20 MHz to 6 GHz RF/IF Gain Block ADL5542

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1 FEATURES Fixed gain of db Operation up to 6 GHz Input/output internally matched to Ω Integrated bias control circuit Output IP3 46 dbm at MHz 4 dbm at 9 MHz Output 1 db compression:.6 db at 9 MHz Noise figure of 3 db at 9 MHz Single V power supply Small footprint 8-lead LFCSP Pin compatible with 1 db gain ADL41 1 kv ESD (Class 1C) MHz to 6 GHz RF/IF Gain Block FUNCTIONAL BLOCK DIAGRAM RFIN CB INPUT MATCH BIAS CONTROL Figure 1. OUTPUT MATCH RFOUT VPOS GENERAL DESCRIPTION The is a broadband db linear amplifier that operates at frequencies up to 6 GHz. The device can be used in a wide variety of CATV, cellular, and instrumentation equipment. The provides a gain of db that is stable over frequency, temperature, power supply, and from device to device. The device is internally matched to Ω with an input return loss of 1 db or better, up to 6 GHz. Only input/output ac coupling capacitors, power supply decoupling capacitors, and an external inductor are required for operation. The is fabricated on an InGaP HBT process and has an ESD rating of 1 kv (Class 1C). The device is packaged in a 3 mm 3 mm LFCSP that uses an exposed paddle for excellent thermal impedance. The consumes 93 ma on a single V supply and is fully specified for operation from 4 C to +8 C. A fully populated RoHS-compliant evaluation board is available. The ADL41 is a companion part that offers a gain of 1 db in a pin-compatible package. Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 916, Norwood, MA , U.S.A. Tel: Analog Devices, Inc. All rights reserved. Technical Support

2 TABLE OF CONTENTS Features... 1 Functional Block Diagram... 1 General Description... 1 Revision History... 2 Specifications... 3 Typical Scattering Parameters... Absolute Maximum Ratings... 6 ESD Caution... 6 Pin Configuration and Function Descriptions... 7 Data Sheet Typical Performance Characteristics...8 Operating to MHz... 1 Basic Connections Soldering Information and Recommended PCB Land Pattern Evaluation Board Outline Dimensions Ordering Guide REVISION HISTORY 2/1 Rev. B to Rev. C Changed Frequency Range from MHz to 6 MHz to MHz to 6 MHz (Throughout)... 1 Changes to Table Added Figure 14 to Figure 19; Renumbered Sequentially... 1 Changes to Basic Connections Section and Table ; Added Figure 21 and Figure Updated Outline Dimensions Changes to Ordering Guide /13 Rev. A to Rev. B Added Figure 13; Renumbered Sequentially /7 Rev. to Rev. A Changes to Figure Change to Basic Connections Section... 1 Changes to Table... 1 Change to Table Deleted Notes from Ordering Guide Section /7 Revision : Initial Version Rev. C Page 2 of 13

3 SPECIFICATIONS VPOS = V and TA = 2 C, unless otherwise noted. Table 1. Parameter Test Conditions/Comments Min Typ Max Unit OVERALL FUNCTION Frequency Range 6 MHz Gain (S21) 9 MHz 19.7 db Input Return Loss (S11) Frequency MHz to GHz 1 db Output Return Loss (S22) Frequency MHz to GHz 1 db Reverse Isolation (S12) 22 db FREQUENCY = MHz Gain.9 db Output 1 db Compression Point 17. dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 38 dbm Noise Figure 2.9 db FREQUENCY = 1 MHz Gain.2 db Output 1 db Compression Point 19.6 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 37 dbm Noise Figure 3. db FREQUENCY = MHz Gain db vs. Frequency ± MHz ±.1 db vs. Temperature 4 C TA +8 C ±.1 db vs. Supply 4.7 V to.2 V ±.2 db Output 1 db Compression Point.6 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = 3 dbm per tone 46 dbm Noise Figure db FREQUENCY = 9 MHz Gain db vs. Frequency ± MHz ±.3 db vs. Temperature 4 C TA +8 C ±.14 db vs. Supply 4.7 V to.2 V ±.2 db Output 1 db Compression Point.6 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 4 dbm Noise Figure db FREQUENCY = MHz Gain db vs. Frequency ± MHz ±. db vs. Temperature 4 C TA +8 C ±.23 db vs. Supply 4.7 V to.2 V ±.4 db Output 1 db Compression Point 18 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 39 dbm Noise Figure db FREQUENCY = 24 MHz Gain db vs. Frequency ± MHz ±. db vs. Temperature 4 C TA +8 C ±.24 db vs. Supply 4.7 V to.2 V ±.4 db Output 1 db Compression Point 16.8 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 38 dbm Noise Figure db Rev. C Page 3 of 13

