MAX2720/MAX2721. PART MAX2720EUP MAX2721EUP *Exposed paddle. -40 C to +85 C 20 TSSOP-EP* 20 TSSOP-EP* -40 C to +85 C MAX2720/MAX2721

Transcription

1 19-166; Rev ; 1/ µ µ PART EUP EUP *Exposed paddle. GND DROUT SHDN GND I- I+ GND BIAS TEMP. RANGE -4 C to +85 C -4 C to +85 C PA DRIVER VGA LO PHASE SHIFTER Σ 9 LO DOUBLER x2 PIN-PACKAGE TSSOP-EP* TSSOP-EP* DRIN 19 GND 18 PC 17 MODOUT Q- ENX2 13 Q LO Maxim Integrated Products 1

2 ABSOLUTE MAXIMUM RATINGS to GND...-.3V to +6V ENX2, SHDN, PC, I+, I-, Q+, Q-, LO, DRIN to GND...-.3V to ( +.3V) ENX2, SHDN Continuous Current...±mA PC Continuous Current...±mA I+ to I-, Q+ to Q-...±2V MODOUT, DROUT to GND Short-Circuit Duration...s Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Continuous Power Dissipation (T A = +7 C) -Pin TSSOP-EP (derate 21.7mW/ C above +7 C) W Operating Temperature Range...-4 C to +85 C Junction Temperature C Storage Temperature Range C to +15 C Lead Temperature (soldering s) C SHDN ENX2 PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage Supply Current Supply Current with PA Driver Disabled Shutdown Supply Current, DRIN = GND, DRIN = GND SHDN = GND Logic Input High Voltage 2. Logic Input Low Voltage Logic Input Bias Current PC Input Bias Current.5V < V PC < 2.5V.5V < V PC < 2.5V, SHDN = GND V ma ma µa V V µa µa AC ELECTRICAL CHARACTERISTICS SHDN ENX2 Ω Ω PARAMETER I/Q BASEBAND INPUTS I/Q Input -1dB Bandwidth (Note 2) I/Q Input -3dB Bandwidth (Note 2) I/Q Differential Input Level I/Q Gain Imbalance I/Q Phase Imbalance I/Q Input Resistance I/Q Input Resistance Mismatch I/Q Input Capacitance Group Delay Ripple Group Delay Mismatch CONDITIONS f I = f Q < BW -3dB,.5V < V PC < 2.5V f I = f Q < BW -3dB,.5V < V PC < 2.5V f I = f Q < BW -1dB f I = f Q < BW -1dB f I = f Q < BW -1dB khz < f I+ = f Q+ < 2MHz khz < f I = f Q < 2MHz MIN TYP MAX ±.2 ± UNITS MHz MHz mvp-p db degrees kω Ω pf ns ns 2

3 AC ELECTRICAL CHARACTERISTICS (continued) SHDN ENX2 Ω Ω PARAMETER CONDITIONS MIN TYP MAX UNITS MODULATOR OUTPUT Frequency Range (Note 3) MHz Output Power, High, V PC = 2.5V, ENX2 = or GND, (Note 3) Output Power Variation Over V PC = 2.5V, ±1. ±1.8 Temperature T A = -4 C to +85 C ±.8 ±1.5 Power Control Range V PC =.5V, ENX2 = or GND PC Slope Slope between V PC = 1V and V PC = 2V Output 1dB Compression Point V PC = 2.5V Output Third-Order Intercept Point V PC = 2.5V (Note 4) Output VSWR Out-of-Band Noise Density Carrier Suppression Sideband Suppression MODOUT to LO Input Isolation Power-Supply Ripple Rejection (Note 5) LO Input VSWR, V PC = 2.5V, ENX2 = or GND, (Note 3).5V < V PC < 2.5V V PC = 2.5V, I/Q terminated in 5Ω,.5V < V PC < 2.5V V PC = 2.5V V PC =.5V.5V < V PC < 2.5V = +3.V + mvp-p at khz/3khz LO BUFFER, LO FREQUENCY DOUBLER, QUADRATURE GENERATOR LO Frequency Range (Note 3) LO Input Power (Note 3) ENX2 = GND ENX2 = ENX2 = GND ENX2 = ENX2 = GND ENX2 = ENX2 = GND ENX2 = : :1 1.8:1 1.6: :1 dbm db db db/v dbm dbm dbm/hz dbc dbc db dbc MHz dbm 3

