"Half-Bridge" IGBT INT-A-PAK (Ultrafast Speed IGBT), 200 A

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1 INT-A-PAK "Half-Bridge" IGBT INT-A-PAK FEATURES Vishay High Power Products Generation 4 IGBT technology Ultrafast: Optimized for high speed 8 khz to 4 khz in hard switching, > 2 khz in resonant mode Very low conduction and switching losses HEXFRED antiparallel diodes with ultrasoft recovery Industry standard package UL approved file E78996 Compliant to RoHS directive 22/95/EC Designed and qualified for industrial level PRODUCT SUMMARY V CES I C DC V CE(on) at 2 A, 25 C 6 V 265 A 1.74 V BENEFITS Increased operating efficiency Direct mounting to heatsink Performance optimized for power conversion: UPS, SMPS, welding Low EMI, requires less snubbing ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS Collector to emitter voltage V CES 6 V T C = 25 C 265 Continuous collector current I C T C = 67 C 2 Pulsed collector current I CM 4 A Peak switching current I LM 4 Peak diode forward current I FM 4 Gate to emitter voltage ± 2 RMS isolation voltage V ISOL Any terminal to case, t = 1 min 25 V T C = 25 C 625 Maximum power dissipation P D T C = 85 C 325 W ELECTRICAL SPECIFICATIONS ( = 25 C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Collector to emitter breakdown voltage V BR(CES) = V, I C = 1 ma = 15 V, I C = 2 A Collector to emitter voltage V CE(on) = 15 V, I C = 2 A, = 125 C V Gate threshold voltage (th) I C =.25 ma Temperature coeff. of threshold voltage Δ(th) /Δ V CE =, I C =.25 ma mv/ C Forward transconductance g fe V CE = 2 V, I C = 2 A S = V, V CE = 6 V Collector to emitter leakage current I CES = V, V CE = 6 V, = 125 C ma I C = 2 A, = V Diode forward voltage drop V FM I C = 2 A, = V, = 125 C V Gate to emitter leakage current I GES = ± 2 V - - ± 25 na Document Number: For technical questions, contact: indmodules@vishay.com Revision: 4-May-1 1

2 Vishay High Power Products"Half-Bridge" IGBT INT-A-PAK SWITCHING CHARACTERISTICS ( = 25 C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS Total gate charge Q g IC = 2 A Gate to emitter charge Q ge I C = 27 A nc Gate to collector charge Q gc = 15 V Turn-on delay time t d(on) Rise time t r IC = 2 A Turn-off delay time t d(off) V CC = 36 V ns Fall time t f = ± 15 V = 25 C Turn-on switching energy E on R g1 = 15 Ω Turn-off switching energy E off R g2 = Ω mj Total switching energy E ts Turn-on delay time t d(on) Rise time t r IC = 2 A Turn-off delay time t d(off) V CC = 36 V ns Fall time t f = ± 15 V = 125 C Turn-on switching energy E on R g1 = 15 Ω Turn-off switching energy E off R g2 = Ω mj Total switching energy E ts Input capacitance C ies VGE = V Output capacitance C oes V CC = 3 V pf Reverse transfer capacitance C res f = 1. MHz Diode reverse recovery time t rr ns Diode peak reverse current I I C = 2 A rr A V CC = 36 V Diode recovery charge Q rr di/dt = 13 A/μs μc Diode peak rate of fall of recovery during t b di (rec)m /dt A/μs THERMAL AND MECHANICAL SPECIFICATIONS PARAMETER SYMBOL MIN. TYP. MAX. UNITS Operating junction temperature range C Storage temperature range T Stg IGBT Junction to case R thjc Diode C/W Case to sink per module R thcs case to heatsink Mounting torque Nm case to terminal 1, 2, Weight g For technical questions, contact: indmodules@vishay.com Document Number: Revision: 4-May-1

3 "Half-Bridge" IGBT INT-A-PAKVishay High Power Products 14 Load Current (A) Square wave: 6 % of rated voltage I For both: Duty cycle: 5 % = 125 C T sink = 9 C Gate drive as specified Power Dissipation = 12 W 2 Ideal diodes f - Frequency (khz) Fig. 1 - Typical Load Current vs. Frequency (Load Current = I RMS of Fundamental) IC - Collector-to-Emitter Current (A) = 15V 5 µs pulse width = 125 C = 25 C TC - Case Temperature ( C) V CE - Collector-to-Emitter Voltage (V) Fig. 2 - Typical Output Characteristics Maximum DC Collector Current (A) Fig. 4 - Case Temperature vs. Maximum Collector Current IC - Collector-to-Emitter Current (A) 1 = 2 V 5 µs pulse width = 125 C = 25 C VCE - Collector-to-Emitter Voltage (V) A 2 A A Gate-to-Emitter Voltage (V) Fig. 3 - Typical Transfer Characteristics Junction Temperature ( C) Fig. 5 - Typical Collector to Emitter Voltage vs. Junction Temperature Document Number: For technical questions, contact: indmodules@vishay.com Revision: 4-May-1 3

