MAX V Capable, Low-R ON, Beyond-the-Rails DPDT Analog Switch

Transcription

1 Click here for production status of specific part numbers. MAX V Capable, Low-R ON, General Description The MAX2327 ultra-small, low-on-resistance (R ON ) double-pole/double-throw (DPDT) analog switches feature Beyond-the-Rails capability that allows signals from -.V to +12V to pass without distortion, even when the power supply is below the signal range. The low onresistance (.2Ω) also makes the devices ideal for lowdistortion switching applications, such as audio or video. The MAX2327 is fully specified to operate from a single +1.6V to +.V power supply. Because of the low supply current requirement, V CC can be provided by a GPIO. When power is not applied, the switches go to a high-impedance mode and all analog signal ports can withstand signals from -.V to +.V. The switches are controlled with a single control bit, CB. The MAX2327 is available in a 1.6mm x 1.6mm,.4mm pitch, 9-bump wafer-level package (WLP) and operates over the -4 C to +8 C extended temperature range. Applications Cell phone Tablet Portable Audio/Video Equipment Portable Navigation Devices Benefits and Features Distortion-Free Beyond-the-Rails Signaling Negative Voltage Audio and Video Signal Capable -.V to +12V Analog Signal Range Independent of V CC On-Resistance.2Ω (Typ) +1.6V to +.V Single-Supply Range Total Harmonic Distortion Plus Noise.1% (Typ) On-Resistance Flatness.1Ω (Typ) Low Supply Current 3μA (Typ) at 1.6V Can be Powered by GPIO High-Impedance Mode When V CC Not Applied ESD Protection on COM_ ±1kV Human Body Model ±8kV IEC Air Gap ±6kV IEC Contact Design Flexibility Break-Before-Make Operation 9-Bump WLP (1.6mm x 1.6mm) -4 C to +8 C Operating Temperature Range Ordering Information appears at end of data sheet ; Rev ; 6/18

2 MAX V Capable, Low-R ON, Absolute Maximum Ratings V CC, CB to GND...-.3V to +6V NC_, NO_ to GND...-6V to +12.V COM_ to GND (V CC < 1.6V)...-6V to +6V COM_ to GND (V CC 1.6V)... -6V to ( V NC_ /V NO_ )V Continuous Current NC_, NO_, COM_ A to +1.1A Peak Current NC_, NO_, COM_ (% duty cycle, 1ms pulse) A to +1.6A Continuous Power Dissipation (T A = +7 C, derate 11.91mW/ C above +7 C.) mW Operating Temperature Range C to +8 C Junction Temperature...+1 C Storage Temperature Range C to +1 C Soldering Temperature (reflow) C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information WLP PACKAGE CODE Outline Number Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient (θ JA ) C/W Junction to Case (θ JC ) N/A W91P1+1 For the latest package outline information and land patterns (footprints), go to Note that a +, #, or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD1-7, using a four-layer board. For detailed information on package thermal considerations, refer to Maxim Integrated 2

3 MAX V Capable, Low-R ON, Electrical Characteristics (V CC = +1.6V to +.V, T A = -4 C to +8 C, unless otherwise noted. Typical values are at V CC = +2.V, T A = +2 C, unless otherwise noted. (Note 1)) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Power-Supply Range V CC 1.6. V Power-Supply Rejection Ratio PSRR R COM_ = 32Ω, f = 2kHz 8 db V CC = +1.6V, V CB = V or V CC 3 Supply Current I CC V CC = +4.2V, V CB = V or V CC 9 ANALOG SWITCH (NC_ to COM_, NO_ to COM_) Analog Signal Range On-Resistance On-Resistance Match Between Channels V NC_, V NO_, V COM_ V R ON V CC = 2.V, V COM_ = V, I COM_ = 1mA (Note 2) V CC = 1.8V, V COM_ = V, I COM_ = 1mA (Note 2) ΔR ON V CC = 2.V, V NC_ = V, I COM_ = 1mA, between same NC_ and NO_ channel On-Resistance Flatness R FLAT V CC = 2.V, I COM_ = 1mA, V COM_ = -.V to +12V (Note 3, Note 4) NC_ or NO_ Off-Leakage Current COM Off-Leakage Current COM On-Leakage Current TIMING CHARACTERISTICS I NO_(OFF) / I NC_(OFF) I COM_(OFF) I COM_(ON) V CC = 2.V, switch open, V NO_ or V NC_ = -.V, +12V, V COM_ = -.V, +12V unconnected V CC = V, T A = 2 C, V COM_ = -.V, +12V, V NO_ or V NC_ = -.V, +12V, unconnected V CC = 2.V, switch closed, V COM_ = V NO_ = -.V, +12V, unconnected µa Ω.2.3 Ω.1. Ω na µa na Turn-On Time t ON V NO_ or V NC_ = V, +R L = Ω (Figure 2) 3 µs Turn-Off Time t OFF V NO_ or V NC_ = V, +R L = Ω (Figure 1) 3 µs Break-Before-Make Time t BBM R L = Ω, time for both NC/NO switches are open during transition (Figure 2) AUDIO PERFORMANCE Total Harmonic Distortion Plus Noise THD + N f = 2Hz to 2kHz, V COM_ =.V P-P, R S = R L = 6Ω, DC bias = Off-Isolation V ISO f = 1kHz, V CC = V, DC bias =.2V, R S = R L = Ω; V COM_ =.V P-P, Figure 3 Crosstalk V CT R S = R L = Ω, V COM_ =.V P-P, f = 1kHz (Figure 3) 3 µs.1 % -6 db -1 db -3dB Bandwidth BW R S = R L = Ω 1 MHz Maxim Integrated 3

