GHz Upconverter/Amplifier. Technical Data HPMX 2006 YYWW HPMX 2006 YYWW HPMX-2006

Transcription

1 GHz Upconverter/Amplifier Technical Data HPMX-26 Features Wide Band Operation RF Output: 8-25 MHz IF Input: DC- 9 MHz V Operation Mixer + Amplifier: 38 ma Mixer only: 15 ma Standby Mode: <4 µa Differential LO and High Impedance IF Inputs -8.5 dbm Mixer and +4.5 dbm Amplifier Output Power at 19 MHz (P 1dB ) JEDEC Standard SSOP-16 Surface Mount Package Package Pin Configuration Amp Ve1 6 Amp RF in 7 enable 8 Plastic SSOP-16 HPMX 26 YYWW HPMX 26 YYWW 16 Mixer Vc 15 Gnd 14 Amp Vc 13 Amp RF Out 12 Amp Ve2 11 Amp 1 Ve2 1 Gnd 1 9 Mixer RF Out Description The HPMX-26 upconverter/ amplifier IC is designed to meet the needs of cellular and PCS telephone and wireless LAN applications. Applications Cordless Handsets and Base Stations Wireless Data Terminals Cellular/PCS Handsets and Base Stations Functional Block Diagram LO INPUT IF INPUT RF OUTPUT ENABLE AMP INPUT HPMX-26 AMP OUTPUT The IC consists of a Gilbert Cell mixer optimized for upconversion followed by a post-amplifier. The mixer and amplifier are independent allowing the insertion of a sideband filter between the two. The mixer is double balanced. Both LO and puts may be run either single-endedly, or in differential mode to reduce LO leakage. puts are matched near 5 Ω; high impedance IF inputs allow the mixer to be used as a BPSK modulator. An integrated transformer on the mixer RF port creates a single-ended, matched to 5 Ω output at 19 MHz, and also reduces common mode noise.

2 2 The amplifier features a singleended 5 Ω match on the input port. The open collector output is easily matched with a simple 2 element network, providing flexible use and good power added efficiency. The amplifier can be disabled to allow use of the mixer alone, reducing the current draw to around 15 ma. The entire IC can be put into a standby mode reducing current consumption to under 4 µa from a 3V source. The SSOP-16 package insures that the IC occupies a minimal amount of printed circuit board space. The HPMX-26 is manufactured using Hewlett-Packard s 3 GHz ISOSAT-II process which combines stepper lithography, self alignment, ion implantation techniques and gold metalization to produce state-of-the-art RFICs. HPMX-26 Absolute Maximum Ratings [1] Mixer Amplifier Symbol Parameter Units Min. Max. Min. Max. V CC Supply Voltage V P diss Power Dissipation [2,3] mw Single-Ended Input Mixer LO Voltage V V C +.2 Single-Ended Input Mixer IF Voltage V V C +.2 Amplifier Input RF Power dbm +5 T j Junction Temperature C T STG Storage Temperature C Notes: 1. Operation of this device in excess of any of these parameters may cause permanent damage. 2. T CASE = 25 C 3. Derate at 7 mw/ C for T CASE >82 C. Recommended operating range of V cc = 2.7 to 4. V, T a = -4 to + 85 C HPMX-26 Guaranteed Electrical Specifications Standard test conditions apply unless otherwise noted. Thermal Resistance [2] : θ jc = 15 C/W Standard Test Conditions Unless otherwise stated, all test data was taken on packaged parts under the following conditions: V cc = +3. VDC, Z out = 5 Ω, ambient temperature T a = 25 C put: 175 MHz, -3 dbm, single-ended put: 15 MHz, 3 mv p-p, single-ended, terminated in a 5 Ω pull-up resistor (R1R2 in Figure 11) Z out mixer = Z in amp = 5 Ω, Z out amp per Figure 11 ( (L=2.8 nh, C=2.2 pf) See Figure 11 for test set-up schematic diagram. Symbol Parameters and Test Conditions Units Min. Typ. Max. I C mix Sleep Mode Current, Mixer µa 2 I C amp Sleep Mode Current, Amplifier µa 2 I C mix Mixer Transmit Current ma I C amp Amplifier Transmit Current ma P out SSB Output Power, Mixer Only dbm P out Output Power, Amplifier Only (-9.5 dbm in) dbm

