PHYSICS-BASED THRESHOLD VOLTAGE MODELING WITH REVERSE SHORT CHANNEL EFFECT

Size: px
Start display at page:

Download "PHYSICS-BASED THRESHOLD VOLTAGE MODELING WITH REVERSE SHORT CHANNEL EFFECT"

Transcription

1 Journal of Modeling and Simulation of Microsystems, Vol. 2, No. 1, Pages 51-56, PHYSICS-BASED THRESHOLD VOLTAGE MODELING WITH REVERSE SHORT CHANNEL EFFECT K-Y Lim, X. Zhou, and Y. Wang School of Electrical & Electronic Engineering, Nanyang Technological University, Nanyang Avenue, Singapore Abstract This paper presents a physic-based reverse short channel effect (RSCE) model for threshold voltage (V th ) modeling of deep submicron MOSFETs. Unlike those conventional empirically-based RSCE models, the proposed model is derived based on two Gaussian pile-up profiles located at the source and drain edges of a MOSFET. The model has a simple compact form that can be utilized to characterize the advanced halo-implant MOSFETs. A detailed comparison of the proposed RSCE model with the previously proposed model is also presented. The analytical model has been applied to, and verified with, experimental data of a 0.25-µm CMOS process for ten different gate lengths as well as various drain and substrate bias conditions. Keywords: RSCE, lateral non-uniform profile, threshold voltage, compact model, MOSFET 1. Introduction Advanced MOSFETs are non-uniformly doped as a result of complex process flow. Basically, non-uniform doping profiles can be categorized into vertical non-uniformity and lateral non-uniformity, as shown in Fig. 1. The vertical nonuniformity can be due to additional implantation for threshold voltage adjustment or for punchthrough prevention. On the other hand, lateral non-uniformity may be due to the intended pocket implantation for deep submicron technology or the unavoidable transient enhanced diffusion of boron impurity in nmos. Therefore, one of the key factors to model threshold voltage accurately is to model its non-uniform doping profile. Currently, there are many V th models [1-6] that are able to model the vertical non-uniform doping profile of a MOSFET. However, all the V th models for lateral non-uniform doping profiles for reverse short channel effect (RSCE) [7-12] are empirical, which are normally modeled by simply adding exponential functions to its long channel V th expression. Hence, the focus here is to transform the lateral 2-D pile-up profile across the channel to an effective doping expression that can be applied directly to the compact V th expression [7] for efficient circuit simulation. Despite that RSCE observed in V th - L g curve is solely due to the lateral doping nonuniformity, the complete V th model of advance MOSFETs should also include the other critical effects, such as drain induced barrier lowering, charge sharing effect as well as the effect of vertical non-uniformity. In the V th model that is presented in this paper, all short channel effects, except for the RSCE, are modeled as in a recent published article [7]. The model for vertical non-uniform doping profile of MOSFET has been explained in [1]. Fig. 1: MOSFET with both vertical and horizontal non-uniform doping profiles. In Section 2 of this paper, formulation of the proposed model is presented. Comparison of the model with the empirical hyperbolic cosine RSCE model [7] is discussed in Section 3, together with experimental verification of the proposed model. Finally, a brief summary is given in Section 4. exzhou@ntu.edu.sg Computational Publications, ISSN

2 JMSM, Vol. 2, No. 1, Pages 53-56, Model RSCE in nmosfets is mainly caused by the boron dopant pile-up phenomenon at the edge of the source and drain regions. Therefore, the basis of the model is to assume two Gaussian profiles at the source and drain edges. The Gaussian profile is expressed as: N p ( y) N pile exp[ ( y l β ) 2 ] (1) where y represents the distance across the channel and is the metallurgical channel length of the MOSFET. N pile and I β are the peak pile-up doping concentration and the characteristic length, respectively. Since the pile-up profile is due to boron redistribution along the channel after the post- LDD annealing process or due to direct pocket implant at the source and drain side, it can be assumed symmetrical for both the source and drain sides. With these conceptual pile-up profiles, as shown in Fig. 1, the profiles are summed up mathematically along the entire metallurgical channel length of the MOSFET. It is then divided by the metallurgical channel length to obtain an averaged effective concentration expression, as follows: Fig. 2: MEDICI simulated doping profiles across MOSFET channel for L g 0.24, 0.34, 0.5 and 1 µm. Eq. (2) merely gives an effective value of the non-uniform channel doping as a function of. However, RSCE is not quantified through its effective channel doping, but through the threshold voltage. Thus, to fully characterize RSCE, it is necessary to substitute the derived effective channel doping expression (2) into a physical short-channel V th model. The V th model used in this work is given as [13]: N eff y N exp pile --- l β 2 y + exp l β 2 + N s dy λζ V th V FB + γ s + φ s0 V bs φ L s v bs eff v bs φ s v bs (3) N s l β N pile exp( t 2 ) dt exp( t 2 ) dt l β 0 0 l β (2) ζ 2ε si qn eff (3a) πerf ( L N s N eff l β ) + pile ( ) l β φ s0 2kT N eff q ln n i (3b) where N s is the effective vertical non-uniform substrate doping without considering the lateral pile-up charge [1]. Notice that the pile-up terms at the source and drain edges are only differentiated by an translation term. The final effective concentration expression is an error function of its metallurgical channel length as well as the peak value and characteristic length of its pile-up profile. φ s φ s0 φ s 1 z φ s ( V cosh L eff 2l α bi φ s0 ) -- 2 iv sinh z ds 2l α 2 cosh sinh L eff 2l α (3c) (3d) Fig. 2 shows the MEDICI-simulated doping profiles across the surface channel for four different devices with increasing channel length starting from 0.24 µm up to 1 µm. As shown in Fig. 2, when the channel length is long, such as in the case of L g 0.5 µm and 1 µm, their center channel doping profiles overlap each other, thus producing a threshold voltage independent of the channel length. But this is not true for the case when L g 0.24 µm, where its center channel doping profile is higher than its long-channel counterpart. Its center channel profile is higher because the two pile-up profiles at the source and drain edges overlap each other, thereby causing RSCE to be observed as the device shrinks. l α αφ ( s0 V bs ) 0.25 l β βφ ( s0 V bs ) 0.25 V bi φ s0 + V ds z ln V bi φ s0 (3e) (3f) (3g) The threshold voltage expression consists of three main terms, namely, the flat-band voltage, the surface potential and the voltage across the insulated gate dielectric. V FB, γ, n i, and 52

