Project-wise Reports of Sectorial Monitoring Committee

Size: px
Start display at page:

Download "Project-wise Reports of Sectorial Monitoring Committee"

Transcription

1 Project-wise Reports of Sectorial Monitoring Committee 1. Project Title: Advanced Microsensors and Microsystems : Design, Development and Applications 2. Project Details: Nodal Lab CSIR-Central Electronics Engineering Research Institute,.Pilani, Rajasthan Participating Labs NIL Nodal Officer Dr Jamil Akhtar Taskforce Director, CSIR-CEERI, Pilani Chairman Total Man Days Mandays (Approx.) Approved Cost Lakh Fund received Lakh Fund utilized Lakh up to December Periodic Key Recommendations of Task Force/RC/Monitoring Committee Proposed Revised S.No Key Action taken on Deliverables Deliverable Recommendati6ns Key (approved by Task of Task Force/RC/ Recommendations Force) Monitoring Committee 1. Satisfactory and N/A As outlined N/A Excellent 2. -do- N/A As outlined N/A 3. Over all progress N/A As outlined N/A was well Appreciated I I 4. Design and better Software tool As outlined N/A understanding usage was prior to fabrication made more was appreciated. reachable to Use of software trainees and tools was found project staff extensively utilized. 1

2 5. Working N/A As Outlined N/A prototypes were appreciated 6. Packaging issues Inter group As Outlined N/A were discussed networking was and More enhanced and emphasis was availability of in given on house sensors Integrated were made electronics for in available to house sensors Circuit team 7. Future of FTI level As Outlined N/A Microsensors was activities were highlighted and identified for Chairman users and suggested industries. towards commercialization of developed sensors 4. Project Achievements: 5. No. Deliverables promised at Deliverables Achieved If not achieved, reasons start thereof 1. Demonstration/Application Ach ieved N/A of ISFET/EGFET ph sensor 2. MEMS Pressure Sensor Achieved N/A for UAV, RO Application 3 Gas Sensor for CH4 & Achieved N/A voc 4. MEMS Accelerometer in Achieved - FTI N/A packaged form 5. MEMS Micro-Mirror Arrays Achieved N/A Chip (Exploratory Activity) 2

3 6. RF-MEMS Achieved at Chip N/A Level- FTT 7. Micro-Fluidics Achieved N /A 8. L TCC Packaging Achieved N/A 9. Signal conditioning Achieved N/A 10. MEMS Magnetometer Achieved at Chip N/A Level. 11. HEMT Bio-Sensor Achieved N/A 12. ph ion meter Achieved N/A 13. Gas Detector Achieved N/A 14. Water and Food: Achieved N/A Application 5. Outcomes and outputs from the projects: a. Outcomes 1. Lead(s) identified: Number and names with TRL i. MEMS Pressure Sensor- TRL 5-6 (BARC, IGCAR, NAL, M/s JK Tire and M/s Samsung) ii. Gas Sensor Platform- TRL-7 (Demo and Industry meet arranged) iii. ISFET ph Meter- TRL-5 (Potential bio-sensor under Mission program) iv. MEMS Accelerometer- TRL-5 (Approved FTT activity, Evaluated with NAL Network project) v. RF-MEMS : (Approved FTI activity, User-SAC Ahmedabad) TRL-5 vi. L TCC technology - TRL- 5/6 (DRDO-DRDE, DIHAR, SSPL) 2. Technology/Product developed: Number and names with TRL level of Development ~ ISFET /EGFET for ph sensor- TRL-5 ~ MEMS Gas Sensor Platform- TRL-7 ~ MEMS Accelerometer- TRL-5 ~ MEMS Pressure sensor for Ro water, Air and Vacuum-TRL-7 ~ MEMS Gyroscope (Single axis)- TRL-4 ~ LTCC for MEMS packaging- TRL-7 3

4 > Microsystems for LPG, Alcohol, Food, water and Fruits-TRL- 7/8 3. Technology/Product transferred: Number and names with name of licensee(s) - NIL 4. Facility created: Number and names with uniqueness & utility > LDV based MEMS Structures Characterizing facility > USM in MEMS- working prototype demonstrated > Laser based dicing of composite structures (Glass bonded silicon) > E-beam assisted Polysilicon thin film as piezoresistive with low TCR- demonstrated 5. Sponsored projects obtained (with details) BARC Mumbai - MEMS Pressure Sensor Lakh ( ) DRDO- DRDE: ( Phase -1 completed) 6. External Cash Flow (ECF) generated - More than Lakh 7. Societal impact created (quantified data) > Real time RO water control system in Shekhawati area > Milk Analyzer > LPG and Alcohol detector b. Outputs: 1. Periodic Reports Submitted: 6 task force meetings were conducted and progress reports in 4 RCs 2. Publications: Total Number of Publications: 212 Type May 2012 April2013 April2014 April2015- Apri12016 March 2013 March 2014 March 2015 March 2016 Oct SCI Journal Non-SCI Journal International Conference National Conference Total number of publications i. Total number 212 4