4 AC ELECTRICAL CHARACTERISTICS (continued) SHDN ENX2 Ω Ω PA DRIVER PARAMETER Frequency Range (Note 6) Gain (Note 6) Gain Variation Over Temperature Noise Figure Output 1dB Compression Point Output Third-Order Intercept Point Reverse Isolation DROUT to LO Input Isolation Input VSWR Output VSWR T A = -4 C to +85 C (Note 7) (Note 8) CONDITIONS MIN TYP MAX ±.4 ±.8 ±.3 ± :1 1.5:1 UNITS MHz db db db dbm dbm db db Note 1: Min/max limits are guaranteed by design and characterization and are not production tested. Note 2: I/Q input bandwith is determined by the baseband source impedance and the I/Q input capacitance. The bandwith can be increased by lowering the baseband source impedance. Note 3: MODOUT output power specifications are met over this frequency range for V PC = 2.5V and. Note 4 IP3 measured with two tones, f 1 = 5kHz and f 2 = 6kHz, at mvp-p each. Note 5: Measured relative to desired upconverted signal level. Note 6 DROUT gain specifications are met over this frequency range at. Note 7: IP3 measured with two tones, f 1 = 19MHz and f 2 = 191MHz, at -18dBm each. Note 8: IP3 measured with two tones, f 1 = 2315MHz and f 2 = 2316MHz, at -18dBm each. 4

5 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) SUPPLY CURRENT (ma) SUPPLY CURRENT vs. SUPPLY VOLTAGE WITH PA DRIVER ENABLED ENX2 = GND T A = -4 C ENX2 = SUPPLY VOLTAGE (V) /21toc1 SUPPLY CURRENT (ma) SUPPLY CURRENT vs. SUPPLY VOLTAGE WITH PA DRIVER DISABLED DRIN = GND ENX2 = GND ENX2 = T A = -4 C SUPPLY VOLTAGE (V) /21toc vs. RF FREQUENCY V PC = 2.5V V PC = 1.5V V PC =.5V T A = -4 C RF FREQUENCY (MHz) /21toc4 AND CARRIER AND SIDEBAND SUPPRESSION (dbc) MODULATOR PERFORMANCE vs. LO POWER (ENX2 = GND) OUTPUT POWER CARRIER SUPPRESSION SIDEBAND SUPPRESSION LO POWER (dbm) /21toc5 AND CARRIER AND SIDEBAND SUPPRESSION (dbc) MODULATOR PERFORMANCE vs. LO POWER (ENX2 = ) OUTPUT POWER CARRIER SUPPRESSION SIDEBAND SUPPRESSION LO POWER (dbm) /21toc6 5

6 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. PC VOLTAGE (ENX2 = GND) GHz 1.7GHz 2.1GHz /21toc7 CARRIER SUPPRESSION (dbc) MODULATOR CARRIER SUPPRESSION vs. PC VOLTAGE (ENX2 = GND) 1.7GHz 2.1GHz 1.9GHz /21toc8 SIDEBAND SUPPRESSION (dbc) MODULATION SIDEBAND SUPPRESSION vs. PC VOLTAGE (ENX2 = GND) 1.7GHz 1.9GHz 2.1GHz /21toc vs. PC VOLTAGE (ENX2 = ) 1.7GHz 1.9GHz 2.1GHz /21toc CARRIER SUPPRESSION (dbc) MODULATOR CARRIER SUPPRESSION vs. PC VOLTAGE (ENX2 = ) 1.7GHz 1.9GHz 2.1GHz /21toc11 SIDEBAND SUPPRESSION (dbc) MODULATOR SIDEBAND SUPPRESSION vs. PC VOLTAGE (ENX2 = ) 2.1GHz 1.9GHz 1.7GHz /21toc

