK1, CLK1 Input ECL/PECL Alternative differential reference clock signal input FSELA, FSELB, FSELC, FSELD Input ECL/PECL Selection output frequency divider for bank A, B, C and D MR Input ECL/PECL Reset CLK_SEL Input ECL/PECL Clock reference select input QA[0:1], QA[0:1] Output ECL/PECL Bank A differential outputs QB[0:2], QB[0:2] Output ECL/PECL Bank B differential outputs QC[0:3], QC[0:3] Output ECL/PECL Bank C differential outputs QD[0:5], QD[0:5] Output ECL/PECL Bank D differential outputs V BB Output DC Reference voltage output for single ended ECL or PECL operation (1) Power supply Negative power supply Power supply Positive power supply. All pins must be connected to the positive power supply for correct DC and AC operation. 1. In ECL mode (negative power supply mode), is either 3.3 V or 2.5 V and is connected to GND (0 V). In PECL mode (positive power supply mode), is connected to GND (0 V) and is either +3.3 V or +2.5 V. In both modes, the input and output levels are referenced to the most positive supply ( ). Table 3. Absolute Maximum Ratings (1) Symbol Characteristics Min Max Unit Condition Supply Voltage V V IN DC Input Voltage V V OUT DC Output Voltage V I IN DC Input Current ±20 ma I OUT DC Output Current ±50 ma T S Storage Temperature C T FUNC Functional Temperature Range T A = 40 T J = +110 C 1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated conditions is not implied. Table 4. General Specifications Symbol Characteristics Min Typ Max Unit Condition V TT Output Termination Voltage 2 (1) MM ESD Protection (Machine Model) 175 V HBM ESD Protection (Human Body Model) 4000 V CDM ESD Protection (Charged Device Model) 2000 V LU Latch-Up Immunity 200 ma C IN Input Capacitance 4.0 pf Inputs θ JA, θ JC θ JB Thermal Resistance (junction-to-ambient, junction-to-board, junction-to-case) T J Operating Junction Temperature (2) (continuous operation) MTBF = 9.1 years See Table 9. Thermal Resistance 1. Output termination voltage V TT = 0 V for = 2.5 V operation is supported but the power consumption of the device will increase. 2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are specified up to 110 C junction temperature allowing the to be used in applications requiring industrial temperature range. It is recommended that users of the employ thermal modeling analysis to assist in applying the junction temperature specifications to their particular application. Freescale Semiconductor 3 V C/W C