5 SCI Journals - 57; International Conferences- 1 05; Book Chapters - 2 Non-SCI Journals- 27 National Conferences - 23 ii. Cumulative IF (as per 2015 figures) (Approx.) iii. Average IF iv. Average IF/scientist Patents Filed 8 Patents 4. Human Resource generated i. PhD fellows: 25 No No. PhDs completed 12 No. pursuing ii. Project fellows: 50 Project Fellows (PF + SPF) iii. Skills imparted: 35 M.Tech and B. Tech Trainees involved in MEMS processes, packaging and characterization More than 20 contract workers were trained in fabline 5. External collaborations established );> BARC Mumbai...:. MEMS Si-Pressure Sensor );> Tezpur University Assam- Consultancy for MEMS facility );> IGCAR Kalpakkam- MEMS SiC Pressure Sensors );> DRDO-DRDE & SSPL- L TCC Technology );> SAC Ahmedabad, SCL Chandigarh - RF-MEMS );> M/s JK Tyre -MEMS Pressure Sensor );> M/s S.S. Engineers Jaipur, MEMS Pressure Sensor for RO );> M/s Wacwin India );> M/s Solid Block semiconductor Solutions ( );> M/s Plenumtek, Nagpur- MEMS Pressure Sensor );> MIT Singapore - MEMS gauge for vacuum );> Da Pro, Singapore - Rubber Diaphragm for RO water sensor );> M/s Chemicot Scientific Gases ( NOIDA) 6. Sectoral Monitoring Committee Recommendations on Lead/Technology/Product (listed above): For each Lead/Technology/Product provide details separately: Criteria Name of Lead IT echnology /Product SMC Recommendations 1. Sensors: Pressure Sensor Gas sensor 5

6 Is the Lead/ Technology/Product worth taking up further? What is the further R&D efforts that need to be put by CSIR/ CSIR laboratories? MEMS Accelerometer and Gyroscope ISFET ph-meter II. RF-MEMS Ill. L TCC packaging technology as continuing activity Yes Customization and tuning of the technologies as per the application specific industry requirements Global benchmarking of the MPXY 8000 series (Motorola), cost Currently available commercial products have a price range Lead/Technology/Product between Rs 1000 to 30,000 depending on the specifically wrt specifications application. and cost Figaro TGS2444, TGS3870 and TGS2602, Cost: Currently available commercial products have a price range between Rs 1000 to 30,000 depending on the application and system performance. Is the Lead/Technology/Product worthy of commissioning a DPR at this stage? What are the likely resources and time duration required for taking forward the identified Lead/ Technology/Product to the desired TRL? SeaFET (Sea-Bird Scientific, Washington, USA), Cost: Cost of Competing technologies available in the market varies from Rs. 60, to Rs. 100, based on its resolution. Silicon designs, Cost: Approx.: Rs. 70,000 Yes -3 Years Potential stake holders who may JK Tyres, Samsung, BARC, IGCAR, Chemicot, DIHAR, be appropriate to partner DRDE, DLJ, SAC, IISU technically as well as financially The development should be in close collaboration with Suggestion for plausible road map towards further user/ industry development of lead/technology/product for achieving desired TRL GO GO/NO GO further development Other suggestions, if any, related to benefits/usage/ commercialization 7. Identified "lessons to be learnt", especially from shortcomings/failures. NIL. 4 6

7 8. Comments on financial progress on the project fund availability and utilization of fund in the project: Financial progress is satisfactory and investment made is justified. Sectoral Monitoring Committee Recommendations on Facility creation or other outcomes: Purchase of Laser Doppler Vibrometer has been extensively used for dynamic characterization of 3-D moving MEMS structures. The creation of this crucial facility is relevant to meet the objectives of the project. Characterization of Gyroscope, Gyro-Accelerometer, RF-MEMS Switches, Accelerometers and Magnetometer has been carried out on LDV. The expenditure made for this facility creation is justified. This facility should be made available to users from other Institutions. 9. Grading of Project Execution: Outstanding/ Excellent/ Very Good/ Good/ Satisfactory/ Unsatisfactory Excellent 10. Additional comments, if any: Indian Foundries available at STAR-C, SCL should be used for future realization of sensors fabrication. Sign clture of Chairman & all Members of Sectoral Monitoring Committee Prof. G. K. Ananthasuresh Prof Subir Kumar Saha Dr. R. K. Sharma ~<-,S h4/\~ G~~ - Dr. Debashis Dutta Dr. C. P. Ravikumar Dr. Aravind S. Bharadwaj s~..a4y)~~ Dr. S. Srikanth DrSC ~ Shri S. K. Sharma Chairman, SMC 7

Project-wise Reports of Sectorial Monitoring Committee

Project-wise Reports of Sectorial Monitoring Committee Project-wise Reports of Sectorial Monitoring Committee 1. Project T itle :FUTU~ E: Creating intellectual property and capabilities for the development of improved security features and substrates for the

More information

Project-wise Reports of Sectorial Monitoring Committee. CSIR- Central Institute of Mining and Fuel Research, Dhanbad

Project-wise Reports of Sectorial Monitoring Committee. CSIR- Central Institute of Mining and Fuel Research, Dhanbad Project-wise Reports of Sectorial Monitoring Committee 1. Project Title: Development of suitable design methodology for extraction of coal at greater depths (>300m) for Indian geomining conditions (DeepCoal)

More information

Des MEMS aux NEMS : évolution des technologies et des concepts aux travers des développements menés au LETI

Des MEMS aux NEMS : évolution des technologies et des concepts aux travers des développements menés au LETI Des MEMS aux NEMS : évolution des technologies et des concepts aux travers des développements menés au LETI Ph. Robert 1 Content LETI at a glance From MEMS to NEMS: 30 years of technological evolution

More information

Recent Innovations in MEMS Sensors for PNT Applications

Recent Innovations in MEMS Sensors for PNT Applications Recent Innovations in MEMS Sensors for PNT Applications Stanford PNT Symposium 2017 Alissa M. Fitzgerald, Ph.D. Founder & CEO amf@amfitzgerald.com Overview Navigation Developments in MEMS gyroscope technology

