Tutorial In Practical Circuit Board Design Ben LeVesque ECE480 Team 3 November 9 th, 2007
|
|
- Coral Hutchinson
- 6 years ago
- Views:
Transcription
1 utorial In Practical Circuit Board Design Ben LeVesque ECE480 eam 3 November 9 th, 2007 Keywords Circuit board, Cadence, Layout, Capture, post processing, trace capacity, trace ampacity, Via Abstract his document explores the creation of a circuit board from the initial creation of a schematic to the final post processing of CAD files while covering a breadth of information that a first time circuit board designer needs to know. hese practical issues range from the selection of a board house to on board heatsink design with recommendations for the first time designer that are usually obtained through experience. 1 Introduction/Objective Engineering schooling tends to focus on the concepts and theories needed to create circuits, but how do we get those bread boarded circuits from the lab and onto a circuit board? he obvious place to start is with the tutorials for whatever CAD package you plan to use in order to learn the software, but these software tutorials do not cover the design issues that arise during the design of a circuit board. he goal of this application note is not to be a tutorial for any particular software package, but as a guide to what is needed to obtain a successful design the first time. In order to achieve these goals we will be exploring the creation of a simple circuit board that contains transistor drivers and a connector. he purpose of this circuit is to drive low power valves and a heater coil in an oven. he design of this circuit will be done in Cadence s Orcad Capture CIS 10.1 and Orcad Layout Plus 10.1 with the assumption that the reader has done the tutorials for this software.
2 2 Creation of Design 2.1 Capture Figure 1: Schematic of example circuitry he first step in the creation of a circuit board is to create the schematic of the circuit that you plan to make a circuit board for. his is done in Cadence s Capture program. If parts cannot be found in the local library or online database during the schematic capture process, symbols must be created for them. Creation of new device symbols is covered in Cadence s tutorials. he above example circuit is made up of parts obtained through the local and online databases, while the connector is a uncommon part that a symbol had to be created for. 2.2 Selecting a board house he next step to the creation of a circuit board is to select a manufacture to create the circuit board once your design is done. he following criteria should be used when selecting a board house
3 1) Capabilities a. olerances b. Copper thickness c. Solder mask d. Silk screening e. Number of layers 2) urn around time 3) Documentation (ease of use of service) 4) Cost It is important to select a board house at this time because the capabilities of the board house may define the tolerances of the boards design. olerances are important to ensure that the board house can make features small enough for the design. he thickness of the copper on the board defines how much current the traces of the board can carry and is covered later in this document. So if a design contains high current traces a board vendor who can create boards with thicker traces maybe desirable. If a solder mask and silk screen are desired then a board house that has these capabilities must be selected. Likewise, if a board with many layers is needed, then the board house must be capable of this as well. he example design is very simple in nature. It does not contain any very high current signals or tight tolerances, but does require a silk screen and solder mask. Because of the short time frame of the example project a very fast turn around time is required, and since this is our first design good documentation on how to use the board houses services is required. With these criteria, PCBepress.com is selected for this project. heir service is very well documented and automated so they are able to achieve quick two day turn around times at a low cost Drill Sizes Board houses typically do not have all sizes of drill bits, so all holes on the circuit board must be of the sizes that the board house you send your design to has. his information is typically available on the company s website. Some specify hole size before the circuit boards are platted, while others specify the size of the hole after it is plated. he platting process provides a conductive path through all holes on the circuit board and as such it adds a small amount of material to the inner diameter of the holes. It is important to be aware of this difference as it is desirable to have components fit snuggly in their holes because this makes it much easier to assemble the boards and reduces the amount of solder needed to place the component. o meet this requirement it is often necessary to go through the foot prints of all through-hole devices in a design and change the drill sizes to sizes that a board house has.
4 Our sample design requires several holes in two different sizes to be drilled for the connector. We had to create this part, so at the time it s creation we used holes of the proper size according to PCBexpress s website. 2.3 Layout Once all drill sizes have been corrected in all the devices foot prints, the layout process can begin. When the netlist from Capture is imported into Layout you will be forced to link each symbol from your schematic to a physical package for Layout. Once all the packages are linked you will be presented with a window like the one below in which the yellow lines between devices represent connections from the schematic created in Capture. Figure 2: Initial layout of parts he first step as the Cadence tutorial suggests is to create a board outline. Create an outline that fits your final required dimensions or if you are just trying to make the device as small as possible create an outline with some extra room. We will follow the creation of a device of the smallest size possible. he next step is to place your components with special consideration of the yellow lines that indicate connections. Keep in mind that you may be able to be swap pins on certain devices such as micro controllers and connectors to achieve a better layout. A better layout is one that keeps short signal paths directly back to a common ground point, short signal lengths and keeps the
5 number of vias required to a minimum. It is also desirable to keep devices that create large amounts of heat away from one another, and high current switching signals away from sensitive low level signals and parts. Figure 3: Initial board outline and placement of devices 2.4 race sizes While laying out the circuit board it is important to know how much current is flowing in each trace. he traces on a circuit board have capacitance, inductance, and resistance. he effects of capacitance and inductance are a large area of discussion beyond the scope of this application note, but should be considered by the designer if high speed circuitry is involved in the design. he effects of resistance are more important for the low speed application covered here. When current passes through a trace a voltage drop occurs which results in thermal dissipation. With this in mind the trace must be sized so that it does not get too hot or so it does not introduce too much voltage drop for proper circuit operation. he following table gives a conservative guide on how to size traces according to temperature increase. here are several online calculators for achieving these values and voltage drops in the reference section of this application note. It is suggested to use either this table or the online calculators as the equations that define these properties are too complex for the level of discussion in this document.