3 Physics-Based Threshold Voltage Modeling with Reverse Short Channel Effect V bi are the flat-band voltage, body-effect factor, intrinsic doping concentration, and built-in potential, respectively. φ s0 and φ s are the surface potentials without and with considering the barrier-lowering effect. φ s is the surface potential barrier lowering based on quasi-2d formulation, with l α being the characteristic length of the non-uniform surface potential profile. The square root term in the V th expression is based on charge sharing formulation. N pile, α, β, λ, i, and j are processdependent fitting parameters in the V th model. However, there are only two parameters that determine the RSCE, which are used to characterize the lateral non-uniform Gaussian profiles. They are the characteristic length l β (which determines the lateral spread of the pile-up) and the peak concentration N pile (which determines the amount of the pileup). As the channel length of MOSFET reduces, its effective doping value increases exponentially, causing a roll-up characteristic of the V th - L g curve at decreasing, which is known as the RSCE. 3. Discussion There exist various empirical RSCE models, which are introduced based on the anomalous RSCE trend observed in advanced MOSFETs. One of the empirical models that is very similar to the proposed model is explained in [7], and rewritten below: N pile N eff N s (4) cosh( ( 2l β )) Similar to the proposed effective channel-doping model, this empirical model has two important terms, namely, the effective vertical doping (N s ) and the lateral non-uniform pile-up. The pile-up term has two process-dependent fitting parameters, N pile and l β, which are same as the proposed model. However, the proposed model and the empirical model have different pile-up functionality. The proposed model is an error function for the horizontal non-uniformity whereas (4) employs a hyperbolic cosine function. Unlike the proposed model that assumes two Gaussian-shaped pile-up profiles at the source and drain edges, the empirical model is borrowed from the quasi-2d potential barrier lowering solution [7]. Fig. 3 compares the two N eff models. The solid lines illustrate the characteristic of the proposed N eff model for three increasing l β values (0.08; 0.1; 0.12 µm), whereas the dashed lines represent the characteristic of the hyperbolic cosine N eff model for the same set of l β. The N s terms in (2) and (4) are both fixed to 6x10 17 cm -3, and N pile is fixed to 2x10 17 cm -3. As seen from Fig. 3, the roll-up behavior of the proposed model begins at a longer channel length. Its roll-up rate is gradual with smaller initial roll-up rate followed by steeper roll-up rate when L g is below 1 µm. As for the empirical hyperbolic cosine model, it shows no roll-up until L g is below 1 µm, and a abrupt roll-up is observed. Therefore, the hyperbolic cosine model tends to give a more abrupt V th roll-up as compared to the proposed model. The parameters l β and N pile control the roll-up part of the V th - L g curve. When l β or N pile increases, larger RSCE is observed. The effect of l β and N pile on V th roll-up is illustrated in Figs. 6a and 6b. The two parameters contribute differently to the V th roll-up characteristic. When l β changes, there is no change at the roll-off portion of the V th - L g curve. The roll-off portion will only shift when N pile changes, as shown in Fig. 4b. This is because l β represents the characteristic length of the pile-up profile, which determines the spread of the pile-up profile. When l β increases, the two pile-up profile will meet at a longer channel length, thereby causing the onset of V th rollup occuring at a longer channel length. Once the two profiles meet, the amount additional pile-up charges will remain the same as long as N pile is unchanged, so the roll-off characteristic will be the same based on the principle of charge sharing. On the other hand, if N pile increases, there will be more pile-up charges, thereby causing a consistent shift in the roll-off portion of the V th - L g curve, but the onset of roll-up will remain the same. In Fig. 4a, the onset of V th roll-up for different l β is not clearly separated due to the intrinsic nature of the proposed model, which has a gradual roll-up characteristic. If similar l β changes are applied to the empirical RSCE model (4), its onset roll-up is clearly related to the l β value, as seen in Fig. 5a. Fig. 5a and Fig. 5b are reproduced from Fig. 2d and Fig. 2e of [7], with the same respective l β and N pile changes as in Figs. 4a and 4b. It is clearly seen from Fig. 5b that when N pile changes, the onset of roll-up is not altered, which confirms the physical representations of l β and N pile. Fig. 3: Effective channel doping against channel length for three different characteristic lengths. Solid lines: proposed RSCE model; Dashed lines: hyperbolic cosine model [7]. 53

4 JMSM, Vol. 2, No. 1, Pages 53-56, The derived model employs an error function instead of the empirical hyperbolic cosine function as proposed in [7]. Although it is less computationally efficient for error function as compared to hyperbolic cosine function, the proposed model has shown more accurate and physical results. Fig. 6a and Fig. 6b plot the same set of MEDICI-simulated V th data for three different characteristic lengths (l β 0.08, 0.1, and 0.12 µm) in three different symbols. The lines in Fig. 6a represent the newly proposed model, whereas the lines in Fig. 6b are the empirical V th model [7]. Although both can model the V th roll-up behavior, the new model shows a better match as compared to the hyperbolic cosine function, especially when the characteristic length is large. This is because the formulation of the model is based on the average of the individual local profiles, which is more accurate as the pile-up profile becomes more gradual. The empirical model is limited to pile-up profile that is abrupt with small characteristic length. Fig. 4: The proposed RSCE threshold voltage against channel length for l β variation and N pile variation. Fig. 6: Threshold voltage against channel length for three different characteristic lengths. proposed RSCE model; hyperbolic cosine model [7]. Symbols: MEDICI data, Lines: model data. Fig. 5: The empirical hyperbolic cosine RSCE threshold voltage against channel length for l β variation and N pile variation. Fig. 7a and Fig. 7b further verify the proposed RSCE V th model by comparing to the experimental data for a 0.25-µm CMOS technology with ten different channel lengths from 10 µm down to 0.2 µm. Four different Vbs conditions with low and high drain bias conditions are compared as shown in Figs. 54

