AD Bit, 80 MSPS/105 MSPS/125 MSPS/150 MSPS, 1.8 V Dual Analog-to-Digital Converter FUNCTIONAL BLOCK DIAGRAM FEATURES

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1 -Bit, 80 MSPS/05 MSPS/5 MSPS/50 MSPS,.8 V Dual Analog-to-Digital Converter AD967 FEATURES SNR = 69.4 dbc (70.4 dbfs) to 70 5 MSPS SFDR = 85 dbc to 70 5 MSPS Low power: MSPS SNR = 69. dbc (70. dbfs) to MSPS SFDR = 84 dbc to MSPS Low power: MSPS.8 V analog supply operation.8 V to 3.3 V CMOS output supply or.8 V LVDS output supply Integer -to-8 input clock divider IF sampling frequencies to 450 MHz Internal ADC voltage reference Integrated ADC sample-and-hold inputs Flexible analog input range: V p-p to V p-p Differential analog inputs with 650 MHz bandwidth ADC clock duty cycle stabilizer 95 db channel isolation/crosstalk Serial port control User-configurable, built-in self-test (BIST) capability Energy-saving power-down modes Integrated receive features Fast detect/threshold bits Composite signal monitor APPLICATIONS Communications Diversity radio systems Multimode digital receivers (3G) GSM, EDGE, WCDMA, CDMA000, WiMAX, TD-SCDMA I/Q demodulation systems Smart antenna systems General-purpose software radios Broadband data applications VIN+A VIN A VREF SENSE CML RBIAS VIN B VIN+B FUNCTIONAL BLOCK DIAGRAM AVDD DVDD FD(0:3)A FD BITS/THRESHOLD DETECT SHA REF SELECT SHA AD967 MULTICHIP SYNC ADC ADC AGND SYNC FD(0:3)B SDIO/ SCLK/ DCS DFS PROGRAMMING DATA SIGNAL MONITOR DIVIDE TO 8 DUTY CYCLE STABILIZER FD BITS/THRESHOLD DETECT SPI CSB SIGNAL MONITOR DATA DRVDD DCO GENERATION SIGNAL MONITOR INTERFACE SMI SDFS SMI SCLK/ PDWN CMOS OUTPUT BUFFER CMOS OUTPUT BUFFER SMI SDO/ OEB NOTES.PIN NAMES ARE FOR THE CMOS PIN CONFIGURATION ONLY; SEE FIGURE 7 FOR LVDS PIN NAMES. Figure. DRGND DA D0A CLK+ CLK DCOA DCOB DB PRODUCT HIGHLIGHTS. Integrated dual, -bit, 80 MSPS/05 MSPS/5 MSPS/ 50 MSPS ADC.. Fast overrange detect and signal monitor with serial output. 3. Signal monitor block with dedicated serial output mode. 4. Proprietary differential input that maintains excellent SNR performance for input frequencies up to 450 MHz. 5. Operation from a single.8 V supply and a separate digital output driver supply to accommodate.8 V to 3.3 V logic families. 6. Standard serial port interface (SPI) that supports various product features and functions, such as data formatting (offset binary, twos complement, or gray coding), enabling the clock DCS, power-down, test modes, and voltage reference mode. 7. Pin compatibility with the AD9640, AD967-, and AD9600 for a simple migration from bits to 4 bits, bits, or 0 bits. D0B Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 906, Norwood, MA , U.S.A. Tel: Fax: Analog Devices, Inc. All rights reserved.

2 * Product Page Quick Links Last Content Update: 08/30/06 Comparable Parts View a parametric search of comparable parts Evaluation Kits AD967 Evaluation Board Documentation Application Notes AN-4: Techniques for High Speed ADC PCB Layout AN-8: Fundamentals of Sampled Data Systems AN-345: Grounding for Low-and-High-Frequency Circuits AN-75: A First Approach to IBIS Models: What They Are and How They Are Generated AN-737: How ADIsimADC Models an ADC AN-74: Frequency Domain Response of Switched- Capacitor ADCs AN-756: Sampled Systems and the Effects of Clock Phase Noise and Jitter AN-807: Multicarrier WCDMA Feasibility AN-808: Multicarrier CDMA000 Feasibility AN-8: MicroController-Based Serial Port Interface (SPI) Boot Circuit AN-87: A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs AN-835: Understanding High Speed ADC Testing and Evaluation AN-85: A WiMax Double Downconversion IF Sampling Receiver Design AN-878: High Speed ADC SPI Control Software AN-905: Visual Analog Converter Evaluation Tool Version.0 User Manual AN-935: Designing an ADC Transformer-Coupled Front End Data Sheet AD967: -Bit, 80 MSPS/05 MSPS/5 MSPS/50 MSPS,.8 V Dual Analog-to-Digital Converter Data Sheet Tools and Simulations Visual Analog AD967 IBIS Models AD967/AD9640 S-Parameters Reference Materials Technical Articles MS-0: Designing Power Supplies for High Speed ADC Design Resources AD967 Material Declaration PCN-PDN Information Quality And Reliability Symbols and Footprints Discussions View all AD967 EngineerZone Discussions Sample and Buy Visit the product page to see pricing options Technical Support Submit a technical question or find your regional support number * This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to the content on this page does not constitute a change to the revision number of the product data sheet. This content may be frequently modified.

3 TABLE OF CONTENTS Features... Applications... Functional Block Diagram... Product Highlights... Revision History... 3 General Description... 4 Specifications... 5 ADC DC Specifications AD967-80/AD ADC DC Specifications AD967-5/AD ADC AC Specifications AD967-80/AD ADC AC Specifications AD967-5/AD Digital Specifications... 9 Switching Specifications AD967-80/AD Switching Specifications AD967-5/AD Timing Specifications... 3 Absolute Maximum Ratings... 5 Thermal Characteristics... 5 ESD Caution... 5 Pin Configurations and Function Descriptions... 6 Equivalent Circuits... 0 Typical Performance Characteristics... Theory of Operation... 6 ADC Architecture... 6 Analog Input Considerations... 6 Voltage Reference... 8 Clock Input Considerations... 9 Power Dissipation and Standby Mode... 3 Digital Outputs... 3 Timing... 3 ADC Overrange and Gain Control Fast Detect Overview ADC Fast Magnitude ADC Overrange (OR) Gain Switching Signal Monitor Peak Detector Mode RMS/MS Magnitude Mode Threshold Crossing Mode Additional Control Bits DC Correction Signal Monitor SPORT Output Built-In Self-Test (BIST) and Output Test Built-In Self-Test (BIST) Output Test Modes Channel/Chip Synchronization Serial Port Interface (SPI)... 4 Configuration Using the SPI... 4 Hardware Interface... 4 Configuration Without the SPI... 4 SPI Accessible Features... 4 Memory Map Reading the Memory Map Register Table Memory Map Register Table Memory Map Register Descriptions Applications Information Design Guidelines Evaluation Board... 5 Power Supplies... 5 Input Signals... 5 Output Signals... 5 Default Operation and Jumper Selection Settings... 5 Alternative Clock Configurations... 5 Alternative Analog Input Drive Configuration Schematics Evaluation Board Layouts Bill of Materials... 7 Outline Dimensions Ordering Guide Rev. B Page of 76