6 emp Rise 10 C 20 C 30 C Copper 1/2 oz. 1 oz. 2 oz. 1/2 oz. 1 oz. 2 oz. 1/2 oz. 1 oz. 2 oz. race Width Maximum Current (Amps) Figure 4: race Ampacity Military Standard 275 [1] For the example board a current carrying capacity of 7.5 Amps at an ambient temperature of 85 Celsius is desired, voltage drop is not a concern. he board house selected only carries one once copper plated boards so a trace width of 0.1 is required to keep the trace temperature under its maximum of 130 Celsius for the traces that carry a power signal. he signals in the design are of low current and are not critical, so a smaller trace size of is selected for them. 2.5 Heatsinking A circuit board can be used as a heatsink to dissipate power from surface mount devices. he thermal resistance of the circuit board is largely dependent on the amount of copper on the surface of the board that is directly connected to the device. It is also dependent on the ambient temperature, overall size of the circuit board, and the presence of other thermally dissipative devices in close proximity
7 on the board. A very large amount of modeling can go into determining heat flow and temperature rise of a given circuit board layout, but typically it is done through the concepts of thermal resistance. hermal resistance is a value that is typically listed in a datasheet or derived experimentally in the units of degrees of temperature increase per watt of power dissipation. Figure 5: hermal resistance & Max Power Dissipation vs. P.C.B. Copper Area DPAK package [4] j B P * R a a d P * R d j a j c P P d _ max d _ max a a R R J _ max j c B _ max j c Junction emperature j Ambient emperature a P Power Dissipated R d j a R j c hermal Resistance, junction to ambient hermal Resistance, junction to case here are two considerations that must be made while selecting how much area a heat sink should have during the layout process. Both the maximum junction and board temperature must be within allowable ranges. he maximum junction temperature allowable by a device is typically listed in its datasheet while
8 the maximum board temperature must be obtained from your board house. As a general rule standard FR-4 circuit board material has a maximum repeatable temperature of 130 Celsius before it breaks down. With the equations above and a graph like to one above it is possible to select the proper amount of copper area on the circuit board for worse case thermal dissipation. Our example requires that a 150watt oven can be driven with 24volts continuously. An On Semiconductor N-channel mosfet was selected for this task. Specifications R Ω DSon _ max 150w ( )^2 * RDSon _ max mW 24V R 50 Minimum pad size (only enough copper area to mount component) j j a _ max B _ max 150 Celsius 130 Celsius a _ max 85 Celsius j * Celsius he junction temperature of the device is much less than the board constraint of 130 Celsius and the device constrain of 150 Celsius so no additional copper area is required to heat sink the device. It should be noted that the traces used to connect the device to the rest of the circuit will serve to provide some additional heat sinking so the actual operating temperature of the device will be much less. With heat sinking requirements and trace sizes determined the actual routing of traces can begin. Start with the critical traces such as grounds, and power signals that must be kept as short as possible.
9 Figure 6: Critical length power signals routed 2.6 Vias Often it is necessary for a signal to go from one side of the board to the other. his can be done at the through hole lead of a device or through a via. A via is a hole that is drilled in the circuit that is plated all the way through with metal. his creates a connection from one layer to the layer on the other side of the board. A via s current capacity depends on the diameter of the via, the thickness of the plating, and whether the via is filled with solder. If the circuit requires that a significant amount of current be put through a via, analysis should be done to ensure that there is not potential for failure at the via. Such analysis is beyond the scope of this applications note, so it is assumed that only low current signals are passed through via s. In the case of the example, there are no possible direct paths from all of the resistors to the connector. So the signal must be passed to the other side of the board by passing it through a via. Also because the via is a drilled feature we had to select a via of a diameter that our board house could drill.