4 Data Sheet Parameter Test Conditions/Comments Min Typ Max Unit FREQUENCY = 3 MHz Gain db vs. Frequency ± MHz ±.4 db vs. Temperature 4 C TA +8 C ±.31 db vs. Supply 4.7 V to.2 V ±.4 db Output 1 db Compression Point 13.7 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 33 dbm Noise Figure db FREQUENCY = 8 MHz Gain db vs. Frequency ± MHz ±.3 db vs. Temperature 4 C TA +8 C ±1.2 db vs. Supply 4.7 V to.2 V ±.4 db Output 1 db Compression Point 6.8 dbm Output Third-Order Intercept Δf = 1 MHz, output power (POUT) = dbm per tone 24.2 dbm Noise Figure db POWER INTERFACE Pin VPOS Supply Voltage (VPOS) 4.. V Supply Current ma vs. Temperature 4 C TA +8 C ±1 ma Power Dissipation VPOS = V. W Rev. C Page 4 of 13

5 TYPICAL SCATTERING PARAMETERS VPOS = V and TA = 2 C, the effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Freq. (MHz) Magnitude (db) Angle ( ) Magnitude (db) Angle ( ) Magnitude (db) Angle ( ) Magnitude (db) Angle ( ) Rev. C Page of 13

6 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage, VPOS 6. V Input Power (re: Ω) 1 dbm Internal Power Dissipation (Paddle Soldered) 6 mw θjc (Junction to Paddle) 28. C/W Maximum Junction Temperature 1 C Operating Temperature Range 4 C to +8 C Storage Temperature Range 6 C to +1 C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION Rev. C Page 6 of 13

7 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 8 RFOUT CB TOP VIEW (Not to Scale) 7 6 VPOS NOTES 1. EXPOSED PADDLE. INTERNALLY CONNECTED TO. SOLDER TO A LOW IMPEDANCE GROUND PLANE. Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1 RFIN RF Input. Requires a dc blocking capacitor. 2, 3, 6, 7 Ground. Connect these pins to a low impedance ground plane. 4 CB Low Frequency Bypass. A 1 µf capacitor should be connected between this pin and ground. VPOS Power Supply for Bias Controller. Connect directly to external power supply. 8 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is tied to the external power supply. RF path requires a dc blocking capacitor. Exposed Paddle Exposed Paddle. Internally connected to. Solder to a low impedance ground plane. Rev. C Page 7 of 13

8 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS VPOS = V and TA = 2 C, unless otherwise noted. C1 = 33 pf, C2 = 33 pf, L1 = 47 nh GAIN, P1dB, OIP3, NF (db, dbm) OIP3 (dbm) GAIN 1 P1dB 1 NF OIP3 AND P1dB (dbm) OIP3 (+8 C) OIP3 (+2 C) P1dB (+2 C) OIP3 ( 4 C) P1dB (+8 C) P1dB ( 4 C) FREQUENCY (GHz) Figure 3. Gain, P1dB, OIP3, and Noise Figure vs. Frequency FREQUENCY (GHz) Figure 6. OIP3 and P1dB vs. Frequency and Temperature GAIN (db) C 4 C +2 C OIP3 (dbm) GHz 9MHz 3.GHz MHz 2GHz FREQUENCY (GHz) P OUT (dbm) Figure 4. Gain vs. Frequency and Temperature Figure 7. OIP3 vs. Output Power (POUT) and Frequency 8 1 S22 7 S11, S22, S12 (db) S12 S FREQUENCY (GHz) Figure. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency NOISE FIGURE (db) 6 +8 C 4 +2 C 3 4 C FREQUENCY (GHz) Figure 8. Noise Figure vs. Frequency and Temperature Rev. C Page 8 of 13

9 PERCENTAGE (%) 3 PERCENTAGE (%) OIP3 (dbm) NOISE FIGURE (db) Figure 9. OIP3 Distribution at 9 MHz Figure 12. Noise Figure Distribution at 9 MHz V, +8 C PERCENTAGE (%) 1 1 SUPPLY CURRENT (ma) V, +2 C V, 4 C P1dB (dbm) P OUT (dbm) Figure 1. P1dB Distribution at 9 MHz Figure 13. Supply Current vs. POUT 4 3 PERCENTAGE (%) GAIN (db) Figure 11. Gain Distribution at 9 MHz Rev. C Page 9 of 13

10 Data Sheet OPERATING TO MHz VPOS = V and TA = 2 C, unless otherwise noted. C1 =.1 µf, C2 =.1 µf, L1 = 1 µh. 4 4 OIP3 4 4 OIP3 (+2 C) OIP3 (+8 C) GAIN, P1dB, OIP3, NF (db, dbm) GAIN NF P1dB OIP3 AND P1dB (dbm) OIP3 ( 4 C) P1dB (+8 C) P1dB (+2 C) P1dB ( 4 C) Figure 14. Gain, P1dB, OIP3, and Noise Figure vs. Frequency Figure 17. OIP3 and P1dB vs. Frequency and Temperature GAIN (db) C 4 C +8 C OIP3 (dbm) MHz 14MHz MHz 6MHz Figure 1. Gain vs. Frequency and Temperature P OUT (dbm) Figure 18. OIP3 vs. Output Power (POUT) and Frequency S11, S22, S22 (db) S11 S22 S12 NOISE FIGURE (db) C +2 C 4 C Figure 16. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency Figure 19. Noise Figure vs. Frequency and Temperature Rev. C Page 1 of 13

