MAX2687 MAX2689 MAX2694. MAX2687 MAX2694 L1 = 4.7nH C1 = 100nF C2 = 10pF. MAX2689 L1 = 5.8nH C1 = 100nF C2 = 10pF

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1 EVALUATION KIT AVAILABLE MAX27/MAX29/MAX29 General Description The MAX27/MAX29/MAX29 low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim s advanced SiGe process, the devices achieve high gain and low noise figure while maximizing the input-referred 1dB compression point and the 3rd-order intercept point. The MAX27/ MAX29/MAX29 provide high gains of 12dB, 1dB, and 1dB, respectively. Each is optimized for high linearity. The devices operate from a +1.V to +3.V single supply. The optional shutdown feature in the devices reduces the supply current to less than 1FA. The devices are available in a very small, lead-free, RoHS-compliant,.mm x.mm x.mm wafer-level package (WLP). Applications Telematics (Asset Tracking and Management) Personal Navigation Devices (PNDs) Cellular Phones with GPS Notebook PCs/Ultra-Mobile PCs Recreational, Marine Navigation Avionics Watches Digital Cameras S High Power Gain: 17.dB (MAX27) S Low Noise Figure:.dB (MAX27) S Integrated Ω Output Matching Circuit S Low Supply Current:.mA (MAX29) S Wide Supply Voltage Range: 1.V to 3.V S Low Bill of Materials: One Inductor, Two Capacitors S Small Footprint:.mm x.mm S.mm-Pitch Wafer-Level Package (WLP) Ordering Information appears at end of data sheet. Features Typical Application Circuit V CC C2 V CC A1 A2 RFOUT RF OUTPUT RF INPUT C1 L1 RFIN B1 MAX27 MAX29 MAX29 B2 R1 2kI SHDN OPTIONAL SHUTDOWN GND MAX27 MAX29 L1 =.7nH C1 = 1nF C2 = 1pF MAX29 L1 =.nh C1 = 1nF C2 = 1pF For pricing, delivery, and ordering information, please contact Maxim Direct at , or visit Maxim s website at 19-; Rev 2; 1/13

2 ABSOLUTE MAXIMUM RATINGS V CC to GND...-.3V to +3.V Other Pins to GND...-.3V to (+ Operating V CC +.3V) Maximum RF Input Power... +dbm Continuous Power Dissipation (T A = +7 C) -Bump WLP (derates 9.7mW/ C above +7 C)...77mW Maximum Current into RF Input...1mA Operating Temperature Range... - C to + C Junction Temperature...+1 C Storage Temperature Range... - C to +1 C Soldering Temperature (reflow) (Note 1)...+2 C Note 1: Refer to Application Note 191: Wafer-Level Packaging (WLP) and Its Applications. CAUTION! ESD SENSITIVE DEVICE Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 2) WLP Junction-to-Ambient Thermal Resistance (q JA )...13 C/W Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD1-7, using a four-layer board. For detailed information on package thermal considerations, refer to DC ELECTRICAL CHARACTERISTICS (MAX27/MAX29/MAX29 EV kit, V CC = 1.V to 3.V, T A = -NC to +NC, no RF signals are applied. Typical values are at V CC = 2.V and T A = +2NC, unless otherwise noted.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage V MAX27 7. Supply Current SHDN = high MAX29 7. ma MAX29. Shutdown mode, V SHDN = V 2 µa Digital Input Logic-High (Note ) 1.2 V Digital Input Logic-Low (Note ). V AC ELECTRICAL CHARACTERISTICS (MAX27/MAX29/MAX29 EV kit, V CC = 1.V to 3.V, T A = -NC to +NC, f RFIN = 17.2MHz. Typical values are at V CC = 2.V and T A = +2NC, unless otherwise noted.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS RF Frequency L1 band 17.2 MHz MAX VCC = 2.V (Note ) MAX Power Gain MAX MAX db VCC = 1.V MAX MAX Maxim Integrated