10 Figure 7: hree via s were required to route all signals to the connector With the remainder of the layout complete, the board s dimensions are pulled in to minimize the size of the board. Also if screw hole mounts or silk screen labels are needed, this is the time to add them. 2.7 Post Processing Once the circuit board layout is complete it must be converted to file formats that a board house can work with. Some board houses accept saved files from certain programs, while most require files in Extended Gerber RS-274X file format. hese files must be exported from Layout using the post processor. his process is straight forward and covered in Cadence s tutorials, but care is required in reviewing the board house s required file names and formats. It is highly recommended to use a Gerber file viewer such as the free version of ViewMate from pentalogix.com to view generated Gerber files to ensure that they are correct. Any flaw in these files will show up in the final circuit board. 3 Recommendations 3.1 Drawing Schematic If your schematic is very large or complicated, use multiple pages for your schematics in Capture with each page broken down into the segments of your circuit. his makes it much easier to read your schematics and go back to them
11 later. o link wires from page to page you want to use an off-page connector from the place drop down menu. 3.2 Auto-routing vs. Manual routing Most layout packages include some sort of auto trace router. Some are very complex and are very powerful. However, it is not recommended to use these auto-routers when you make your first design. he auto-routers tend to be very complicated to use and often do not do as good of a job as manually placing parts and traces with some thought. hose who do PCB layout for a living largely do it manually because a person can typically do a much better job of laying out parts than a machine because a person is much more in tune with compromises that can be made in the design to achieve a good layout. It is worth noting that auto-routers can be useful for quick and dirty layout or for quickly doing small sections of a board at time. 4 Conclusion Circuit board design like all areas of design requires experience to become good at it. his document should provide all the information the first time designer needs to create a working product when the board comes back from the board house. Circuit board design can be very tricky and complicated so it is suggested to start with a simple design for your first layout. References - for further information 1 race Ampacity Military Standard Online trace ampacity calculator 4 hermal resistance of a DPAK package l/pdf/dppak.pdf 5 Via current capcaities
PCB layout tutorial MultiSim/Ultiboard
PCB layout tutorial MultiSim/Ultiboard The basic steps in designing a PCB Paper design and prototype of the basic circuit. Identify the parts and the footprints that will be used. Make a circuit schematic,
More informationPI3DPX1207B Layout Guideline. Table of Contents. 1 Layout Design Guideline Power and GROUND High-speed Signal Routing...
PI3DPX1207B Layout Guideline Table of Contents 1 Layout Design Guideline... 2 1.1 Power and GROUND... 2 1.2 High-speed Signal Routing... 3 2 PI3DPX1207B EVB layout... 8 3 Related Reference... 8 Page 1
More informationGetting Started in Eagle Professional Schematic Software. Tyler Borysiak Team 9 Manager
Getting Started in Eagle 7.3.0 Professional Schematic Software Tyler Borysiak Team 9 Manager 1 Executive Summary PCBs, or Printed Circuit Boards, are all around us. Almost every single piece of electrical
More informationCreating another Printed Circuit Board
Appendix C Creating another Printed Circuit Board In this chapter, we will learn the following to World Class standards: Starting with a Finished Schematic Creating the Layers for the Printed Circuit Board
More informationFeatures DNC GND GND GND GATE GATE. Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXGD3108N8TC ZXGD ,500
V ACTIVE OR'ING MOSFET CONTROLLER IN SO8 Description is a V Active OR ing MOSFET Controller designed for driving a very low R DS(ON) Power MOSFET as an ideal diode. This replaces the standard rectifier
More informationDriving 2W LEDs with ILD4120
Application Note AN270 Revision: 0.4 Date: LED Driver & AF Discretes Edition 2011-09-13 Published by Infineon Technologies AG 81726 Munich, Germany 2011 Infineon Technologies AG All Rights Reserved. LEGAL
More informationPART OBSOLETE - USE ZXGD3111N7. Features. GND GND Vcc GATE. GATE Top View Pin-Out
PART OBSOLETE - USE N7 V ACTIVE OR-ING MOSFET CONTROLLER IN SO8 Description is a V Active OR-ing MOSFET controller designed for driving a very low R DS(ON) Power MOSFET as an ideal diode. This replaces
More informationFeatures SO-7. Typical Configuration for Low-Side -ve Supply Rail DRAIN. Top View
V ACTIVE OR'ING MOSFET CONTROLLER IN SO7 Description The is a V Active OR ing MOSFET Controller designed for driving a very low R DS(ON) Power MOSFET as an ideal diode. This replaces the standard rectifier
More informationQuiz Design Question. Signal Grounds. Wires Theory vs Reality
Quiz Design Question Quiz Thu 2:30p The design question will involve one of Op amp or BJT(s) or MOSFET(s). One or more of these datasheets will be included in the exam: OP AMP http://web.mit.edu/6.101/www/reference/lm741.pdf
More informationLM18293 Four Channel Push-Pull Driver
LM18293 Four Channel Push-Pull Driver General Description Typical Connection March 1998 The LM18293 is designed to drive DC loads up to one amp. Typical applications include driving such inductive loads
More informationPCB Design Guidelines for GPS chipset designs. Section 1. Section 2. Section 3. Section 4. Section 5
PCB Design Guidelines for GPS chipset designs The main sections of this white paper are laid out follows: Section 1 Introduction Section 2 RF Design Issues Section 3 Sirf Receiver layout guidelines Section
More information200mA High Speed LDO Voltage Regulator with Inrush Current Prevention
ETR03066-004 200mA High Speed LDO Voltage Regulator with Inrush Current Prevention GENERAL DESCRIPTION The XC6233 series is a 200mA high speed LDO regulator that features high accurate high ripple rejection
More informationEdition Published by Infineon Technologies AG Munich, Germany 2011 Infineon Technologies AG All Rights Reserved.