5 Physics-Based Threshold Voltage Modeling with Reverse Short Channel Effect 7a and 7b, respectively. As is clearly shown, the proposed model can accurately model the actual experimental V th data. Fig. 7: Threshold voltage for various substrate biases. Symbols: experimental data, Lines: model data. Vds 0.1V; Vds 2.5V. 4. Conclusion In conclusion, the well-known RSCE has been characterized and modeled through the proposed N eff model. The model is developed based on two gradual Gaussian pile-up profiles and further reduced to a useful compact expression. It is more robust as compared to the previous proposed hyperbolic cosine model [7]. It is relatively easy to use and has good value to technology development and device modeling. References [1] K. Y. Lim, X. Zhou, "Modeling of Threshold Voltage with Non-uniform Substrate Doping," Proc. of the 1998 IEEE International Conference on Semiconductor Electronics (ICSE'98), Malaysia, 1998, pp [2] N. D. Arora, "Semi-empirical model for the threshold voltage of a double implanted MOSFET and its temperature dependence," Solid-State Electron., vol. 30, pp , [3] C. Lallement, M. Bucher, and C. Enz, "Modelling and characterization of non-uniform substrate doping," Solid-State Electron., vol. 41, pp , [4] W. Zhang and Z. Yang, "A new threshold voltage model for deep-submicron MOSFET's with non-uniform substrate dopings," 1997 Hong Kong Electron Devices Meeting, pp , [5] P. Ratnam, C. Andre, and T. Salama, "A new approach to the modelling of non-uniformly doped short channel MOSFET's," IEEE Trans. Electron Devices, vol. 31, pp , [6] D. A. Antoniadis, "Calculation of threshold voltage in non-uniformly doped MOSFET's," IEEE Trans. Electron Devices, vol. 31, pp , [7] X. Zhou, K. Y. Lim, and D. Lim, "A General Approach to Compact Threshold Voltage Formulation base on 2- D Numerical Simulation and Experimental Correlation for Deep-Submicron ULSI Technology Development," IEEE Trans. Electron Devices, vol. 47, pp , Jan [8] N. D. Arora, and M. S. Sharma, "Modeling the Anomalous Threshold Voltage Behavior of Submicrometer MOSFET's," IEEE Electron Device Lett., vol. 13, pp , Feb [9] M. K. Khanna, M. C. Thomas, R. S. Gupta, and S. Haldar, "An Analytical Model for Anomalous Threshold Voltage Behavior of Short Channel MOSFET's," Solid-State Electron., vol. 41, pp , [10] B. Yu, C. H. J. Wann, E. D. Nowak, K. Noda, and C. Hu, "Short-Channel Effect Improved by Lateral Channel-Engineering in Deep-Submicrometer MOSFET's," IEEE Trans. Electron Devices, vol. 44, pp , Apr [11] Y. Cheng, T. Sugii, K. Chen, and C. Hu, "Modeling of Small Size MOSFETs with Reverse Short Channel and Narrow Width Effects for Circuit Simulation," Solid-State Electron., vol. 41, pp , [12] Y. Cheng, T. Sugii, K. Chen, Z. Liu, M. C. Jeng, and C. Hu, "Modeling Reverse Short Channel and Narrow Width Effects in Small Size MOSFET's for Circuit Simulation," SISPAD'97, pp , [13] K. Y. Lim, X. Zhou, and D. Lim, "A predictive lengthdependent saturation current model based on accurate threshold voltage modeling," Proc. MSM99, Puerto Rico, Apr. 1999, pp Received in Cambridge, MA, USA, 19th February 2000 Paper 2/

6 JMSM, Vol. 2, No. 1, Pages 53-56,

Department of Electrical Engineering IIT Madras

Department of Electrical Engineering IIT Madras Department of Electrical Engineering IIT Madras Sample Questions on Semiconductor Devices EE3 applicants who are interested to pursue their research in microelectronics devices area (fabrication and/or

More information

Sub-Threshold Region Behavior of Long Channel MOSFET

Sub-Threshold Region Behavior of Long Channel MOSFET Sub-threshold Region - So far, we have discussed the MOSFET behavior in linear region and saturation region - Sub-threshold region is refer to region where Vt is less than Vt - Sub-threshold region reflects

More information

CHAPTER 3 TWO DIMENSIONAL ANALYTICAL MODELING FOR THRESHOLD VOLTAGE

CHAPTER 3 TWO DIMENSIONAL ANALYTICAL MODELING FOR THRESHOLD VOLTAGE 49 CHAPTER 3 TWO DIMENSIONAL ANALYTICAL MODELING FOR THRESHOLD VOLTAGE 3.1 INTRODUCTION A qualitative notion of threshold voltage V th is the gate-source voltage at which an inversion channel forms, which

More information

Drive performance of an asymmetric MOSFET structure: the peak device

Drive performance of an asymmetric MOSFET structure: the peak device MEJ 499 Microelectronics Journal Microelectronics Journal 30 (1999) 229 233 Drive performance of an asymmetric MOSFET structure: the peak device M. Stockinger a, *, A. Wild b, S. Selberherr c a Institute

More information

NAME: Last First Signature

NAME: Last First Signature UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE 130: IC Devices Spring 2003 FINAL EXAMINATION NAME: Last First Signature STUDENT

More information

Channel Engineering for Submicron N-Channel MOSFET Based on TCAD Simulation

Channel Engineering for Submicron N-Channel MOSFET Based on TCAD Simulation Australian Journal of Basic and Applied Sciences, 2(3): 406-411, 2008 ISSN 1991-8178 Channel Engineering for Submicron N-Channel MOSFET Based on TCAD Simulation 1 2 3 R. Muanghlua, N. Vittayakorn and A.

More information

Lecture 31 - The Short Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 25, 2007

Lecture 31 - The Short Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 25, 2007 6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 31-1 Lecture 31 - The Short Metal-Oxide-Semiconductor Field-Effect Transistor (cont.) April 25, 2007 Contents: 1. Short-channel effects

More information

CHAPTER 2 LITERATURE REVIEW

CHAPTER 2 LITERATURE REVIEW CHAPTER 2 LITERATURE REVIEW 2.1 Introduction of MOSFET The structure of the MOS field-effect transistor (MOSFET) has two regions of doping opposite that of the substrate, one at each edge of the MOS structure

More information

Session 10: Solid State Physics MOSFET

Session 10: Solid State Physics MOSFET Session 10: Solid State Physics MOSFET 1 Outline A B C D E F G H I J 2 MOSCap MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor: Al (metal) SiO2 (oxide) High k ~0.1 ~5 A SiO2 A n+ n+ p-type Si (bulk)

More information

EFFECT OF THRESHOLD VOLTAGE AND CHANNEL LENGTH ON DRAIN CURRENT OF SILICON N-MOSFET

EFFECT OF THRESHOLD VOLTAGE AND CHANNEL LENGTH ON DRAIN CURRENT OF SILICON N-MOSFET EFFECT OF THRESHOLD VOLTAGE AND CHANNEL LENGTH ON DRAIN CURRENT OF SILICON N-MOSFET A.S.M. Bakibillah Nazibur Rahman Dept. of Electrical & Electronic Engineering, American International University Bangladesh

More information

Performance Evaluation of MISISFET- TCAD Simulation

Performance Evaluation of MISISFET- TCAD Simulation Performance Evaluation of MISISFET- TCAD Simulation Tarun Chaudhary Gargi Khanna Rajeevan Chandel ABSTRACT A novel device n-misisfet with a dielectric stack instead of the single insulator of n-mosfet