3 3 HPMX-26 Summary Characterization Information Standard test conditions apply unless otherwise noted. Table 2 applies for 9 and 25 MHz. IF remains 15 MHz for all frequencies. Performance vs. Frequency 9 MHz 19 MHz 25 MHz Units Mixer RF Output Power, Vif = 3 mvpp dbm Mixer RF Output Power, V if = 3 mv pp dbm Mixer RF Output Power at 1 db Gain Compression dbm Mixer Output Third Order Intercept Point dbm Mixer LO Suppression dbc Mixer Phase Noise (4 MHz offset) dbm/hz Amplifier RF Output Power at Pin = -9.5 dbm dbm Amplifier RF Output Power at 1 db Gain Compression dbm Amplifier Output Third Order Intercept Point dbm Small Signal Amplifier Gain db Amplifier Noise Figure db Amplifier Input Return Loss db Amplifier Output Return Loss db Isolation, Mixer Output to Amplifier Input db HPMX-26 Pin Description Table No. Mnemonic Description Typical Signal Notes 1 LO differential mixer LO -3 dbm from single-ended, LO identical to LObar. 2 LObar input 5 Ω source DC present (needs Cbl). 3 internal voltage reference Supplies base bias for AC-coupled IF. 4 IF differential mixer IF -6 dbm from single-ended, IF identical to IFbar. 5 IFbar input 5 Ω source Must bias per Table 4. 6 AmpVe1 ground V or unconnected Disconnect for mixer only 7 AmpRFin amplifier input -9.5 dbm from 5 Ω source DC present (needs Cbl) 8 Enable chip (amp and mixer) <.4V disables enable input >2.5V enables IC 9 MxRFout mixer RF output -9. dbm into 5 Ω load At DC ground 1 1 ground V 11 Amp1Ve2 ground V or unconnected Disconnect for mixer only 12 AmpVe2 ground V or unconnected Disconnect for mixer only 13 AmpRFout amplifier output +3 dbm into 5 Ω load DC present (needs Cbl). RF match required. 14 AmpVc amplifier Vcc input 3 V, 23 ma 15 ground V 16 MxVc mixer Vcc input 3 V, 15 ma

4 4 HPMX-26 Typical Performance Standard test conditions apply unless otherwise noted. CURRENT (ma) T A = +85 C T A = +5 C T A = +25 C T A = + C T A = 4 C VOLTAGE (V) Figure 1. Amplifier Device Current vs. Device Voltage over Temperature. CURRENT (ma) T A = +85 C T A = +5 C 5 T A = +25 C T A = + C T A = 4 C VOLTAGE (V) Figure 2. Mixer Device Current vs. Device Voltage over Temperature Gss P 1dB Pin = -9.5 dbm TEMPERATURE ( C) Figure 3. Amp. Output at P in = 9.5 dbm and at 1 db Compression and Small Signal Gain vs. Temperature GAIN (db) FREQUENCY (MHz) Figure 4. Mixer Output at V if = 3 mv pp and 3 mv pp, at P 1dB, and LO Suppression at V if = 3 mv pp vs. IF Frequency. P 1dB 3 mv 3 mv LO lkg mv P 1dB 3 mv -35 LO lkg LO Figure 5. Mixer Output at V if = 3 mv pp and 3 mv pp, at P 1dB, and LO Suppression at V if = 3 mv pp vs. LO Power mv P 1dB 3 mv LO lkg TEMPERATURE ( C) Figure 6. Mixer Output at V if = 3 mv pp and 3 mv pp, at P 1dB, and LO Suppression at V if = 3 mv pp vs. Temperature FREQUENCY (MHz) Figure 7. Mixer Output Spectrum for 1 GHz Bandwidth, Centered at 19 MHz. Table 1. Typical Output Spurs for 6 GHz, Standard Test Conditions < <-8 <-8 1 <-8 <-8 < <-6 <-6 2 <-8 <-6 <-6 <-6 <-6 < <-6 <-6 <-6 <-6 <-6 <-6 3 <-6 < <-6 <-6 < <-6 < <-6 <-6 4 < <-6

5 5 HPMX-26 Mixer Port Impedances GHz Mag. Deg Figure 8. Impedance of Mixer IF Port. Circuit of Figure 11 with 1K Pull up Resistors for the IFs and LO and RF Ports Terminated in 5 Ω. GHz Mag. Deg..5 [1] [2] Figure 9. Impedance of Mixer LO Port. [1] Circuit of Figure 11 with IF and RF Ports Terminated in 5 Ω. [2] As above but LO RC combination in Figure 11 changed from 12 Ω and 12 pf to Ω and 2.7 pf (recommended use for >1.75 GHz). GHz Mag. Deg Figure 1. Impedance of Mixer RF Port. Circuit of Figure 11 with IF and LO Ports Terminated in 5 Ω. Typical Scattering Parameters, Common Emitter, Z O = 5 Ω, V CC =3 V, I C = 23 ma Freq. S 11 S 21 S 12 S 22 GHz Mag. Ang. db Mag. Ang. db Mag. Ang. Mag. Ang

