MUR2100E. Ultrafast E Series with High Reverse Energy Capability ULTRAFAST RECTIFIER 2.0 AMPERES, 1000 VOLTS

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1 Preferred Device SWITCHMODE Power Rectifier Ultrafast E Series with High Reverse Energy Capability These state of the art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features 0 mjoules valanche Energy Guaranteed Excellent Protection gainst Voltage Transients in Switching Inductive oad Circuits Ultrafast 75 Nanosecond Recovery Time 75 C Operating Junction Temperature ow Forward Voltage ow eakage Current High Temperature Glass Passivated Junction These are Pb Free Devices* Mechanical Characteristics: Case: Epoxy, Molded Weight: 0.4 Gram (pproximately) Finish: ll External Surfaces Corrosion Resistant and Terminal eads are Readily Solderable ead Temperature for Soldering Purposes: 60 C Max for Seconds Polarity: Cathode Indicated by Polarity Band MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating Symbol Value Unit V RRM V RWM V R 00 V verage Rectified Forward Current (Note ) I T = 5 C Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Operating Junction Temperature and Storage Temperature Range THERM CHRCTERISTICS I FSM 5 T J, T stg 65 to +75 Characteristic Symbol Value Unit Maximum Thermal Resistance, Junction to mbient C R J (Note ) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Pulse Test: Pulse Width = 00 s, Duty Cycle.0%. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. UTRFST RECTIFIER.0 MPERES, 00 VOTS PSTIC XI ED CSE 59 MRKING DIGRM MUR0E YYWW = ssembly ocation Y = Year WW = Work Week = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMTION Device Package Shipping MUR0E xial ead** 00 Units/Bag MUR0EG xial ead** 00 Units/Bag MUR0ER xial ead** 5000/Tape & Reel MUR0ERG xial ead** 5000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. **This package is inherently Pb Free. Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, C, 006 July, 006 Rev. 6 Publication Order Number: MUR0E/D

2 EECTRIC CHRCTERISTICS Maximum Instantaneous Forward Voltage (Note ) (I F =.0, T J = ) (I F =.0, T J = ) Maximum Instantaneous Reverse Current (Note ) (Rated dc Voltage, T J = 0 C) (Rated dc Voltage, T J = ) Maximum Reverse Recovery Time (I F =.0, di/dt = 50 / s) (I F = 0.5, I R =.0, I REC = 0.5 ) Maximum Forward Recovery Time (I F =.0, di/dt = 0 / s, I REC to.0 V) Characteristic Symbol Value Unit V F.75.0 i R 600 t rr 0 75 V ns t fr 75 ns Controlled valanche Energy (See Test Circuit in Figure 6) W V mj. Pulse Test: Pulse Width = 00 s, Duty Cycle.0%. I F, INSTNTNEOUS FORWRD CURRENT ().0 V 75 C 0 C V F, INSTNTNEOUS VOTGE (V) Figure. Maximum Forward Voltage I F, INSTNTNEOUS FORWRD CURRENT ().0 V 75 C 0 C V F, INSTNTNEOUS VOTGE (V) Figure. Typical Forward Voltage

3 .0E 0.0E 0 I R, REVERSE CURRENT ().0E 0 V 75 C.0E 0.0E 04 0 C.0E 05.0E 06.0E 07.0E I R, REVERSE CURRENT ().0E 0.0E 0 V 75 C.0E 04.0E 05 0 C.0E 06.0E 07.0E I F(V), VERGE FORWRD CURRENT () V R, REVERSE VOTGE (V) Figure. Maximum Reverse Current DC.5.0 SQURE WVE T, MBIENT TEMPERTURE ( C) Figure 5. Current Derating P F(V), VERGE POWER DISSIPTION () V R, REVERSE VOTGE (V) Figure 4. Typical Reverse Current 4 SQURE WVE DC I F(V), VERGE FORWRD CURRENT () Figure 6. Power Dissipation 0 C, CPCITNCE (pf) V R, REVERSE VOTGE (V) Figure 7. Typical Capacitance

4 NOTE. MBIENT MOUNTING DT Data shown for thermal resistance, junction to ambient (R J ) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPIC VUES FOR R J IN STI IR Mounting ead ength, Method /8 /4 / Units R J MOUNTING METHOD MOUNTING METHOD Vector Pin Mounting É É MOUNTING METHOD = /8 Board Ground Plane P.C. Board with / X / Copper Surface 4

5 PCKGE DIMENSIONS XI ED CSE 59 ISSUE U PORITY INDICTOR OPTION S NEEDED (SEE STYES) K F B D F K NOTES:. DIMENSIONING ND TOERNCING PER NSI Y4.5M, 98.. CONTROING DIMENSION: INCH.. RUES ND NOTES SSOCITED WITH JEDEC DO 4 OUTINE SH PPY 4. PORITY DENOTED BY CTHODE BND. 5. ED DIMETER NOT CONTROED WITHIN F DIMENSION. INCHES MIIMETERS DIM MIN MX MIN MX B D F K STYE : PIN. CTHODE (PORITY BND). NODE SWITCHMODE is a trademark of Semiconductor Components Industries, C. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 807 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MUR0E/D

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