More information

2007-Novel structures of a MEMS-based pressure sensor

2007-Novel structures of a MEMS-based pressure sensor C-(No.16 font) put by office 2007-Novel structures of a MEMS-based pressure sensor Chang-Sin Park(*1), Young-Soo Choi(*1), Dong-Weon Lee (*2) and Bo-Seon Kang(*2) (1*) Department of Mechanical Engineering,

More information

Micro and Smart Systems

Micro and Smart Systems Micro and Smart Systems Lecture - 39 (1)Packaging Pressure sensors (Continued from Lecture 38) (2)Micromachined Silicon Accelerometers Prof K.N.Bhat, ECE Department, IISc Bangalore email: knbhat@gmail.com

More information

Advancing MEMS R&D in materials, processes and devices to face major needs arising from the booming MEMS market

Advancing MEMS R&D in materials, processes and devices to face major needs arising from the booming MEMS market Advancing MEMS R&D in materials, processes and devices to face major needs arising from the booming MEMS market Dr Julien Arcamone MEMS Business development Manager, CEA-LETI julien.arcamone@cea.fr MEMS

More information

Reducing MEMS product development and commercialization time

Reducing MEMS product development and commercialization time Reducing MEMS product development and commercialization time Introduction Fariborz Maseeh, Andrew Swiecki, Nora Finch IntelliSense Corporation 36 Jonspin Road, Wilmington MA 01887 www.intellisense.com

More information

NRC Aerospace Institute for Aerospace Research. NRC-IAGT Collaborative Forum on Future Gas Turbine Challenges and Opportunities

NRC Aerospace Institute for Aerospace Research. NRC-IAGT Collaborative Forum on Future Gas Turbine Challenges and Opportunities NRC Aerospace Institute for Aerospace Research NRC-IAGT Collaborative Forum on Future Gas Turbine Challenges and Opportunities NRC: A National Institution Federal government agency Provides essential elements

More information

Academic Course Description SRM University Faculty of Engineering and Technology Department of Electronics and Communication Engineering

Academic Course Description SRM University Faculty of Engineering and Technology Department of Electronics and Communication Engineering Academic Course Description SRM University Faculty of Engineering and Technology Department of Electronics and Communication Engineering EC0032 Introduction to MEMS Eighth semester, 2014-15 (Even Semester)

More information

Deformable Membrane Mirror for Wavefront Correction

Deformable Membrane Mirror for Wavefront Correction Defence Science Journal, Vol. 59, No. 6, November 2009, pp. 590-594 Ó 2009, DESIDOC SHORT COMMUNICATION Deformable Membrane Mirror for Wavefront Correction Amita Gupta, Shailesh Kumar, Ranvir Singh, Monika

More information

Noel Technologies. Provider of Advanced Lithography and Semiconductor Thin Film Services

Noel Technologies. Provider of Advanced Lithography and Semiconductor Thin Film Services Noel Technologies Provider of Advanced Lithography and Semiconductor Thin Film Services Noel Technologies Keith Best Biography Over the last 27 years, Keith Best has held a variety of semiconductor processing

More information

Heterogeneous Technology Alliance. SOI MEMS Platform

Heterogeneous Technology Alliance. SOI MEMS Platform Heterogeneous Technology Alliance SOI MEMS Platform Added value of HTA SOI MEMS Platform to customers 23-Aug-11 Page 1 Attractive offering of HTA SOI MEMS Platform One-stop shop 1 Very extensive R&D resources,

More information

FEMTOPRINT From a Factory-of-the-Future FP7 project to a spin-off Yves Bellouard Project coordinator of FP7 Femtoprint

FEMTOPRINT From a Factory-of-the-Future FP7 project to a spin-off Yves Bellouard Project coordinator of FP7 Femtoprint www.femtoprint.eu FEMTOPRINT From a Factory-of-the-Future FP7 project to a spin-off Yves Bellouard Project coordinator of FP7 Femtoprint FEMTOPRINT A printer for microsystems Marking / Optical Memory 2

More information

Triple i - The key to your success

Triple i - The key to your success Triple i - The key to your success The needs and challenges of today s world are becoming ever more demanding. Standards are constantly rising. Creativity, reliability and high performance are basic prerequisites

More information

Patenting, Innovation & Technology Transfer : The CSIR Experience

Patenting, Innovation & Technology Transfer : The CSIR Experience Publically funded patents and technology transfer: A review of the Indian Bayh- Dole bill. Patenting, Innovation & Technology Transfer : The CSIR Dr. Rekha Chaturvedi Head, IPR Cell National University

More information

Open Innovation to Manage Risks in Technology The Business of Breakthroughs

Open Innovation to Manage Risks in Technology The Business of Breakthroughs Open Innovation to Manage Risks in Technology The Business of Breakthroughs Janos Veres, Program Manager 2016 PARC, All rights reserved. PARC Legacy: A Storied History of Inventing the Future 1970 1973

More information

Compound Semiconductor Center

Compound Semiconductor Center Compound Semiconductor Center Compound Semiconductor Centre Building a Technology Cluster in South Wales Dr Wyn Meredith Status October 2015 Formal JV: 50:50 Cardiff University: IQE Academia Public Sector

More information

M.Tech: Industrial Automation & Robotics The National Institute of Engineering, Mysore-08. (Established in 1946) Department of Mechanical Engineering

M.Tech: Industrial Automation & Robotics The National Institute of Engineering, Mysore-08. (Established in 1946) Department of Mechanical Engineering M.Tech: Industrial Automation & Robotics The National Institute of Engineering, Mysore-08 (Established in 1946) Department of Mechanical Engineering About our Institute and the Department The National

More information

ICT Micro- and nanoelectronics technologies

ICT Micro- and nanoelectronics technologies EPoSS Proposers' Day, 2 Feb 2017, Brussels ICT 31-2017 Micro- and nanoelectronics technologies Eric Fribourg-Blanc, Henri Rajbenbach, Andreas Lymberis European Commission DG CONNECT (Communications Networks,