More information

Solid State Device Fundamentals

Solid State Device Fundamentals Solid State Device Fundamentals 4.4. Field Effect Transistor (MOSFET) ENS 463 Lecture Course by Alexander M. Zaitsev alexander.zaitsev@csi.cuny.edu Tel: 718 982 2812 4N101b 1 Field-effect transistor (FET)

More information

Lecture-45. MOS Field-Effect-Transistors Threshold voltage

Lecture-45. MOS Field-Effect-Transistors Threshold voltage Lecture-45 MOS Field-Effect-Transistors 7.4. Threshold voltage In this section we summarize the calculation of the threshold voltage and discuss the dependence of the threshold voltage on the bias applied

More information

Abhinav Kranti, Rashmi, S Haldar 1 & R S Gupta

Abhinav Kranti, Rashmi, S Haldar 1 & R S Gupta Indian Journal of Pure & Applied Physics Vol. 4, March 004, pp 11-0 Modelling of threshold voltage adjustment in fully depleted double gate (DG) SOI MOSFETs in volume inversion to quantify requirements

More information

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha

ECE520 VLSI Design. Lecture 2: Basic MOS Physics. Payman Zarkesh-Ha ECE520 VLSI Design Lecture 2: Basic MOS Physics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Review of Last Lecture Semiconductor

More information

Modeling & Analysis of Surface Potential and Threshold Voltage for Narrow channel 3D FDSOI MOSFET

Modeling & Analysis of Surface Potential and Threshold Voltage for Narrow channel 3D FDSOI MOSFET Modeling & Analysis of Surface Potential and Threshold Voltage for Narrow channel 3D... 273 IJCTA, 9(22), 2016, pp. 273-278 International Science Press Modeling & Analysis of Surface Potential and Threshold

More information

SCALING AND NUMERICAL SIMULATION ANALYSIS OF 50nm MOSFET INCORPORATING DIELECTRIC POCKET (DP-MOSFET)

SCALING AND NUMERICAL SIMULATION ANALYSIS OF 50nm MOSFET INCORPORATING DIELECTRIC POCKET (DP-MOSFET) SCALING AND NUMERICAL SIMULATION ANALYSIS OF 50nm MOSFET INCORPORATING DIELECTRIC POCKET (DP-MOSFET) Zul Atfyi Fauzan M. N., Ismail Saad and Razali Ismail Faculty of Electrical Engineering, Universiti

More information

MOSFET Parasitic Elements

MOSFET Parasitic Elements MOSFET Parasitic Elements Three MITs of the ay Components of the source resistance and their influence on g m and R d Gate-induced drain leakage (GIL) and its effect on lowest possible leakage current

More information

AS THE GATE-oxide thickness is scaled and the gate

AS THE GATE-oxide thickness is scaled and the gate 1174 IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 46, NO. 6, JUNE 1999 A New Quasi-2-D Model for Hot-Carrier Band-to-Band Tunneling Current Kuo-Feng You, Student Member, IEEE, and Ching-Yuan Wu, Member,

More information

improving further the mobility, and therefore the channel conductivity. The positive pattern definition proposed by Hirayama [6] was much improved in

improving further the mobility, and therefore the channel conductivity. The positive pattern definition proposed by Hirayama [6] was much improved in The two-dimensional systems embedded in modulation-doped heterostructures are a very interesting and actual research field. The FIB implantation technique can be successfully used to fabricate using these

More information

MOSFET FUNDAMENTALS OPERATION & MODELING

MOSFET FUNDAMENTALS OPERATION & MODELING MOSFET FUNDAMENTALS OPERATION & MODELING MOSFET MODELING AND OPERATION MOSFET Fundamentals MOSFET Physical Structure and Operation MOSFET Large Signal I-V Characteristics Subthreshold Triode Saturation

More information

Why Scaling? CPU speed Chip size R, C CPU can increase speed by reducing occupying area.

Why Scaling? CPU speed Chip size R, C CPU can increase speed by reducing occupying area. Why Scaling? Higher density : Integration of more transistors onto a smaller chip : reducing the occupying area and production cost Higher Performance : Higher current drive : smaller metal to metal capacitance

More information

An Analytical model of the Bulk-DTMOS transistor

An Analytical model of the Bulk-DTMOS transistor Journal of Electron Devices, Vol. 8, 2010, pp. 329-338 JED [ISSN: 1682-3427 ] Journal of Electron Devices www.jeldev.org An Analytical model of the Bulk-DTMOS transistor Vandana Niranjan Indira Gandhi

More information

ANALYTICAL MODELING AND CHARACTERIZATION OF CYLINDRICAL GATE ALL AROUND MOSFET

ANALYTICAL MODELING AND CHARACTERIZATION OF CYLINDRICAL GATE ALL AROUND MOSFET ANALYTICAL MODELING AND CHARACTERIZATION OF CYLINDRICAL GATE ALL AROUND MOSFET Shailly Garg 1, Prashant Mani Yadav 2 1 Student, SRM University 2 Assistant Professor, Department of Electronics and Communication,

More information

Section 2.3 Bipolar junction transistors - BJTs

Section 2.3 Bipolar junction transistors - BJTs Section 2.3 Bipolar junction transistors - BJTs Single junction devices, such as p-n and Schottkty diodes can be used to obtain rectifying I-V characteristics, and to form electronic switching circuits

More information

Substrate Bias Effects on Drain Induced Barrier Lowering (DIBL) in Short Channel NMOS FETs

Substrate Bias Effects on Drain Induced Barrier Lowering (DIBL) in Short Channel NMOS FETs Australian Journal of Basic and Applied Sciences, 3(3): 1640-1644, 2009 ISSN 1991-8178 Substrate Bias Effects on Drain Induced Barrier Lowering (DIBL) in Short Channel NMOS FETs 1 1 1 1 2 A. Ruangphanit,

More information

Lecture 24 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) The Long Metal-Oxide-Semiconductor Field-Effect Transistor

Lecture 24 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) The Long Metal-Oxide-Semiconductor Field-Effect Transistor 6.720J/3.43J - Integrated Microelectronic Devices - Spring 2007 Lecture 24-1 Lecture 24 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) The Long Metal-Oxide-Semiconductor Field-Effect

More information

Charge-Based Continuous Equations for the Transconductance and Output Conductance of Graded-Channel SOI MOSFET s

