ANALOG IC DESIGN HIGH SPEED SERIAL LINKS (HSSL)
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1 ANALOG IC DESIGN HIGH SPEED SERIAL LINKS (HSSL)
2 Team members Transmitter Receiver Timing Nasr Mahana Mohamed Alaa Issa Mostafa Naeem Ahmed El-Said Mostafa Ayesh Mohamed Issa El- Dacher Hisham Moubarak Ahmed El-Said Shehata Mohamed Megahed Mabrouk Mohamed Mansour El- Rayany
3 Introduction Why HSSL? 10GBaseKR Standard System overview Channel Transmitter Receiver Timing system
4 Why HSSL? Many core system processors Bandwidth increased to Tpbs Limited number of pins HSSL
5 10GBaseKR Standard Transmitter Receiver Speed Gbps Speed Gbps Max. output diff. peak-peak 1.2V Max. input diff. peak-peak 1.2V Max. jitter 0.28 UI Max Jitter 0.13 UI Programmable Equalization (3-tap FIR) AC coupling CM voltage limit 0-1.9
6 System overview
7 Channel Limited channel bandwidth High frequency attenuation and dispersion Inter symbol interference (ISI)
8 Tx & Rx Transmitter Serializer 3-Tap FIR Receiver AFE ADC 3-Tap DFE & 2-tap FFE
9 Timing System Phase locked loop (PLL) at Tx side PLL at Rx side with CDR
10 TRANSMITTER
11 Transmitter system overview Serializer. Three tap FIR equalizer.
12 Conceptual I/O Transmitter Goals High bit rate Low power consumption Low noise, free of unnecessary time-domain spikes. Low coupling to other links
13 System Overview
14 Multiplexer
15 Multiplexer Introduction. Different architectures. Topologies. Results. Power budget. Corner results.
16 Introduction High-speed links can be limited by both the channel and the circuits. Multiplexing circuitry also limits maximum data rate.
17 Different Architectures Full rate architecture. Advantages: Relaxes duty cycle of the clock. Disadvantages: Need to generate and distribute high speed clock. Need to design high speed flip-flop.
18 Half Rate Architecture Half-rate architecture uses 2 clock phases separated by 180 to mux data. Advantages: eliminates high-speed clock and flip-flop. Disadvantages: Output eye is sensitive to clock duty cycle..
19 Half Rate Architecture Tree architecture 16:1 MUX with 4 stages based on 2_to_1 MUX
20 1/4-rate architecture 4-phase clock distribution spaced at phase spacing and duty cycle critical for uniform output eye. Advantages: Reduce the frequency of the clock. Disadvantages: Increase multiplexing factor to allow for lower frequency clock distribution.
21 Tree Architecture
22 First Stage Input data rate 625Mb/s. Output data rate 1.25Gb/s. The clock is 625MHZ. All circuit implemented in CMOS.
23 Second Stage Input data rate 1.25Gb/s. output data rate 2.5Gb/s. The clock is 1.25MHZ. All circuit implemented in CMOS.
24 Third Stage Input data rate 2.5Gb/s. output data rate 5Gb/s. The clock is 2.5MHZ. All circuit implemented in CMOS.
25 Fourth Stage Input data rate 5Gb/s. output data rate 10Gb/s. The clock is 5MHZ. Flip-Flop and Latch are implemented by TSPC. 2_1_mux is CML MUX.
26 Flip Flop Built from master and slave D latches A negative level-sensitive latch A positive level-sensitive latch
27 2:1 MUX No restoring mux uses two transmission gates. Only 4 transistors More efficient. Low area. Low power. High speed than other CMOS.
28 CML MUX
29 TSPC
30 First Stage Result Flip Flop
31 First Stage Result D latch
32 First Stage Result 2:1 MUX
33 First Stage Result Eye diagram
34 Second Stage Result Eye diagram
35 Third Stage Result Eye diagram
36 Fourth Stage Result TSPC Flip Flop
37 Fourth Stage Result TSPC latch
38 Fourth Stage Result CML MUX
39 Fourth Stage Result Eye diagram
40 Power budget Stage 1-First stage power u watt 2-Second stage u watt 3-Third stage m watt. 4-Fourth stage m watt. 5-Total power m watt.
41 Corner Results Ss corner,ff_res, high_temp MUX across this corner which is the worst corner and generate output swing 0.67 mv pp.