4 REVISION HISTORY 5/0 Rev. A to Rev. B Deleted CP-64-3 Package... Universal Added CP-64-6 Package... Universal Changed AD967BCPZ-80 to AD and AD967BCPZ-05 to AD Throughout... 5 Changed AD967BCPZ-5 to AD967-5 and AD967BCPZ-50 to AD Throughout... 6 Changes to Figure Changes to Figure Updated Outline Dimensions Changes to Ordering Guide /09 Rev. 0 to Rev. A Changes to Table 6... Changes to Table 7... Changes to Figure Changes to Figure, Figure, and Figure Changes to Table Changes to Configuration Using the SPI Section... 4 Change to Table Change to Signal Monitor Period (Register 0x3 to Register 0x5) Section Updated Outline Dimensions /07 Revision 0: Initial Version Rev. B Page 3 of 76

5 GENERAL DESCRIPTION The AD967 is a dual, -bit, 80 MSPS/05 MSPS/5 MSPS/ 50 MSPS analog-to-digital converter (ADC). The AD967 is designed to support communications applications where low cost, small size, and versatility are desired. The dual ADC core features a multistage, differential pipelined architecture with integrated output error correction logic. Each ADC features wide bandwidth differential sample-and-hold analog input amplifiers supporting a variety of user-selectable input ranges. An integrated voltage reference eases design considerations. A duty cycle stabilizer is provided to compensate for variations in the ADC clock duty cycle, allowing the converters to maintain excellent performance. The AD967 has several functions that simplify the automatic gain control (AGC) function in the system receiver. The fast detect feature allows fast overrange detection by outputting four bits of input level information with very short latency. In addition, the programmable threshold detector allows monitoring of the incoming signal power, using the four fast detect bits of the ADC with very low latency. If the input signal level exceeds the programmable threshold, the coarse upper threshold indicator goes high. Because this threshold indicator has very low latency, the user can quickly turn down the system gain to avoid an overrange condition. The second AGC-related function is the signal monitor. This block allows the user to monitor the composite magnitude of the incoming signal, which aids in setting the gain to optimize the dynamic range of the overall system. The ADC output data can be routed directly to the two external -bit output ports. These outputs can be set from.8 V to 3.3 V CMOS or.8 V LVDS. Flexible power-down options allow significant power savings, when desired. Programming for setup and control is accomplished using a 3-bit SPI-compatible serial interface. The AD967 is available in a 64-lead LFCSP and is specified over the industrial temperature range of 40 C to +85 C. Rev. B Page 4 of 76

6 SPECIFICATIONS ADC DC SPECIFICATIONS AD967-80/AD AD967 AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, DCS enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted. Table. AD AD Parameter Temperature Min Typ Max Min Typ Max Unit RESOLUTION Full Bits ACCURACY No Missing Codes Full Guaranteed Guaranteed Offset Error Full ±0. ±0.6 ±0.3 ±0.7 % FSR Gain Error Full % FSR Differential Nonlinearity (DNL) Full ±0.4 ±0.4 LSB 5 C ±0. ±0. LSB Integral Nonlinearity (INL) Full ±0.9 ±0.9 LSB 5 C ±0.4 ±0.4 LSB MATCHING CHARACTERISTIC Offset Error Full ±0. ±0.6 ±0.3 ±0.7 % FSR Gain Error Full ±0. ±0.75 ±0. ±0.75 % FSR TEMPERATURE DRIFT Offset Error Full ±5 ±5 ppm/ C Gain Error Full ±95 ±95 ppm/ C INTERNAL VOLTAGE REFERENCE Output Voltage Error ( V Mode) Full ±5 ±6 ±5 ±6 mv Load ma Full 7 7 mv INPUT REFERRED NOISE VREF =.0 V 5 C LSB rms ANALOG INPUT Input Span, VREF =.0 V Full V p-p Input Capacitance Full 8 8 pf VREF INPUT RESISTANCE Full 6 6 kω POWER SUPPLIES Supply Voltage AVDD, DVDD Full V DRVDD (CMOS Mode) Full V DRVDD (LVDS Mode) Full V Supply Current IAVDD, 3 Full ma IDVDD, 3 Full 6 34 ma IDRVDD (3.3 V CMOS) Full 3 34 ma IDRVDD (.8 V CMOS) Full 5 ma IDRVDD (.8 V LVDS) Full ma POWER CONSUMPTION DC Input Full mw Sine Wave Input (DRVDD =.8 V) Full mw Sine Wave Input (DRVDD = 3.3 V) Full mw Standby Power 4 Full 5 68 mw Power-Down Power Full mw Measured with a low input frequency, full-scale sine wave, with approximately 5 pf loading on each output bit. Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 8 for the equivalent analog input structure. 3 The maximum limit applies to the combination of IAVDD and IDVDD currents. 4 Standby power is measured with a dc input and with the CLK pins inactive (set to AVDD or AGND). Rev. B Page 5 of 76

7 ADC DC SPECIFICATIONS AD967-5/AD AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, DCS enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted. Table. AD967-5 AD Parameter Temperature Min Typ Max Min Typ Max Unit RESOLUTION Full Bits ACCURACY No Missing Codes Full Guaranteed Guaranteed Offset Error Full ±0.3 ±0.6 ±0. ±0.6 % FSR Gain Error Full % FSR Differential Nonlinearity (DNL) Full ±0.4 ±0.9 LSB 5 C ±0. ±0. LSB Integral Nonlinearity (INL) Full ±0.9 ±.3 LSB 5 C ±0.4 ±0.5 LSB MATCHING CHARACTERISTIC Offset Error 5 C ±0.3 ±0.6 ±0. ±0.7 % FSR Gain Error 5 C ±0. ±0.75 ±0. ±0.8 % FSR TEMPERATURE DRIFT Offset Error Full ±5 ±5 ppm/ C Gain Error Full ±95 ±95 ppm/ C INTERNAL VOLTAGE REFERENCE Output Voltage Error ( V Mode) Full ±5 ±6 ±5 ±6 mv Load ma Full 7 7 mv INPUT REFERRED NOISE VREF =.0 V 5 C LSB rms ANALOG INPUT Input Span, VREF =.0 V Full V p-p Input Capacitance Full 8 8 pf VREF INPUT RESISTANCE Full 6 6 kω POWER SUPPLIES Supply Voltage AVDD, DVDD Full V DRVDD (CMOS Mode) Full V DRVDD (LVDS Mode) Full V Supply Current IAVDD, 3 Full ma IDVDD, 3 Full 4 50 ma IDRVDD (3.3 V CMOS) Full 36 4 ma IDRVDD (.8 V CMOS) Full 8 ma IDRVDD (.8 V LVDS) Full ma POWER CONSUMPTION DC Input Full mw Sine Wave Input (DRVDD =.8 V) Full mw Sine Wave Input (DRVDD = 3.3 V) Full mw Standby Power 4 Full mw Power-Down Power Full mw Measured with a low input frequency, full-scale sine wave, with approximately 5 pf loading on each output bit. Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 8 for the equivalent analog input structure. 3 The maximum limit applies to the combination of IAVDD and IDVDD currents. 4 Standby power is measured with a dc input and with the CLK pins inactive (set to AVDD or AGND). Rev. B Page 6 of 76