Application Note AN213 Revision: 0.6 Date: LED Driver & AF Discretes Edition 2011-02-28 Published by Infineon Technologies AG 81726 Munich, Germany 2011 Infineon Technologies AG All Rights Reserved. LEGAL
More informationAssembly Instructions
Assembly Instructions For the SSQ-2F 3.1 MHz Rife Controller Board Kit v1.41 Manual v1.00 2012 by Ralph Hartwell Spectrotek Services GENERAL ASSEMBLY INSTRUCTIONS Arrange for a clean work surface with
More informationGS61008T Top-side cooled 100 V E-mode GaN transistor Preliminary Datasheet
Features 100 V enhancement mode power switch Top-side cooled configuration R DS(on) = 7 mω I DS(max) = 90 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More informationZVS Power Resonator. CRO-SM1 Ultra Compact Self Resonating Power Oscillator
ZVS Power Resonator CRO-SM1 Ultra Compact Self Resonating Power Oscillator Features and Specifications Automatic Resonance, no tuning needed Wide supply voltage range (12V 30V) ZVS (Zero Voltage Switching)
More informationDesign For Manufacture
NCAB Group Seminar no. 11 Design For Manufacture NCAB GROUP Design For Manufacture Design for manufacture (DFM) What areas does DFM give consideration to? Common errors in the documentation Good design
More informationThermal behavior of the new high-current PROFET
BTS7002-1EPP, BTS7004-1EPP, BTS7006-1EPP, BTS7008-1EPP, BTS7008-2EPA High-current PROFET 12V smart high side power switch, BTS700x Family About this document Scope and purpose This document shows how to
More informationAssembly Instructions for the 1.5 Watt Amplifier Kit
Assembly Instructions for the 1.5 Watt Amplifier Kit 1.) All of the small parts are attached to a sheet of paper indicating both their value and id. 2.) Leave the parts affixed to the paper until you are
More informationDriving High Power LEDs Starting from 700mA with Low Cost LED Controller IC ILD4001
Driving High Power LEDs Starting from 700mA with Low Cost LED Controller IC ILD4001 Application Note 213 http://www.infineon.com/lowcostleddriver Rev. 1.1, 2011-06 -23 Power Management & Multimarket Edition
More informationCir cuit s 212 Lab. Lab #7 Filter Design. Introductions:
Cir cuit s 22 Lab Lab #7 Filter Design The purpose of this lab is multifold. This is a three-week experiment. You are required to design a High / Low Pass filter using the LM38 OP AMP. In this lab, you
More informationPCB Production Methods
PCB Production Methods PCB Development Process Summary Manufacturing Constraints Gerber Schematic Board Manufacture This is art! Ensure that the schematic is accurate. Run the ERC often. This is art! Ensure
More informationcourtesy Wikipedia user Wikinaut
What's a PCB? https://learn.sparkfun.com/tutorials/pcb-basics Printed circuit board is the most common name but may also be called printed wiring boards or printed wiring cards. Before the advent of the
More informationDynamic thermal behavior of MOSFETs
AN_201712_PL11_001 About this document Scope and purpose Thermal management can be a tricky task. As long as the losses are constant it is easy to derive the maximum chip temperature from simple measurements
More informationWheatstone Bridge. M16C Microcontroller Strain Gauge (temperature compensation)
Overview Eagle Version: 5.11.0 Circuit: Strain gauge amplifier for interface with a microcontroller. Time Requirements 2 + 2 + 2 hours. This three part guide is intended to provide an introduction to PCB
More informationProject Design for TAPR Manufacturing. Design for Manufacturability
Project Design for TAPR Manufacturing Design for Manufacturability -or- How to ease your project into mass production with the least amount of pain (both yours and TAPR s) Scotty Cowling, WA2DFI 2010 Dayton
More informationHigh Current Voltage Regulator Module (VRM) Uses DirectFET MOSFETs to Achieve Current Densities of 25A/in2 at 1MHz to Power 32-bit Servers
High Current Voltage Regulator Module (VRM) Uses DirectFET MOSFETs to Achieve Current Densities of 25A/in2 at 1MHz to Power 32-bit Servers Ralph Monteiro, Carl Blake and Andrew Sawle, Arthur Woodworth
More informationPCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010
PCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010 Printed Circuit Boards What are they? How can I make one? 424 Project description Eagle Tutorial http://www.electronicmanufacturers.co.za/
More informationGS61008P Bottom-side cooled 100 V E-mode GaN transistor Preliminary Datasheet
Features 100 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 7 mω I DS(max) = 90 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More informationGS61004B 100V enhancement mode GaN transistor Preliminary Datasheet
Features 100V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 15 mω I DS(max) = 45 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More informationDUAL STEPPER MOTOR DRIVER
DUAL STEPPER MOTOR DRIVER GENERAL DESCRIPTION The is a switch-mode (chopper), constant-current driver with two channels: one for each winding of a two-phase stepper motor. is equipped with a Disable input
More informationWires, Ground loops Thermal considerations Energy PCB Layout Spring 2018 Lecture 12 1