42 Agenda 3 Tap Equalizer with programmable cofficient Digital To analog Converter Drivers Predrivers Flipflop TransmitterOutput
43 3Tap Equalizer With programmable Cofficient Vpre=[c(-1)-c(0)-c(1) ]V Vpst=[c(-1)+c(0)-c(1)]V Vss=[c(-1)+c(0)+c(1)]V C-1 has 8 settings from 0 to with step size of at least C1 has 8 settings from 0 to with step size of at least 0.05.
44 Frequency-Domain Representation W(z)=-c(-1)+ c(0) -c(1) z=exp(j*2*pi*f*ts)=cos(2*pi*f*ts)+sin(2*pi*f*ts) At low frequency(f=0) Z= cos(0)+jsin(0) W(f=0)= c(-1)+ c(0)- c(1) At Nyquist frequency response (f=1/2ts) Z= cos(pi)+jsin(pi)=-1 W(f=1/2Ts)= -1
45 Frequency-Domain Representation C(-1) C(0) C(1) LF NF db db db db db db db 0 The Equalizer has -26db of frequency peaking Attenutes DC at -26.6db and passes Nyquist frequency
46 Coefficient Range and Equivalent current C(-1) Pre-tap current C(0) Main-tap current C(1) Post-tap current 0 0mA 1 20mA 0 0mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
47 Digital to analog converter Segmented current arrays All current sources are equal and controlled by thermometer code so that when digital input increases by 1 LSB, one additional current is switched to output.
48 current segmented arrays Advantages Guarantee monotonicity: the transfer characteristics of such arrays is monotonic function of input. Cancel the glitches that lead to large DNL,since it s controlled by thermometer coding.
49 Matching Analyze performance of mismatch on circuit :- Systematic Mismatch VDS Random Mismatch Id= Id = / / Larger device area less mismatch effect Larger gate-overdrive less threshold mismatch
50 Cascode current mirror
51 Monte Carlo simulation
52 Drivers
53 CML pre drivers. Capacitance driving
54 CML Latch Operation At the beginning of regeneration phase : Vout(0)=GM1 RD vin Gm3Vout= +CL Vout(t)=Gm1RD Vin exp exp
55 Setting & hold time
56 Flip flop output
57 Transmitter Output Eye diagram without any Equalization
58 Transmitter Output Minimum output swing without any equalization Outpu
59 Transmitter Output Eye diagram after passing 16 inch channel with - 12db loss without Equalization
60 Transmitter Output Eye diagram at Tx with Equalization
61 Transmitter Output Eye diagram at Tx with Equalization after passing 16 inch channel with -12db loss
62 Transmitter Output Eye diagram after passing 22 inch channel with - 20db loss without Equalization
63 Transmitter output Eye diagram after passing 22inch channel with - 20db loss with Equalization
64 Corners Simulation System passes all corners specially FF corner for Transistor, SS corner for resistor with high temp and supply=0.9v SS corner for Transistor,ff corner for resistor with low temp and supply=1.1v
65 Rise &Fall time Rise time is equal 29.5 ps. Fall time is equal 35.9 ps. at SS corner for transistor FF for resistor, temperature 0ºC and supply 0.9 V
66 Rise &Fall time 2 Rise time is equal 44.2 ps. Fall time is equal 44.3 ps. at FF corner for transistor SS for resistor, temperature 85ºC and supply 1.1 V
67 Power budget Type Power consumption MUX Pre-driver Flip-flop Driver Total power 11.73mW 4.5mW 2mW 20mW 38.23mW
68 Drivers layout
69 Future Work Bandgap reference circuit Layout and post layout simulation
70 RECEIVER SYSTEM LEVEL OVERVIEW
71 RX system level conventional Architecture
72 RX system level Recent years & future trend
73 Our Rx System level
74 ANALOG FRONT END (AFE)
75 Contents Introduction Continuous Time Linear Equalizer (CTLE) Design Simulation Results Variable Gain Amplifier (VGA) Design Simulation Results
76 Introduction Received signals suffers from frequency dependent attenuation and dispersion causing inter symbol interference (ISI) Dispersion due to skin effect and dielectric losses
77 Continuous Time Linear Equalizer (CTLE) Equalizer acts as a high-pass filter to compensate for channel high frequency losses Passive linear Vs. Active linear equalizer First order Vs. Second order CTLE
