SMC3535K. Single P-Channel MOSFET FEATURES VDS = -30V, ID = -5.8A DESCRIPTION PART NUMBER INFORMATION APPLICATIONS
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1 Single P-Channel MOSFET ESCRIPTION SMC33 is the P-Channel logic enhancement mode power field effect transistor is produced using high cell density. advanced trench technology to provide excellent RS(ON), low gate charge and operation gate as.v. This device is suitable for use as a load switch or other general applications. PART NUMBER INFORMATION SMC 33 K - TR G a b c d e a : Company name. b : Product Serial number. c : Package code K:SOT-89 d : Handling code TR:Tape&Reel e : Green produce code G:RoHS Compliant FEATURES VS = -3V, I = -.8A RS(ON)=mΩ(Typ.)@VGS=-V RS(ON)=mΩ(Typ.)@VGS=-.V RS(ON)=6mΩ(Typ.)@VGS=-.V Fast switch Low gate charge High power and current handling capability APPLICATIONS Portable Equipment Battery Powered System C-C Power Management G S G SOT-89 S ABSOLUTE MAXIMUM RATINGS (TA = C Unless otherwise noted ) Symbol Parameter Rating Units VSS rain-source Voltage -3 V VGSS Gate-Source Voltage ± V -.8 A I Continuous rain Current TA=7 C -.6 A IM Pulsed rain Current A -3 A.7 W P Power issipation B TA=7 C. W TJ Operation Junction Temperature -/ C TSTG Storage Temperature Range -/ C THERMAL RESISTANCE Symbol Parameter Typ Max Units RθJA Thermal Resistance Junction to Ambient B t s Thermal Resistance Junction to Ambient BC Steady-State 7 C/W
2 ELECTRICAL CHARACTERISTICS(TA = C Unless otherwise noted ) Symbol Parameter Condition Min Typ Max Unit Static Parameters BVSS rain-source Breakdown Voltage VGS=V, I=-μA -3 V RS(ON) rain-source On-Resistance VGS(th) Gate Threshold Voltage VS=VGS, I=-μA V IGSS Gate Leakage Current VS=V, VGS=±V ± na ISS Zero Gate Voltage rain Current VS=-3V, VGS=V, TJ= C - VS=-V, VGS=V, TJ=7 C - μa VGS=-.V, I=-A 6 mω VGS=-V, I=-.8A 8 VGS=-.V, I=-3A 6 78 Gfs Forward Transconductance VS=-V, I=-.8A 3 S iode Characteristics VS iode Forward Voltage IS=-A, VGS=V V IS Continuous Source Current -.9 A trr Reverse Recovery Time 6.8 ns IS=-.8A, dl/dt=a/μs Qrr Reverse Recovery Charge 9.8 nc ynamic and Switching Parameters Qg Total Gate Charge (V) 8.3 Qg Qgs Total Gate Charge (.V) Gate-Source Charge VS=-V, VGS=-V, I=-.8A Qgd Gate-rain Charge Ciss Input Capacitance Coss Output Capacitance VS=-V, VGS=V, f=mhz 8 Crss Reverse Transfer Capacitance 8 td(on). Turn-On Time tr V=-V, VGEN=-V,.9 td(off) RG=6Ω, I=-A Turn-Off Time tf.8 Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged. A. Pulsed width limited by maximum junction temperature, TJ(MAX)= C. B. The value of RθJA is measured with the device mounted on in FR- board in a still air environment with maximum junction temperature TJ(MAX)= C (initial temperature ). C. TJ(MAX)= C,using junction-to-case thermal resistance (RθJC) is more useful in additional heat sinking is used. 77 nc pf ns The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet.