More information

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL Shailesh Kumar, A.K Meena, Monika Chaudhary & Amita Gupta* Solid State Physics Laboratory, Timarpur, Delhi-110054, India *Email: amita_gupta/sspl@ssplnet.org

More information

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies Industrialization of Micro-Electro-Mechanical Systems Werner Weber Infineon Technologies Semiconductor-based MEMS market MEMS Market 2004 (total 22.7 BUS$) Others mostly Digital Light Projection IR Sensors

More information

NTU RECIPIENTS OF NRF S PROOF OF CONCEPT SCHEME GRANTS. 1. A Semantics-Based and Service-Oriented Framework for the Virtualisation of Sensor Networks

NTU RECIPIENTS OF NRF S PROOF OF CONCEPT SCHEME GRANTS. 1. A Semantics-Based and Service-Oriented Framework for the Virtualisation of Sensor Networks Reg. No. 200604393R FACT SHEET For immediate release Total: 7 pages including this page Singapore, 21 August 2009 NTU RECIPIENTS OF NRF S PROOF OF CONCEPT SCHEME GRANTS 1. A Semantics-Based and Service-Oriented

More information

A fps CMOS Ion-Image Sensor with Suppressed Fixed-Pattern-Noise for Accurate High-throughput DNA Sequencing

A fps CMOS Ion-Image Sensor with Suppressed Fixed-Pattern-Noise for Accurate High-throughput DNA Sequencing A 64 64 1200fps CMOS Ion-Image Sensor with Suppressed Fixed-Pattern-Noise for Accurate High-throughput DNA Sequencing Xiwei Huang, Fei Wang, Jing Guo, Mei Yan, Hao Yu*, and Kiat Seng Yeo School of Electrical

More information

BICI HK Collaborative Research Program Proposal Instruction

BICI HK Collaborative Research Program Proposal Instruction Project briefing: BICI HK Collaborative Research Program Proposal Instruction The research/technology had better relate to 6 BICI focus areas, or the research/technology relate to 18 Collabroative Innovation

More information

Feature-level Compensation & Control

Feature-level Compensation & Control Feature-level Compensation & Control 2 Sensors and Control Nathan Cheung, Kameshwar Poolla, Costas Spanos Workshop 11/19/2003 3 Metrology, Control, and Integration Nathan Cheung, UCB SOI Wafers Multi wavelength

More information

Number of Projects (Completed/ In progress)

Number of Projects (Completed/ In progress) Number of Research Projects - 19 19 Number of Projects (/ In progress) Sponsored Projects /In progress Title of project Duration Amount of grant (Lacs) Sponsoring agency PI/Co-PI (1) (2) (3) (4) (5) (6)

More information

Study of MEMS Devices for Space Applications ~Study Status and Subject of RF-MEMS~

Study of MEMS Devices for Space Applications ~Study Status and Subject of RF-MEMS~ Study of MEMS Devices for Space Applications ~Study Status and Subject of RF-MEMS~ The 26 th Microelectronics Workshop October, 2013 Maya Kato Electronic Devices and Materials Group Japan Aerospace Exploration

More information

Faculty Development Program on Micro-Electro-Mechanical Systems (MEMS Sensor)

Faculty Development Program on Micro-Electro-Mechanical Systems (MEMS Sensor) Faculty Development Program on Micro-Electro-Mechanical Systems (MEMS Report MEMS sensors have been dominating the consumer products such as mobile phones, music players and other portable devices. With

More information

Teaching Design to Engineers. Prof. Timothy A Gonsalves Director IIT Mandi, Himachal

Teaching Design to Engineers. Prof. Timothy A Gonsalves Director IIT Mandi, Himachal Teaching Design to Engineers Prof. Timothy A Gonsalves Director IIT Mandi, Himachal director@iitmandi.ac.in November 2013 Evolution of Engineering The Middle Ages to early 20 th century, design as an art:

More information

Academic Program IIT Rajasthan

Academic Program IIT Rajasthan Academic Program IIT Rajasthan Prem K Kalra 28 October 2009 IIT Rajasthan 1 Challenges of the 21 st century Inclusive & sustainable development Global thinking & approach Building capacity, capability

More information

Participer aux futurs projets KET et multi-ket d Horizon 2020

Participer aux futurs projets KET et multi-ket d Horizon 2020 Paris, 08 Novembre 2012 Colloque "Technologies clés génériques : saisir les nouvelles opportunités européennes pour la recherche et l innovation" Participer aux futurs projets KET et multi-ket d Horizon

More information

Design of MEMS Piezoelectric Vibrational Energy Harvesters for Industrial and Commercial Applications

Design of MEMS Piezoelectric Vibrational Energy Harvesters for Industrial and Commercial Applications Design of MEMS Piezoelectric Vibrational Energy Harvesters for Industrial and Commercial Applications Consumer Applications Civil Infrastructure Kathleen M. Vaeth, Vice President of Engineering microgen

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition

More information

ICU News Flash. ICU consortium. Infrared Imaging Components for Use in Automotive Safety Applications (ICU)

ICU News Flash. ICU consortium. Infrared Imaging Components for Use in Automotive Safety Applications (ICU) We would welcome your opinion and comments at the contact option on ICU s website ICU News Flash Infrared Imaging Components for Use in Automotive Safety Applications (ICU) Co-financed by the EC D e a

More information

Projects and Partners Working with Chalcogenide Advanced Manufacturing Partnership (ChAMP)

