Apple iphone X IR Dot Projector

Transcription

1 Apple iphne X IR Dt Prjectr Dt Prjectr bundle including Heptagn Imaging reprt by Sylvain HALLEREAU December rue la Nue Bras de Fer NANTES - FRANCE inf@systemplus.fr System Plus Cnsulting Apple iphne X 3D Dt Prjectr 1

2 Table f Cntents Overview / Intrductin 3 Executive Summary Reverse Csting Methdlgy Cmpany Prfile 7 Supply chain Heptagn Lumentum TrueDepth Mdule Supply Apple iphne X Teardwn 22 Synthesis f the Methdlgy Dt Prjectr teardwn Ceramic Package 39 View, Dimensins & Marking Crss-Sectin Prcess Characteristics Bradcmm BCM15952 IC Schttky Dide NIR VCSEL 62 Die View, Dimensins & Marking Cavity Crss-Sectin Prcess Characteristics Flded Optic 71 View, Dimensins & Marking Disassembly & Main Blcks Identificatin Lens Crss-Sectin Prcess Characteristics Active DOE 99 DOE Dimensins DOE Disassembly & Main Blcks Identificatin DOE Crss Sectin Prcess Characteristics Cmparisn: Apple Dt Prjectr, Intel Real Sense, PMD/Infinen 126 Manufacturing Prcess Flw 130 Glbal Overview f the Dt Prjectr Package Frnt-End Prcess Flw Package Fabricatin Unit NIR VCSEL Frnt-End Prcess NIR VCSEL Wafer Fabricatin Unit Flded Optic Wafer Prcess Flw Flded Optic Wafer Fabricatin Unit DOE Wafer Prcess Flw DOE Wafer Fabricatin Unit Final Assembly Unit Cst Analysis 150 Overview f the Cst Analysis Yields Explanatin and Hyptheses Integrated Circuit Ceramic Package NIR VCSEL Flded Optic Flded Optic Frnt-End Cst Flded Optic Frnt-End Cst per prcess steps Flded Optic Back-End 0 : Prbe Test and Dicing Flded Optic Wafer and Die Cst Flded Optic Cmpnent Cst DOE Active Back-End : Final Assembly Cst Back-End : Final Assembly Cst per Prcess Step 3D Illuminatin Mdule Cmpnent Cst Estimated Price Analysis 180 3D Illuminatin Mdule 181 Cmpany services System Plus Cnsulting Apple iphne X 3D Dt Prjectr 2

3 Executive Summary Overview / Intrductin Executive Summary Reverse Csting Methdlgy Glssary Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus The Apple iphne X brings ttally new functinality based n the TrueDepth technlgy. This prject is issued frm a cllabratin including Lumentum fr the VCSEL dide and Heptagn fr the active DOE and flded ptic. The iphne X implements this technlgy using a Dt Prjectr. The subsystem features a 30,000 dts prjectr frm Heptagn. We estimate that the Active DOE and the flded ptic are manufactured by Heptagn. The electrnic package is assembled by an OSAT. The IC driver is designed by Bradcm. The ngrid VCSEL array dide is manufactured by Lumentum. Heptagn perfrms the assembly f the Dt Prjectr. T prvide the 30,000 dts, the VCSEL supplies the IR light and the Flded Optic directs the IR light t the Active Diffractive Optical Element (DOE). Finally, the Active DOE divides the light beam int 30,000 dts f light. The VCSEL is driven in pwer, beam shape and frequency by an ASIC frm Bradcm. The reprt includes technlgy and cst analysis f the Dt Prjectr. These analyses prvide the technical intelligence necessary t understand this technlgy. A cmparisn between the Dt Prjectr and the Intel Real Sense prjectr and the PMD/Infinen slutin are perfrmed System Plus Cnsulting Apple iphne X 3D Dt Prjectr 3

4 Dt Prjectr Teardwn Overview / Intrductin Cmpany Prfile & Supply Dt Prjectr Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn RGB Camera Dt Prjectr Glbal View 2017 by System Plus Cnsulting Dt Prjectr Bttm View Dt Prjectr Flex Marking 2017 by System Plus Cnsulting 2017 by System Plus Cnsulting Flex Manufacturing Prcess Flw Ceramic Cst Analysis Abut System Plus Dt Prjectr Flex Remval 2017 by System Plus Cnsulting The Dt Prjectr mdule has a ceramic substrate with a separate ceramic blck under the VCSEL. Ceramic substrate Dt Prjectr Flex Remval 2017 by System Plus Cnsulting 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 4

5 Dt Prjectr Dimensin Overview / Intrductin Cmpany Prfile & Supply XXmm Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Manufacturing Prcess Flw DOE Tp Lenses XXmm XXXmm Light Guide Bttm Lenses Substrate XXmm Ceramic Substrate Cst Analysis 2017 by System Plus Cnsulting Abut System Plus DOE Dt Prjectr Glbal View Flex Tp Lenses Light Guide Bttm Lenses Substrate Ceramic Substrate Flex 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 5

6 Dt Prjectr Teardwn Overview / Intrductin Cmpany Prfile & Supply The ptical blck is glued n tp f the ceramic substrate. Light Guide Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Bttm Lenses Substrate Manufacturing Prcess Flw Cst Analysis Abut System Plus VCSEL Dt Prjectr Opened View 2017 by System Plus Cnsulting 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 6

7 Dt Prjectr AlN Ceramic Overview / Intrductin Cmpany Prfile & Supply Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Manufacturing Prcess Flw Cst Analysis Abut System Plus 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 7

