INIŢIERE IN REALIZAREA PRACTICĂ A SCHEMELOR ELECTRONICE -PRACTICAL ELECTRONICS-

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1 INIŢIERE IN REALIZAREA PRACTICĂ A SCHEMELOR ELECTRONICE -PRACTICAL ELECTRONICS- Ciprian Ionescu Web: Profesor la Departamentul Tehnologie Electronică şi Fiabilitate, Facultatea Electronică, Telecomunicaţii şi Tehnologia informaţiei Universitatea Politehnica din Bucureşti Cabinet:Localul Leu, cam B 310

2 Metods for electronic PCB prototyping - Through Milling - On breadboards 2

3 Realization of PCB prototypes by milling By means of very small size milling tools (cutters) the isolation of the paths for interconnecting the electronic components or even the total removal of the conductive areas takes place in the case of applications for high frequency operation. Numeric Coordinate (NC) drilling is done through the same equipment and is practically similar to the one in the industrial process. Milling / Drilling Equipment at UPB-CETTI is the ProtoMat M100 / HF type, from firma LPKF. It is essentially a plan plotter in place of the classic plotting head with a motor adapted to the drilling and milling operations specific to the manufacturing of PCBs. It can produce high-quality prototypes for standard printed wiring boards, but is also perfectly suited to the manufacture of radio frequency and microwave circuits. Another direction of use of the equipment is the manufacture of front panels for appliances, engraving in aluminum or plastic. 3

4 Equipment for PCB realization through milling LPKF-Protomat M100/HF Track width min. 100 μm (4 mil); Minimum Spacings 100 μm (4 mil) Min. Hole Diam. 0.2 mm (8 mil) Autocontac additional equipment for conducting paste filling of vias

5 Manufacturing of a printed circuit by mechanical engraving (milling and drilling) It is done in two stages: First, the board is prepared in a specialized software, CircuitCAM, which imports the Gerber and Excellon files (N.C. Drill) and performs the insulation around the tracks; The project is after that exported to the BoardMaster program that prepares the production and controls the PCB engraving machine. Note: The layout of the printed circuit board is usually imported from the computer-aided design (CAD) program with which the PCB project was generated, but it can also be generated directly into CircuitCAM by adding the graphic elements that make up the circuit. 5

6 The main steps needed to realize printed circuits by milling with LPKF equipment PCB LAYOUT Postprocessing: Gerber Files Apertures List NC Drill Files Drill (Tool) List Saving: Files *.CAM Tool Library *.TOL LPKF CIRCUIT CAM Export: Files *.LMD= LPKF Mill-Drill Files for phase configuration *.PHS, of dispensing *.DIS, and suction *.VAC Operations: File Import Apertures Edit Layers assignment Tracks Isolation Contour routing (milling) LPKF BOARD MASTER RS 232 Saving: Files *.JOB Operations: Positioning, panelization Phase and parameters selection for machining PROTOMAT M100 /HF 6

7 LPKF Tools used for milling and drilling 7

8 Particularities for PCB realization with the milling equipment LPKF ProtoMat M100

9 Realization of printed circuit CAE-CAD-CAM Laboratory Prototype Laboratory LAYOUT ALLEGRO ORCAD ALTIUM PROTOMAT PLOTTER CAD DATA Gerber EXCELLON DXF HPGL CIRCUIT CAM CAD Procesor Computation of Isolation BOARD MASTER Tool Library Production Phase Plotter Commands Data Flux Exchange between CAE-CAD-CAM and Prototyping Laboratories

10 Elements of the milling/drilling head To ensure minimal penetration of the cutter into the substrate and smooth processing of special materials, the milling depth can be controlled without direct contact with the surface, the milling head being supported by an air cushion. In order to be used for high-frequency circuits, the equipment has a motor speed of between and rpm, programmable and controlled by software. 10

11 The equipment also allows metallic holes to be made, the process being called Autocontac. For this, the equipment has to be filled with a dispenser and a syringe holder is added to the milling head. The principle of making metal holes is illustrated in the figure. (a) The principle of making metallic holes by the Autocontac process (a) paste dispensing, (b) paste absorption; 1 conductive paste, 2 dispensing needle, 3 copper pill, 4 printed circuit, 5 support material (b) 11

12 Postprocessing of the project : Gerber 274X (recommended for: OrCAD) *.max *.top, *.bot, *.dts, thruhole.tap Gerber 274X Processing, CircuitCAM Processing, CircuitCAM *.top, *.bot, *.dts, thruhole.tap *.cam Do not appear when no Drill layer is defined! *.cam *.lmd Execution CAM, BoardMaster

13 PCB Simple face Double layer, w/o plated through holes No vias in a component pad No vias under components Spacing/track widths: recommended >0.4 mm; No smaller than 0.4 mm theoretically min. 0.2 mm with microcutter 0.1 Holes: different diameters as few as possible! Internal Outlines defined on Global layer Avoiding of 90º angles at tracks T junctions to avoid some milling problems.