4 Table 5. PECL DC Characteristics ( = 2.5 V ± 5% or = 3.3 V ± 5%, = GND, T J = 0 C to +110 C) Symbol Characteristics Min Typ Max Unit Condition Clock Input Pair CLK0, CLK0, CLK1, CLK1 (PECL differential signals) V PP Differential Input Voltage (1) V CMR Differential Cross Point Voltage (2) V Differential operation V Differential operation I IN Input Current (1) ±150 µa V IN = V IL or V IN = V IH Clock Inputs MR, CLK_SEL, FSELA, FSELB, FSELC, FSELD (PECL single ended signals) V IH Input Voltage High V V IL Input Voltage Low V I IN Input Current (3) PECL Clock Outputs (QA[0:1], QA[0:1], QB[0:2], QB[0:2], QC[0:3], QC[0:3], QD[0:5], QD[0:5] ±150 µa V IN = V IL or V IN = V IH V OH Output High Voltage V I OH = 30 ma (4) V OL Output Low Voltage V I OL = 5 ma (4) Supply Current and V BB I EE (5) Maximum Quiescent Supply Current without Output Termination Current ma pins V BB Output Reference Voltage V I BB = 0.4 ma 1. V PP (DC) is the minimum differential input voltage swing required to maintain device functionality. 2. V CMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the V CMR (DC) range and the input swing lies within the V PP (DC) specification. 3. Input have internal pullup/pulldown resistors which affect the input current. 4. Equivalent to a termination of 50 Ω to V TT. 5. I CC calculation: I CC = (number of differential output used) x (I OH + I OL ) + I EE I CC = (number of differential output used) x (V OH V TT ) R load + (V OL V TT ) R load + I EE. Table 6. ECL DC Characteristics ( = 2.5 V ± 5% or = 3.3 V ± 5%, = GND, T J = 0 C to +110 C) Symbol Characteristics Min Typ Max Unit Condition Clock Input Pair CLK0, CLK0, CLK1, CLK1 (ECL differential signals) V PP Differential Input Voltage (1) V CMR Differential Cross Point Voltage (2) V Differential operation V Differential operation I IN Input Current (1) ±150 µa V IN = V IL or V IN = V IH Clock Inputs MR, CLK_SEL, FSELA, FSELB, FSELC, FSELD (PECL single ended signals) V IH Input Voltage High V V IL Input Voltage Low V I IN Input Current (3) ECL Clock Outputs (QA[0:1], QA[0:1], QB[0:2], QB[0:2], QC[0:3], QC[0:3], QD[0:5], QD[0:5] ±150 µa V IN = V IL or V IN = V IH V OH Output High Voltage V I OH = -30 ma (4) V OL Output Low Voltage V I OL = -5 ma (4) Supply Current and V BB I EE (5) Maximum Quiescent Supply Current without Output Termination Current ma pins V BB Output Reference Voltage V I BB = 0.4 ma 1. V PP (DC) is the minimum differential input voltage swing required to maintain device functionality. 2. V CMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the V CMR (DC) range and the input swing lies within the V PP (DC) specification. 3. Input have internal pullup/pulldown resistors which affect the input current. 4. Equivalent to a termination of 50 Ω to V TT. 5. I CC calculation: I CC = (number of differential output used) x (I OH + I OL ) + I EE I CC = (number of differential output used) x (V OH V TT ) R load + (V OL V TT ) R load + I EE. 4 Freescale Semiconductor

5 Table 7. AC Characteristics (ECL: = 3.3 V ± 5% or = 2.5 V ± 5%, = GND) or (PECL: = 3.3 V ± 5% or = 2.5 V ± 5%, = GND, T J = 0 C to +110 C) (1) Symbol Characteristics Min Typ Max Unit Condition Clock Input Pair CLK0, CLK0, CLK1, CLK1 (PECL or ECL differential signals) V PP Differential Input Voltage (2) (peak-to-peak) V CMR Differential Input Crosspoint Voltage (3) PECL ECL V V f CLK Input Frequency MHz Differential ECL/PECL Clock Outputs (QA[0:1], QA[0:1], QB[0:2], QB[0:2], QC[0:3], QC[0:3], QD[0:5], QD[0:5] t PD Propagation Delay CLK0 or CLK1 to Qx MR to Qx V O(P-P) Differential Output Voltage (peak-to-peak) f O < 1.0 GHz f O < 2.0 GHz t sk(o) Output-to-Output Skew within QA[0:1] within QB[0:2] within QC[0:3] within QD[0:5] 1. AC characteristics apply for parallel output termination of 50 Ω to V TT. 2. V PP (AC) is the minimum differential ECL/PECL input voltage swing required to maintain AC characteristics including tpd and device-to-device skew. 3. V CMR (AC) is the crosspoint of the differential ECL/PECL input signal. Normal AC operation is obtained when the crosspoint is within the V CMR (AC) range and the input swing lies within the V PP (AC) specification. Violation of V CMR (AC) or V PP (AC) impacts the device propagation delay, device and part-to-part skew. 4. Output pulse skew is the absolute difference of the propagation delay times: t plh t phl. V V ps ps TBD TBD mv mv ps ps ps ps Differential any output 130 ps t sk(pp) Output-to-Output Skew (part-to-part) 300 ps Differential t JIT(CC) Output Cycle-to-Cycle Jitter RMS (1σ) 1 ps t SK(P) DC O Output Pulse Skew (4) Output Duty Cycle f REF < 0.1 GHz f REF < 1.0 GHz f REF < 2.0 GHz ps % % % Differential DC REF = 50% DC REF = 50% DC REF = 50% t r, t f Output Rise/Fall Time ps 20% to 80% Freescale Semiconductor 5