Charge-Based Continuous Equations for the Transconductance and Output Conductance of Graded-Channel SOI MOSFET s Charge-Based Continuous Equations for the Transconductance and Output Conductance of Graded-Channel SOI MOSFET s Michelly de Souza 1 and Marcelo Antonio Pavanello 1,2 1 Laboratório de Sistemas Integráveis,

More information

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET)

FIELD EFFECT TRANSISTOR (FET) 1. JUNCTION FIELD EFFECT TRANSISTOR (JFET) FIELD EFFECT TRANSISTOR (FET) The field-effect transistor (FET) is a three-terminal device used for a variety of applications that match, to a large extent, those of the BJT transistor. Although there

More information

Semiconductor TCAD Tools

Semiconductor TCAD Tools Device Design Consideration for Nanoscale MOSFET Using Semiconductor TCAD Tools Teoh Chin Hong and Razali Ismail Department of Microelectronics and Computer Engineering, Universiti Teknologi Malaysia,

More information

Chapter 4. CMOS Cascode Amplifiers. 4.1 Introduction. 4.2 CMOS Cascode Amplifiers

Chapter 4. CMOS Cascode Amplifiers. 4.1 Introduction. 4.2 CMOS Cascode Amplifiers Chapter 4 CMOS Cascode Amplifiers 4.1 Introduction A single stage CMOS amplifier cannot give desired dc voltage gain, output resistance and transconductance. The voltage gain can be made to attain higher

More information

6.012 Microelectronic Devices and Circuits

6.012 Microelectronic Devices and Circuits Page 1 of 13 YOUR NAME Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 6.012 Microelectronic Devices and Circuits Final Eam Closed Book: Formula sheet provided;

More information

A Novel GGNMOS Macro-Model for ESD Circuit Simulation

A Novel GGNMOS Macro-Model for ESD Circuit Simulation Chinese Journal of Electronics Vol.18, No.4, Oct. 2009 A Novel GGNMOS Macro-Model for ESD Circuit Simulation JIAO Chao and YU Zhiping (Institute of Microelectronics, Tsinghua University, Beijing 100084,

More information

Optimization of Threshold Voltage for 65nm PMOS Transistor using Silvaco TCAD Tools

Optimization of Threshold Voltage for 65nm PMOS Transistor using Silvaco TCAD Tools IOSR Journal of Electrical and Electronics Engineering (IOSR-JEEE) e-issn: 2278-1676,p-ISSN: 2320-3331, Volume 6, Issue 1 (May. - Jun. 2013), PP 62-67 Optimization of Threshold Voltage for 65nm PMOS Transistor

More information

UNIT 3: FIELD EFFECT TRANSISTORS

UNIT 3: FIELD EFFECT TRANSISTORS FIELD EFFECT TRANSISTOR: UNIT 3: FIELD EFFECT TRANSISTORS The field effect transistor is a semiconductor device, which depends for its operation on the control of current by an electric field. There are

More information

EECS 312: Digital Integrated Circuits Lab Project 2 Extracting Electrical and Physical Parameters from MOSFETs. Teacher: Robert Dick GSI: Shengshuo Lu

EECS 312: Digital Integrated Circuits Lab Project 2 Extracting Electrical and Physical Parameters from MOSFETs. Teacher: Robert Dick GSI: Shengshuo Lu EECS 312: Digital Integrated Circuits Lab Project 2 Extracting Electrical and Physical Parameters from MOSFETs Teacher: Robert Dick GSI: Shengshuo Lu Due 3 October 1 Introduction In this lab project, we

More information

Power MOSFET Zheng Yang (ERF 3017,

Power MOSFET Zheng Yang (ERF 3017, ECE442 Power Semiconductor Devices and Integrated Circuits Power MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Evolution of low-voltage (

More information

INTERNATIONAL JOURNAL OF APPLIED ENGINEERING RESEARCH, DINDIGUL Volume 1, No 3, 2010

INTERNATIONAL JOURNAL OF APPLIED ENGINEERING RESEARCH, DINDIGUL Volume 1, No 3, 2010 Low Power CMOS Inverter design at different Technologies Vijay Kumar Sharma 1, Surender Soni 2 1 Department of Electronics & Communication, College of Engineering, Teerthanker Mahaveer University, Moradabad

More information

THE METAL-SEMICONDUCTOR CONTACT

THE METAL-SEMICONDUCTOR CONTACT THE METAL-SEMICONDUCTOR CONTACT PROBLEM 1 To calculate the theoretical barrier height, built-in potential barrier, and maximum electric field in a metal-semiconductor diode for zero applied bias. Consider

More information

Design cycle for MEMS

Design cycle for MEMS Design cycle for MEMS Design cycle for ICs IC Process Selection nmos CMOS BiCMOS ECL for logic for I/O and driver circuit for critical high speed parts of the system The Real Estate of a Wafer MOS Transistor

More information

SUBTHRESHOLD operation of a MOSFET has long been

SUBTHRESHOLD operation of a MOSFET has long been IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, VOL. 16, NO. 4, APRIL 1997 343 A Three-Parameters-Only MOSFET Subthreshold Current CAD Model Considering Back-Gate Bias and

More information

LEAKAGE POWER REDUCTION IN CMOS CIRCUITS USING LEAKAGE CONTROL TRANSISTOR TECHNIQUE IN NANOSCALE TECHNOLOGY

LEAKAGE POWER REDUCTION IN CMOS CIRCUITS USING LEAKAGE CONTROL TRANSISTOR TECHNIQUE IN NANOSCALE TECHNOLOGY LEAKAGE POWER REDUCTION IN CMOS CIRCUITS USING LEAKAGE CONTROL TRANSISTOR TECHNIQUE IN NANOSCALE TECHNOLOGY Abhishek Sharma 1,Shipra Mishra 2 1 M.Tech. Embedded system & VLSI Design NITM,Gwalior M.P. India

More information

Analytical Model for Surface Potential and Inversion Charge of Dual Material Double Gate Son MOSFET

Analytical Model for Surface Potential and Inversion Charge of Dual Material Double Gate Son MOSFET International Journal of Engineering and Technical Research (IJETR) Analytical Model for Surface Potential and Inversion Charge of Dual Material Double Gate Son MOSFET Gaurabh Yadav, Mr. Vaibhav Purwar

More information

Performance investigations of novel dual-material gate (DMG) MOSFET with dielectric pockets (DP)

Performance investigations of novel dual-material gate (DMG) MOSFET with dielectric pockets (DP) Science in China Series E: Technological Sciences 2009 SCIENCE IN CHINA PRESS www.scichina.com tech.scichina.com Performance investigations of novel dual-material gate (DMG) MOSFET with dielectric pockets

