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1 Distributed by: The content and copyrights of the attached material are the property of its owner.
2 BRBCT Preferred Device SWITCHODE Power Rectifier Surface ount Power Package The Power Rectifier is a state of the art device that employs the use of the Schottky Barrier principle with a platinum barrier metal. eatures Package Designed for Power Surface ount pplications Center Tap Configuration Guardring for Stress Protection ow orward Voltage 75 C Operating Junction Temperature Epoxy eets U 9 in Short Heat Sink Tab anufactured Not Sheared! Similar in Size to Industry Standard TO 2 Package Pb ree Packages are vailable echanical Characteristics Case: Epoxy, olded, Epoxy eets U 9 V Weight:.7 Grams (pproximately) inish: ll External Surfaces Corrosion Resistant and Terminal eads are Readily Solderable ead and ounting Surface Temperature for Soldering Purposes: 26 C ax. for Seconds Device eets S Requirements ESD Ratings: achine odel, C > V Human Body odel, B >8 V XIU RTINGS (Per eg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RR V RW V R V verage Rectified orward Current (Rated V R, T C = C) Total Device Peak Repetitive orward Current (Rated V R, Square Wave, khz, T C = C) Non Repetitive Peak Surge Current (Surge pplied at Rated oad Conditions Halfwave, Single Phase, 6 Hz) Peak Repetitive Reverse Surge Current (2. s,. khz) I (V) I R I S 5 I RR.5 Storage Temperature Range T stg 65 to +75 C Operating Junction Temperature (Note ) T J 65 to +75 C Voltage Rate of Change (Rated V R ) dv/dt, V/ s aximum ratings are those values beyond which device damage can occur. aximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.. The heat generated must be less than the thermal conductivity from Junction to mbient: dp D /dt J < /R J. SCHOTTKY BRRIER RECTIIER PERES VOTS CSE 8B STYE RKING DIGR Y WW B G K Y WW BG K = ssembly ocation = Year = Work Week = Device Code = Pb ree Package = Diode Polarity ORDERING INORTION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, C, 6 ebruary, 6 Rev. 6 Publication Order Number: BRBCT/D
3 BRBCT THER CHRCTERISTICS (Per eg) Characteristic Symbol Value Unit Thermal Resistance, Junction to Case R JC C/W Junction to mbient (Note 2) R J 5 EECTRIC CHRCTERISTICS (Per eg) aximum Instantaneous orward Voltage (Note ) (i = mp, T C = 25 C) (i = mp, T C = 25 C) (i = mp, T C = 25 C) (i = mp, T C = 25 C) aximum Instantaneous Reverse Current (Note ) (Rated dc Voltage, T J = 25 C) (Rated dc Voltage, T J = 25 C) 2. When mounted using minimum recommended pad size on R board.. Pulse Test: Pulse Width = s, Duty Cycle 2.%. v i R 6.. V m ORDERING INORTION Device Package Shipping BRBCT 5 Units / Rail BRBCTG (Pb ree) 5 Units / Rail BRBCTT 8 Units / Tape & Reel BRBCTTG (Pb ree) 8 Units / Tape & Reel or information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. i, INSTNTNEOUS ORWRD CURRENT (PS) C 5 C C T J = 25 C I R, REVERSE CURRENT (m) T J = 5 C T J = 25 C T J = C T J = 25 C 6 8 v, INSTNTNEOUS VOTGE (VOTS) igure. Typical orward Voltage Per Diode V R, REVERSE VOTGE (VOTS) igure 2. Typical Reverse Current Per Diode I (V), VERGE ORWRD CURRENT (PS) SQURE WVE RTED VOTGE PPIED R JC = 2 C/W T C, CSE TEPERTURE ( C) igure. Typical Current Derating, Case, Per eg DC VERGE POWER (WTTS) T J = 25 C I PK /I V = I PK /I V = I PK /I V = VERGE CURRENT (PS) igure. verage Power Dissipation & verage Current PI DC SQURE WVE 2
4 BRBCT PCKGE DIENSIONS CSE 8B ISSUE J T SETING PNE B 2 G S D P. (.5) T B K C H E V W W J NOTES:. DIENSIONING ND TOERNCING PER NSI Y.5, CONTROING DIENSION: INCH.. 8B THRU 8B OBSOETE, NEW STNDRD 8B. INCHES IIETERS DI IN X IN X B C D E G. BSC 2.5 BSC H J K N.97 RE 5. RE P.79 RE 2. RE R.9 RE.99 RE S V VRIBE CONIGURTION ZONE R N U P STYE : PIN. NODE 2. CTHODE. NODE. CTHODE VIEW W W VIEW W W VIEW W W SODERING OOTPRINT* SCE : *or additional information on our Pb ree strategy and soldering details, please download the ON Semiconductor Soldering and ounting Techniques Reference anual, SODERR/D. mm inches
5 BRBCT SWITCHODE is a trademark of Semiconductor Components Industries, C. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICTION ORDERING INORTION ITERTURE UIENT: iterature Distribution Center for ON Semiconductor P.O. Box 62, Phoenix, rizona US Phone: or 8 86 Toll ree US/Canada ax: or Toll ree US/Canada orderlit@onsemi.com N. merican Technical Support: Toll ree US/Canada Japan: ON Semiconductor, Japan Customer ocus Center 2 9 Kamimeguro, eguro ku, Tokyo, Japan 5 5 Phone: ON Semiconductor Website: Order iterature: or additional information, please contact your local Sales Representative. BRBCT/D
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