6 Differential Pulse Generator Z = 50 Ω Z O = 50 Ω R T = 50 Ω DUT Z O = 50 Ω R T = 50 Ω V TT V TT Figure 3. AC Test Reference CLK N CLK N MR 50% Q X Q X tpd t PD (CLK to Q) (MR to Q) Figure 4. t PD Measurement Waveform Asynchronous Reset Functional Diagram APPLICATIONS INFORMATION CLK N MR Q X ( 2) Q X ( 1) Figure 5. Functional Diagram 6 Freescale Semiconductor

7 APPLICATIONS INFORMATION Understanding the Junction Temperature Range of the To make the optimum use of high clock frequency and low skew capabilities of the, the is specified, characterized and tested for the junction temperature range of T J =0 C to +110 C. Because the exact thermal performance depends on the PCB type, design, thermal management and natural or forced air convection, the junction temperature provides an exact way to correlate the application specific conditions to the published performance data of this data sheet. The correlation of the junction temperature range to the application ambient temperature range and vice versa can be done by calculation: T J = T A + R thja P tot Assuming a thermal resistance (junction to ambient) of 17 C/W (2s2p board, 200 ft/min airflow, see Table 9. Thermal Resistance) and a typical power consumption of 1026 mw (all outputs terminated 50 ohms to V TT, =3.3V, frequency independent), the junction temperature of the is approximately T A +17 C, and the minimum ambient temperature in this example case calculates to 17 C (the maximum ambient temperature is 93 C, see Table 8). Exceeding the minimum junction temperature specification of the does not have a significant impact on the device functionality. However, the continuous use the at high ambient temperatures requires thermal management to not exceed the specified maximum junction temperature. Please see the application note AN1545 for a power consumption calculation guideline. Table 8. Ambient Temperature Ranges (P tot = 1026 mw) Maintaining Lowest Device Skew The guarantees low output-to-output bank skew of 130 ps and a part-to-part skew of max. 300 ps. To ensure low skew clock signals in the application, both outputs of any differential output pair need to be terminated identically, even if only one output is used. When fewer than all nine output pairs are used, identical termination of all output pairs within the output bank is recommended. This will reduce the device power consumption while maintaining minimum output skew. Power Supply Bypassing The is a mixed analog/digital product. The differential architecture of the supports low noise signal operation at high frequencies. In order to maintain its superior signal quality, all pins should be bypassed by high-frequency ceramic capacitors connected to GND. If the spectral frequencies of the internally generated switching noise on the supply pins cross the series resonant point of an individual bypass capacitor, its overall impedance begins to look inductive and thus increases with increasing frequency. The parallel capacitor combination shown ensures that a low impedance path to ground exists for frequencies well above the noise bandwidth nf 0.1 nf Figure 6. Power Supply Bypass R thja (2s2p board) T A, Min (1) T A, Max Natural convection 20 C/W 21 C 89 C 100 ft/min 18 C/W 18 C 92 C 200 ft/min 17 C/W 17 C 93 C 400 ft/min 16 C/W 16 C 94 C 800 ft/min 15 C/W 15 C 95 C 1. The device function is guaranteed from T A = 40 C to T J = 110 C. Freescale Semiconductor 7

