2009 International Zurich Symposium on Electromagnetic Compatibility

Transcription

1 2009 International Zurich Symposium on Electromagnetic Compatibility Module Level EMI Measurements and Estimation Workshop Predicting Module Level RF Emissions from IC Emissions Measurements using a 1 GHz TEM or GTEM Cell a Review of Related Published Technical Papers James P. Muccioli, Jastech EMC Consulting, LLC Terry M. North, Jastech EMC Consulting, LLC Kevin P. Slattery, Intel Corporation 1

2 Outline of Topics Introduction Description of the TEM Cell and IC Test Board Development of the TEM Cell Method Evaluation of IC Process Variables Evaluation of the Effects of IC Internal Structure, Software Level, Environmental Temperature and IC Packaging on Emissions Correlation Between IC and Far Field Measurements Extension of the 1 GHz TEM Cell Method to Several GHz Using a Small GTEM Cell Related IC Emissions Measurement Standards Conclusions 2

3 Description of the TEM Cell and IC Test Board 3

4 Cross Section Of 1 GHz TEM Cell 30.5 cm Side View Diagram of TEM Cell 50 ohm load Spectrum Analyzer 4.5 cm IC (DUT) Support Circuitry 10.1 cm 2 In the Fisher TEM Cell, the IC Test Board is actually part of the cell structure. 4

5 View of 1 GHz TEM Cell 5

6 IC Test Board Left side: support circuitry Right side: IC under test (facing into TEM Cell) 6

7 Development of the TEM Cell Method 7

8 Some of the Contributors to the IC - EMC Task Force Jim Muccioli: Chairman Mike Catherwood: V. Chair Scott Lytle: Secretary Terry North: Editor Ross Carlton: IEC Liaison Jerry Meyerhoff Kevin Slattery Bob Moeckel Steven Chybowski Arnie Nielsen Ed Bronaugh Gerald Servais Tim Harrington Art Collard Richard Goulette Don Seyerle Joe Fischer D. W. Elting Poul Andersen Mark Steffka Garth D Abreu Jim Rader Tony Anthony Paul Cook Stevan Dobrasevic Rick Goodwin William Hutter Kevin Lavery Andy Macko Phil Bator Dave Pamparo Ian Morgan David Meir Glen Watkins Rick Goodwin Robert DeMoor 8

9 Vision and Goal of the IC - EMC Task Force To develop a measurement method to characterize the RF emissions from integrated circuits that: Is usable to at least 1 GHz Is able to provide a repeatable signature Facilitates emission comparisons between different IC design implementations (layout or die shrink variations) Evaluates the effect of process variations and other critical factors on RF emissions 9

10 Vision and Goal of the IC - EMC Task Force The end users require that this method: Provides the capability for IC manufacturers to quickly evaluate the effects of design or process changes to their final product emissions Provides the capability for IC customers to quickly evaluate the potential effect of an IC source or process change on their product RF emissions 10

11 References - Technical Papers on IC Emissions [1] Investigation of the Theoretical Basis for Using a 1 GHz TEM Cell to Evaluate the Radiated Emissions from Integrated Circuits, Muccioli, North, Slattery, 1996 IEEE International Symposium on EMC [2] Model of IC Emissions into a TEM Cell, Engel, 1997 IEEE International Symposium on EMC [3] Characterization of the RF Emissions from a Family of Microprocessors Using a 1 GHz TEM Cell, Muccioli, North, Slattery, 1998 IEEE International Symposium on EMC [4] Measuring the Radiated Emissions from a Family of Microprocessors Using a 1-GHz TEM Cell, Slattery, Muccioli, North, 1999 IEEE International Symposium on EMC [5] Modeling the Radiated Emissions from Microprocessors and other VLSI Devices, Slattery, Muccioli, North, 2000 IEEE International Symposium on EMC 11

12 References - Technical Papers on IC Emissions [6] Constructing the Lagrangian of VLSI Devices from Near Field Measurements of the Electric and Magnetic Fields, Slattery, Muccioli, North, 2000 IEEE International Symposium on EMC [7] Using Near-Field Scanning to Predict Radiated Fields, Shi, Cracraft, Zhang, DuBroff, Slattery, Yamaguchi, 2004 IEEE International Symposium on EMC [8] Electromagnetic Emissions: IC-Level versus System-Level, Deutschmann, Winkler, Ostermann, Lamedschwandner, 2004 IEEE International Symposium on EMC ]9] Predicting TEM Cell Measurements from Near Field Scan Data, Weng, Beetner, DuBroff, 2006 IEEE International Symposium on EMC [10] Near field measurements to predict the electromagnetic emission of integrated circuits, Deutschmann, Pitsch, Langer, 5 th International Workshop on Electromagnetic Compatibility of Integrated Circuits, November 2005, Munich, Germany 12

13 TEM Cell with Cal Antennas 13

14 Comparison of Model (Red) vs Measured Parallel Loop (Green) Model vs Parallel Loop A comparison of the spectral output of the theoretical model and the parallel loop at a distance of inch from the ground plane. model actual Frequency (MHz) [1] Investigation of the Theoretical Basis for Using a 1 GHz TEM Cell to Evaluate the Radiated Emissions from Integrated Circuits, Muccioli, North, Slattery, 1996 IEEE International Symposium on EMC 14

15 Parallel Loop Output vs Distance & Frequency The minimum of this family of curves is in the range of to inch distance from the ground plane. This suggests that another mechanism is affecting the coupling at very close spacing. dbuv inches.062 inches.125 inches Distance.250 inches.375 inches.50 inches MHz 15