4 Vishay High Power Products"Half-Bridge" IGBT INT-A-PAK 1 Thermal Response (ZthJC ).1.1 D = Single pulse (thermal response).1 1E t 1 - Rectangular Pulse Duration (s) Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction to Case VCE - Gate-to-Emitter Voltage (V) 2 V CC = 4 V I C = 135 A Total Switching Losses (mj) V CC = 36 V = 125 C = 15 V Rg1 = 15 Ω Rg2 = Ω Q G - Total gate Charge (nc) I C - Collector-to-Emitter Current (A) Fig. 7 - Typical Gate Charge vs. Gate to Emitter Voltage Fig. 9 - Typical Switching Losses vs. Collector to Emitter Current Total Switching Losses (mj) V cc = 36 V = 125 C = 15 V I c = 2 A IC - Collector-to-Emitter Current (A) = 2 V Safe operating area R G - Gate Resistance (Ω) Fig. 8 - Typical Switching Losses vs. Gate Resistance V CE - Collector-to-Emitter Voltage (V) Fig. 1 - Reverse Bias SOA For technical questions, contact: indmodules@vishay.com Document Number: Revision: 4-May-1

5 "Half-Bridge" IGBT INT-A-PAKVishay High Power Products 2 I F - Instantaneous Forward Current (A) = 25 C = 125 C trr (ns) A, 125 C 2 A, 125 C A, 125 C 4 A, 25 C 2 A, 25 C A, 2 5 C V FM - Forward Voltage Drop (V) Fig Typical Forward Voltage Drop vs. Instantaneous Forward Current di F/ dt (A/µs) Fig Typical Reverse Recovery Time vs. di F /dt 2 25 QRR (nc) 15 4 A, 125 C 2 A, 125 C A, 125 C 4 A, 25 C I RRM (A) A, 125 C 2 A, 125 C A, 125 C 5 2 A, 25 C A, 25 C 5 4 A, 25 C 2 A, 25 C A, 25 C di F/ dt (A/µs) Fig Typical Stored Charge vs. di F /dt di F/ dt (A/µs) Fig Typical Reverse Recovery vs. di F /dt Document Number: For technical questions, contact: indmodules@vishay.com Revision: 4-May-1 5

6 Vishay High Power Products"Half-Bridge" IGBT INT-A-PAK GATE VOLTAGE D.U.T. 1% +Vg +Vg Vce DUT VOLTAGE AND CURRENT 1% Ic Vcc 9% Ic Ipk Ic td(on) tr 5% Vce Vce Ic dt Vce ie dt t2 Eon = t1 t1 t2 Fig. 15a - Test Circuit for Measurement of I LM, E on, E off(diode), t rr, Q rr, I rr, t d(on), t r, t d(off), t f Fig. 15c - Test Waveforms for Circuit of Fig. 18a, Defining E on, t d(on), t r +Vge 9% Vge Ic trr Ic dt trr Qrr id dt = tx Ic 1% Vce Vce Ic 9% Ic 5% Ic Vpk tx 1% Vcc Irr 1% Irr Vcc td(off) tf DIODE RECOVERY WAVEFORMS t1+5µs Eoff = Vce ic dt t1 Vce Ic dt DIODE REVERSE RECOVERY ENERGY t3 Vd Ic dt t4 Erec Vd id dt = t3 t4 t1 t2 Fig. 15b - Test Waveforms for Circuit of Fig. 18a, Defining E off, t d(off), t f Fig. 15d - Test Waveforms for Circuit of Fig. 18a, Defining E rec, t rr, Q rr, I rr Vg GATE SIGNAL DEVICE UNDER TEST CURRENT D.U.T. VOLTAGE IN D.U.T. CURRENT IN D1 t t1 t2 Fig. 15e - Macro Waveforms for Figure 18a's Test Circuit For technical questions, contact: indmodules@vishay.com Document Number: Revision: 4-May-1

7 "Half-Bridge" IGBT INT-A-PAKVishay High Power Products V L V * c D.U.T. - 48V R L = 48V 4 X C 5V 6µF V Fig Clamped Inductive Load Test Circuit Fig Pulsed Collector Current Test Circuit ORDERING INFORMATION TABLE Device code GA 2 T S 6 U PbF Essential part number IGBT modules 2 - Current rating (2 = 2 A) 3 - Circuit configuration (T = Half bridge) 4 - INT-A-PAK 5 - Voltage code (6 = 6 V) 6 - Speed/type (U = Ultrafast IGBT) 7 - PbF = Lead (Pb)-free CIRCUIT CONFIGURATION 1 S1 S LINKS TO RELATED DOCUMENTS Dimensions Document Number: For technical questions, contact: indmodules@vishay.com Revision: 4-May-1 7

8 DIMENSIONS in millimeters (inches) INT-A-PAK IGBT Outline Dimensions Vishay Semiconductors (.67) 23 (.91) 23 (.91) (.56) 5 (.2) 35 (1.38) 14.5 (.57) (1.18) 9 (.33) 28 (1.1) 29 (1.15) 7 (.28) Ø 6.5 (Ø.25) 2.8 x.8 (.11 x.3) 8 (3.15) 3 screws M6 x 1 66 (2.6) 94 (3.7) 37 (1.44) Revision: 27-Mar-13 1 Document Number: For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

9 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 211/65/EU of The European Parliament and of the Council of June 8, 211 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 22/95/EC. We confirm that all the products identified as being compliant to Directive 22/95/EC conform to Directive 211/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS79A standards. Please note that some Vishay documentation may still make reference to the IEC definition. We confirm that all the products identified as being compliant to IEC conform to JEDEC JS79A standards. Revision: 2-Oct-12 1 Document Number: 9

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