11 BASIC CONNECTIONS The basic connections for operating the are shown in Figure. Recommended components are listed in Table. The input and output should be ac-coupled with appropriately sized capacitors (device characterization was performed with 33 pf capacitors). A V dc bias is supplied to the amplifier via VPOS (Pin ) and through a biasing inductor connected to RFOUT (Pin 8). The bias voltage should be decoupled using a 1 µf capacitor, a 1.2 nf capacitor, and two 68 pf capacitors. RFIN VCC C1 33pF C3 1µF C6 1µF 1 RFIN CB C 1.2nF RFOUT VPOS C4 68pF L1 47nH VCC C7 68pF Figure. Basic Connections C2 33pF RFOUT For operation below MHz, a larger biasing choke and ac coupling capacitors are necessary (see Table ). Figure 21 shows Input return loss, output return loss, and gain for frequencies between MHz and MHz. The noise figure performance for operation from MHz to MHz is shown in Figure NOISE FIGURE (db) Figure 22. Noise Figure vs. Frequency from MHz to MHz SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 23 shows the recommended land pattern for the. To minimize thermal impedance, the exposed paddle on the package underside should be soldered down to a ground plane along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground layers exist, they should be stitched together using vias (a minimum of five vias is recommended). For more information on land pattern design and layout, refer to Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). 2.3mm GAIN (db) S21 S RETURN LOSS (db).mm PIN 1 1.8mm PIN mm 18. S22 4 PIN 4 PIN Figure 21. Input Return Loss (S11), Output Return Loss (S22), and Gain (S21) vs. Frequency mm 1.3mm Figure 23. Recommended Land Pattern Table. Recommended Components for Basic Connections Frequency C1 C2 C3 L1 C4 C C6 C7 MHz to MHz.1 µf.1 µf 1 µf 1 µh (Coilcraft 8LS-12XJL_ or equivalent) 68 pf 1.2 nf 1 µf 68 pf MHz to MHz.1 µf.1 µf 1 µf 47 nh (Coilcraft 63LS-471NXJL_ or equivalent) 68 pf 1.2 nf 1 µf 68 pf MHz to 6 MHz 33 pf 33 pf 1 µf 47 nh (Coilcraft 63CS-47NXJL_ or equivalent) 68 pf 1.2 nf 1 µf 68 pf Rev. C Page 11 of 13

12 Data Sheet EVALUATION BOARD Figure 26 shows the schematic for the evaluation board. The board is powered by a single V supply. W1 The components used on the board are listed in Table 6. Power can be applied to the board through clip-on leads (VCC and ) or through a 2-pin header (W1). RFIN VCC C1 33pF 1 C6 1µF RFIN C 1.2nF RFOUT C4 68pF 8 L1 47nH C2 33pF RFOUT C3 1µF 4 CB DUT1 VPOS C7 68pF C8 OPEN C9 OPEN VCC Figure 24. Evaluation Board Layout (Bottom) Figure 26. Evaluation Board Schematic Figure 2. Evaluation Board Layout (Top) Table 6. Evaluation Board Configuration Options Component Function Default Value DUT1 Gain block C1, C2 AC coupling capacitors 33 pf, 42 C3 Low frequency bypass capacitor 1 μf, 8 C4, C, C6, C7, C8, C9 Power supply decoupling capacitors C4, C7 = 68 pf, 63 C = 1.2 nf, 63 C6 = 1 μf, 8 C8, C9 = open L1 DC bias inductor 47 nh, 63 (Coilcraft 63CS-47NXJL_ or equivalent) VCC and Clip-on terminals for power supply W1 2-pin header for connection of ground and supply via cable Rev. C Page 12 of 13

13 OUTLINE DIMENSIONS SQ BSC 8 PIN 1 INDEX AREA TOP VIEW..4.3 EXPOSED PAD 4 1 BOTTOM VIEW PIN 1 INDICATOR (R.1) SEATING PLANE MAX.2 NOM COPLANARITY.8.3 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TOJEDEC STANDARDS MO-229-WEED Figure Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm 3 mm Body, Very Very Thin, Dual Lead (CP-8-13) Dimensions shown in millimeters A ORDERING GUIDE Model 1 Temperature Range Package Description Package Option Branding ACPZ-R7 4 C to +8 C 8-Lead LFCSP_WD, 7 Tape and Reel CP-8-13 Q1 -EVALZ Evaluation Board 1 Z = RoHS Compliant Part. 7 1 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D /1(C) Rev. C Page 13 of 13

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