6 6 HPMX-26 Test Circuit off board Cbl (>1 pf) mixer put C1 R3 1 pf off board Cbl (>1 pf) 5 Ω IF source 1 pf 5 12 pf 12 5 off board Cbl (>1 pf) 5 Amp1 Ve1 Mixer Vc Amp Vc Amp RF out Amp Ve2 Amp1 Ve2 3V.1 µf 22 pf 2.2 pf Amp RF output printed 3V 1 pf amp RF input off board Cbl (>1 pf) standby input Amp RF in enable Mixer RF out Mixer RF output (at DC ground) Figure 11. Test Board Configuration. HPMX-26 Circuit Use mixer put 1 pf IF source (Rs = Rterm) 1 pf Rterm standby input Cbl (>1 pf) C1 R3 R2 C15 R1 Amp1 Ve1 Amp RF in enable Mixer Vc Amp Vc Amp RF out Amp Ve2 Amp1 Ve2 Mixer RF out Vcc.1 µf 22 pf C8 Amp RF output L2 Vcc C12(1 pf) C14 L3 Sideband Filter Figure 12. Schematic Diagram of Typical IC Use. Table 2 lists values for components that change depending on frequency of operation and AC or DC coupling of the put. For 2.5 GHz operation, a pre-amplifier may be inserted between the Mixer output and the Amp RF in. Table 2. Values for Variable Components (see next page for details). Component Function Value Condition Value Condition Notes C1, R3 LO AC coupling 12 pf + 12 Ω F LO < 1.75 GHz 2.7 pf + Ω F LO > 1.75 GHz de-q with R = 12 Ω for broadband operation < 1.75 GHz IF AC coupling 1 pf typ AC coupled short ckt DC coupled see also R1,R2 R1,R2 biases IF bases 5 Ω typ AC coupled open ckt DC coupled also sets load for optimum IF [1] C8, L2 amp out match see Table 3 for values vs. frequency L2 set by position of C12 L3, C14 mixer output match not used 19 MHz operation 27 nh 9 MHz operation 9 MHz operation only 1.3 pf [2] C15 amp input match not used 19 MHz operation 3.3 pf [2] 9 MHz operation 9 MHz operation only Notes: 1. Noise Optimum at R1, R2 = 15 Ω 2. Optional

7 7 mixer put Cbl C1 R3 1 pf 1 pf R1 Rterm R2 mixer put Amp1 Ve1 Amp RF in standby input enable Mixer Vc Amp Vc Amp RF out Amp Ve2 Amp1 Ve2 Mixer RF out Vcc.1 µf 22 pf mixer RF output L3 C15 standby input Amp1 Ve1 Amp RF in enable Sideband Filter Amp RF out Amp Ve2 Amp1 Ve2 Mixer RF out C14 L3 C8 Amp L2 RF output Vcc C12 (1 pf) Frequency, MHz L2, nh C8, pf Figure 13. Mixer Only Use (AC Coupled Single-ended Use Shown). er to Table 2 for Component Values. single-ended mixer put Cbl (>1 pf) C1 R3 Figure 15. LO Connections for Singleended Operation. 1 pf 1 pf Rterm single-ended mixer put, AC coupled R2 R1 Figure 17. IF Connections for AC Coupled Single-ended Use. Figure MHz Use. er to Table 2 for Component Values. differential mixer put Cbl (>1 pf) Cbl (>1 pf) Figure 16. LO Connections for Balanced Operation. balanced mixer put, AC coupled 1 pf 1 pf R2 R1 Figure 18. IF Connections for AC Coupled Balanced Use. Table 3. Amp Output Match Component Values vs. Frequency. 1. and LO bar in are identical; either can be used as the single-ended LO input with the other AC grounded. 2. R3 lowers the Q of the blocking capacitor to remove possible resonances for broadband operation below 1.75 GHz. 1. The IF pins require a bias voltage to operate properly (see Table 4). When the IF is AC coupled, this voltage is supplied from the pin via R1 and R2. When the IF is DC coupled, the voltage is externally generated and the pin is not used. 2. The base current is small, so to 1st order the value of R1, R2 can be selected to set the IF load impedance (5-2 ohm typ.) 3. and IF bar in are identical; either can be used as as the single-ended IF input with the other AC grounded. 4. R term (optional) should be the same value as the IF source impedance. It improves LO rejection by balancing the IF port and also de-q s. balanced mixer put, DC coupled. DC level of IF source must be at V base (Table 4). V base Vcc, V Vbase, V For DC coupled operation, the put must also supply V base to both and bar, per the values in Table 4. pin is not used. Figure 19. IF Connections for DC Coupled Use. Table 4. V base vs. V cc. V base is the required bias at the IF ports.

8 Part Number Ordering Information Part Number No. of Devices Container HPMX-26-TR1 1 Tape and Reel HPMX-26-BLK 25 Tape Package Dimensions JEDEC Standard SSOP-16 Package (.175) REF. HPMX 26 YYWW E1 E SYMBOL A A1 b C D E e E1 h L θ DIMENSIONS MIN. MAX (.54) (.62).127 (.5).254 (.1).23 (.8).35 (.12).178 (.7).254 (.1) 4.81 (.189) 5.4 (.197) (.231) (.241).635 BSC (.25) (.151).35 (.12).533 (.21) (.157).457 (.18).787 (.31) 8 e TYP. D h x 45 A b TYP. A1 L C DIMENSIONS IN MILLIMETERS AND (INCHES). For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: or Far East/Australasia: Call your local HP sales office. Japan: (81 3) Europe: Call your local HP sales office. Data subject to change. Copyright 1998 Hewlett-Packard Co. Obsoletes E Printed in U.S.A E (4/98)