7 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. PC VOLTAGE (ENX2 = GND) T A = -4 C /21toc13 CARRIER SUPPRESSION (dbc) MODULATOR CARRIER SUPPRESSION vs. PC VOLTAGE (ENX2 = GND) T A = -4 C /21toc14 SIDEBAND SUPPRESSION (dbc) MODULATOR SIDEBAND SUPPRESSION vs. PC VOLTAGE (ENX2 = GND) T A = -4 C /21toc vs. PC VOLTAGE (ENX2 = ) T A = -4 C /21toc16 CARRIER SUPRESSION (dbc) MODULATOR CARRIER SUPPRESSION vs. PC VOLTAGE (ENX2 = ) T A = -4 C /21toc17 SIDEBAND SUPRESSION (dbc) MODULATOR SIDEBAND SUPPRESSION vs. PC VOLTAGE (ENX2 = ) T A = -4 C /21toc18 7

8 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. INPUT LEVEL (T A = -4 C) V PC = 2.5V V PC = 2.V V PC = 1.5V V PC = 1.V V PC =.5V toc vs. INPUT LEVEL () V PC = 2.5V V PC = 2.V V PC = 1.5V V PC = 1.V V PC =.5V toc vs. INPUT LEVEL () V PC = 2.5V V PC = 2.V V PC = 1.5V V PC = 1.V V PC =.5V toc21-6, INPUT LEVEL (mvp-p) -6, INPUT LEVEL (mvp-p) -6, INPUT LEVEL (mvp-p) OUTPUT IP3 (dbm) MODULATOR OUTPUT IP3 vs. PC VOLTAGE T A = -4 C /21toc22 VSWR LO PORT VSWR vs. LO FREQUENCY (ENX2 = GND) FREQUENCY (MHz) -24 VSWR LO PORT VSWR vs. LO FREQUENCY (ENX2 = ) FREQUENCY (MHz) 8

9 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) GAIN (db) T A = -4 C PA DRIVER GAIN vs. SUPPLY VOLTAGE SUPPLY VOLTAGE (V) /21toc27 OUTPUT IP3 (dbm) PA DRIVER OUTPUT IP3 vs. SUPPLY VOLTAGE T A = -4 C SUPPLY VOLTAGE (V) /21toc28 OUTPUT P1dB (dbm) PA DRIVER OUTPUT P1dB vs. SUPPLY VOLTAGE T A = -4 C SUPPLY VOLTAGE (V) /21toc29 GAIN (db) T A = -4 C PA DRIVER GAIN vs. RF FREQUENCY RF FREQUENCY (MHz) /21toc3 OUTPUT IP3 (dbm) PA DRIVER OUTPUT IP3 vs. FREQUENCY T A = -4 C FREQUENCY (MHz) /21toc31 OUTPUT P1dB (dbm) PA DRIVER OUTPUT P1dB COMPRESSION POINT vs. FREQUENCY T A = -4 C FREQUENCY (MHz) /21toc32 9

10 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) NOISE FIGURE (db) PA DRIVER NOISE FIGURE vs. FREQUENCY.5 T A = -4 C FREQUENCY (MHz) /21toc PA DRIVER OUTPUT POWER vs. INPUT POWER T A = -4 C INPUT POWER (dbm) /21toc34