78 CTLE Channel Equalizer Equalized channel
79 Concept of operation
80 Design
81 Pros & Cons Pros Low power and area Cancel both precursor and long tail ISI Cons Noise and cross talk are amplified Very sensitive to PVT
82 Simulation results AC-Response Peaking variation : 0 db 10dB
83 Peaking adaptation values Rdeg (Ω) Boosting (db) K 10.5
84 Simulation results AC-Response (1) Typical back plane channel with S 21 = -5.3 db -3dB BW =
85 Simulation results Eye diagram (1) Typical back plane channel with S 21 = -5.3 db
86 Simulation results AC-Response (3) Typical back plane channel with S 21 = -9.5 db
87 Simulation results Eye diagram (2) Typical back plane channel with S 21 = -9.5 db
88 Simulation results AC-Response (3) Typical back plane channel with S 21 = db
89 Simulation results Eye diagram (3) Typical back plane channel with S 21 = db
90 Characteristics Power Consumption Range Data Rate Supply Voltage Technology 7.84 mw 0-10 db 10 Gbps 1V 65nm
91 Variable Gain Amplifier (VGA) Channel attenuates signal + CTLE boost high freq. Received signal must be amplified for operating the ADC Varying gain by varying the degeneration resistance to adjust the output swing at constant value = 1.2V p- p
92 Design Large Bandwidth Reject CM noise Sets CM for following stage A =
93 Simulation results (1)
94 Simulation results (2)
95 Different gain adaptations
96 Characteristics Power Consumption Output voltage swing Data Rate Supply Voltage Technology 3.2mW 1.2V p-p 10 Gbps 1V 65nm
97 Conclusion & Further work Conclusion AFE of the Rx flatten the frequency response of the signal after being the channel effect, and amplifies the signal going to the ADC Further Work Passing corners Layout
98 Questions?
99 LOW POWER, HIGH SPEED FLASH ADC
100 Overview ADC in Digital RX Architecture System level design Models Expected Specs Circuits Schematics Specs Simulation Results Waveforms Integration with system Waveforms
101 ADC Architecture Most proper candidates: Type Resolution Speed Pipeline High Medium Flash Low High Folding Medium High
102 ADC Architecture: Time Interleaving Pros: Lower sampling frequency Relax design of ADC components Cons: Gain mismatch Offset mismatch Timing mismatch
103 ADC Architecture: Flash ADC Pros: Highest conversion speed. Cons: Efficient only Up to 6 bits Large area High power
104 ADC System-Level Design
105 1 st model Sub-ADC model
106 Dynamic performance: Output spectrum SFDR = 39dB for 1.25GHz 2.5GS/s
107 2 nd model AMS-Library Modified Model
108 Dynamic performance for sub-adc: Output spectrum SFDR = 34.5dB for 1.25 GHz 2.5GS/s
109 Static performance:
110 10 GS/s Interleaved ADC Model
111 Output spectrum for 5GHz input SFDR = 33.4dB for 5GHz 10GS/s
112 Expected Specs ADC is expected to have the following specs at 5GHz input (Nyquist frequency): Spec SNR_nominal SINAD SNR THD SDR SFDR ENOB Value db db db db db 33.4 db 3.32 bits
113 Circuits
114 Track and Hold Amplifier (THA) Track and hold Circuit: Sampling Switch Buffer TYPE Pros Open Loop High speed (90MHz - 10GHz)* Unconditionally stable Closed Loop More accurate linearity on average 50dB 78dB * Reduce charge injection Cons Pedestal error Less accurate - Poor linearity (28dB - 63dB)* Less Speed ( 240MHz)* Stability issue must be considered * Pieter Harpe, Concepts for Smart AD and DA Converters, chap.7, pp.82
115 Open Loop Track and Hold Bootstrapped Sampling switch Pros: Higher linearity Small switch size Less charge/clock injection expense: Caps are large µw power consumption Andrew Masami Abo, Design for Reliability of Low-voltage, Switched-capacitor Circuits
116 Open Loop Track and Hold Buffer Topologies
117 SF or DP? Topology Source Follower Differential Pair Gain Linearity Determined by second order effects Body effect channel length mod. Determined by first order effects Mismatch sensitivity Low High Controllability Design freedom * Pieter Harpe, Concepts for Smart AD and DA Converters, chap.7, pp.82