More information

(Refer Slide Time: 02:05)

(Refer Slide Time: 02:05) Electronics for Analog Signal Processing - I Prof. K. Radhakrishna Rao Department of Electrical Engineering Indian Institute of Technology Madras Lecture 27 Construction of a MOSFET (Refer Slide Time:

More information

CHAPTER 8 The PN Junction Diode

CHAPTER 8 The PN Junction Diode CHAPTER 8 The PN Junction Diode Consider the process by which the potential barrier of a PN junction is lowered when a forward bias voltage is applied, so holes and electrons can flow across the junction

More information

ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline:

ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline: ECE 340 Lecture 37 : Metal- Insulator-Semiconductor FET Class Outline: Metal-Semiconductor Junctions MOSFET Basic Operation MOS Capacitor Things you should know when you leave Key Questions What is the

More information

Solid State Devices- Part- II. Module- IV

Solid State Devices- Part- II. Module- IV Solid State Devices- Part- II Module- IV MOS Capacitor Two terminal MOS device MOS = Metal- Oxide- Semiconductor MOS capacitor - the heart of the MOSFET The MOS capacitor is used to induce charge at the

More information

EE 5611 Introduction to Microelectronic Technologies Fall Thursday, September 04, 2014 Lecture 02

EE 5611 Introduction to Microelectronic Technologies Fall Thursday, September 04, 2014 Lecture 02 EE 5611 Introduction to Microelectronic Technologies Fall 2014 Thursday, September 04, 2014 Lecture 02 1 Lecture Outline Review on semiconductor materials Review on microelectronic devices Example of microelectronic

More information

Analysis on Effective parameters influencing Channel Length Modulation Index in MOS

Analysis on Effective parameters influencing Channel Length Modulation Index in MOS Analysis on Effective parameters influencing Channel Length Modulation ndex in MOS Abhishek Debroy, Rahul Choudhury,Tanmana Sadhu 2 Department of ECE,NT Agartala, Tripura 2 Department of ECE,St. Thomas

More information

FET. Field Effect Transistors ELEKTRONIKA KONTROL. Eka Maulana, ST, MT, M.Eng. Universitas Brawijaya. p + S n n-channel. Gate. Basic structure.

FET. Field Effect Transistors ELEKTRONIKA KONTROL. Eka Maulana, ST, MT, M.Eng. Universitas Brawijaya. p + S n n-channel. Gate. Basic structure. FET Field Effect Transistors ELEKTRONIKA KONTROL Basic structure Gate G Source S n n-channel Cross section p + p + p + G Depletion region Drain D Eka Maulana, ST, MT, M.Eng. Universitas Brawijaya S Channel

More information

Advanced MOSFET Basics. Dr. Lynn Fuller

Advanced MOSFET Basics. Dr. Lynn Fuller ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Advanced MOSFET Basics Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035

More information

Two Dimensional Analytical Threshold Voltages Modeling for Short-Channel MOSFET

Two Dimensional Analytical Threshold Voltages Modeling for Short-Channel MOSFET Two Dimensional Analytical Threshold Voltages Modeling for Short-Channel MOSFET Sanjeev kumar Singh, Vishal Moyal Electronics & Telecommunication, SSTC-SSGI, Bhilai, Chhatisgarh, India Abstract- The aim

More information

Chapter 2 : Semiconductor Materials & Devices (II) Feb

Chapter 2 : Semiconductor Materials & Devices (II) Feb Chapter 2 : Semiconductor Materials & Devices (II) 1 Reference 1. SemiconductorManufacturing Technology: Michael Quirk and Julian Serda (2001) 3. Microelectronic Circuits (5/e): Sedra & Smith (2004) 4.

More information

UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences.

UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences. UNIVERSITY OF CALIFORNIA AT BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences Discussion #9 EE 05 Spring 2008 Prof. u MOSFETs The standard MOSFET structure is shown

More information

Lecture 4. MOS transistor theory

Lecture 4. MOS transistor theory Lecture 4 MOS transistor theory 1.7 Introduction: A MOS transistor is a majority-carrier device, in which the current in a conducting channel between the source and the drain is modulated by a voltage

More information

Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004

Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004 Student Lecture by: Giangiacomo Groppi Joel Cassell Pierre Berthelot September 28 th 2004 Lecture outline Historical introduction Semiconductor devices overview Bipolar Junction Transistor (BJT) Field

More information

MOSFET & IC Basics - GATE Problems (Part - I)

MOSFET & IC Basics - GATE Problems (Part - I) MOSFET & IC Basics - GATE Problems (Part - I) 1. Channel current is reduced on application of a more positive voltage to the GATE of the depletion mode n channel MOSFET. (True/False) [GATE 1994: 1 Mark]

More information

Assignment 1 SOLUTIONS

Assignment 1 SOLUTIONS ELEC5509 Assignment 1 SOLUTIONS September 2013 The nmos technology used in ELEC4609 provides enhancement MOSFETs with VT = 0.7V and depletion MOSFETs with VTd = -3.0V. The gate oxide thickness t ox = 50nm

More information

2D Transconductance to Drain Current Ratio Modeling of Dual Material Surrounding Gate Nanoscale SOI MOSFETs

2D Transconductance to Drain Current Ratio Modeling of Dual Material Surrounding Gate Nanoscale SOI MOSFETs 0 N.B.BALAMURUGAN et al : D TRANSCONDUCTANCE TO DRAIN CURRENT RATIO MODELING OF D Transconductance to Drain Current Ratio Modeling of Dual Material Surrounding Gate Nanoscale SOI MOSFETs N.B.Balamurugan,

More information

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism;

Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; Chapter 3 Field-Effect Transistors (FETs) 3.1 Introduction Field-Effect Transistor (FET) is one of the two major transistors; FET derives its name from its working mechanism; The concept has been known

More information

Lecture 16: MOS Transistor models: Linear models, SPICE models. Context. In the last lecture, we discussed the MOS transistor, and

Lecture 16: MOS Transistor models: Linear models, SPICE models. Context. In the last lecture, we discussed the MOS transistor, and Lecture 16: MOS Transistor models: Linear models, SPICE models Context In the last lecture, we discussed the MOS transistor, and added a correction due to the changing depletion region, called the body

More information

UNIT 3 Transistors JFET

UNIT 3 Transistors JFET UNIT 3 Transistors JFET Mosfet Definition of BJT A bipolar junction transistor is a three terminal semiconductor device consisting of two p-n junctions which is able to amplify or magnify a signal. It

More information

Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET

Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET Evaluation of STI degradation using temperature dependence of leakage current in parasitic STI MOSFET Oleg Semenov a, Michael Obrecht b and Manoj Sachdev a a Dept. of Electrical and Computer Engineering,

More information

In this lecture we will begin a new topic namely the Metal-Oxide-Semiconductor Field Effect Transistor.