Projects and Partners Working with Chalcogenide Advanced Manufacturing Partnership (ChAMP) Projects and Partners Working with Chalcogenide Advanced Manufacturing Partnership (ChAMP) Dr John Lincoln Industrial Liaison Officer j.lincoln@soton.ac.uk March 2015 ChAMP Aims Establish world leading

More information

MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016

MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 A*STAR S IME KICKS OFF CONSORTIA TO DEVELOP ADVANCED PACKAGING SOLUTIONS FOR NEXT-GENERATION INTERNET OF THINGS APPLICATIONS AND HIGH-PERFORMANCE WIRELESS

More information

Plan Optik AG. Plan Optik AG PRODUCT CATALOGUE

Plan Optik AG. Plan Optik AG PRODUCT CATALOGUE Plan Optik AG Plan Optik AG PRODUCT CATALOGUE 2 In order to service the high demand of wafers more quickly, Plan Optik provides off the shelf products in sizes from 2 up to 300mm diameter. Therefore Plan

More information

MEMS Processes at CMP

MEMS Processes at CMP MEMS Processes at CMP MEMS Processes Bulk Micromachining MUMPs from MEMSCAP Teledyne DALSA MIDIS Micralyne MicraGEM-Si CEA/LETI Photonic Si-310 PHMP2M 2 Bulk micromachining on CMOS Compatible with electronics

More information

ACTIVE ANTENNA AND CIRCUITS FOR UWB TRANSCEIVERS

ACTIVE ANTENNA AND CIRCUITS FOR UWB TRANSCEIVERS ACTIVE ANTENNA AND CIRCUITS FOR UWB TRANSCEIVERS MITHILESH KUMAR CENTRE FOR APPLIED RESEARCH IN ELECTRONICS (CARE) INDIAN INSTITUTE OF TECHNOLOGY, DELHI December 2010 ACTIVE ANTENNA AND CIRCUITS FOR UWB

More information

STI Policy, Indicators and Industry- Academia Interaction

STI Policy, Indicators and Industry- Academia Interaction STI Policy, Indicators and Industry- Academia Interaction Dr. Neeraj Sharma Advisor & Head Technology Development and Transfer and Policy Research Department of Science & Technology E-mail: neerajs@nic.in

More information

National Centre for Flexible Electronics

National Centre for Flexible Electronics National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances

More information

AFRL-SN-WP-TM

AFRL-SN-WP-TM AFRL-SN-WP-TM-2006-1156 MIXED SIGNAL RECEIVER-ON-A-CHIP RF Front-End Receiver-on-a-Chip Dr. Gregory Creech, Tony Quach, Pompei Orlando, Vipul Patel, Aji Mattamana, and Scott Axtell Advanced Sensors Components

More information

JHU/APL CubeSat Summary. Andy Lewin 11 August 2007

JHU/APL CubeSat Summary. Andy Lewin 11 August 2007 JHU/APL CubeSat Summary Andy Lewin 11 August 2007 Overview APL is providing active support for the CubeSat community Advocacy for CubeSat/nanosatellite secondary payloads on missions in which APL is involved

More information

Horizon Work Programme Leadership in enabling and industrial technologies - Introduction

Horizon Work Programme Leadership in enabling and industrial technologies - Introduction EN Horizon 2020 Work Programme 2018-2020 5. Leadership in enabling and industrial technologies - Introduction Important notice on the Horizon 2020 Work Programme This Work Programme covers 2018, 2019 and

More information

Impact of international cooperation and science and innovation strategies on S&T output: a comparative study of India and China

Impact of international cooperation and science and innovation strategies on S&T output: a comparative study of India and China Impact of international cooperation and science and innovation strategies on S&T output: a comparative study of India and China S. A. Hasan, Amit Rohilla and Rajesh Luthra* India and China have made sizeable

More information

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Scott Goodwin 1, Erik Vick 2 and Dorota Temple 2 1 Micross Advanced Interconnect Technology Micross

More information

SPLIT-BOSS DESIGN FOR IMPROVED PERFORMANCE OF MEMS PIEZORESISTIVE PRESSURE SENSOR

SPLIT-BOSS DESIGN FOR IMPROVED PERFORMANCE OF MEMS PIEZORESISTIVE PRESSURE SENSOR SPLIT-BOSS DESIGN FOR IMPROVED PERFORMANCE OF MEMS PIEZORESISTIVE PRESSURE SENSOR 1 RAMPRASAD M. NAMBISAN, 2 N. N. SHARMA Department of Electrical and Electronics Engineering, Birla Institute of Technology

More information

MEMS. Gas sensors market and technology trends. K. Biasio Marketing Manager Tronics Microsystems, Marketing, Crolles, France

MEMS. Gas sensors market and technology trends. K. Biasio Marketing Manager Tronics Microsystems, Marketing, Crolles, France MEMS K. Biasio Marketing Manager Tronics Microsystems, Marketing, Crolles, France Biography For more than 15 years, Karl Biasio has been involved at both technical and business levels in the field of innovative

More information

STRUCTURE OF THE H2020 PROPOSAL, TYPES OF ACTIONS, TLR. Summer School for Young Researchers, September 2017, Odessa

STRUCTURE OF THE H2020 PROPOSAL, TYPES OF ACTIONS, TLR. Summer School for Young Researchers, September 2017, Odessa STRUCTURE OF THE H2020 PROPOSAL, TYPES OF ACTIONS, TLR Summer School for Young Researchers, 25-28 September 2017, Odessa FROM THE IDEA TO THE PROJECT Idea Partner Proposal ADMINISTRATIVE PROCEDURES Single/Two-stage

More information

DEEP SMC SPEED QUALITY PRECISION. Welding and Fabrication CNC Punching. Laser Cutting. Advanced Assembly Stamping