11 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) SUPPLY CURRENT (ma) SUPPLY CURRENT vs. SUPPLY VOLTAGE WITH PA DRIVER ENABLED SUPPLY VOLTAGE (V) /21toc35 SUPPLY CURRENT (ma) T A = -4 C 5 4 ENX2 = GND 3 ENX2 = 6 SUPPLY CURRENT vs. SUPPLY VOLTAGE WITH PA DRIVER DISABLED DRIN = GND ENX2 = GND ENX2 = SUPPLY VOLTAGE (V) T A = -4 C /21toc vs. RF FREQUENCY V PC = 2.5V T A = -4 C V PC = 1.5V V PC =.5V RF FREQUENCY (MHz) toc38 AND CARRIER AND SIDEBAND SUPPRESSION (dbc) MODULATOR PERFORMANCE vs. LO POWER (ENX2 = GND) OUTPUT POWER SIDEBAND SUPPRESSION CARRIER SUPPRESSION RF FREQUENCY (MHz) /21toc39 AND CARRIER AND SIDEBAND SUPPRESSION (dbc) MODULATOR PERFORMANCE vs. LO POWER (ENX2 = ) OUTPUT POWER SIDEBAND SUPPRESSION CARRIER SUPPRESSION LO POWER (dbm) /21toc4 11

12 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. PC VOLTAGE (ENX2 = GND) GHz 2.3GHz 2.5GHz /21toc41 CARRIER SUPPRESSION (dbm) CARRIER SUPPRESSION vs. PC VOLTAGE (ENX2 = GND) 2.3GHz 2.5GHz GHz /21toc42 SIDEBAND SUPRESSION (dbc) SIDEBAND SUPRESSION vs. PC VOLTAGE (ENX2 = GND) 2.1GHz 2.3GHz 2.5GHz TOC vs. PC VOLTAGE (ENX2 = ) 2.1GHz 2.3GHz 2.5GHz TOC44 CARRIER SUPRESSION (dbc) MODULATOR CARRIER SUPRESSION vs. PC VOLTAGE (ENX2 = ) 2.1GHz 2.3GHz 2.5GHz TOC45 SIDEBAND SUPRESSION (dbc) MODULATOR SIDEBAND SUPRESSION vs. PC VOLTAGE (ENX2 = ) 2.3GHz 2.1GHz 2.5GHz TOC46 12

13 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. PC VOLTAGE (ENX2 = GND) T A = -4 C TOC47 CARRIER SUPRESSION (dbc) MODULATOR CARRIER SUPRESSION vs. PC VOLTAGE (ENX2 = GND) T A = -4 C TOC48 SIDEBAND SUPRESSION (dbc) MODULATOR SIDEBAND SUPRESSION vs. PC VOLTAGE (ENX2 = GND) T A = -4 C TOC vs. PC VOLTAGE (ENX2 = ) T A = -4 C TOC45 CARRIER SUPPRESSION (dbc) MODULATOR CARRIER SUPRESSION vs. PC VOLTAGE (ENX2) = T A = -4 C TOC51 SIDEBAND SUPPRESSION (dbc) MODULATOR SIDEBAND SUPPRESSION vs. PC VOLTAGE (ENX2 = ) T A = -4 C TOC52 13

14 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) vs. INPUT LEVEL (T A = -4 C) V PC = 2.5V V PC = 2.V V PC = 1.5V, INPUT LEVEL (mvp-p) V PC = 1.V V PC =.5V TOC vs. INPUT LEVEL () V PC = 2.5V V PC = 2.V V PC = 1.5V V PC = 1.V V PC =.5V, INPUT LEVEL (mvp-p) TOC vs. INPUT LEVEL () V PC = 2.5V V PC = 2.V V PC = 1.5V V PC = 1.V V PC =.5V, INPUT LEVEL (mvp-p) TOC55 OUTPUT IP3 (dbm) MODULATOR OUTPUT IP3 vs. PC VOLTAGE T A = -4 C INPUT LEVEL (mvp-p) TOC56 OUTPUT P1dB (dbm) MODULATOR OUTPUT P1dB COMPRESSION POINT vs. PC VOLTAGE T A = -4 C /21toc57 VSWR LO PORT VSWR vs. LO FREQUENCY (ENX2 = ) FREQUENCY (MHz) toc58 14