Wires, Ground loops Thermal considerations Energy PCB Layout 6.101 Spring 2018 Lecture 12 1 4 Quiz Grades 3 2 Quiz Grades 1 0
More informationLM V Monolithic Triple Channel 15 MHz CRT DTV Driver
220V Monolithic Triple Channel 15 MHz CRT DTV Driver General Description The is a triple channel high voltage CRT driver circuit designed for use in DTV applications. The IC contains three high input impedance,
More informationTD-DEV V Technical Specification
High-Efficiency MODULE Carrier Board TD-DEV-500-12V Technical Specification POWER SUPPLY TECHNOLOGY FEATURES Low profile 1U, 500W power supply High efficiency power supply Fully integrated with CPU control
More informationA Basis for LDO and It s Thermal Design
A Basis for LDO and It s Thermal Design Introduction The AIC LDO family device, a 3-terminal regulator, can be easily used with all protection features that are expected in high performance voltage regulation
More informationFeatures. Top View Pin-Out
40 1A GATE DRIE SOT363 Description is a high-speed, non-inverting single gate driver for switching MOSFETs. It can transfer up to 1A peak source/sink current into the gate for effective charging and discharging
More informationAP Khz, 3A PWM Buck DC/DC Converter. Features. General Description. Applications. Description. Pin Assignments
Features - Output voltage: 3.3, 5, 12 and adjustable output version - Adjustable version output voltage range, 1.23 to 37+4% - 150Khz +15% fixed switching frequency - oltage mode non-synchronous PWM control
More informationEE320L Electronics I. Laboratory. Laboratory Exercise #6. Current-Voltage Characteristics of Electronic Devices. Angsuman Roy
EE320L Electronics I Laboratory Laboratory Exercise #6 Current-Voltage Characteristics of Electronic Devices By Angsuman Roy Department of Electrical and Computer Engineering University of Nevada, Las
More informationSingle Switch Forward Converter
Single Switch Forward Converter This application note discusses the capabilities of PSpice A/D using an example of 48V/300W, 150 KHz offline forward converter voltage regulator module (VRM), design and
More informationMain improvements are increased number of LEDs and therefore better temperature indication with one Celsius degree increments.
LED Thermometer V2 (Fahrenheit/Celsius/±1 ) PART NO. 2244754 After completing this great starter kit, users will have a nice interactive LED thermometer. You will learn one principle how temperature can
More informationMOSFET as a Switch. MOSFET Characteristics Curves
MOSFET as a Switch MOSFET s make very good electronic switches for controlling loads and in CMOS digital circuits as they operate between their cut-off and saturation regions. We saw previously, that the
More informationFeatures. Applications. Figure 1. Typical Application Circuit
3A, Low Voltage, Adjustable LDO Regulator with Dual Input Supply General Description The is a high-bandwidth, low-dropout, 3A voltage regulator ideal for powering core voltages of lowpower microprocessors.
More informationHELA-10: HIGH IP3, WIDE BAND, LINEAR POWER AMPLIFIER
AN-60-009 Ref. EA-7193 Application Note on HELA-10: HIGH IP3, WIDE BAND, LINEAR POWER AMPLIFIER Mini-Circuits P.O. Box 350166 Brooklyn, NY 11235 AN-60-009 Rev.: F M150261 (04/15/15) File name: AN60009.doc
More informationCHAPTER 3 PROJECT METHODOLOGY
CHAPTER 3 PROJECT METHODOLOGY 3.1 Introduction This chapter will cover the details explanation of methodology that is being used to make this project complete and working well. Many methodology or findings
More informationCAD Layout Recommendations for the PowerBlox Family
Solved by APPLICATION NOTE ANP4 TM CAD Layout Recommendations for the PowerBlox Family Introduction The Sipex PowerBlox family of parts offers designers a very high power density solution for wide input
More informationInstructions for Building the Pulsed Width Modulation Circuit. MC-12 (DC Motor Controller or PWM) From Electronic Light Inc. (revised kit 5/08)
Instructions for Building the Pulsed Width Modulation Circuit MC-12 (DC Motor Controller or PWM) From Electronic Light Inc. (revised kit 5/08) Using this circuit for a pulsed DC current to your cell. Do
More informationPreliminary Datasheet
Preliminary Datasheet Macroblock 4-Channel All-Ways-On TM MBI1824 Constant Current LED Driver Features Maximum 50V output sustaining voltage 4 constant-current output channels Constant output current invariant
More informationBill of Materials: PWM Stepper Motor Driver PART NO
PWM Stepper Motor Driver PART NO. 2183816 Control a stepper motor using this circuit and a servo PWM signal from an R/C controller, arduino, or microcontroller. Onboard circuitry limits winding current,
More informationWD3122EC. Descriptions. Features. Applications. Order information. High Efficiency, 28 LEDS White LED Driver. Product specification
High Efficiency, 28 LEDS White LED Driver Descriptions The is a constant current, high efficiency LED driver. Internal MOSFET can drive up to 10 white LEDs in series and 3S9P LEDs with minimum 1.1A current
More informationTECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors
TECHNICAL REPORT: CVEL-14-059 Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors Andrew J. McDowell and Dr. Todd H. Hubing Clemson University April 30, 2014
More informationPADS Layout for an Integrated Project. Student Workbook
Student Workbook 2017 Mentor Graphics Corporation All rights reserved. This document contains information that is trade secret and proprietary to Mentor Graphics Corporation or its licensors and is subject
More informationInstructions for Building the Pulsed Width Modulation Circuit. MC-12 (DC Motor Controller or PWM) From Electronic Light Inc. (revised kit 8/08)
Instructions for Building the Pulsed Width Modulation Circuit MC-12 (DC Motor Controller or PWM) From Electronic Light Inc. (revised kit 8/08) Using this circuit for a pulsed DC current to your cell. Do
More informationMiniSKiiP Dual Utilization, PCB Design Recommendations and Test Results
Application Note AN1402 Revision: 02 Issue date: 2014-12-19 Prepared by: Ingo Staudt Approved by: Peter Beckedahl Keyword: MiniSKiiP Dual, PCB design, high power PCB MiniSKiiP Dual Utilization, PCB Design
More informationPCB Fundamentals Quiz
1. PCBs should be fabricated with layers. a. Odd Number of b. Even Number of c. Any Number of Reason: Using an odd number of layers may result in board warpage. 2. Which of the following is not taken into
More informationDATASHEET VXR S SERIES
VXR250-2800S SERIES HIGH RELIABILITY COTS DC-DC CONVERTERS DATASHEET Models Available Input: 11 V to 60 V continuous, 9 V to 80 V transient 250 W, single output of 3.3 V, 5 V, 12 V, 15 V, 28 V -55 C to
More informationHigh currents in safe paths
High currents in safe paths Webinar November 3 rd 2015 Speaker: Andreas Schilpp www.we-online.de topics Flex-rigid technology with thick copper layers Update Design Rules Wirelaid Update UL-Listing Wirelaid
More informationINPUT: 110/220VAC. Parallel Input Series Input Parallel Output Series Output (W/CT)
Linear power supply design: To make a simple linear power supply, use a transformer to step down the 120VAC to a lower voltage. Next, send the low voltage AC through a rectifier to make it DC and use a
More informationIntroduction to NI Multisim & Ultiboard Software version 14.1
School of Engineering and Applied Science Electrical and Computer Engineering Department Introduction to NI Multisim & Ultiboard Software version 14.1 Dr. Amir Aslani August 2018 Parts Probes Tools Outline
More informationGS66502B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet
GS66502B Features 650 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 200 mω I DS(max) = 7.5 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive
More informationRF circuit fabrication rules
RF circuit fabrication rules Content: Single layer (ref. page 4) No vias (ref. page 4) With riveted vias (ref. pages 4,5,6) With plated vias (ref. pages 4, 5,7,8,9,10,11) Component assembly (ref. pages
More informationFPF1005-FPF1006 IntelliMAX TM Advanced Load Management Products
FPF5-FPF IntelliMAX TM Advanced Load Management Products Features 1. to 5.5V Input Voltage Range Typical R DS(ON) = 5mΩ @ = 5.5V Typical R DS(ON) = 55mΩ @ ESD Protected, above V HBM Applications PDAs Cell
More informationGS P Bottom-side cooled 100 V E-mode GaN transistor Preliminary Datasheet. Features. Applications. Description.
Features 100 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 5 mω I DS(max) = 120 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More information1.0MHz,24V/2.0A High Performance, Boost Converter
1.0MHz,24V/2.0A High Performance, Boost Converter General Description The LP6320C is a 1MHz PWM boost switching regulator designed for constant-voltage boost applications. The can drive a string of up
More informationDC Solid State Power Controller Module
DC Solid State Power Controller Module Description: The Solid State Power Controller (SSPC) Module is a microcontroller-based Solid State Relay rated upto 25A designed to be used in Army, Air force and
More informationVSX60 & VSX75 APPLICATION NOTES
Application Guide DCAN-40 Rev F VSX60 & VSX75 APPLICATION NOTES The VSX60 Series and VSX75 Series are 60 Watt and 75 Watt, respectively, dual output converters with 18-36V (VSX60 only) and 36-75V input
More informationBlue Ring Tester Kit Assembly & User Manual
Blue Ring Tester Kit Assembly & User Manual Alltronics LLC/AnaTek Instruments 2761 Scott Blvd, Santa Clara, CA, 95050, USA March 2015 Edition Tel: 408-778-3868, Fax: 408-778-2558, E mail : tech@alltronics.com
More informationSGM9154 Single Channel, Video Filter Driver for HD (1080p)
PRODUCT DESCRIPTION The SGM9154 video filter is intended to replace passive LC filters and drivers with an integrated device. The 6th-order channel offers High Definition (HDp) filter. The SGM9154 may
More informationECE453 Lab 5: FM Quadrature Demodulation / PCB Design Using Eagle
ECE453 Lab 5: FM Quadrature Demodulation / PCB Design Using Eagle In this lab, you will work with your partner to design a printed circuit board for a quadrature demodulator IC and supporting components.