DEEP SMC SPEED QUALITY PRECISION. Welding and Fabrication CNC Punching. Laser Cutting. Advanced Assembly Stamping DEEP SMC Laser Cutting Welding and Fabrication CNC Punching Advanced Assembly Stamping Specialized Metal Works Sheet Metal Bending Metal Parts for Critical Applications SPEED QUALITY PRECISION One of the

More information

Application-Based Opportunities for Reused Fab Lines

Application-Based Opportunities for Reused Fab Lines Application-Based Opportunities for Reused Fab Lines Semicon China, March 17 th 2010 Keith Best Simax Lithography S I M A X A L L I A N C E P A R T N E R S Outline Market: Exciting More than Moore applications

More information

Detailed Bio Data of Mr. AMITAVA GHOSHas per AICTE Format

Detailed Bio Data of Mr. AMITAVA GHOSHas per AICTE Format Detailed Bio Data of Mr. AMITAVA GHOSHas per AICTE Format Name of the Faculty: AMITAVA GHOSH Senior Technical Assistant Date of Joining the Institute: 19/08/2009. 1 st class & Control. 9 8 Microprocessor

More information

CITATION OF PRESIDENT S SCIENCE AND TECHNOLOGY MEDAL 2012 WINNER

CITATION OF PRESIDENT S SCIENCE AND TECHNOLOGY MEDAL 2012 WINNER CITATION OF PRESIDENT S SCIENCE AND TECHNOLOGY MEDAL 2012 WINNER Professor Dim-Lee Kwong Executive Director, Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR) For his

More information

Technology Transfers Opportunities, Process and Risk Mitigation. Radhika Srinivasan, Ph.D. IBM

Technology Transfers Opportunities, Process and Risk Mitigation. Radhika Srinivasan, Ph.D. IBM Technology Transfers Opportunities, Process and Risk Mitigation Radhika Srinivasan, Ph.D. IBM Abstract Technology Transfer is quintessential to any technology installation or semiconductor fab bring up.

More information

Foundations Required for Novel Compute (FRANC) BAA Frequently Asked Questions (FAQ) Updated: October 24, 2017

Foundations Required for Novel Compute (FRANC) BAA Frequently Asked Questions (FAQ) Updated: October 24, 2017 1. TA-1 Objective Q: Within the BAA, the 48 th month objective for TA-1a/b is listed as functional prototype. What form of prototype is expected? Should an operating system and runtime be provided as part

More information

DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production

DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark

More information

3D Optical Motion Analysis of Micro Systems. Heinrich Steger, Polytec GmbH, Waldbronn

3D Optical Motion Analysis of Micro Systems. Heinrich Steger, Polytec GmbH, Waldbronn 3D Optical Motion Analysis of Micro Systems Heinrich Steger, Polytec GmbH, Waldbronn SEMICON Europe 2012 Outline Needs and Challenges of measuring Micro Structure and MEMS Tools and Applications for optical

More information

MICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles

MICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles MICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles S Beeby, M J Tudor, R Torah, K Yang, Y Wei Dr Steve Beeby ESD Research Group Smart Fabrics 2011 5 th April 2011 Overview Introduce the MicroFlex

More information

Overview of Auburn University

Overview of Auburn University Overview of Auburn University David M. Bevly Associate Professor Director of the GPS and Vehicle Dynamics Lab dmbevly@eng.auburn.edu (334) 844-3446 Auburn RESEARCH Peaks of Excellence Seven University

More information

SESSION JAN 2016-June 2016

SESSION JAN 2016-June 2016 SESSION JAN 2016-June 2016 DEPARTMENT OF CIVIL ENGINEERING WORKSHOPS SHORT TERM COURSES INDUSTRIAL VISITS SEMINAR & CONFERENCES GUEST LECTURES SUMMITS E-tabs Design & Analysis Software 15 th - 17 th February

More information

Evolution of International Business

Evolution of International Business Evolution of International Business Ch 6 International Strategic Alliance Fiat Cinquecento Trepiuno Concept Ford Ka Fiat Cinquecento Ford Ka International Strategic Alliances at a Glance Over the past

More information

Market Survey for the F4E Diagnostics Team

Market Survey for the F4E Diagnostics Team Market survey on availability of engineering effort to (1) provide support on the preparation of build-to-print design specifications of the Diagnostics; (2) and to provide industrial expertise on the

More information

EE 410: Integrated Circuit Fabrication Laboratory

EE 410: Integrated Circuit Fabrication Laboratory EE 410: Integrated Circuit Fabrication Laboratory 1 EE 410: Integrated Circuit Fabrication Laboratory Web Site: Instructor: http://www.stanford.edu/class/ee410 https://ccnet.stanford.edu/ee410/ (on CCNET)

More information

From vision to growth: Role of research in building world-class excellence in future added value electronics

From vision to growth: Role of research in building world-class excellence in future added value electronics From vision to growth: Role of research in building world-class excellence in future added value electronics Antti Vasara, CEO VTT Technical Research Centre of Finland Ltd Contents 1. VTT in short 2. Our

More information

COLLABORATIVE R&D & IP ISSUES IN TECHNOLOGY TRANSFER IN UNIVERSITY SYSTEM

COLLABORATIVE R&D & IP ISSUES IN TECHNOLOGY TRANSFER IN UNIVERSITY SYSTEM COLLABORATIVE R&D & IP ISSUES IN TECHNOLOGY TRANSFER IN UNIVERSITY SYSTEM Avinash Kumar Addl. Dir (IPR) DRDO HQ, DRDO Bhawan, Rajaji Marg New Delhi- 100 011 avinash@hqr.drdo.in IPR Group-DRDO Our Activities