8 ADC AC SPECIFICATIONS AD967-80/AD AD967 AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, DCS enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted. Table 3. AD AD Parameter Temperature Min Typ Max Min Typ Max Unit SIGNAL-TO-NOISE RATIO (SNR) fin =.3 MHz 5 C db fin = 70 MHz 5 C db Full db fin = 40 MHz 5 C db fin = 0 MHz 5 C db SIGNAL-TO-NOISE AND DISTORTION (SINAD) fin =.3 MHz 5 C db fin = 70 MHz 5 C db Full db fin = 40 MHz 5 C db fin = 0 MHz 5 C db EFFECTIVE NUMBER OF BITS (ENOB) fin =.3 MHz 5 C.5.4 Bits fin = 70 MHz 5 C.4.4 Bits fin = 40 MHz 5 C.4.4 Bits fin = 0 MHz 5 C.3. Bits WORST SECOND OR THIRD HARMONIC fin =.3 MHz 5 C dbc fin = 70 MHz 5 C dbc Full dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc SPURIOUS-FREE DYNAMIC RANGE (SFDR) fin =.3 MHz 5 C dbc fin = 70 MHz 5 C dbc Full dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc WORST OTHER HARMONIC OR SPUR fin =.3 MHz 5 C 9 9 dbc fin = 70 MHz 5 C dbc Full 8 8 dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc TWO-TONE SFDR fin = 9. MHz, 3. MHz ( 7 dbfs ) 5 C dbc fin = 69. MHz, 7. MHz ( 7 dbfs ) 5 C 8 8 dbc CROSSTALK Full db ANALOG INPUT BANDWIDTH 5 C MHz See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Crosstalk is measured at 00 MHz with dbfs on one channel and with no input on the alternate channel. Rev. B Page 7 of 76

9 ADC AC SPECIFICATIONS AD967-5/AD AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, DCS enabled, fast detect output pins disabled, and signal monitor disabled, unless otherwise noted. Table 4. AD967-5 AD Parameter Temperature Min Typ Max Min Typ Max Unit SIGNAL-TO-NOISE RATIO (SNR) fin =.3 MHz 5 C db fin = 70 MHz 5 C db Full db fin = 40 MHz 5 C db fin = 0 MHz 5 C db SIGNAL-TO-NOISE AND DISTORTION (SINAD) fin =.3 MHz 5 C db fin = 70 MHz 5 C db Full db fin = 40 MHz 5 C db fin = 0 MHz 5 C db EFFECTIVE NUMBER OF BITS (ENOB) fin =.3 MHz 5 C.4.4 Bits fin = 70 MHz 5 C.4.4 Bits fin = 40 MHz 5 C.3.3 Bits fin = 0 MHz 5 C.3. Bits WORST SECOND OR THIRD HARMONIC fin =.3 MHz 5 C dbc fin = 70 MHz 5 C dbc Full dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc SPURIOUS-FREE DYNAMIC RANGE (SFDR) fin =.3 MHz 5 C dbc fin = 70 MHz 5 C dbc Full dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc WORST OTHER HARMONIC OR SPUR fin =.3 MHz 5 C 9 9 dbc fin = 70 MHz 5 C dbc Full 8 80 dbc fin = 40 MHz 5 C dbc fin = 0 MHz 5 C dbc TWO-TONE SFDR fin = 9. MHz, 3. MHz ( 7 dbfs ) 5 C dbc fin = 69. MHz, 7. MHz ( 7 dbfs ) 5 C 8 8 dbc CROSSTALK Full db ANALOG INPUT BANDWIDTH 5 C MHz See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Crosstalk is measured at 00 MHz with dbfs on one channel and with no input on the alternate channel. Rev. B Page 8 of 76

10 DIGITAL SPECIFICATIONS Rev. B Page 9 of 76 AD967 AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, and DCS enabled, unless otherwise noted. Table 5. Parameter Temperature Min Typ Max Unit DIFFERENTIAL CLOCK INPUTS (CLK+, CLK ) Logic Compliance CMOS/LVDS/LVPECL Internal Common-Mode Bias Full. V Differential Input Voltage Full 0. 6 V p-p Input Voltage Range Full GND 0.3 AVDD +.6 V Input Common-Mode Range Full. AVDD V High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current Full 0 +0 μa Low Level Input Current Full 0 +0 μa Input Capacitance Full 4 pf Input Resistance Full 8 0 kω SYNC INPUT Logic Compliance CMOS Internal Bias Full. V Input Voltage Range Full GND 0.3 AVDD +.6 V High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current Full 0 +0 μa Low Level Input Current Full 0 +0 μa Input Capacitance Full 4 pf Input Resistance Full 8 0 kω LOGIC INPUT (CSB) High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current Full 0 +0 μa Low Level Input Current Full 40 3 μa Input Resistance Full 6 kω Input Capacitance Full pf LOGIC INPUT (SCLK/DFS) High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current (VIN = 3.3 V) Full 9 35 μa Low Level Input Current Full 0 +0 μa Input Resistance Full 6 kω Input Capacitance Full pf LOGIC INPUTS/OUTPUTS (SDIO/DCS, SMI SDFS) High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current Full 0 +0 μa Low Level Input Current Full 38 8 μa Input Resistance Full 6 kω Input Capacitance Full 5 pf LOGIC INPUTS/OUTPUTS (SMI SDO/OEB, SMI SCLK/PDWN) High Level Input Voltage Full. 3.6 V Low Level Input Voltage Full V High Level Input Current (VIN = 3.3 V) Full μa Low Level Input Current Full 0 +0 μa