3 AC ELECTRICAL CHARACTERISTICS (continued) (MAX27/MAX29/MAX29 EV kit, V CC = 1.V to 3.V, T A = -NC to +NC, f RFIN = 17.2MHz. Typical values are at V CC = 2.V and T A = +2NC, unless otherwise noted.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS MAX27. Noise Figure VCC = 1.V to 3.3V MAX db MAX29.97 MAX27. In-Band 3rd-Order Input (Note ) MAX29.1 Intercept Point MAX29. dbm MAX Out-of-Band 3rd-Order Input (Note 7) MAX29 Intercept Point MAX29. dbm MAX Input 1dB Compression Point (Note ) MAX dbm MAX MAX27 7. Input Return Loss MAX29 9 db MAX29 1. MAX Output Return Loss MAX db MAX MAX Reverse Isolation MAX db MAX Note 3: Min and max limits guaranteed by test at T A = +2 C and guaranteed by design and characterization at T A = - C and T A = + C, unless otherwise noted. Note : Min and max limits guaranteed by test at T A = +2 C. Note : Min limit guaranteed by design and characterization. Note : Measured with the two tones located at 1MHz and 2MHz offset from the center of the GPS band with -27dBm/tone for the MAX27, -3dBm/tone for the MAX29, and -2dBm/tone for the MAX29. Note 7: Measured with input tones at 1713MHz (-27dBm) and 11MHz (-39dBm). Note : Measured with a tone located at the center of the GPS band. Maxim Integrated 3

4 Typical Operating Characteristics (MAX27/MAX29/MAX29 EV kit. Typical values are at V CC = 2.V, T A = +2 C, and f RFIN = 17.2MHz, unless otherwise noted.) MAX INPUT RETURN LOSS vs. FREQUENCY MAX27 toc GAIN vs. FREQUENCY MAX27 toc REVERSE ISOLATION vs. FREQUENCY MAX27 toc3 S GAIN S S22-1 OUTPUT RETURN LOSS vs. FREQUENCY MAX27 toc 1 IN-BAND IIP3 vs. SUPPLY VOLATAGE T A = +2 C T A = - C T A = + C MAX27 toc OUT-OF-BAND IIP3 vs. SUPPLY VOLTAGE ftone 1 = 1713MHz PTONE 1 = -27dBm ftone 2 = 11MHz PTONE 2 = -39dBm +2 C + C MAX27 toc C INPUT P1dB vs. SUPPLY VOLATAGE T A = +2 C MAX27 toc7 1dB GAIN DESENSE vs. BLOCKER FREQUENCY MAX27 toc INPUT P1dB (dbm) T A = - C T A = + C BLOCKER POWER (dbm) BLOCKER Maxim Integrated

5 Typical Operating Characteristics (continued) (MAX27/MAX29/MAX29 EV kit. Typical values are at V CC = 2.V, T A = +2 C, and f RFIN = 17.2MHz, unless otherwise noted.) MAX29 INPUT RETURN LOSS vs. FREQUENCY MAX27 toc GAIN vs. FREQUENCY MAX27 toc1-1 REVERSE ISOLATION vs. FREQUENCY MAX27 toc S GAIN S S22-1 OUTPUT RETURN LOSS vs. FREQUENCY MAX27 toc IN-BAND IIP3 vs. SUPPLY VOLTAGE +2 C + C - C MAX27 toc OUT-OF-BAND IIP3 vs. SUPPLY VOLTAGE ftone 1 = 1713MHz PTONE 1 = -27dBm ftone 2 = 11MHz PTONE 2 = -39dBm +2 C - C + C MAX27 toc INPUT P1dB (dbm) INPUT P1dB vs. SUPPLY VOLTAGE +2 C - C + C MAX27 toc1 BLOCKER POWER (dbm) dB GAIN DESENSE vs. BLOCKER FREQUENCY MAX27 toc BLOCKER Maxim Integrated

6 Typical Operating Characteristics (continued) (MAX27/MAX29/MAX29 EV kit. Typical values are at V CC = 2.V, T A = +2 C, and f RFIN = 17.2MHz, unless otherwise noted.) MAX29 S INPUT RETURN LOSS vs. FREQUENCY MAX27 toc17 GAIN GAIN vs. FREQUENCY MAX27 toc1 S REVERSE ISOLATION vs. FREQUENCY MAX27 toc OUTPUT RETURN LOSS vs. FREQUENCY MAX27 toc2 IN-BAND IIP3 vs. SUPPLY VOLTAGE (TWO TONES LOCATED AT 1MHz AND 2MHz OFFSET WITH -3dBm/TONE) T A = - C MAX27 toc OUT-OF-BAND IIP3 vs. SUPPLY VOLTAGE (TONE 1 AT 1713MHz, -27dBm; TONE 2 AT 11MHz, -39dBm) T A = + C MAX27 toc22 S22-1 T A = +2 C T A = + C 3 T A = +2 C T A = - C -2 INPUT P1dB (dbm) INPUT P1dB COMPRESSION vs. SUPPLY VOLTAGE T A = + C T A = +2 C T A = - C MAX27 toc BLOCKER POWER (dbm) dB GAIN DESENSE vs. BLOCKER FREQUENCY MAX27 toc BLOCKER Maxim Integrated