8 XXmm Overview / Intrductin NIR VCSEL Die View and Dimensins XX mm Cmpany Prfile & Supply Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Die Area: XXmm² (xx x xx mm) Nb f PGDW per 3-inch wafer: XX Pad number: x Wire Bnding: XX Manufacturing Prcess Flw Cst Analysis Abut System Plus VCSEL Optical View 2017 by System Plus Cnsulting 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 8

9 NIR VCSEL Die Crss-Sectin Overview / Intrductin Cmpany Prfile & Supply Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Manufacturing Prcess Flw Cst Analysis Abut System Plus Seed layer in titanium fr the gld layer: 0.05µm 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 9

10 Flded Optic - Disassembly Overview / Intrductin Cmpany Prfile & Supply Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Manufacturing Prcess Flw Cst Analysis Abut System Plus 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 10

11 Active Diffractive Optical Element - Disassembly Overview / Intrductin Cmpany Prfile & Supply Synthesis Teardwn Ceramic Package IC Bradcm NIR VCSEL Flded Optic Active DOE Cmparisn Manufacturing Prcess Flw Cst Analysis Abut System Plus DOE Disassembly Optical View 2017 by System Plus Cnsulting 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 11

12 Bradcm BCM15952 Frnt-End Cst Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Synthesis Supply Yields Bradcm BCM15952 Cst NIR VCSEL Wafer & Die Cst Ceramic Package Cst Flded Optic Cst Active DOE Cst Assembly Cst Cmpnent Cst Abut System Plus 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 12

13 NIR VCSEL Frnt-End Cst per Prcess Steps Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Synthesis Supply Yields Bradcm BCM15952 Cst NIR VCSEL Wafer & Die Cst Ceramic Package Cst Flded Optic Cst Active DOE Cst Assembly Cst Cmpnent Cst Abut System Plus Sensr Manufacturing Steps Cst (Simulated with LED CSim+ Cst Simulatin Tl) 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 13

14 3D Illuminatin Mdule Estimated Manufacturer Price Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Financial Ratis Manufacturer Price Abut System Plus 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 14

15 Related Reprts Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus Cmpany services Feedbacks Cntact Legal REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING IMAGING Samsung Galaxy S8 Iris Scanner STMicrelectrnics Time f Flight Prximity Sensr in the Apple iphne 7 Plus Texas Instruments Time f Flight Image Sensr fr Industrial Applicatins Melexis Time f Flight Imager fr Autmtive Applicatins Lenv Phab2Pr 3D TF Camera MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT DÉVELOPPEMENT IMAGING 3D Imaging and Sensing 2017 Camera Mdule Industry Market and Technlgy Trends 2017 IR LEDS and VCSELs - Technlgy, Applicatins and Industry Trends 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 15

16 COMPANY SERVICES 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 16

17 Business Mdels a Fields f Expertise Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis Abut System Plus Cmpany services Feedbacks Cntact Legal Custm Analyses (>130 analyses per year) Reprts (>40 reprts per year) Csting Tls Trainings 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 17

18 Cntact Overview / Intrductin Cmpany Prfile & Supply Manufacturing Prcess Flw Cst Analysis PHOENIX YOLE Inc. FRANKFURT/MAIN Eurpa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK Abut System Plus Cmpany services Feedbacks Cntact Legal GREATER CHINA YOLE Headquarters 21 rue La Nue Bras de Fer Nantes FRANCE sales@systemplus.fr Eurpe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phenix USA laferriere@yle.fr Asia Sales Office Takashi ONOZAWA Tky JAPAN nzawa@yle.fr Mavis WANG GREATER CHINA wang@yle.fr 2017 System Plus Cnsulting Apple iphne X 3D Dt Prjectr 18

19 ORDER FORM Please prcess my rder fr iphne X IR Dt Prjectr Reverse Csting Reprt Ref.: SP17376 Full Reverse Csting reprt: EUR 3,990* Annual Subscriptin (including this reprt as the first f the year): 3 reprts EUR 8 400* 5 reprts EUR * 7 reprts EUR * 10 reprts EUR * 15 reprts EUR * *Fr price in dllars please use the day s exchange rate *All reprts are delivered electrnically in pdf frmat *Fr French custmer, add 20 % fr VAT *Our prices are subject t change. Please check ur new releases and price changes n The present dcument is valid 6 mnths after its publishing date: December 2017 SHIP TO Name (Mr/Ms/Dr/Pr):... Jb Title:... Cmpany:... Address:... City: State:... Pstcde/Zip:... Cuntry:... VAT ID Number fr EU members:... Tel: Date:... Signature:... BILLING CONTACT First Name:... Last Name: Phne:... PAYMENT DELIVERY n receipt f payment: By credit card: Number: Expiratin date: / Card Verificatin Value: By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charrn St Herblain France BIC cde: CCFRFRPP In EUR Bank cde : Branch cde : Accunt : IBAN: FR In USD Bank cde : Branch cde : Accunt : IBAN: FR Return rder by: FAX: MAIL: SYSTEM PLUS CONSULTING 21 rue La Nuë Bras de Fer Nantes France Cntact: sales@systemplus.fr TEL: ABOUT SYSTEM PLUS CONSULTING System Plus Cnsulting is specialized in the cst analysis f electrnics frm semicnductr devices t electrnic systems. A cmplete range f services and csting tls t prvide in-depth prductin cst studies and t estimate the bjective selling price f a prduct is available. Our services: TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS - sales@systemplus.fr Perfrmed by

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