11 Parameter Temperature Min Typ Max Unit Input Resistance Full 6 kω Input Capacitance Full 5 pf DIGITAL OUTPUTS CMOS Mode DRVDD = 3.3 V High Level Output Voltage IOH = 50 μa Full 3.9 V IOH = 0.5 ma Full 3.5 V Low Level Output Voltage IOL =.6 ma Full 0. V IOL = 50 μa Full 0.05 V CMOS Mode DRVDD =.8 V High Level Output Voltage IOH = 50 μa Full.79 V IOH = 0.5 ma Full.75 V Low Level Output Voltage IOL =.6 ma Full 0. V IOL = 50 μa Full 0.05 V LVDS Mode DRVDD =.8 V Differential Output Voltage (VOD), ANSI Mode Full mv Output Offset Voltage (VOS), ANSI Mode Full V Differential Output Voltage (VOD), Reduced Swing Mode Full mv Output Offset Voltage (VOS), Reduced Swing Mode Full V Pull up. Pull down. Rev. B Page 0 of 76

12 SWITCHING SPECIFICATIONS AD967-80/AD AD967 AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, and DCS enabled, unless otherwise noted. Table 6. AD AD Parameter Temperature Min Typ Max Min Typ Max Unit CLOCK INPUT PARAMETERS Input Clock Rate Full MHz Conversion Rate DCS Enabled Full MSPS DCS Disabled Full MSPS CLK Period Divide-by- Mode (tclk) Full ns CLK Pulse Width High Divide-by- Mode, DCS Enabled Full ns Divide by--mode, DCS Disabled Full ns Divide-by- Mode, DCS Enabled Full.6.6 ns Divide-by-3 Through Divide-by-8 Full ns Modes, DCS Enabled DATA OUTPUT PARAMETERS (DATA, FD) CMOS Mode DRVDD = 3.3 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns Setup Time (ts) Full ns Hold Time (th) Full ns CMOS Mode DRVDD =.8 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns Setup Time (ts) Full ns Hold Time (th) Full ns LVDS Mode DRVDD =.8 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns CMOS Mode Pipeline Delay (Latency) Full Cycles LVDS Mode Pipeline Delay (Latency) Full /.5 /.5 Cycles Channel A/Channel B Aperture Delay (ta) Full.0.0 ns Aperture Uncertainty (Jitter, tj) Full ps rms Wake-Up Time 3 Full μs OUT-OF-RANGE RECOVERY TIME Full Cycles Conversion rate is the clock rate after the divider. Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with 5 pf load. 3 Wake-up time is dependent on the value of the decoupling capacitors. Rev. B Page of 76

13 SWITCHING SPECIFICATIONS AD967-5/AD AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, maximum sample rate, VIN =.0 dbfs differential input,.0 V internal reference, and DCS enabled, unless otherwise noted. Table 7. AD967-5 AD Parameter Temperature Min Typ Max Min Typ Max Unit CLOCK INPUT PARAMETERS Input Clock Rate Full MHz Conversion Rate DCS Enabled Full MSPS DCS Disabled Full MSPS CLK Period Divide-by- Mode (tclk) Full ns CLK Pulse Width High Divide-by- Mode, DCS Enabled Full ns Divide-by- Mode, DCS Disabled Full ns Divide-by- Mode, DCS Enabled Full.6.6 ns Divide-by-3-Through-8 Mode, Full ns DCS Enabled DATA OUTPUT PARAMETERS (DATA, FD) CMOS Mode DRVDD = 3.3 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns Setup Time (ts) Full ns Hold Time (th) Full ns CMOS Mode DRVDD =.8 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns Setup Time (ts) Full ns Hold Time (th) Full ns LVDS Mode DRVDD =.8 V Data Propagation Delay (tpd) Full ns DCO Propagation Delay (tdco) Full ns CMOS Mode Pipeline Delay (Latency) Full Cycles LVDS Mode Pipeline Delay (Latency) Full /.5 /.5 Cycles Channel A/Channel B Aperture Delay (ta) Full.0.0 ns Aperture Uncertainty (Jitter, tj) Full ps rms Wake-Up Time 3 Full μs OUT-OF-RANGE RECOVERY TIME Full 3 3 Cycles Conversion rate is the clock rate after the divider. Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with 5 pf load. 3 Wake-up time is dependent on the value of the decoupling capacitors. Rev. B Page of 76

14 TIMING SPECIFICATIONS Table 8. Parameter Conditions Min Typ Max Unit SYNC TIMING REQUIREMENTS tssync SYNC to rising edge of CLK setup time 0.4 ns thsync SYNC to rising edge of CLK hold time 0.40 ns SPI TIMING REQUIREMENTS tds Setup time between the data and the rising edge of SCLK ns tdh Hold time between the data and the rising edge of SCLK ns tclk Period of the SCLK 40 ns ts Setup time between CSB and SCLK ns th Hold time between CSB and SCLK ns thigh SCLK pulse width high 0 ns tlow SCLK pulse width low 0 ns ten_sdio Time required for the SDIO pin to switch from an input to an 0 ns output relative to the SCLK falling edge tdis_sdio Time required for the SDIO pin to switch from an output to an 0 ns input relative to the SCLK rising edge SPORT TIMING REQUIREMENTS tcssclk Delay from rising edge of CLK+ to rising edge of SMI SCLK ns tssclksdo Delay from rising edge of SMI SCLK to SMI SDO ns tssclksdfs Delay from rising edge of SMI SCLK to SMI SDFS ns Timing Diagrams N N+ N+ N+ 3 t A N+ 4 N+ 5 N+ 6 N+ 7 N+ 8 CLK+ t CLK CLK CH A/CH B DATA N 3 t PD N N N 0 N 9 N 8 N 7 N 6 N 5 N 4 CH A/CH B FAST DETECT N 3 N N N N + N + N + 3 N + 4 N + 5 N + 6 t S th t DCO t CLK DCOA/DCOB Figure. CMOS Output Mode Data and Fast Detect Output Timing (Fast Detect Mode Select Bits = 000) Rev. B Page 3 of 76

15 N N+ N+ N+ 3 t A N+ 4 N+ 5 N+ 6 N+ 7 N+ 8 CLK+ t CLK CLK CH A/CH B DATA t PD A B A B A B A B A B A B A B A B A B A CH A/CH B FAST DETECT N 3 N N N 0 N 9 N 8 N 7 N 6 N 5 N 4 A B A B A B A B A B A B A B A B A B A N 7 N 6 N 5 N 4 N 3 N N N N + N + t DCO t CLK DCO+ DCO Figure 3. LVDS Mode Data and Fast Detect Output Timing (Fast Detect Mode Select Bits = 00 Through Fast Detect Mode Select Bits = 00) CLK+ t SSYNC t HSYNC SYNC Figure 4. SYNC Input Timing Requirements CLK+ CLK t CSSCLK SMI SCLK t SSCLKSDFS t SSCLKSDO SMI SDFS SMI SDO DATA Figure 5. Signal Monitor SPORT Output Timing (Divide-by- Mode) DATA Rev. B Page 4 of 76