4 MAX V Capable, Low-R ON, Electrical Characteristics (continued) (V CC = +1.6V to +.V, T A = -4 C to +8 C, unless otherwise noted. Typical values are at V CC = +2.V, T A = +2 C, unless otherwise noted. (Note 1)) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NC_ Off-Capacitance C NC_(OFF) V NC_ /V NO_ =.V P-P, f = 1MHz 4 pf NO_ Off-Capacitance C NO_(OFF) V NC_ /V NO_ =.V P-P, f = 1MHz 4 pf COM_ On-Capacitance C COM_(ON) V NC_ /V NO_ =.V P-P, f = 1MHz 6 pf DIGITAL I/O (CB) Input Logic High Voltage V IH 1.4 V Input Logic Low Voltage V IL.4 V Input Leakage Current I IN V CB = or V CC na THERMAL PROTECTION Thermal Shutdown T SHDN 1 ºC Thermal Hysteresis T HYST 2 ºC ESD PROTECTION COM_ HBM ±1 IEC Air-Gap Discharge ±8 IEC Contact Discharge ±6 All other pins HBM ±2 kv Note 1: All specifications are 1% production tested at T A = +2 C, unless otherwise noted. Specifications are over T A = -4 C to +8 C and are guaranteed by design. Note 2: The same limits apply for V COM_ = -.V to +.V with NC_ channels and V to 12V with NO_ channels. These are guaranteed by design. Note 3: Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over specified analog signal ranges. Note 4: Guaranteed by design; not production tested. kv Maxim Integrated 4

5 MAX V Capable, Low-R ON, -VIN_ VIN_ MAX2327 NC_ COM_ OR NO_ NC_ OR NO_ CB COM_ RL CL VOUT LOGIC INPUT LOGIC INPUT VIH VIL VIN_ V -VIN_ % ton.1 x -VIN_.9 x VIN_ tr < ns tf < ns LOGIC INPUT CL INCLUDES FIXTURE AND STRAY CAPACITANCE RL VOUT = VIN_ ( ) RL + RON toff CONTROL DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH. Figure 1. Switching Time V CC V IN MAX2327 NC_ COM_ NO_ V OUT LOGIC INPUT V IH V IL % CB R L Ω C L 3pF LOGIC INPUT GND V OUT.9 x V OUT C L INCLUDES FIXTURE AND STRAY CAPACITANCE. t BBM Figure 2. Break-Before-Make Interval Ω NC1 COM1 MAX2327 NO1* VIN VOUT NETWORK ANALYZER Ω Ω MEAS REF Ω Ω *FOR CROSSTALK THIS PIN IS NO2. NC2 AND COM2 ARE OPEN. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND "OFF" NO_ OR NC_ TERMINAL ON EACH SWITCH. 3dB BANDWIDTH IS MEASURED BETWEEN COM_ AND "ON" NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. Figure 3. 3dB Bandwidth, Off-Isolation, and Crosstalk CROSSTALK = 2log V OUT V IN OFF-ISOLATION = 2log V OUT V IN 3dB BANDWIDTH = 2log V OUT V IN Maxim Integrated