More information

M.Tech: Industrial Automation & Robotics

M.Tech: Industrial Automation & Robotics M.Tech: Industrial Automation & Robotics The National Institute of Engineering Mysuru-08 (Established in 1946) Department of Mechanical Engineering About our Pride Institute and the Department The National

More information

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative

POSSUM TM Die Design as a Low Cost 3D Packaging Alternative POSSUM TM Die Design as a Low Cost 3D Packaging Alternative The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration

More information

Partnering along the chain of innovation : III-V lab example

Partnering along the chain of innovation : III-V lab example Partnering along the chain of innovation : III-V lab example Dominique Pons Symposium Global Open Innovation Networks What is III-V Lab? a jointly owned Alcatel-Lucent / Thales R&D Lab French GIE (Groupement

More information

Embedded Surface Mount Triaxial Accelerometer

Embedded Surface Mount Triaxial Accelerometer Embedded Surface Mount Triaxial Accelerometer Robert D. Sill Senior Scientist PCB Piezotronics Inc. 951 Calle Negocio, Suite A San Clemente CA, 92673 (877) 679 0002 x2954 rsill@pcb.com Abstract 18566 59

More information

No Export Licence Required - Not Protectively Marked

No Export Licence Required - Not Protectively Marked Discipline or report series #10 Technology/CASE Title #15 Summary and Completion Report for the Clean Sky CASE Project Date #40 15 November 25 Summary #60 This report summarises the work undertaken on

More information

DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production

DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication DTU Danchip DTU Danchip is Denmark

More information

Accelerating Scale Up of Large Area Electronics

Accelerating Scale Up of Large Area Electronics Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved. Who are CPI? CPI is a UK technology innovation

More information

Strategies of Effective Technology Licensing

Strategies of Effective Technology Licensing Strategies of Effective Technology Licensing Government of India Ministry of Science & Technology Department of Scientific & Industrial Research International Workshop on Supporting Innovative Entrepreneurs

More information

PROCUREMENT OF GOODS UNDER OPEN TENDER PROCEDURE

PROCUREMENT OF GOODS UNDER OPEN TENDER PROCEDURE IFB NO. KGEC/DST-WB/EE /2018-19/995 PROCUREMENT OF GOODS UNDER OPEN TENDER PROCEDURE Kalyani Government Engineering College Kalyani 741 235; Nadia, West Bengal 1 Government of West Bengal Office of the

More information

1. PUBLISHABLE SUMMARY

1. PUBLISHABLE SUMMARY Ref. Ares(2018)3499528-02/07/2018 1. PUBLISHABLE SUMMARY Summary of the context and overall objectives of the project (For the final period, include the conclusions of the action) The AIDA-2020 project

More information

EUTRAIN. Funding, Programming, and Governance issues in International transport cooperative research

EUTRAIN. Funding, Programming, and Governance issues in International transport cooperative research Funding, Programming, and Governance issues in International transport cooperative research Dr. KAYITHA Ravinder Scientist CSIR-CRRI, New Delhi INDIA Final Conference October 9th, 2013, Brussels, Belgium

More information

Emerging MEMS & Sensor Technologies to Watch: Alissa M. Fitzgerald, Ph.D., Founder & CEO Semicon West 2018

Emerging MEMS & Sensor Technologies to Watch: Alissa M. Fitzgerald, Ph.D., Founder & CEO Semicon West 2018 Emerging MEMS & Sensor Technologies to Watch: 2018 Alissa M. Fitzgerald, Ph.D., Founder & CEO amf@amfitzgerald.com Outline About AMFitzgerald What emerging means in this presentation Emerging MEMS & sensor

More information

Lithography in our Connected World

Lithography in our Connected World Lithography in our Connected World SEMI Austin Spring Forum TOP PAN P R INTING CO., LTD MATER IAL SOLUTIONS DIVISION Toppan Printing Co., LTD A Broad-Based Global Printing Company Foundation: January 17,

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2010

EE C245 ME C218 Introduction to MEMS Design Fall 2010 Instructor: Prof. Clark T.-C. Nguyen EE C245 ME C218 Introduction to MEMS Design Fall 2010 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley

More information

InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor

InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor MEMS Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor

More information

OLAE in Horizon 2020 LEIT ICT WP DG CONNECT - European Commission

OLAE in Horizon 2020 LEIT ICT WP DG CONNECT - European Commission OLAE in Horizon 2020 LEIT ICT WP 2014-15 DG CONNECT - European Commission 11 December 2013 Horizon 2020, Industrial Leadership (LEIT) Priority An Overview of Calls related to OLAE LEIT ICT 3 2014 Advanced

More information

Good evening, Mr Iswaran, Minister in the Prime Minister s Office and Second Minister for Home Affairs & Second Minister for Trade and Industry

Good evening, Mr Iswaran, Minister in the Prime Minister s Office and Second Minister for Home Affairs & Second Minister for Trade and Industry Speech by Dr Lim Ser Yong, Executive Director, SIMTech, at the SIMTech 20 th Anniversary Gala Dinner on Wednesday, 10 th July 2013, 7.15pm at The Fullerton Hotel Singapore Good evening, Mr Iswaran, Minister

More information

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components

More information

MEDIA RELEASE INSTITUTE OF MICROELECTRONICS KICKS OFF COPPER WIRE BONDING CONSORTIUM II TO TACKLE COPPER INTERCONNECTS RELIABILITY ISSUES

MEDIA RELEASE INSTITUTE OF MICROELECTRONICS KICKS OFF COPPER WIRE BONDING CONSORTIUM II TO TACKLE COPPER INTERCONNECTS RELIABILITY ISSUES MEDIA RELEASE INSTITUTE OF MICROELECTRONICS KICKS OFF COPPER WIRE BONDING CONSORTIUM II TO TACKLE COPPER INTERCONNECTS RELIABILITY ISSUES 1. Singapore, 25 March, 2013 -- The Institute of Microelectronics

More information

Introduction to MEMS. I) Course goals Information sources III) Course outline. Course Goals. Introduction to Micro/nano world.

