Module Integration Sensor Requirements

Transcription

1 Module Integration Sensor Requirements Phil Allport Module Integration Working Group Sensor Geometry and Bond Pads Module Programme Issues Numbers of Sensors Required

2 Nobu s Sensor Size Summary n.b mm square implies 2.4cm strips at 75.6μm pitch (assuming 4 rows on each sensor)

3 Nobu s Sensor Size Summary 12cmx6cm-6chips 10cmx10cm-10chips

4 Nobu s SLHC Module Proposal Presented at the Oct. workshop at CERN One module with 124x64mm 2 sensor Segmented into 1, 2, and 4 striplets Wrap-around hybrids with 1, 2, and 4 rows of ASIC s Y. Unno Presentation 7/12/06

5 Nobu s 6 Chip Wide Module Edge stay-clear region (10 mm) should not have openings for strips/bias rings High/Low position of the modules in the right figure Tilt angle of 16 deg. is comfortable for roofing Note: available TPG size, 100mm x <150mm

6 Nobu s 10 Chip Wide Module 20 chips read out in series at 160MHz (or 40 chips if wrap around?) What assumed maximum occupancy?

7 LBL Stave Proposal; Carl Haber

8 Needs gluing to sensitive face of silicon Need for tiling in z-direction (tilt or high/low?) Issues for stereo side? (see next)

9 Schematic 2 Edge Cooling Contact 10 Chip Wide Stave Concept to avoid gluing to silicon strip surface Sensors 4 rows of 2.5cm mini-strips Hybrid 3.1cm wide (2.5cm if no fan-ins) To avoid ±2mm with rotated stereo sensor and to keep same hybrid on both sides would like to have stereo layer sensor with 4 rotated rows and bond-pads in the middle (requiring <2.5cm hybrid) For hermeticity - either high/low sensor mounting (bad for rework) or tilt each sensor up by 1mm over 10cm (10mrad) Current Barrel Module

10 Issues for Module Layout Design External Constraints on Module Design Final required granularity pitch ASIC power density Required spatial resolution (both r-φ and z) Stereo angle / ambiguities / pattern recognition Track trigger requirements Required hermeticity of each tracking layer Lowest feasible coolant temperature and required sensor temperature Mechanical and thermal stability of external supports Minimum required natural frequency Allowed total radiation length (material budget) Total power (is there a maximum allowed?) and cable budgets Maximum price of full tracker solution (including likely yield issues)

11 Issues for Module Layout Design Internal Constraints on Module Design Automation of construction, ease of rework and likely yield Mechanical tolerances, metrology precision and required rigidity Module envelope minimum distance to nearest module / supports Risk: similarity to existing solutions (not just in ATLAS) Post-irradiation operation - factor of 3(?) thermal runaway margin Can components be safely glued onto sensor segmented surface ASIC layout, # ASICs per hybrid, bond length to sensor, dispense with fan-ins? Total cost of components, construction and testing Stereo (rotate sensor or mask design with rotated rows for stereo side) Wrap-around or r-φ / stereo treated independently Maximise common components for each side, at all radii and on disks

12 Current Barrel Module Specifications

13 Sensor Requirements Expect miniature sensors on wafer for irradiation studies and QA checking. Some full-size sensors should be irradiated to different doses Saturation charge for oxide (check interstrip isolation) Outer layer doses Maximum inner layer dose Protons and neutrons? Assume sensors from this batch will serve module prototyping needs until a nearly pre-series order in months time for TDR prototypes Groups (funding agencies?) possibly requiring modules: Germany Netherlands Japan Spain Switzerland USA UK. Assume sensors needed for each funding agency?

14 Recent Presentations Steering Group Project Office Module Integration ABC-next Proposals and Expressions of Interest &p_top_type=P&p_open_id= &p_open_type=P

15 ATLAS SLHC Proposals

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