16 ABSOLUTE MAXIMUM RATINGS Table 9. Parameter ELECTRICAL AVDD, DVDD to AGND DRVDD to DRGND AGND to DRGND AVDD to DRVDD VIN+A/VIN+B, VIN A/VIN B to AGND CLK+, CLK to AGND SYNC to AGND VREF to AGND SENSE to AGND CML to AGND RBIAS to AGND CSB to AGND SCLK/DFS to DRGND SDIO/DCS to DRGND SMI SDO/OEB SMI SCLK/PDWN SMI SDFS D0A/D0B through DA/DB to DRGND FD0A/FD0B through FD3A/FD3B to DRGND DCOA/DCOB to DRGND ENVIRONMENTAL Operating Temperature Range (Ambient) Maximum Junction Temperature Under Bias Storage Temperature Range (Ambient) Rating 0.3 V to +.0 V 0.3 V to +3.9 V 0.3 V to +0.3 V 3.9 V to +.0 V 0.3 V to AVDD + 0. V 0.3 V to +3.9 V 0.3 V to +3.9 V 0.3 V to AVDD + 0. V 0.3 V to AVDD + 0. V 0.3 V to AVDD + 0. V 0.3 V to AVDD + 0. V 0.3 V to +3.9 V 0.3 V to +3.9 V 0.3 V to DRVDD V 0.3 V to DRVDD V 0.3 V to DRVDD V 0.3 V to DRVDD V 0.3 V to DRVDD V 0.3 V to DRVDD V 0.3 V to DRVDD V 40 C to +85 C 50 C 65 C to +50 C THERMAL CHARACTERISTICS The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints and maximizes the thermal capability of the package. Table 0. Thermal Resistance Package Type 64-Lead LFCSP 9 mm 9 mm (CP-64-6) Airflow Velocity (m/s) θja, θjc, 3 θjb, 4 Unit C/W C/W C/W Per JEDEC 5-7, plus JEDEC 5-5 SP test board. Per JEDEC JESD5- (still air) or JEDEC JESD5-6 (moving air). 3 Per MIL-Std 883, Method Per JEDEC JESD5-8 (still air). Typical θja is specified for a 4-layer PCB with a solid ground plane. As shown, airflow improves heat dissipation, which reduces θja. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θja. ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B Page 5 of 76

17 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS DRGND D3B DB DB D0B (LSB) DNC DNC DVDD FD3B FDB FDB FD0B SYNC CSB CLK CLK+ DRVDD D4B D5B 3 D6B 4 D7B 5 D8B 6 D9B 7 D0B 8 DB (MSB) 9 DCOB 0 DCOA DNC DNC 3 D0A (LSB) 4 DA 5 DA 6 PIN INDICATOR EXPOSED PADDLE, PIN 0 (BOTTOM OF PACKAGE) AD967 PARALLEL CMOS TOP VIEW (Not to Scale) 48 SCLK/DFS 47 SDIO/DCS 46 AVDD 45 AVDD 44 VIN+B 43 VIN B 4 RBIAS 4 CML 40 SENSE 39 VREF 38 VIN A 37 VIN+A 36 AVDD 35 SMI SDFS 34 SMI SCLK/PDWN 33 SMI SDO/OEB D3A D4A D5A DRGND DRVDD D6A D7A DVDD D8A D9A D0A DA (MSB) FD0A FDA FDA FD3A NOTES. DNC = DO NOT CONNECT.. THE EXPOSED PAD MUST BE CONNECTED TO ANALOG GROUND. Figure 6. LFCSP Parallel CMOS Pin Configuration (Top View) Table. Pin Function Descriptions (Parallel CMOS Mode) Pin No. Mnemonic Type Description ADC Power Supplies 0, 64 DRGND Ground Digital Output Ground., DRVDD Supply Digital Output Driver Supply (.8 V to 3.3 V). 4, 57 DVDD Supply Digital Power Supply (.8 V Nominal). 36, 45, 46 AVDD Supply Analog Power Supply (.8 V Nominal). 0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package., 3, 58, 59 DNC Do Not Connect. ADC Analog 37 VIN+A Input Differential Analog Input Pin (+) for Channel A. 38 VIN A Input Differential Analog Input Pin ( ) for Channel A. 44 VIN+B Input Differential Analog Input Pin (+) for Channel B. 43 VIN B Input Differential Analog Input Pin ( ) for Channel B. 39 VREF Input/Output Voltage Reference Input/Output. 40 SENSE Input Voltage Reference Mode Select. See Table 4 for details. 4 RBIAS Input/Output External Reference Bias Resistor. 4 CML Output Common-Mode Level Bias Output for Analog Inputs. 49 CLK+ Input ADC Clock Input True. 50 CLK Input ADC Clock Input Complement. ADC Fast Detect Outputs 9 FD0A Output Channel A Fast Detect Indicator. See Table 7 for details. 30 FDA Output Channel A Fast Detect Indicator. See Table 7 for details. 3 FDA Output Channel A Fast Detect Indicator. See Table 7 for details. 3 FD3A Output Channel A Fast Detect Indicator. See Table 7 for details. 53 FD0B Output Channel B Fast Detect Indicator. See Table 7 for details. 54 FDB Output Channel B Fast Detect Indicator. See Table 7 for details. 55 FDB Output Channel B Fast Detect Indicator. See Table 7 for details. 56 FD3B Output Channel B Fast Detect Indicator. See Table 7 for details. Rev. B Page 6 of 76