In this lecture we will begin a new topic namely the Metal-Oxide-Semiconductor Field Effect Transistor. Solid State Devices Dr. S. Karmalkar Department of Electronics and Communication Engineering Indian Institute of Technology, Madras Lecture - 38 MOS Field Effect Transistor In this lecture we will begin

More information

Lecture 4 -- Tuesday, Sept. 19: Non-uniform injection and/or doping. Diffusion. Continuity/conservation. The five basic equations.

Lecture 4 -- Tuesday, Sept. 19: Non-uniform injection and/or doping. Diffusion. Continuity/conservation. The five basic equations. 6.012 ELECTRONIC DEVICES AND CIRCUITS Schedule -- Fall 1995 (8/31/95 version) Recitation 1 -- Wednesday, Sept. 6: Review of 6.002 models for BJT. Discussion of models and modeling; motivate need to go

More information

M. Jagadesh Kumar and G. Venkateshwar Reddy Department of Electrical Engineering, Indian Institute of Technology, Hauz Khas, New Delhi , India

M. Jagadesh Kumar and G. Venkateshwar Reddy Department of Electrical Engineering, Indian Institute of Technology, Hauz Khas, New Delhi , India M. Jagadesh Kumar and G. V. Reddy, "Diminished Short Channel Effects in Nanoscale Double- Gate Silicon-on-Insulator Metal Oxide Field Effect Transistors due to Induced Back-Gate Step Potential," Japanese

More information

Introduction to Electronic Devices

Introduction to Electronic Devices Introduction to Electronic Devices (Course Number 300331) Fall 2006 Field Effect Transistors (FETs) Dr. Dietmar Knipp Assistant Professor of Electrical Engineering Information: http://www.faculty.iubremen.de/dknipp/

More information

8. Characteristics of Field Effect Transistor (MOSFET)

8. Characteristics of Field Effect Transistor (MOSFET) 1 8. Characteristics of Field Effect Transistor (MOSFET) 8.1. Objectives The purpose of this experiment is to measure input and output characteristics of n-channel and p- channel field effect transistors

More information

Experiment 3. 3 MOSFET Drain Current Modeling. 3.1 Summary. 3.2 Theory. ELEC 3908 Experiment 3 Student#:

Experiment 3. 3 MOSFET Drain Current Modeling. 3.1 Summary. 3.2 Theory. ELEC 3908 Experiment 3 Student#: Experiment 3 3 MOSFET Drain Current Modeling 3.1 Summary In this experiment I D vs. V DS and I D vs. V GS characteristics are measured for a silicon MOSFET, and are used to determine the parameters necessary

More information

This document is downloaded from DR-NTU, Nanyang Technological University Library, Singapore.

This document is downloaded from DR-NTU, Nanyang Technological University Library, Singapore. This document is downloaded from DR-NTU, Nanyang Technological University Library, Singapore. Title Going green for discrete power diode manufacturers Author(s) Tan, Cher Ming; Sun, Lina; Wang, Chase Citation

More information

Future MOSFET Devices using high-k (TiO 2 ) dielectric

Future MOSFET Devices using high-k (TiO 2 ) dielectric Future MOSFET Devices using high-k (TiO 2 ) dielectric Prerna Guru Jambheshwar University, G.J.U.S. & T., Hisar, Haryana, India, prernaa.29@gmail.com Abstract: In this paper, an 80nm NMOS with high-k (TiO

More information

Designing and Simulation of Full Adder Cell using Self Reverse Biasing Technique

Designing and Simulation of Full Adder Cell using Self Reverse Biasing Technique Designing and Simulation of Full Adder Cell using Self Reverse Biasing Technique Chandni jain 1, Shipra mishra 2 1 M.tech. Embedded system & VLSI Design NITM,Gwalior M.P. India 474001 2 Asst Prof. EC Dept.,

More information

EEC 216 Lecture #8: Leakage. Rajeevan Amirtharajah University of California, Davis

EEC 216 Lecture #8: Leakage. Rajeevan Amirtharajah University of California, Davis EEC 216 Lecture #8: Leakage Rajeevan Amirtharajah University of California, Davis Outline Announcements Review: Low Power Interconnect Finish Lecture 7 Leakage Mechanisms Circuit Styles for Low Leakage

More information

Xing ZHOU, Ph.D. EDUCATION

Xing ZHOU, Ph.D. EDUCATION EDUCATION Xing ZHOU, Ph.D. School of Electrical and Electronic Engineering, Nanyang Technological University, Block S1, Nanyang Avenue, Singapore 639798, Republic of Singapore Phone: (65) 6790-4532; Fax:

More information

Contents. Contents... v. Preface... xiii. Chapter 1 Introduction...1. Chapter 2 Significant Physical Effects In Modern MOSFETs...

Contents. Contents... v. Preface... xiii. Chapter 1 Introduction...1. Chapter 2 Significant Physical Effects In Modern MOSFETs... Contents Contents... v Preface... xiii Chapter 1 Introduction...1 1.1 Compact MOSFET Modeling for Circuit Simulation...1 1.2 The Trends of Compact MOSFET Modeling...5 1.2.1 Modeling new physical effects...5

More information

2014, IJARCSSE All Rights Reserved Page 1352

2014, IJARCSSE All Rights Reserved Page 1352 Volume 4, Issue 3, March 2014 ISSN: 2277 128X International Journal of Advanced Research in Computer Science and Software Engineering Research Paper Available online at: www.ijarcsse.com Double Gate N-MOSFET

More information

IMPROVED CURRENT MIRROR OUTPUT PERFORMANCE BY USING GRADED-CHANNEL SOI NMOSFETS

IMPROVED CURRENT MIRROR OUTPUT PERFORMANCE BY USING GRADED-CHANNEL SOI NMOSFETS IMPROVED CURRENT MIRROR OUTPUT PERFORMANCE BY USING GRADED-CHANNEL SOI NMOSFETS Marcelo Antonio Pavanello *, João Antonio Martino and Denis Flandre 1 Laboratório de Sistemas Integráveis Escola Politécnica

More information

4.1 Device Structure and Physical Operation

4.1 Device Structure and Physical Operation 10/12/2004 4_1 Device Structure and Physical Operation blank.doc 1/2 4.1 Device Structure and Physical Operation Reading Assignment: pp. 235-248 Chapter 4 covers Field Effect Transistors ( ) Specifically,