6 MAX V Capable, Low-R ON, Typical Operating Characteristics V CC = +2.V, T A = +2 C, unless otherwise noted. 1 ICOM = 1mA ON RESISTANCE vs COM VOLTAGE toc1 1 ON-RESISTANCE vs COM VOLTAGE ICOM = 1mA, VCC = 3.V toc2 1 ON RESISTANCE vs COM VOLTAGE ICOM = 1mA, VCC = V toc ON RESISTANCE (Ω).6.4 VCC = 1.8V V CC = 3.V VCC = V ON RESISTANCE (Ω).6.4 TA = -4 C T A = +2 C TA = +8 C ON RESISTANCE (Ω).6.4 TA = -4 C T A = +2 C TA = +8 C COM VOLTAGE (V) COM VOLTAGE (V) COM VOLTAGE (V) TURN-OFF TIME (µs) TURN-OFF TIME vs. SUPPLY VOLTAGE toc4 V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF TURN-ON TIME (µs) TURN-ON TIME vs. SUPPLY VOLTAGE toc V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 4 3 BBM TIME vs. SUPPLY VOLTAGE toc6 V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF 4 TURN-OFF TIME vs. TEMPERATURE toc7 V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF BBM TIME (µs) 2 1 TURN-OFF TIME (µs) SUPPLY VOLTAGE (V) TEMPERATURE ( C) Maxim Integrated 6

7 MAX V Capable, Low-R ON, Typical Operating Characteristics (continued) V CC = +2.V, T A = +2 C, unless otherwise noted. TURN-ON TIME (µs) TURN-ON TIME vs. TEMPERATURE toc8 V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF BBM TIME (µs) BBM TIME vs. TEMPERATURE toc9 V NC_ = -.V, V NO_ = +.V, R L = Ω, C L = 3pF SUPPLY CURRENT (µa) SUPPLY CURRENT vs. LOGIC-INPUT VOLTAGE FALLING RISING toc TEMPERATURE ( C) TEMPERATURE ( C) LOGIC_INPUT VOLTAGE (V) 1 LOGIC THRESHOLD vs. SUPPLY VOLTAGE RISING toc11 2 COM ON LEAKAGE CURRENT vs. TEMPERATURE toc12 LOGIC THRESHOLD (V) FALLING TD+/TD- LEAKAGE CURRENT (na) 1 1 COM = -.V COM = +12V SUPPLY VOLTAGE (V) TEMPERATURE ( C) 2 COM OFF LEAKAGE CURRENT vs. TEMPERATURE toc13 FREQUENCY RESPONSE toc14 TD+/TD- LEAKAGE CURRENT (na) 1 1 COM = +.V COM = -.V MAGNITUDE (db) TEMPERATURE ( C) FREQUENCY( MHz) Maxim Integrated 7

8 MAX V Capable, Low-R ON, Typical Operating Characteristics (continued) V CC = +2.V, T A = +2 C, unless otherwise noted. OFF-ISOLATION toc1 CROSS TALK toc MAGNITUDE (db) MAGNITUDE (db) FREQUENCY (MHz) FREQUENCY (MHz). R SOURCE = Ω THD+N toc17 1 MAXIMUM SIGNAL SWING (1.6V V CC < 2.V) toc18 THD+N (%) R L = 32Ω SIGNAL SWING (V) 7..1 R L = Ω FREQUENCY (Hz) 2..64MHz FREQUENCY (MHz) 1 MAXIMUM SIGNAL SWING (2.V V CC < V) toc19 1 MAXIMUM SIGNAL SWING (V V CC <.V) toc2 SIGNAL SWING (V) 7. SIGNAL SWING (V) MHz FREQUENCY (MHz).3MHz FREQUENCY (MHz) Maxim Integrated 8

9 MAX V Capable, Low-R ON, Bump Configuration TOP VIEW BUMP SIDE DOWN MAX A + NC1 CB NC2 B C COM1 NO1 GND VCC COM2 NO2 WLP Bump Descriptions PIN NAME FUNCTION A1 NC1 Normally Closed Terminal for Switch 1 A2 CB Digital Control Input. Drive CB low to connect COM_ to NC_. Drive CB high to connect COM_ to NO_. A3 NC2 Normally Closed Terminal for Switch 2 B1 COM1 Common Terminal for Switch 1 B2 GND Ground B3 COM2 Common Terminal for Switch 2 C1 NO1 Normally Open Terminal for Switch 1 C2 V CC Positive Supply Voltage Input. Bypass V CC to GND with a.1µf capacitor as close to the device as possible. C3 NO2 Normally Open Terminal for Switch 2 Maxim Integrated 9