118 Designed THA
119 Reference Ladder To generate reference levels Stack of resistors in series voltage divider rule Alternatives: Band-gap references Adjustable references* * Ken Yang, Ramy Yousry, Tamer Ali, Hung Chen, 10Gb/s Serial I/O Receiver Based on V i bl R f ADC
120 Differential Reference ladder
121 Comparator Design Comparator consists of: Pre-Amplifier Regenerative latch
122 Pre-Amplifier Design
123 Regenerative Latch Strong-Arm Latch CML latch
124 Designed Comparator
125 Circuit results (1): THA measured specs: Process Power supply Signal range v in,pp Input common mode voltage 65 nm 1 V 1.2 V 0.6 V Output common mode voltage 0.3V 1.25 GHz input Supported Load Topology FOM_SFDR Sampling frequency ( fs ) Power consumption 31 db 300f F Source follower fj 2.5 GHz 2.44 mw
126 Circuit results (2): Reference ladder specs: Power Single resistance value Resistance Stack systematic error in reference value Comparator Specs: Power Maximum systematic offset Delay mw 4 ohm ohm ±3.6 mv 2 mw 13 mv 88.4 psec
127 Sub-ADC
128 Full Flash,Time Interleaved ADC
129 Simulation Results(1) THA output for Random input stream
130 Simulation Results(2) Reference levels for Comparators
131 Simulation Results(3) Single reference level, showing the effect of kickback noise and input feed-through
132 Simulation Results(4) static performance Analog output corresponding to output codes from the ADC
133 Simulation Results(5) DNL -using histogram Method-
134 Simulation Results(6) INL INL = +0.25/ No mis-codes
135 Power consumption distribution Total consumed power per single ADC (2.5 GSps)= 49.6 mw
136 Thermometer to binary Decoder
137 Final results Total Power FSR (DR) SNDR ENOB 158 mw 1 Vp-p db 3.1 bits INL / FOM 5GHz 1.58 pj/conversion step 28 db
138 Comparison with literature ADC Performance Survey (ISSCC & VLSI Symposium)
139 All System: TX with CTLE and VGA
140 All System: Adding ADC
141 Future work Variable reference levels digitally controlled by the equalizer Offset cancellation circuit Digital calibration for the ADC
142 Questions?
143 DIGITAL EQUALIZATION
144 Overview Digital Encoder Digital Equalization Methods Chosen Approach Adaptive Coefficients
145 Digital Encoder Why? Types Rom-based, Fat tree, BEC Chosen Approach Simulation
146 ROM-Based
147 ROM-Based
148 Fat-tree Based
149 MUX-Based
150 Bubble Error
151 Chosen Approach
152 Simulation
153 Digital Equalization Types FFE or FIR DFE
154 Feedback Forward Equalizer Serial FIR
155 Feedback Forward Equalizer Drawback
156 Feedback Forward Equalizer Parallel Processing
157 Feedback Forward Equalizer Equations :
158 Simulation
159 Decision Feedback Equalizer Type used :
160 Simulation
161 Chosen Approach Mixed Architecture
162 Simulation
163 Simulation
164 Adaptive Cofficients Two Modes for operation : 1- Training Mode 2- Decision Directed Mode
165 Adaptive Cofficients Least Mean Square : The basic premise of the LMS algorithm is the use of the instantaneous estimates of the gradient in the steepest descent algorithm
166 LMS Algorithm Implementation
167 Adaptive Coefficients LMS Types : 1- Variable Step Size Normalized LMS
168 Adaptive Coefficients 2- sign LMS (sign-sign, sign- data, sign- error) where w(n + 1) = w(n) + μu(n) sgn(e(n))
169 Questions and Discussion
170 PLL SYSTEM
171 Overview What is PLL? Block Diagram of PLL Targets and Specifications Simulations and results
172 What is PLL?
173 Block Diagram of PLL
174 Targets & Specs Targets: Eliminating Frequency & Phase errors Specifications Jitter Phase Margin K vco Icp 1ps 60 degrees 700MHz/V 150 ua
175 Block Diagram The transfer function of the system is given by: where,, and 1
176 Noise Performance in PLL
177 Simulations and Results PLL Parameters Parameter Value Reference Frequency MHz N 66 K vco BW Phase margin Peaking 700MHz/V 7MHz 60 degrees <2 db