7 Bump Configuration TOP VIEW V CC + A1 MAX27 MAX29 MAX29 A2 RFOUT (SHDN) RFIN B1 B2 GND WLP BUMP NAME FUNCTION Bump Description A1 V CC Supply Voltage. Bypass to ground with a 1pF capacitor as close as possible to the IC. A2 RFOUT (SHDN) RF Output/SHDN Input. RFOUT is internally matched to I and pulled up to V CC through a 1MI resistor. SHDN is shared with the RFOUT bump. The devices are in active mode by default once V CC is applied. RFOUT(SHDN) can be pulled to a DC low through a 2kI resistor to shut down the IC. B1 RFIN RF Input. Requires a DC-blocking capacitor and external matching components. B2 GND Ground. Connect to the PCB ground plane. Detailed Description The MAX27/MAX29/MAX29 are LNAs designed for GPS L1, Galileo, and GLONASS applications. The devices feature an optional power-shutdown control mode to eliminate the need for an external supply switch. The devices achieve high gain, low noise figure, and excellent linearity. Input and Output Matching The devices require an off-chip input matching. Only an inductor in series with a DC-blocking capacitor is needed to form the input matching circuit. The Typical Application Circuit shows the recommended inputmatching network. These values are optimized for the best simultaneous gain, noise figure, and return loss performance. The value of the input coupling capacitor affects IIP3. A smaller coupling capacitor results in lower IIP3. The devices integrate an on-chip output matching to I at the output, eliminating the need for external matching components. Tables 1 and 2 list typical device S parameters and Kf values. Typical noise parameters are shown in Tables 3 and. Shutdown The devices include an optional shutdown feature to turn off the entire chip. The devices are placed in active mode by default once VCC is applied, due to the on-chip pullup resistor to VCC at the RFOUT bump (shared with the SHDN input). To shut down the part, apply a logiclow to the RFOUT bump through an external resistor with an adequate value, e.g., 2kI, in order not to load the RF output signal during active operation. Maxim Integrated 7

8 Table 1. MAX27 Typical S Parameter Values and K-Factor FREQ (MHz) S11 MAG S11 S21 MAG S21 S12 MAG S12 S22 MAG S K f Table 2. MAX29 Typical S Parameter Values and K-Factor FREQ (MHz) S11 MAG S11 S21 MAG S21 S12 MAG S12 S22 MAG S Kf Maxim Integrated

9 Table 3. MAX29 Typical S Parameter Values and K-Factor FREQ (MHz) S11 MAG S11 S21 MAG S21 S12 MAG S12 S22 MAG S K f Table. MAX27 Typical Noise Parameters (V CC = 2.V, T A = +2NC) FMIN G OPT G OPT ANGLE R N (I) Table. MAX29 Typical Noise Parameters (V CC = 2.V, T A = +2NC) FMIN G OPT G OPT ANGLE R N (I) Maxim Integrated 9

10 Table. MAX29 Typical Noise Parameters (V CC = 2.V, T A = +2NC) FMIN G OPT G OPT ANGLE R N (I) Applications Information A properly designed PCB is essential to any RF microwave circuit. Use controlled-impedance lines on all high-frequency inputs and outputs. Bypass VCC with decoupling capacitors located close to the device. For long VCC lines, it may be necessary to add decoupling capacitors. Locate these additional capacitors further away from the device package. Proper grounding of the GND bump is essential. If the PCB uses a topside RF ground, connect it directly to the GND bump. For a board where the ground is not on the component layer, connect the GND bump to the board with multiple vias close to the package. Refer to mvp/id/932/t/do for the MAX27/MAX29/MAX29 EV kit schematic, Gerber data, PADS layout file, and BOM information. PROCESS: SiGe BiCMOS Chip Information Ordering Information PART TEMP RANGE PIN-PACKAGE MAX27EWS+T -NC to +NC WLP MAX29EWS+T -NC to +NC WLP MAX29EWS+T -NC to +NC WLP +Denotes a lead(pb)-free/rohs-compliant package. T = Tape and reel. Package Information For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. WLP WA LAND PATTERN NO. Refer to Application Note Maxim Integrated

11 REVISION NUMBER REVISION DATE MAX27/MAX29/MAX29 DESCRIPTION Revision History PAGES CHANGED 9/11 Initial release 1 /12 Added MAX29 to data sheet All 2 1/13 Revised AC Electrical Characteristics table 2 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 1 Rio Robles, San Jose, CA 913 USA Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.