More informationMGA GHz 3 V, 17 dbm Amplifier. Data Sheet. Features. Description. Applications. Surface Mount Package. Simplified Schematic
MGA-853.1 GHz 3 V, 17 dbm Amplifier Data Sheet Description Avago s MGA-853 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from.1 to
More informationLM137/LM337 3-Terminal Adjustable Negative Regulators
3-Terminal Adjustable Negative Regulators General Description The LM137/LM337 are adjustable 3-terminal negative voltage regulators capable of supplying in excess of 1.5A over an output voltage range of
More information28 V, 150 ma Voltage Regulator with Stand-by Mode
28 V, 150 ma Voltage Regulator with Stand-by Mode FEATURES Operating Voltage Range 2.0 V 28.0 V Output Voltage Range from 2.0 V to 12.0 V with 0.1 V increments (B series) or 2.0 V 23 V with external resistors
More informationEnhanced Optical Position Detector
Enhanced Optical Position Detector Revision v0.2 January 6, 2018 Seth Neumann, seth@modelrailroadcontrolsystems.com Introduction This document describes the Morse Code Buzzer Controller and how to assemble
More informationSGM mA Buck/Boost Charge Pump LED Driver
GENERAL DESCRIPTION The SGM3140 is a current-regulated charge pump ideal for powering high brightness LEDs for camera flash applications. The charge pump can be set to regulate two current levels for Flash
More informationLM137/LM337 3-Terminal Adjustable Negative Regulators
LM137/LM337 3-Terminal Adjustable Negative Regulators General Description The LM137/LM337 are adjustable 3-terminal negative voltage regulators capable of supplying in excess of 1.5A over an output voltage
More informationMAX16803EVKIT+BJT Evaluation Kit+
19-0828; Rev 0; 5/07 MAX16803EVKIT+BJT Evaluation Kit+ General Description The MAX16803EVKIT+BJT (EV kit) demonstrates a high-current LED driver with accurate current control based on the MAX16803 current
More informationXC6210 Series APPLICATIONS. TYPICAL PERFORMANCE CHARACTERISTICS Dropout Voltage vs. Output Current TYPICAL APPLICATION CIRCUIT
ETR317_6 High Current, High Speed LDO Regulators GENERAL DESCRIPTION The XC621 series are precise, low noise, high current, positive voltage low dropout regulators. They are fabricated using Torex s CMOS
More informationAP1506. Package T5: TO220-5L L : K5: TO263-5L T5R: TO220-5L(R)
Features General Description oltage: 3.3, 5, 12 and Adjustable ersion Adjustable ersion oltage Range, 1.23 to 18+4% 150KHz +15% Fixed Switching Frequency oltage Mode Non-Synchronous PWM Control Thermal-Shutdown
More informationGS61004B 100V enhancement mode GaN transistor Preliminary Datasheet
Features 100V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 15 mω I DS(max) = 45 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More informationPackage K5 : TO263-5L T5 : TO220-5L T5R : TO220-5L(R)
Features General Description oltage: 3.3, 5, 12 and Adjustable ersion Adjustable ersion oltage Range, 1.23 to 18+4% 150KHz +15% Fixed Switching Frequency oltage Mode Non-Synchronous PWM Control Thermal-Shutdown
More informationFAN5037. Adjustable Switching Regulator Controller. Features. Description. Applications. Block Diagram.
Adjustable Switching Regulator Controller www.fairchildsemi.com Features High power switch-mode DC-DC controller can provide in excess of 13A Output voltage adjustable from 1.V to 3.6V 85% efficiency Cumulative
More informationILD2035. MR16 3 W Control Board with ILD2035. Application Note AN214. Industrial and Multimarket. Revision: 1.0 Date:
ILD2035 MR16 3 W Control Board with ILD2035 Application Note AN214 Revision: 1.0 Date: Industrial and Multimarket Edition Published by Infineon Technologies AG 81726 Munich, Germany 2011 Infineon Technologies
More informationDistributed by: www.jameco.com 1-800-831-4242 The content and copyrights of the attached material are the property of its owner. Stereo 11W Audio Power Amplifier General Description The is a stereo audio
More informationAP1506. Description. Pin Assignments. Features. Applications. 150kHz, 3A PWM BUCK DC/DC CONVERTER AP SD 4 FB 3 GND 2 Output
150kHz, 3A PWM BUCK DC/DC CONVERTER Description The series are monolithic IC designed for a step-down DC/DC converter, and own the ability of driving a 3A load without external transistor. Due to reducing
More informationGS61008P Bottom-side cooled 100 V E-mode GaN transistor Preliminary Datasheet. Features. Applications. Description. Circuit Symbol.