178 Simulations and Results R =29.78KΩ
179 Simulations and Results C1 =0.22pF
180 Simulations and Results C2 =2.85pF
181 Simulations and Results Closed Loop Transfer Function
182 Simulations and Results Open Loop Transfer Function
183 Simulations and Results Closed Loop Transfer Function
184 Simulations and Results Open Loop Transfer Function
185 Simulations and Results Property C1 C2 R Value 0.22pF 2.85pF 29.78KΩ Icp 150µA Estimated rms Jitter* 47fs
186 Questions?
187 Phase and Frequency Detector (PFD)
188 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
189 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
190 Introduction
191 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
192 Design Issues Function of PFD
193 Design Issues Function of PFD
194 Design Issues Function of PFD
195 Design Issues Function of PFD
196 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
197 Non-Idealities of PFD Dead Zone
198 Non-Idealities of PFD Continuous Time Approximation PFD puts out a pulse width modulated signal and not a continuous current. Good approximation Minor errors in the calculation
199 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
200 Different Implemented Topologies Topology 1
201 Different Implemented Topologies Topology 1
202 Different Implemented Topologies Topology 1
203 Different Implemented Topologies Topology 1
204 Different Implemented Topologies Topology 2
205 Different Implemented Topologies Topology 2
206 Different Implemented Topologies Topology 2
207 Different Implemented Topologies Topology 3
208 Different Implemented Topologies Topology 3
209 Different Implemented Topologies Topology 3
210 Different Implemented Topologies Topology 4
211 Different Implemented Topologies Topology 4
212 Different Implemented Topologies Topology 4
213 Overview Introduction Design Issues Non-Idealities of PFD Dead Zone Continuous Time Approximation Different Implemented Topologies Conclusion
214 Conclusion Comparison between topologies Topology Criteria Number of transistors Power Consumed Detection Range Topology I Topology II Topology III μ w 38 2π DR 2π Topology IV μ w 44 2π DR 2π
215 Conclusion Comparison between topologies Topology Criteria Number of transistors Power Consumed Detection Range Topology I Topology II Topology III Topology IV μw 44 2π DR 2π
216 Questions?
217 Charge Pump
218 Overview Introduction Design Issues Different Topologies Phase Noise Corners Analysis
219 Introduction UP & DOWN currents
220 Introduction
221 Design Issues Current Mismatch V DS,SAT Channel Length (L)
222 Design Issues Charge Injection
223 Design Issues Charge Sharing
224 Design Issues Reference feed through The reference feed through causes an AC signal on the control voltage at reference frequency. Causes spurs in the output spectrum.
225 Topology 1
226 Topology 1 Compliance Curve 0.13v & 0.86v
227 Topology 1 IDS Vs VDS
228 Topology 1 Transient Analysis (UP)
229 Topology 1 Transient Analysis (DOWN)
230 Topology 2
231 Topology 2 Compliance Curve 0.12v & 0.85v
232 Topology 2 IDS Vs VDS
233 Topology 2 Transient Analysis (UP)
234 Topology 2 Transient Analysis (DOWN)
235 Topology 3
236 Topology 3 Unity Gain Buffer
237 Topology 3 Unity Gain Buffer
238 Topology 3 Transient Analysis (UP)
239 Topology 3 Transient Analysis (DOWN)
240 Topology Chosen Topology 2 was used because of: Reduced charge sharing Reduced charge injection Least power ( uw)
241 Phase Noise
242 Corners Analysis Compliance curve 0.2v & 0.75v Phase Noise (at 10M) -111dBc/Hz & -125 dbc/hz
243 Questions?
244 VOLTAGE Controlled oscillator (VCO)
245 Overview VCO basics Different Topologies LC VCO Why LC? -GM vs Colpitts -GM oscillator CMOS vs NMOS and PMOS Simulation and results
246 VCO Basics VCO is a feedback system. Positive feedback Barkhausen criterion
247 Different topologies LC VCO Ring VCO
248 Different topologies Passive Devices Ring Oscillator No Passive devices so it s easier to implement LC Oscillator Spiral inductors and varactors Area Smaller area Larger area Tuning Range Large tuning range Smaller tuning range Frequency High frequency Much higher frequencies Phase noise Poor phase noise performance Better phase noise performance Power Consumption Higher power consumption Lower power consumption
249 LC VCO Why LC? Since the required output jitter from the PLL is 1ps rms, we have chosen to work with the LC VCO in order to achieve the lowest possible phase noise from the oscillator.
250 -GM oscillator vs Colpitts -GM VCO Colpitts VCO
251 -GM oscillator
252 CMOS vs NMOS & PMOS NMOS PMOS
253 Current tail problem Noise report indicated 20% of noise is from current source. On removing current source Phase noise is improved significantly.