10 MAX V Capable, Low-R ON, Detailed Description The MAX2327 is an ultra-small, low on-resistance, high ESD-protected DPDT switch that operates from a +1.6V to +.V supply, and is designed to pass analog signals, such as AC-biased or DC-biased audio and video signals. These switches feature the low on-resistance (R ON ) necessary for high-performance switching applications. The Beyond-the-Rails signal capability of the MAX2327 allows signals below ground and above V CC to pass without distortion. Analog Signal Levels The MAX2327 is bidirectional, allowing NO_, NC_, and COM_ to be configured as either inputs or outputs. The topology of the switches allows the signal to drop below ground without the need of an external negative voltage supply. Digital Control Input The MAX2327 provides a single-bit control logic input, CB. CB controls the switch position, as shown in the Typical Application Circuits. Applications Information Extended ESD Protection ESD-protection structures are incorporated on all pins to protect against electrostatic discharges up to ±2kV (HBM) encountered during handling and assembly. COM1 and COM2 are further protected against ESD up to ±1kV (HBM), ±8kV (Air-Gap Discharge), and ±6kV (Contact Discharge) without damage. NO_ and NC_ are protected against ESD up to ±2kV (HBM) without damage. The ESD structures withstand high ESD both in normal operation and when the device is powered down. After an ESD event, the devices continue to function without latchup. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test methodology and test results. Human Body Model Figure 4 shows the Human Body Model. Figure shows the current waveform it generates when discharged into a low impedance. This model consists of a 1pF capacitor charged to the ESD voltage of interest that is then discharged into the device through a 1.kΩ resistor. R C 1MΩ CHARGE-CURRENT- LIMIT RESISTOR R D 1.kΩ DISCHARGE RESISTANCE I PEAK (AMPS) 1% 9% I r PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) HIGH- VOLTAGE DC SOURCE C S 1pF STORAGE CAPACITOR DEVICE UNDER TEST 36.8% 1% TIME t RL t DL Figure 4. Human Body ESD Test Model Figure. Human Body Current Waveform Maxim Integrated 1

11 MAX V Capable, Low-R ON, IEC The IEC standard covers ESD testing and performance of finished equipment. It does not specifically refer to integrated circuits. The major difference between tests done using the HBM and IEC is higher peak current in IEC , because series resistance is lower in the IEC model. Hence, the ESD withstand voltage measured to IEC is generally lower than that measured using the HBM. Figure 6 shows the IEC model and Figure 7 shows the current waveform for the ±8kV, IEC , Level 4, ESD Contact-Discharge Method. R C MΩ TO 1MΩ CHARGE-CURRENT- LIMIT RESISTOR R D 33Ω DISCHARGE RESISTANCE I PEAK (AMPS) 1% 9% HIGH- VOLTAGE DC SOURCE C S 1pF STORAGE CAPACITOR Figure 6. IEC ESD Test Model DEVICE UNDER TEST 1% t t R =.7ns TO 1ns 3ns 6ns Figure 7. IEC ESD Generator Current Waveform Maxim Integrated 11

12 MAX V Capable, Low-R ON, Typical Application Circuits GPIO VCC.1µF AP/CODEC L-AUDIO R-AUDIO NC1 NC2 MAX2327 COM1 L-AUDIO R-AUDIO AUDIO AMPLIFIER NO1 NO2 COM2 CB P2.6V VCC.1µF WEARABLE CONTACT PMIC VBUS NC1 NC2 MAX2327 COM1 POWER ASSC ECG NO1 NO2 COM2 CB EN GROUND Ordering Information PART NUMBER TEMP RANGE PIN-PACKAGE [TOP MARKING] PACKAGE OUTLINE DRAWING MAX2327EWL+T -4 C to +8 C 9 WLP ALA Denotes a lead(pb)-free/rohs-compliant package. T Denotes tape-and-reel. Maxim Integrated 12

13 MAX V Capable, Low-R ON, Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 6/18 Initial release For pricing, delivery, and ordering information, please contact Maxim Direct at , or visit Maxim Integrated s website at Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. 218 Maxim Integrated Products, Inc. 13