18 Pin No. Mnemonic Type Description Digital Input 5 SYNC Input Digital Synchronization Pin. Slave mode only. Digital Outputs 4 D0A (LSB) Output Channel A CMOS Output Data. 5 DA Output Channel A CMOS Output Data. 6 DA Output Channel A CMOS Output Data. 7 D3A Output Channel A CMOS Output Data. 8 D4A Output Channel A CMOS Output Data. 9 D5A Output Channel A CMOS Output Data. D6A Output Channel A CMOS Output Data. 3 D7A Output Channel A CMOS Output Data. 5 D8A Output Channel A CMOS Output Data. 6 D9A Output Channel A CMOS Output Data. 7 D0A Output Channel A CMOS Output Data. 8 DA (MSB) Output Channel A CMOS Output Data. 60 D0B (LSB) Output Channel B CMOS Output Data. 6 DB Output Channel B CMOS Output Data. 6 DB Output Channel B CMOS Output Data. 63 D3B Output Channel B CMOS Output Data. D4B Output Channel B CMOS Output Data. 3 D5B Output Channel B CMOS Output Data. 4 D6B Output Channel B CMOS Output Data. 5 D7B Output Channel B CMOS Output Data. 6 D8B Output Channel B CMOS Output Data. 7 D9B Output Channel B CMOS Output Data. 8 D0B Output Channel B CMOS Output Data. 9 DB (MSB) Output Channel B CMOS Output Data. DCOA Output Channel A Data Clock Output. 0 DCOB Output Channel B Data Clock Output. SPI Control 48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode. 47 SDIO/DCS Input/Output SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. 5 CSB Input SPI Chip Select (Active Low). Signal Monitor Port 33 SMI SDO/OEB Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode. 35 SMI SDFS Output Signal Monitor Serial Data Frame Sync. 34 SMI SCLK/PDWN Input/Output Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode. Rev. B Page 7 of 76

19 PIN INDICATOR DRGND DNC DNC FD3+ FD3 FD+ FD DVDD FD+ FD FD0+ FD0 SYNC CSB CLK CLK+ DRVDD DNC DNC 3 D0 (LSB) 4 D0+ (LSB) 5 D 6 D+ 7 D 8 D+ 9 DCO 0 DCO+ D3 D3+ 3 D4 4 D4+ 5 D5 6 EXPOSED PADDLE, PIN 0 (BOTTOM OF PACKAGE) AD967 PARALLEL LVDS TOP VIEW (Not to Scale) 48 SCLK/DFS 47 SDIO/DCS 46 AVDD 45 AVDD 44 VIN+B 43 VIN B 4 RBIAS 4 CML 40 SENSE 39 VREF 38 VIN A 37 VIN+A 36 AVDD 35 SMI SDFS 34 SMI SCLK/PDWN 33 SMI SDO/OEB D5+ D6 D6+ DRGND DRVDD D7 D7+ DVDD D8 D8+ D9 D9+ D0 D0+ D (MSB) D+ (MSB) NOTES. DNC = DO NOT CONNECT.. THE EXPOSED PAD MUST BE CONNECTED TO ANALOG GROUND. Figure 7. LFCSP Interleaved Parallel LVDS Pin Configuration (Top View) Table. Pin Function Descriptions (Interleaved Parallel LVDS Mode) Pin No. Mnemonic Type Description ADC Power Supplies 0, 64 DRGND Ground Digital Output Ground., DRVDD Supply Digital Output Driver Supply (.8 V to 3.3 V). 4, 57 DVDD Supply Digital Power Supply (.8 V Nominal). 36, 45, 46 AVDD Supply Analog Power Supply (.8 V Nominal). 0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package., 3, 6, 63 DNC Do Not Connect. ADC Analog 37 VIN+A Input Differential Analog Input Pin (+) for Channel A. 38 VIN A Input Differential Analog Input Pin ( ) for Channel A. 44 VIN+B Input Differential Analog Input Pin (+) for Channel B. 43 VIN B Input Differential Analog Input Pin ( ) for Channel B. 39 VREF Input/Output Voltage Reference Input/Output. 40 SENSE Input Voltage Reference Mode Select. See Table 4 for details. 4 RBIAS Input/Output External Reference Bias Resistor. 4 CML Output Common-Mode Level Bias Output for Analog Inputs. 49 CLK+ Input ADC Clock Input True. 50 CLK Input ADC Clock Input Complement. ADC Fast Detect Outputs 54 FD0+ Output Channel A/Channel B LVDS Fast Detect Indicator 0 True. See Table 7 for details. 53 FD0 Output Channel A/Channel B LVDS Fast Detect Indicator 0 Complement. See Table 7 for details. 56 FD+ Output Channel A/Channel B LVDS Fast Detect Indicator True. See Table 7 for details. 55 FD Output Channel A/Channel B LVDS Fast Detect Indicator Complement. See Table 7 for details. 59 FD+ Output Channel A/Channel B LVDS Fast Detect Indicator True. See Table 7 for details. 58 FD Output Channel A/Channel B LVDS Fast Detect Indicator Complement. See Table 7 for details. 6 FD3+ Output Channel A/Channel B LVDS Fast Detect Indicator 3 True. See Table 7 for details. 60 FD3 Output Channel A/Channel B LVDS Fast Detect Indicator 3 Complement. See Table 7 for details. Digital Input 5 SYNC Input Digital Synchronization Pin. Slave mode only. Rev. B Page 8 of 76

20 Pin No. Mnemonic Type Description Digital Outputs 5 D0+ (LSB) Output Channel A/Channel B LVDS Output Data 0 True. 4 D0 (LSB) Output Channel A/Channel B LVDS Output Data 0 Complement. 7 D+ Output Channel A/Channel B LVDS Output Data True. 6 D Output Channel A/Channel B LVDS Output Data Complement. 9 D+ Output Channel A/Channel B LVDS Output Data True. 8 D Output Channel A/Channel B LVDS Output Data Complement. 3 D3+ Output Channel A/Channel B LVDS Output Data 3 True. D3 Output Channel A/Channel B LVDS Output Data 3 Complement. 5 D4+ Output Channel A/Channel B LVDS Output Data 4 True. 4 D4 Output Channel A/Channel B LVDS Output Data 4 Complement. 7 D5+ Output Channel A/Channel B LVDS Output Data 5 True. 6 D5 Output Channel A/Channel B LVDS Output Data 5 Complement. 9 D6+ Output Channel A/Channel B LVDS Output Data 6 True. 8 D6 Output Channel A/Channel B LVDS Output Data 6 Complement. 3 D7+ Output Channel A/Channel B LVDS Output Data 7 True. D7 Output Channel A/Channel B LVDS Output Data 7 Complement. 6 D8+ Output Channel A/Channel B LVDS Output Data 8 True. 5 D8 Output Channel A/Channel B LVDS Output Data 8 Complement. 8 D9+ Output Channel A/Channel B LVDS Output Data 9 True. 7 D9 Output Channel A/Channel B LVDS Output Data 9 Complement. 30 D0+ Output Channel A/Channel B LVDS Output Data 0 True. 9 D0 Output Channel A/Channel B LVDS Output Data 0 Complement. 3 D+ (MSB) Output Channel A/Channel B LVDS Output Data True. 3 D (MSB) Output Channel A/Channel B LVDS Output Data Complement. DCO+ Output Channel A/Channel B LVDS Data Clock Output True. 0 DCO Output Channel A/Channel B LVDS Data Clock Output Complement. SPI Control 48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode. 47 SDIO/DCS Input/Output SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. 5 CSB Input SPI Chip Select (Active Low). Signal Monitor Port 33 SMI SDO/OEB Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode. 35 SMI SDFS Output Signal Monitor Serial Data Frame Sync. 34 SMI SCLK/PDWN Input/Output Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode. Rev. B Page 9 of 76