16 Two Orientations of Microprocessor Test Board Micro in 1 GHz TEM - 2 Orientations OR 1 OR Frequency (MHz) 16

17 Measurement in ALSE with Biconical Antenna of Micro Test Board in H and V Orientations H vs V Separation at 1 m delta = 9 db Horz vert amb Max level = MHz Highest Meas. Peaks ( MHz) [2] Model of IC Emissions into a TEM Cell, Engel, 1997 IEEE International Symposium on EMC 17

18 Evaluation of IC Process Variables 18

19 IC Emissions Variation Due to Fab and Process Variation Variation Due to Fab and Process dbm G73 c1 1G73 c2 1G73 c3 1G73 c4 3G26 c1 3G26 c2 3G26 c3 3G26 c4 Frequency (MHz) [3] Characterization of the RF Emissions from a Family of Microprocessors Using a 1 GHz TEM Cell, Muccioli, North, Slattery, 1998 IEEE International Symposium on EMC 19

20 Comparison of a Family of Microprocessors -60 Comparison of HC11, HC12 & HC16 Microprocessors HC16 HC11 ZJ HC12 W J 3G26 c2 dbm HC HC12 Frequency (MHz) [4] Measuring the Radiated Emissions from a Family of Microprocessors Using a 1-GHz TEM Cell, Slattery, Muccioli, North, 1999 IEEE International Symposium on EMC 20

21 Evaluation of the Effects of IC Internal Structure, Software Level, Environmental Temperature and IC Packaging on Emissions 21

22 Comparison of Emissions from MCM and Discrete IC Implementations 22

23 Spectral Differences due to Software Level 23

24 Spectral Emissions as a Function of the IC Environmental Temperature [5] Modeling the Radiated Emissions from Microprocessors and other VLSI Devices, Slattery, Muccioli, North, 2000 IEEE International Symposium on EMC 24

25 Relative Emissions Comparison of Four IC Package Implementations Module Conducted RF Emissions db over limit Ball Grid Array Quad Flat Pack Chip Scale Package MultiChip Module 6] Constructing the Lagrangian of VLSI Devices from Near Field Measurements of the Electric and Magnetic Fields, Slattery, Muccioli, North, 2000 IEEE International Symposium on EMC 25

26 Correlation Between IC and Far Field Measurements 26

27 Comparison of TEM Cell Measured Data with Simulation Data and Analytical Formula Calculations both Generated from Near Field Scan Data [7] Using Near-Field Scanning to Predict Radiated Fields, Shi, Cracraft, Zhang, DuBroff, Slattery, Yamaguchi, 2004 IEEE International Symposium on EMC 27

28 Extension of the 1 GHz TEM Cell Method to Several GHz Using a Small GTEM Cell 28

29 Impedance Comparison of Fischer TEM Cell with GTEM compare relative impedance GTEM relative Z mini-tem relative Z ohms freq in MHz

30 Comparison of Electric and Magnetic Fields as Measured in the TEM and GTEM Cells compare GTEM vs mini-tem Compare GTEM and mini-tem, smoothed dbm mini-tem mag 1 mini-tem electric GTEM mag1 GTEM electric magnetic electric freq in MHz db microvolts IC Data on both the TEM and GTEM Cells data points mini-tem GTEM

31 Electric and Magnetic Field Measurements on the GTEM Cell to 10 GHz GTEM MHz GTEM electric GTEM mag1 electric dbm magnetic -60 freq in MHz 31

32 Small GTEM Cell with IC Test Board Port [11] SAE J Measurement of Radiated Emissions from Integrated Circuits TEM / Wideband TEM (GTEM) Cell Method, TEM Cell (150 khz to 1 GHz), Wideband TEM Cell (150 khz to 8 GHz) Society of Automotive Engineers, 400 Commonwealth Drive, Warrendale, PA , USA, (412) [12] IEC : Integrated circuits - Measurement of electromagnetic emissions, 150 khz to 1 GHz - Part 2: Measurement of radiated emissions, TEM Cell and wideband TEM cell method 32

33 Conclusions We have shown the theoretical basis, numerical modeling and empirical observations that many researchers have developed over the twelve years since the first paper on the topic was presented in 1996 The repeatability and correlation between these IC emission measurement methods and other methods, including far field measurements, has been well established Of particular interest for high frequency applications, this method can utilize a GTEM cell enabling emission measurements up to 10 GHz, which is beyond the current capability of other IC measurement techniques 33

34 Conclusions Because of the many variables involved in the application of a particular IC in a module, including PCB layout, packaging and cabling, IC measurement methods will never be able to completely eliminate module level EMC measurements However, these techniques allow the design engineer to obtain an estimation of resultant module level emissions based on IC level measurements This estimation can be made more effective using reasonable assumptions about the effects of application specific variables on the resultant module emissions These assumptions can then be pre validated for limiting cases to provide a reasonable range of expected results 34

35 Related IC Emissions Measurement Standards [11] SAE J Measurement of Radiated Emissions from Integrated Circuits TEM / Wideband TEM (GTEM) Cell Method, TEM Cell (150 khz to 1 GHz), Wideband TEM Cell (150 khz to 8 GHz) Society of Automotive Engineers, 400 Commonwealth Drive, Warrendale, PA , USA, (412) [12] IEC : Integrated circuits - Measurement of electromagnetic emissions, 150 khz to 1 GHz - Part 2: Measurement of radiated emissions, TEM Cell and wideband TEM cell method 35

36 Questions? 36