254 Performance with current source
255 Performance with current source
256 Without current source
257 Without current source
258 Comparison Without Current tail With Current tail Power 3.7mW 3.09mW consumption Kvco 800MHz/V 550MHz/V Phase noise at -112dBc/Hz dBc/Hz 1MHz Figure Of Merit 186.3dBc/Hz 180.3dBc/Hz Figure Of Merit =10log{(fo/Δf)²/L{Δf}.P}
259 Corners Results Across different corners, phase noise has not exceeded -110dBc/Hz Locking frequency is within the range of V
260 Layout Area = µm*282.7µm
261 Area and power NMOS 105µm / 360nm PMOS 105µm/300nm Capacitance range 1.23pF 1.5pF Inductance Width = 9µm R = 40µm Turn s = 1 L = pH Q Fact or = 20.6 Area width = 153µm Area length = 147.5µm
262 Questions?
263 Divider
264 Overview Introduction Proposed Divider Divide by 2 Divide by 3 Divide by 11 Simulations and Results
265 Introduction
266 Proposed System Output of the VCO is GHz Output of the divider MHz The division ratio is 66
267 Cont d Proposed Divider
268 Divide by 2
269 Divide by 3
270 Divide by 11
271 Divide by 11
272 Simulations and Results
273 Cont d Simulations and Results Phase noise Simulation
274 Cont d Simulations and Results Power consumption Power consumption Divide by 2 Divide by 6 The whole divider 1.38 mw 3.32 mw 5.7 mw
275 Questions?
276 Clock and data recovery (CDR)
277 Overview Basic CDR CDR architectures: Single loop Dual loop PI based CDR Proposed system: Advantages Challenges
278 Basic CDR Clock recovery Data retiming
279 CDR Architectures Single loop: Disadvantages: Noisy VCO requires large BW. Large BW results in passing input jitter to output. Harmonics Large lock times
280 Dual loop One loop generates the required freq. The other tracks the phase. Advantage: BW of the two loops are independent. Disadvantages: Frequency offset and VCO matching
281 PI based CDR
282 Proposed system
283 Clocking schemes
284 Questions?
285 Digital Block (DB)
286 Overview Introduction Operation of DB Simulation Result
287 Overview Introduction Operation of DB Simulation Result
288 Introduction Fast stream of data can t be implemented directly. Parallelism is used. Power is reduced.
289 Overview Introduction Operation of DB Simulation Result
290 Operation of DB
291 Operation of DB
292 Operation of DB
293 Operation of DB
294 Operation of DB
295 Operation of DB Shift Right Shift Left Action High Low Late state: shift the data stream to the right by decreasing the delay of the delay line. Low High Early state: shift the data stream to the left by increasing the delay of the delay line. High High High impedance state: no action
296 Overview Introduction Operation of DB Simulation Result
297 Simulation Results
298 Questions?
299 Phase interpolator
300 Phase interpolator
301 Block Diagram
302 Divider
303 Divider
304 Divider The divider has two advantages for the next stages: It automatically produces in-phase and quadraturephase. It produces differential clock, so I practically have 4 phases I, Ibar, Q and Qbar.
305 Multiplexers Two 2-1 multiplexers, one for I-phase and one for Q-phase. CML multiplexers are used.
306 Selecting the quadrant Gray coded selecors. Quadrant S1 S0 1 st 00 2 nd 01 3 rd 11 4 th 10
307 Output waveform
308 Core phase Interpolator
309 Degeneration capacitance Degeneration capacitance at the input. Advantages: Eliminate the sharp edges to allow proper interpolation. Decrease the swing to drive the interpolator to a linear region.
310 Interpolation waveform
311 Simulation and results Typical corner
312 Simulation and results Ff-0deg-1.1V
313 Simulation and results Ss-125deg-0.9V
314 CML to CMOS
315 CML to CMOS
316 CML to CMOS
317 Power Consumption Stage Divider Mux Core PI CML to CMOS Total Power consumption 0.93mW 0.75mW 0.18mW 1.60mW 3.46mW
318 Questions?
319 Thank you!!!
320 Backup slides
321 Area and power (MUX) Device/Property Diff pair Select switches Current mirror Resistance Power consumption Value 2.4µm/60nm 1.2µm/60nm 29µm/240nm 1.25kΩ 0.75mW
322 Power and area (DIVIDER) Device/Property M1 M2 Value 800n/60n M3 M4 1u/60n M5 M6 1u/60n M7 M8 600n/60n Power consumption 0.93mW
323 Power (Core PI ) Device/property Diff pair Switch transistors Current sources Power consumption Value 7µm/60nm 200nm/60nm 8 µm/360nm 0.179mW
324 Questions?
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