21 EQUIVALENT CIRCUITS VIN SCLK/DFS 6kΩ kω Figure 8. Equivalent Analog Input Circuit Figure. Equivalent SCLK/DFS Input Circuit AVDD CLK+ 0kΩ.V 0kΩ CLK SENSE kω Figure 9. Equivalent Clock Input Circuit Figure 3. Equivalent SENSE Circuit DRVDD AVDD CSB 6kΩ kω DRGND Figure 0. Digital Output Figure 4. Equivalent CSB Input Circuit AVDD DRVDD DRVDD SDIO/DCS 6kΩ kω VREF 6kΩ Figure. Equivalent SDIO/DCS or SMI SDFS Circuit Figure 5. Equivalent VREF Circuit Rev. B Page 0 of 76

22 TYPICAL PERFORMANCE CHARACTERISTICS AD967 AVDD =.8 V, DVDD =.8 V, DRVDD = 3.3 V, sample rate = 50 MSPS, DCS enabled,.0 V internal reference, V p-p differential input, VIN =.0 dbfs, and 64k sample, TA = 5 C, unless otherwise noted. 0 0 dbfs SNR = 69.4dBc (70.4dBFS) ENOB =.4 BITS SFDR = 86.5dBc MSPS dbfs SNR = 68.8dBc (69.8dBFS) ENOB =.3 BITS SFDR = 83.5dBc AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure 6. AD Single-Tone FFT with fin =.3 MHz Figure 9. AD Single-Tone FFT with fin = 40 MHz MSPS dbfs SNR = 69.3dBc (70.3dBFS) ENOB =.4 BITS SFDR = 84.0dBc MSPS dbfs SNR = 68.dBc (69.dBFS) ENOB =. BITS SFDR = 77.0dBc AMPLITUDE (dbfs) THIRD HARMONIC SECOND HARMONIC AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure 7. AD Single-Tone FFT with fin = 30.3 MHz Figure 0. AD Single-Tone FFT with fin = 0 MHz MSPS dbfs SNR = 69.dBc (70.dBFS) ENOB =.4 BITS SFDR = 84.0dBc MSPS dbfs SNR = 67.6dBc (68.6dBFS) ENOB =. BITS SFDR = 74.0dBc AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC AMPLITUDE (dbfs) THIRD HARMONIC SECOND HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure 8. AD Single-Tone FFT with fin = 70 MHz Figure. AD Single-Tone FFT with fin = 337 MHz Rev. B Page of 76

23 0 0 50MSPS dbfs SNR = 65.7dBc (66.7dBFS) ENOB = 0.4 BITS SFDR = 70.0dBc 0 0 5MSPS dbfs SNR = 69.4dBc (70.4dBFS) ENOB =.4 BITS SFDR = 85dBc AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure. AD Single-Tone FFT with fin = 440 MHz Figure 5. AD967-5 Single-Tone FFT with fin = 70 MHz 0 0 dbfs SNR = 69.5dBc (70.5dBFS) ENOB =.4 BITS SFDR = 86.5dBc 0 0 5MSPS dbfs SNR = 69.dBc (70.dBFS) ENOB =.3 BITS SFDR = 84dBc AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC AMPLITUDE (dbfs) SECOND HARMONIC THIRD HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure 3. AD967-5 Single-Tone FFT with fin =.3 MHz Figure 6. AD967-5 Single-Tone FFT with fin = 40 MHz 0 0 5MSPS dbfs SNR = 69.4dBc (70.4dBFS) ENOB =.4 BITS SFDR = 85dBc 0 0 5MSPS dbfs SNR = 67.6dBc (68.6dBFS) ENOB =. BITS SFDR = 74dBc AMPLITUDE (dbfs) THIRD HARMONIC SECOND HARMONIC AMPLITUDE (dbfs) THIRD HARMONIC SECOND HARMONIC FREQUENCY (MHz) FREQUENCY (MHz) Figure 4. AD967-5 Single-Tone FFT with fin = 30.3 MHz Figure 7. AD967-5 Single-Tone FFT with fin = 337 MHz Rev. B Page of 76

24 0 00 SFDR (dbfs) SFDR = +85 C SNR/SFDR (dbc AND dbfs) SNR (dbfs) SFDR (dbc) SNR (dbc) 85dB REFERENCE LINE SNR/SFDR (dbc) SFDR = +5 C SFDR = 40 C SNR = +5 C SNR = +85 C SNR = 40 C INPUT AMPLITUDE (dbfs) INPUT FREQUENCY (MHz) Figure 8. AD Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fin =.4 MHz Figure 3. AD Single-Tone SNR/SFDR vs. Input Frequency (fin) and Temperature with V p-p Full Scale SFDR (dbfs) SNR/SFDR (dbc AND dbfs) SNR (dbfs) SFDR (dbc) 85dB REFERENCE LINE GAIN ERROR (%FSR) GAIN OFFSET OFFSET ERROR (%FSR) SNR (dbc) INPUT AMPLITUDE (dbfs) Figure 9. AD Single-Tone SNR/SFDR vs. Input Amplitude (AIN) with fin = 98. MHz TEMPERATURE ( C) Figure 3. AD Gain and Offset vs. Temperature SNR/SFDR (dbc) SFDR = 40 C SNR = +5 C SNR = +85 C SNR = 40 C SFDR = +85 C SFDR = +5 C INPUT FREQUENCY (MHz) Figure 30. AD Single-Tone SNR/SFDR vs. Input Frequency (fin) and Temperature with V p-p Full Scale SFDR/IMD3 (dbc AND dbfs) SFDR (dbc) IMD3 (dbc) SFDR (dbfs) IMD3 (dbfs) INPUT AMPLITUDE (dbfs) Figure 33. AD Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fin = 9. MHz, fin = 3. MHz, fs = 50 MSPS Rev. B Page 3 of 76