15 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) VSWR LO PORT VSWR vs. FREQUENCY (ENX2 = GND) FREQUENCY (MHz) toc GAIN (db) PA DRIVER GAIN vs. SUPPLY VOLTAGE T A = -4 C SUPPLY VOLTAGE (V) TOC61 OUTPUT IP3 (dbm) PA DRIVER OUTPUT IP3 vs. SUPPLY VOLTAGE T A = -4 C SUPPLY VOLTAGE (V) /21toc62 OUTPUT P1dB (dbm) PA DRIVER OUTPUT P1dB vs. SUPPLY VOLTAGE /21toc63 GAIN (db) T A = -4 C PA DRIVER GAIN vs. RF FREQUENCY /21toc64 OUTPUT IP3 (dbm) PA DRIVER OUTPUT IP3 vs. FREQUENCY T A = -4 C /21toc T A = -4 C SUPPLY VOLTAGE (V) RF FREQUENCY (MHz) FREQUENCY (MHz) 15

16 ( EV Kit, = +3.V, SHDN =, ENX2 = GND, V PC = 2.5V, input I/Q signals driven in quadrature, from a 1kΩ source impedance, single-ended, f I+ = f Q+ = 5kHz, V I+ = V Q+ = mvp-p, P LO = -13dBm, f LO = 95MHz (), f LO = MHz (), P DRIN = -12dBm, f DRIN = 19MHz (), f DRIN = 2315MHz (), MODOUT and DROUT ports are matched to a 5Ω load,, unless otherwise noted.) (Note 1) OUTPUT P1dB (dbm) PA DRIVER OUTPUT P1dB vs. FREQUENCY T A = -4 C FREQUENCY (MHz) /21toc66 NOISE FIGURE (db) PA DRIVER NOISE FIGURE vs. FREQUENCY T A = -4 C FREQUENCY (MHz) /21toc PA DRIVER OUTPUT POWER vs. INPUT POWER T A = -4 C /21toc INPUT POWER (dbm) 16

17 1, 5,, 19, EP GND 2 DROUT 3 SHDN 4, 6, 9, 12, 15 7, 8 I-, I+ 11 LO 13, 14 Q+, Q- 16 ENX2 17 MODOUT 18 PC DRIN µ 17

18 ENX2 ENX2 FREQUENCY (MHz) S22 MAG S22 PHASE (degrees) FREQUENCY (MHz) S22 MAG S22 PHASE (degrees)

19 ENX2 LOGIC LEVEL Low High SHDN µ LO INPUT FREQUENCY RANGE (MHz) 85 to 5 5 to to to 25 ENX2 SHDN 19

20 FREQUENCY (MHz) S11 MAG S11 PHASE S21 MAG S21 PHASE S12 MAG S21 PHASE S22 MAG S22 PHASE

21 PA DRIVER OUTPUT SHUTDOWN CONTROL 2.pF k pf 3.9nH 47pF 47pF 8pF (5pF*) GND DROUT SHDN GND DRIN GND PC MODOUT ENX pF pf pf k k PA DRIVER INPUT VGA POWER CONTROL 47pF 1.5nH (1.2nH*) LO DOUBLER ENABLE nh (3.3nH*) 1.pF (27pF*) 47pF MODOUT OUTPUT.1µF 7 I- Q- 14.1µF I MODULATION.1µF 8 I+ Q+ 13.1µF Q MODULATION 47pF pF GND LO 11 LO INPUT 47pF *COMPONENT VALUE FOR NLY. 21

22 TOP VIEW GND DROUT SHDN GND I- I GND TSSOP-EP DRIN 19 GND 18 PC 17 MODOUT 16 ENX Q- 13 Q LO TRANSISTOR COUNT: 41 22

23 TSSOP,NO PADS.EPS 23

24 NOTES 24 Maxim Integrated Products, 1 San Gabriel Drive, Sunnyvale, CA Maxim Integrated Products is a registered trademark of Maxim Integrated Products.