Features 100 V enhancement mode power switch Bottom-side cooled configuration R DS(on) = 7 mω I DS(max) = 90 A Ultra-low FOM Island Technology die Low inductance GaNPX package Easy gate drive requirements
More information28 V Input High Speed Voltage Regulator
28 V Input High Speed Voltage Regulator FEATURES Operating Voltage Range 2.0 V 28.0 V Output Voltage Range from 1.8 V to 18.0 V with 0.1 V increments Output Voltage Accuracy ± 2% Temperature Stability
More informationTQP7M W High Linearity Amplifier. Applications. Ordering Information
Applications Repeaters BTS Transceivers BTS High Power Amplifiers CDMA / WCDMA / LTE General Purpose Wireless 3-pin SOT-89 Package Product Features 5-15 MHz +3 dbm P1dB at 94MHz +49 dbm Output IP3 at 94MHz
More informationTQP3M9008 High Linearity LNA Gain Block
General Description The is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. At 1.9 GHz, the amplifier typically provides 2.6 db gain, +36 dbm OIP3, and 1.3 db Noise
More informationAL5809Q. Pin Assignments. Description ADVANCED INFORMATON. Applications. Features. Typical Applications Circuit
AUTOMOTIVE COMPLIANT 6V TWO TERMINAL CONSTANT CURRENT LED DRIVER PowerDI123 (Type B) Description Pin Assignments The is a constant current linear LED driver that provides a cost-effective two-pin solution
More informationFor details on Vishay Siliconix MOSFETs, visit
SiXXXX For details on MOSFETs, visit /mosfets/ Revision: 6-Oct-09 Document Number: 65580 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.
More information4 Maintaining Accuracy of External Diode Connections
AN 15.10 Power and Layout Considerations for EMC2102 1 Overview 2 Audience 3 References This application note describes design and layout techniques that can be used to increase the performance and dissipate
More informationAT818 FEATURES DESCRIPTION APPLICATION PIN CONFIGURATIONS (TOP VIEW) ORDER INFORMATION. 3.0A Ultra Low Dropout Regulator AT 818- SF8 R
FEATURES DESCRIPTION Adjustable Output from 0.8V Input Voltage as Low as 1.8V Enable Pin 250mV Dropout @2A Over Current and Over Temperature Protection 5μA Quiescent Current in Shutdown P-CH Design to
More informationN-Channel Power MOSFET
_Datasheet Enhancement Mode N-Channel Power MOSFET Features Low RDS(on) & FOM Extremely low switching loss Excellent stability and uniformity Easy to drive Applications Lighting Hard switching PWM Server
More informationNew MOSFET Package Increases Efficiency and Power Capability
Presented for the first time at PCIM Nuremberg Conference, June 07 09 2005 in Nuremberg, Germany. Next PCIM Nuremberg Conference: May 30 June, 2006, see www.pcim.de New MOSFET Package Increases Efficiency
More informationRT9173/A. Peak 3A Bus Termination Regulator. Features. General Description. Applications. Ordering Information. Pin Configurations
Peak 3A Bus Termination Regulator General Description The regulator is designed to convert voltage supplies ranging from 1.6 to 6 into a desired output voltage which adjusted by two external voltage divider
More informationWhat the Designer needs to know
White Paper on soldering QFN packages to electronic assemblies. Brian J. Leach VP of Sales and Marketing AccuSpec Electronics, LLC Defect free QFN Assembly What the Designer needs to know QFN Description:
More informationMGA GHz 3 V, 17 dbm Amplifier. Data Sheet
MGA-853.1 GHz 3 V, 17 dbm Amplifier Data Sheet Description Avago s MGA-853 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from.1 to
More informationRuth Kastner Eli Moshe. Embedded Passives, Go for it!
Ruth Kastner Eli Moshe Embedded Passives, Go for it! Outline Description of a case study: Problem definition New technology to the rescue: Embedded passive components Benefits from new technology Design
More informationDC Solid State Power Controller Module
DC Solid State Power Controller Module Description: These Solid State Power Controller (SSPC) Modules are designed to operate without any heatsink requirements. They are microcontroller-based Solid State
More informationApplication Note CDIAN003
Application Note CDIAN003 CDI GaN Bias Board User s Guide Revision 4.0 February 20, 2015 Quick Start Guide Shown below are the essential connections, controls, and indicators for the GaN Bias Control Board.
More informationTechcode. 3A 150KHz PWM Buck DC/DC Converter TD1501H. General Description. Features. Applications. Package Types DATASHEET
General Description Features The TD1501H is a series of easy to use fixed and adjustable step-down (buck) switch-mode voltage regulators. These devices are available in fixed output voltage of 5V, and
More information