25 SFDR/IMD3 (dbc AND dbfs) IMD3 (dbc) SFDR (dbfs) SFDR (dbc) AMPLITUDE (dbfs) MSPS 7dBFS 7dBFS SFDR = 83.8dBc (90.8dBFS) IMD3 (dbfs) INPUT AMPLITUDE (dbfs) Figure 34. AD Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fin = 69. MHz, fin = 7. MHz, fs = 50 MSPS FREQUENCY (MHz) Figure 37. AD Two-Tone FFT with fin = 69. MHz and fin = 7. MHz NPR = 6.5dBc 8.5MHz NOTCH WIDTH = 3MHz AMPLITUDE (dbfs) AMPLITUDE (dbfs) FREQUENCY (MHz) Figure 35. AD967-5, Two 64k WCDMA Carriers with fin = 70 MHz, fs =.88 MSPS FREQUENCY (MHz) Figure 38. AD Noise Power Ratio (NPR) MSPS 7dBFS 7dBFS SFDR = 86.dBc (93.dBFS) SFDR - SIDE B AMPLITUDE (dbfs) SNR/SFDR (dbc) SFDR - SIDE A SNR - SIDE B SNR - SIDE A FREQUENCY (MHz) Figure 36. AD Two-Tone FFT with fin = 9. MHz and fin = 3. MHz SAMPLE RATE (MSPS) Figure 39. AD Single-Tone SNR/SFDR vs. Sample Rate (fs) with fin =.3 MHz Rev. B Page 4 of 76

26 0.3 LSB rms SFDR DCS ON NUMBER OF HITS (M) SNR/SFDR (dbc) SNR DCS ON SFDR DCS OFF 0 N 3 N N N N + N + OUTPUT CODE Figure 40. AD967 Grounded Input Histogram N SNR DCS OFF DUTY CYCLE (%) Figure 43. AD SNR/SFDR vs. Duty Cycle with fin = 0.3 MHz SFDR INL ERROR (LSB) SNR/SFDR (dbc) SNR OUTPUT CODE Figure 4. AD967 INL with fin = 0.3 MHz INPUT COMMON-MODE VOLTAGE (V) Figure 44. AD SNR/SFDR vs. Input Common Mode (VCM) with fin = 30 MHz DNL ERROR (LSB) OUTPUT CODE Figure 4. AD967 DNL with fin = 0.3 MHz Rev. B Page 5 of 76

27 THEORY OF OPERATION The AD967 dual ADC design can be used for diversity reception of signals, where the ADCs are operating identically on the same carrier but from two separate antennae. The ADCs can also be operated with independent analog inputs. The user can sample any fs/ frequency segment from dc to 00 MHz, using appropriate low-pass or band-pass filtering at the ADC inputs with little loss in ADC performance. Operation to 450 MHz analog input is permitted but occurs at the expense of increased ADC noise and distortion. In nondiversity applications, the AD967 can be used as a baseband or direct downconversion receiver, where one ADC is used for I input data, and the other is used for Q input data. Synchronizaton capability is provided to allow synchronized timing between multiple channels or multiple devices. Programming and control of the AD967 are accomplished using a 3-bit SPI-compatible serial interface. ADC ARCHITECTURE The AD967 architecture consists of a dual front-end sampleand-hold amplifier (SHA), followed by a pipelined, switched capacitor ADC. The quantized outputs from each stage are combined into a final -bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample and the remaining stages to operate on the preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor digitalto-analog converter (DAC) and an interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage of each channel contains a differential SHA that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, corrects errors, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers go into a high impedance state. ANALOG INPUT CONSIDERATIONS The analog input to the AD967 is a differential switched capacitor SHA that has been designed for optimum performance while processing a differential input signal. The clock signal alternatively switches the SHA between sample mode and hold mode (see Figure 45). When the SHA is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within / of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In intermediate frequency (IF) undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, the shunt capacitors limit the input bandwidth. Refer to Application Note AN-74, Frequency Domain Response of Switched-Capacitor ADCs; Application Note AN-87, A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs; and the Analog Dialogue article, Transformer-Coupled Front-End for Wideband A/D Converters, for more information on this subject (see VIN+ C PIN, PAR VIN C PIN, PAR S S H C S C S S C H C H Figure 45. Switched-Capacitor SHA Input For best dynamic performance, the source impedances driving VIN+ and VIN should be matched. An internal differential reference buffer creates positive and negative reference voltages that define the input span of the ADC core. The span of the ADC core is set by this buffer to VREF. Input Common Mode The analog inputs of the AD967 are not internally dc biased. In ac-coupled applications, the user must provide this bias externally. Setting the device so that VCM = 0.55 AVDD is recommended for optimum performance, but the device functions over a wider range with reasonable performance (see Figure 44). An on-board common-mode voltage reference is included in the design and is available from the CML pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the CML pin voltage (typically 0.55 AVDD). The CML pin must be decoupled to ground by a 0. μf capacitor, as described in the Applications Information section. Differential Input Configurations Optimum performance is achieved while driving the AD967 in a differential input configuration. For baseband applications, the AD838, ADA4937-, and ADA4938- differential drivers provide excellent performance and a flexible interface to the ADC. S Rev. B Page 6 of 76

28 The output common-mode voltage of the AD838 is easily set with the CML pin of the AD967 (see Figure 46), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. V p-p 49.9Ω 0.µF 499Ω 53Ω 499Ω AD Ω R R C VIN+ AD967 VIN AVDD CML Figure 46. Differential Input Configuration Using the AD838 For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration. An example is shown in Figure 47. To bias the analog input, the CML voltage can be connected to the center tap of the secondary winding of the transformer. V p-p 49.9Ω 0.µF R R C VIN+ AD967 VIN CML Figure 47. Differential Transformer-Coupled Configuration The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz). Excessive signal power can also cause core saturation, which leads to distortion. At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD967. For applications where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 49) An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use the AD835 differential driver. An example is shown in Figure 50. See the AD835 data sheet for more information. In any configuration, the value of Shunt Capacitor C is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 3 displays recommended values to set the RC network. However, these values are dependent on the input signal and should be used only as a starting guide. Table 3. Example RC Network R Series Frequency Range (MHz) (Ω Each) C Differential (pf) 0 to to to >300 5 Open Single-Ended Input Configuration A single-ended input can provide adequate performance in cost sensitive applications. In this configuration, SFDR and distortion performance degrade due to the large input common-mode swing. If the source impedances on each input are matched, there should be little effect on SNR performance. Figure 48 shows a typical single-ended input configuration. V p-p 0µF 49.9Ω 0.µF 0µF 0.µF kω kω AVDD AVDD kω kω R R C VIN+ VIN Figure 48. Single-Ended Input Configuration AD V p-p 0.µF 0.µF 5Ω R VIN+ P A S S P 0.µF 5Ω 0.µF C R AD967 VIN CML Figure 49. Differential Double Balun Input Configuration V CC 0.µF 0.µF 0Ω 6 8, 3 ANALOG INPUT 0.µF R 00Ω C D R D R G AD835 C 3 0.µF 00Ω 4 0 R 5 ANALOG INPUT 4 0Ω 0.µF 0.µF 0.µF Figure 50. Differential Input Configuration Using the AD835 VIN+ AD967 VIN CML Rev. B Page 7 of 76