14 The cut-out is not defined as an outline, but is a part of electronic component. 14

15 Un-optimized tracks and pad geometry, angles < 90 deg.

16 Various isolation options of tracks and pads (from the copper area) 1. Standard Isolation 2. Pad Clearance 3 Micro Cut Isolation 4. Track clearance Isolation 5 Rubout - complete or partial removal of residual copper 6 Spike removal Milling channel produced by the Universal Cutter, Micro Cutter and End Mill (RF)

17

18 Conţinutul documentaţiei de fabricație PCB 1. CAD File, pdf: PCB drilling and cutting info 2. PANEL CAD File, pdf : Panel drilling and cutting info 3. PCB Gerber File, 274X 4. PCB Drilling file tape 5. PCB Pick and place file - txt / excel 6. PCB Specification file 7. PCB Production file 8. PANEL CAD File, pdf : Panel drilling and cutting info 9. PANEL Gerber File, 274X 10.Fişa de comandă a producătorului

19 Conţinutul documentaţiei de fabricaţie a ŞABLONULUI (STENCIL) 1. PANEL Gerber File, 274X : Assembly top panel ( P.AST) / Assembly bottom (P.ASB) Contour (border) ( P.BRD, P.MLL ) Stencil apertures top (App. Top) / Stencil apertures bottom (App.Bot) Fiducials top / Fiducial bottom 2. Stencil CAD File, pdf : Front edge / Center justified

20 Placement and fixture of laminate Placa de bază (masa echipamentului) este realizată din aluminiu masiv (1), alinierea laminatului (3) destinat prelucrării mecanice (tipic FR2, FR3 sau FR4 de 1,6 mm grosime) este făcută prin intermediul a doi pini cu diametrul de 3 mm (2) iar ca material suport pentru găurire (4) se foloseşte un carton presat de o anumită consistenţă şi de cca. 2 mm grosime. 20

21 Procesarea fişierelor de fabricaţie utilizând programul CircuitCAM CircuitCAM este un sistem software specializat, destinat realizării interfaţării între fişierele de fabricaţie (CAD) şi echipamentul de gravare a circuitelor imprimate. El combină două domenii importante ale tehnologiei electronice: CAD şi CAM. Programul poate fi utilizat pentru importul, verificarea şi editarea fişierelor Gerber şi Excellon, Calcularea izolaţiei între traseele conductoare, Optimizarea comenzilor şi exportul fişierului creat într-un format specific (LMD - LpkfMillDrill) care să asigure legătura cu programul BoardMaster, program care controlează şi comandă plotterul LPKF. 21

22 Fereastra in CircuitCAM

23 Procedura de realizare a izolaţiilor O operaţie foarte importantă în programul CircuitCAM, proces în care se calculează traseele pe care trebuie să le urmărească freza pentru a izola traseele PCB de masa de cupru. Parametrii de realizare a izolaţiei se aleg în funcţie de unealta cu care se va realiza efectiv frezarea şi de precizie plotter. Porţiune dintr-un layout corespunzător unei plăci de circuit imprimat după procedura de generare a izolaţiilor în jurul traseelor 23

24 Frezare în jurul unui traseu cu două unelte de dimensiuni diferite

25 Procesul tehnologic de realizare a găurilor metalizate Procesul se desfăşoară în două etape: Mai întâi găurile sunt umplute cu pastă conductivă cu ajutorul echipamentului de dispensare. Apoi, excesul de pastă este îndepărtat prin absorbţie. Astfel, se asigură un contact bun pe pastilele de lipire, pe ambele feţe ale circuitului imprimat. Se observă că trebuie să se pregătească materialul de suport astfel încât să existe spaţiu liber sub găurile care trebuie metalizate. Pasta este apoi supusă unui tratament termic de întărire într-un cuptor cu convecţie. Pasta utilizată permite echiparea găurilor metalizate şi lipirea componentelor cu aliaj de lipit Sn-Pb sau SAC. 25

26 Prezentarea plăcilor prototip cu contacte metalice (Breadboard)

27 27 Ce este un breadboard? Un breadboard, cunoscut şi sub numele de proto-board este o platformă reutilizabilă folosită pentru construirea temporară a circuitelor electronice.

28 Cum funcţionează? 28 Componentele sunt introduse prin găuri în vederea interconectării. Conexiunile se fac cu ajutorul unor lamele de metal aflate în interiorul breadboard-ului. Lamelele formează o reţea bine definită, aceeaşi pentru orice breadboard.

29 29 Construcţie Dispunerea internă a lamelelor pentru un breadboard de dimensiuni normale:

30 30 Constructie Dispunerea internă a lamelelor pentru un breadboard de dimensiuni normale:

31 Constructie 31 Găurile interconectate intern:

32 Canalul şi rolul acestuia: 32 Circuitele integrate, întrerupătoarele şi alte componente similare se montează foarte uşor peste canal, distanţa între cele mai apropiate găuri este de 0.3 inch (300 mils sau 3 module). 0.3 inch 0.1 inch

33 Exemple 33 Conectarea rezistoarelor în serie: Fire

34 Exemple Conectarea rezistoarelor în paralel şi o greşeală întâlnită frecvent: Masa nu este conectată

35 Componente speciale Condensator electrolitic Tranzistor capsula TO18 LED

36 Schema electrică şi componentele montate pe breadboard 36

37 Mulţumesc pentru atenţie!

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