3 Normalized Threshold Voltage Ptot-Power(W) -VGS(V) Capacitance(pF) RS(ON)(mΩ) TYPICAL CHARACTERISTICS VGS=-3V VGS=-,-.,-6,-V VGS=-.V 8 VGS=-.V VGS=-.8V 6 VGS=-.V VGS=-.V VGS=-.V 3 VGS=-V 8 6 -VS-rain Source Voltage(V) Output Characteristics rain-source On Resistance 8 VS=-V I=-.8A Ciss 8 6 Qg-Gate Charge(nC) Gate Charge Crss Coss 3 -VS-rain Source Voltage(V) Capacitance Gate Threshold Voltage 7 Power issipation 3
4 -I (A) Normalized Transient Thermal Resistance Normalized On Resistance TYPICAL CHARACTERISTICS VGS=-V RS(ON) vs Junction Temperature 7 TJ-Case Temperature( C) rain Current vs TJ. µs ms ms ms C.. uty= t Single Pulse t uty Cycle, =t/t... - VS Voltage (V) Maximum Safe Operation Area..... Square Wave Pulse uration(sec) Thermal Transient Impedance -VGS Ton Toff V Qg VGS Td(on) Tr Td(off) Tf Qgs Qgd 9% % VS Charge Gate Chrge Waveform Switching Time Waveform
5 SOT-89 PACKAGE IMENSIONS A E b E e e b c Symbol imensions In Millimeters imensions In Inches Min. Max. Min. Max. A b b c E E e e L θ
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DESCRIPTION The is the P-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to
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DESCRIPTION The SPP2341 is the P-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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DESCRIPTION The SPN9971 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. The SPN9971 has been designed specifically to
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DESCRIPTION The SPP3415 is the P-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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DESCRIPTION The SPN6242 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationPIN CONFIGURATION(SOT-23)
DESCRIPTION The SPP3401D is the P-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationSPN180T10. N-Channel Enhancement Mode MOSFET. AC/DC Synchronous Rectifier Load Switch UPS Power Tool Motor Control
DESCRIPTION The SPN180T10 is the N-Channel enhancement mode power field effect transistor which is produced using super high cell density DMOS trench technology. This high density process is especially
More informationFeatures. Description. Table 1: Device summary Order code Marking Package Packaging STR1P2UH7 1L2U SOT-23 Tape and reel
P-channel 20 V, 0.087 Ω typ., 1.4 A STripFET H7 Power MOSFET in a SOT-23 package Datasheet - production data Features Order code VDS RDS(on) max ID STR1P2UH7 20 V 0.1 Ω @ 4.5 1.4 A Very low on-resistance
More informationTPH3205WSB. 650V Cascode GaN FET in TO-247 (source tab)
650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,
More informationG S. Drain-Source Voltage -60 V Gate-Source Voltage + 20 V at T = 70 C Continuous Drain Current 3
P-channel Enhancement-mode Power MOSFET Simple rive Requirement Small Package Outline BV -6V Surface Mount evice R S(ON) 5mΩ RoHS-compliant, Halogen-free G S I -1.A SS escription Advanced Power MOSFETs
More informationVDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 180. Qrr (nc) typ 54. * Dynamic R(on)
600V Cascode GaN FET in TO-220 (drain tab) Description The 600V, 150mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge, faster
More informationG S. Drain-Source Voltage 30 V Gate-Source Voltage + 20 V at T = 70 C Continuous Drain Current 3
N-channel Enhancement-mode Power MOSFET Simple rive Requirement Low Gate Charge Surface Mount evice R S(ON) 2mΩ RoHS-compliant, halogen-free G S I.7A BV SS 3V escription Advanced Power MOSFETs from APEC
More informationVDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 63. Qrr (nc) typ 136. * Dynamic R(on)
600V Cascode GaN FET in TO-247 (source tab) Not recommended for new designs see TP65H050WS Description The TPH3205WS 600V, 52mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer
More informationSPN2304. N-Channel Enhancement Mode MOSFET
DESCRIPTION The SPN2304 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationG S. Drain-Source Voltage -30 V Gate-Source Voltage. P D at T A =25 C Total Power Dissipation 1.38 W Linear Derating Factor 0.
P-channel Enhancement-mode Power MOSFET Simple rive Requirement Small Package Outline BV -3V Surface Mount evice R S(ON) 75mΩ RoHS-compliant, Halogen-free G S I -3.7A SS escription Advanced Power MOSFETs
More informationSPC6801. P-Channel Trench MOSFET with Schottky Diode. Battery Powered System DC/DC Converter Load Switch Cell Phone
DESCRIPTION The SPC6801combines the Trench MOSFET technology with a very low forward voltage drop Schottky barrier rectifier in an TSOP-6P package. The Trench MOSFET is the P-Channel enhancement mode power
More informationVDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 60. Qrr (nc) typ 136. Qg (nc) typ 28. * Dynamic RDS(on)
650V Cascode GaN FET in TO-247 (source tab) Description The TPH3205WSB 650V, 49mΩ gallium nitride (GaN) FET is a normally-off device. Transphorm GaN FETs offer better efficiency through lower gate charge,
More informationSPN8822. Common-Drain Dual N-Channel Enhancement Mode MOSFET
DESCRIPTION The SPN8822 is the logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize
More informationCommon-Drain Dual N-Channel Enhancement Mode MOSFET
DESCRIPTION The SPN8206 is the logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize
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DESCRIPTION The SPN4842 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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DESCRIPTION The SPC4567W is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
More informationSPN80T06. N-Channel Enhancement Mode MOSFET. DC/DC Converter Load Switch SMPS Secondary Side Synchronous Rectifier Motor Control Power Tool
DESCRIPTION The SPN80T06 is the N-Channel logic enhancement mode power field effect transistor which is produced using super high cell density DMOS trench technology. This high density process is especially
More informationN-Channel Enhancement Mode MOSFET
DESCRIPTION The SPN4842 is the N-Channel logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored
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