Introduction to MEMS. I) Course goals Information sources III) Course outline. Course Goals. Introduction to Micro/nano world. Introduction to MEMS Instructor: Prof. T.S. Leu ( 呂宗行 ) Department of Aeronautics and Astranautics Course ID: P49170 Email: tsleu@mail.ncku.edu.tw Sep. 2014~Jan. 2015 Lecture hours: Office hours: Friday

More information

Prof. Matteo Rinaldi

Prof. Matteo Rinaldi MATTEO RINALDI Prof. Matteo Rinaldi Northeastern SMART Vision and Mission Northeastern SMART Vision Conceive and pilot disruptive technological innovation in smart devices and systems to make everyday

More information

Glenn G. Daves. Director, Packaging Solutions Development Freescale Semiconductor, Inc.

Glenn G. Daves. Director, Packaging Solutions Development Freescale Semiconductor, Inc. Glenn G. Daves Director, Packaging Solutions Development Freescale Semiconductor, Inc. Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions

More information

New Approaches to Manufacturing Innovation in DOE

New Approaches to Manufacturing Innovation in DOE New Approaches to Manufacturing Innovation in DOE March 6, 2013 TMS 2013 Annual Meeting Dr. Robert Ivester Director (Acting) Advanced Manufacturing Office 1 Energy Efficiency and Renewable Energy eere.energy.gov

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2007

EE C245 ME C218 Introduction to MEMS Design Fall 2007 EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition

More information

HipoCIGS: enamelled steel as substrate for thin film solar cells

HipoCIGS: enamelled steel as substrate for thin film solar cells HipoCIGS: enamelled steel as substrate for thin film solar cells Lecturer D. Jacobs*, Author S. Efimenko, Co-author C. Schlegel *:PRINCE Belgium bvba, Pathoekeweg 116, 8000 Brugge, Belgium, djacobs@princecorp.com

More information

From Open Science to Open Innovation, Case: an Environment such as CERN

From Open Science to Open Innovation, Case: an Environment such as CERN From Open Science to Open Innovation, Case: an Environment such as CERN STI Forum Co-Creating the Future, Bangkok, October 19, 2017 Markus Nordberg Head of Resources Development, Development and Innovation

More information

RF and Microwave Power Standards: Extending beyond 110 GHz

RF and Microwave Power Standards: Extending beyond 110 GHz RF and Microwave Power Standards: Extending beyond 110 GHz John Howes National Physical Laboratory April 2008 We now wish to extend above 110 GHz Why now? Previous indecisions about transmission lines,

More information

The LHCb Vertex Locator : Marina Artuso, Syracuse University for the VELO Group

The LHCb Vertex Locator : Marina Artuso, Syracuse University for the VELO Group The LHCb Vertex Locator : status and future perspectives Marina Artuso, Syracuse University for the VELO Group The LHCb Detector Mission: Expore interference of virtual new physics particle in the decays

More information

INDIAN INSTITUTE OF TECHNOLOGY KANPUR

INDIAN INSTITUTE OF TECHNOLOGY KANPUR INDIAN INSTITUTE OF TECHNOLOGY KANPUR ADVERTISEMENT National Centre for Flexible Electronics Applications are invited for the following temporary & contractual work on printed electronics at FlexE Centre.

More information

GaN Electrochemical Probes and MEMS on Silicon. Ulrich Heinle, Peter Benkart, Ingo Daumiller, Mike Kunze, Ertugrul Sönmez

GaN Electrochemical Probes and MEMS on Silicon. Ulrich Heinle, Peter Benkart, Ingo Daumiller, Mike Kunze, Ertugrul Sönmez GaN Electrochemical Probes and MEMS on Silicon Ulrich Heinle, Peter Benkart, Ingo Daumiller, Mike Kunze, Ertugrul Sönmez Outline Introduction Electrochemical sensors GaN-on-Silicon MEMS High temperature

More information

Vertical Integration of MM-wave MMIC s and MEMS Antennas

Vertical Integration of MM-wave MMIC s and MEMS Antennas JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.6, NO.3, SEPTEMBER, 2006 169 Vertical Integration of MM-wave MMIC s and MEMS Antennas Youngwoo Kwon, Yong-Kweon Kim, Sanghyo Lee, and Jung-Mu Kim Abstract

More information

Micro-PackS, Technology Platform. Security Characterization Lab Opening

Micro-PackS, Technology Platform. Security Characterization Lab Opening September, 30 th 2008 Micro-PackS, Technology Platform Security Characterization Lab Opening Members : Micro-PackS in SCS cluster From Silicium to innovative & commucating device R&D structure, gathering

More information

Canada s National Design Network. Community Research Innovation Opportunity

Canada s National Design Network. Community Research Innovation Opportunity Canada s National Design Network Community Research Innovation Opportunity Over the past five years, more than 7000 researchers in the National Design Network have benefited from industrial tools, technologies,

More information

NOISE IN MEMS PIEZORESISTIVE CANTILEVER

NOISE IN MEMS PIEZORESISTIVE CANTILEVER NOISE IN MEMS PIEZORESISTIVE CANTILEVER Udit Narayan Bera Mechatronics, IIITDM Jabalpur, (India) ABSTRACT Though pezoresistive cantilevers are very popular for various reasons, they are prone to noise

More information