8 APPLICATIONS INFORMATION Using the Thermally Enhanced Package of the The uses a thermally enhanced exposed pad (EP) 52 lead LQFP package. The package is molded so the lead frame is exposed at the surface of the package bottom side. The exposed metal pad will provide the low thermal impedance supporting the power consumption of the high-speed bipolar integrated circuit and eases the power management task for the system design. A thermal land pattern on the printed circuit board and thermal vias are recommended in order to take advantage of the enhanced thermal capabilities of the. Direct soldering of the exposed pad to the thermal land will provide an efficient thermal path. In multilayer board designs, thermal vias thermally connect the exposed pad to internal copper planes. Number of vias, spacing, via diameters and land pattern design depend on the application and the amount of heat to be removed from the package. A nine thermal via array, arranged in a 3 x 3 array and using a 1.2 mm pitch in the center of the thermal land is a requirement for applications on multi-layer boards. The recommended thermal land design comprises a 3 x 3 thermal via array as illustrated in Figure 7. Recommended Thermal Land Pattern, providing an efficient heat removal path. All units mm should be subdivided as illustrated in Figure 8. Recommended Solder Mask Openings. For the nominal package standoff 0.1 mm, a stencil thickness of 5 to 8 mils should be considered Thermal via array (3x3), 1.2 mm pitch, 0.3 mm diameter 0.2 Figure 8. Recommended Solder Mask Openings For thermal system analysis and junction temperature calculation the thermal resistance parameters of the package is provided: 4.8 Table 9. Thermal Resistance (1) All units mm Exposed pad land pattern 4.8 Convection LFPM R THJA (2) C/W R THJA (3) C/W R THJC C/W R THJB (4) C/W Natural (5) 29 (6) 16 Thermal via array (3x3), 1.2 mm pitch, 0.3 mm diameter Exposed pad land pattern Figure 7. Recommended Thermal Land Pattern The via diameter is should be approximately 0.3 mm with 1 ounce copper via barrel plating. Solder wicking inside the via resulting in voids during the solder process must be avoided. If the copper plating does not plug the vias, stencil print solder paste onto the printed circuit pad. This will supply enough solder paste to fill those vias and not starve the solder joints. The attachment process for exposed pad package is equivalent to standard surface mount packages. Figure 8. Recommended Solder Mask Openings illustrates a recommend solder mask opening with respect to the recommended 3 x 3 thermal via array. Because a large solder mask opening may result in a poor release, the opening 1. Applicable for a 3 x 3 thermal via array 2. Junction to ambient, four conductor layer test board (2S2P), per JES51-7 and JESD Junction to ambient, single layer test board, per JESD Junction to board, four conductor layer test board (2S2P) per JESD Junction to exposed pad 6. Junction to top of package It is recommended to employ thermal modeling analysis to assist in applying the general recommendations to their particular application. The exposed pad of the package does not have an electrical low impedance path to the substrate of the integrated circuit and its terminals. The thermal land should be connected to GND through connection of internal board layers. 8 Freescale Semiconductor

9 NOTES Freescale Semiconductor 9

10 NOTES 10 Freescale Semiconductor

11 PACKAGE DIMENSIONS PIN 1 INDEX A X H A-B D D X 13 TIPS 0.2 C A-B D 7 B R (1) VIEW AA X (0.2) 0 MIN 0.20 R GAUGE PLANE 7 0 X=A, B OR D C L B B VIEW Y 48X 0.65 J H C SEATING PLANE 1.7 MAX 4X (12 ) 52X X (12 ) 0.08 M C A-B D VIEW AA 52X 0.1 C J 8 PLATING (0.3) BASE METAL SECTION B-B EXPOSED PAD NOTES: DIMENSIONS ARE IN MILLIMETERS. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H. DIMENSION TO BE DETERMINED AT SEATING PLANE C. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 mm. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD SHALL NOT BE LESS THAN 0.07 mm. THIS DIMENSION DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25mm PER SIDE. THIS DIMENSION IS MAXIMUM PLSTIC BODY SIZE DIMENSION INCLUDING MOLD MISMATCH. EXACT SHAPE OF EACH CORNER IS OPTIONAL. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10mm AND 0.25mm FROM THE LEAD TIP. VIEW J-J VIEW Y CASE 1336A-01 ISSUE O 52-LEAD LQFP PACKAGE Freescale Semiconductor 11

12 How to Reach Us: Home Page: USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH N. Alma School Road Chandler, Arizona or Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen Muenchen, Germany (English) (English) (German) (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo Japan or support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado or Fax: LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customer s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc All rights reserved. Rev. 4 04/2005

MC100ES6222 LOW VOLTAGE, 1:15 DIFFERENTIAL ECL/PECL CLOCK DIVIDER AND FANOUT BUFFER

MC100ES6222 LOW VOLTAGE, 1:15 DIFFERENTIAL ECL/PECL CLOCK DIVIDER AND FANOUT BUFFER LOW VOLTAGE, :5 DIFFERENTIAL ECL/PECL CLOCK DIVIDER AND FANOUT BUFFER The MC00ES222 is a bipolar monolithic differential clock fanout buffer. Designed for most demanding clock distribution systems, the