More information

Three Terminal Devices

Three Terminal Devices Three Terminal Devices - field effect transistor (FET) - bipolar junction transistor (BJT) - foundation on which modern electronics is built - active devices - devices described completely by considering

More information

45nm Bulk CMOS Within-Die Variations. Courtesy of C. Spanos (UC Berkeley) Lecture 11. Process-induced Variability I: Random

45nm Bulk CMOS Within-Die Variations. Courtesy of C. Spanos (UC Berkeley) Lecture 11. Process-induced Variability I: Random 45nm Bulk CMOS Within-Die Variations. Courtesy of C. Spanos (UC Berkeley) Lecture 11 Process-induced Variability I: Random Random Variability Sources and Characterization Comparisons of Different MOSFET

More information

Organic Electronics. Information: Information: 0331a/ 0442/

Organic Electronics. Information: Information:  0331a/ 0442/ Organic Electronics (Course Number 300442 ) Spring 2006 Organic Field Effect Transistors Instructor: Dr. Dietmar Knipp Information: Information: http://www.faculty.iubremen.de/course/c30 http://www.faculty.iubremen.de/course/c30

More information

Simulation of MOSFETs, BJTs and JFETs. At and Near the Pinch-off Region. Xuan Yang

Simulation of MOSFETs, BJTs and JFETs. At and Near the Pinch-off Region. Xuan Yang Simulation of MOSFETs, BJTs and JFETs At and Near the Pinch-off Region by Xuan Yang A Thesis Presented in Partial Fulfillment of the Requirements for the Degree Master of Science Approved November 2011

More information

MOS Field-Effect Transistors (MOSFETs)

MOS Field-Effect Transistors (MOSFETs) 6 MOS Field-Effect Transistors (MOSFETs) A three-terminal device that uses the voltages of the two terminals to control the current flowing in the third terminal. The basis for amplifier design. The basis

More information

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s.

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s. UNIT-I FIELD EFFECT TRANSISTOR 1. Explain about the Field Effect Transistor and also mention types of FET s. The Field Effect Transistor, or simply FET however, uses the voltage that is applied to their

More information

Semiconductor Physics and Devices

Semiconductor Physics and Devices Metal-Semiconductor and Semiconductor Heterojunctions The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is one of two major types of transistors. The MOSFET is used in digital circuit, because

More information

DURING the past decade, CMOS technology has seen

DURING the past decade, CMOS technology has seen IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 51, NO. 9, SEPTEMBER 2004 1463 Investigation of the Novel Attributes of a Fully Depleted Dual-Material Gate SOI MOSFET Anurag Chaudhry and M. Jagadesh Kumar,

More information

A Review of Analytical Modelling Of Thermal Noise in MOSFET

A Review of Analytical Modelling Of Thermal Noise in MOSFET A Review of Analytical Modelling Of Thermal Noise in MOSFET Seemadevi B. Patil, Kureshi Abdul Kadir AP, Jayawantrao Sawant College of Engineering, Pune, Maharashtra, India Principal, Vishwabharati Academy

More information

EE 330 Laboratory 7 MOSFET Device Experimental Characterization and Basic Applications Spring 2017

EE 330 Laboratory 7 MOSFET Device Experimental Characterization and Basic Applications Spring 2017 EE 330 Laboratory 7 MOSFET Device Experimental Characterization and Basic Applications Spring 2017 Objective: The objective of this laboratory experiment is to become more familiar with the operation of

More information

EE70 - Intro. Electronics

EE70 - Intro. Electronics EE70 - Intro. Electronics Course website: ~/classes/ee70/fall05 Today s class agenda (November 28, 2005) review Serial/parallel resonant circuits Diode Field Effect Transistor (FET) f 0 = Qs = Qs = 1 2π

More information

AN1228 Application note How to relate LMOS device parameters to RF performance Introduction

AN1228 Application note How to relate LMOS device parameters to RF performance Introduction Application note How to relate LMOS device parameters to RF performance Introduction This second installment of a two-part paper series on LDMOS technology (see Understanding LDMOS Device Fundamentals,

More information

Reliability of deep submicron MOSFETs

Reliability of deep submicron MOSFETs Invited paper Reliability of deep submicron MOSFETs Francis Balestra Abstract In this work, a review of the reliability of n- and p-channel Si and SOI MOSFETs as a function of gate length and temperature

More information

Davinci. Semiconductor Device Simulaion in 3D SYSTEMS PRODUCTS LOGICAL PRODUCTS PHYSICAL IMPLEMENTATION SIMULATION AND ANALYSIS LIBRARIES TCAD

Davinci. Semiconductor Device Simulaion in 3D SYSTEMS PRODUCTS LOGICAL PRODUCTS PHYSICAL IMPLEMENTATION SIMULATION AND ANALYSIS LIBRARIES TCAD SYSTEMS PRODUCTS LOGICAL PRODUCTS PHYSICAL IMPLEMENTATION SIMULATION AND ANALYSIS LIBRARIES TCAD Aurora DFM WorkBench Davinci Medici Raphael Raphael-NES Silicon Early Access TSUPREM-4 Taurus-Device Taurus-Lithography

More information

Digital Integrated Circuits A Design Perspective. The Devices. Digital Integrated Circuits 2nd Devices

Digital Integrated Circuits A Design Perspective. The Devices. Digital Integrated Circuits 2nd Devices Digital Integrated Circuits A Design Perspective The Devices The Diode The diodes are rarely explicitly used in modern integrated circuits However, a MOS transistor contains at least two reverse biased

More information

Nanoscale MOSFET Modeling for the Design of Low-power Analog and RF Circuits Part I

Nanoscale MOSFET Modeling for the Design of Low-power Analog and RF Circuits Part I Nanoscale MOSFET Modeling for the Design of Low-power Analog and RF Circuits Part I Invited Paper Christian Enz, Francesco Chicco, Alessandro Pezzotta LAB, EPFL, Neuchâtel, Switzerland christian.enz@epfl.ch

More information

MOS Field Effect Transistors

MOS Field Effect Transistors MOS Field Effect Transistors A gate contact gate interconnect n polysilicon gate source contacts W active area (thin oxide area) polysilicon gate contact metal interconnect drain contacts A bulk contact

More information

Direct calculation of metal oxide semiconductor field effect transistor high frequency noise parameters

Direct calculation of metal oxide semiconductor field effect transistor high frequency noise parameters Direct calculation of metal oxide semiconductor field effect transistor high frequency noise parameters C. H. Chen and M. J. Deen a) Engineering Science, Simon Fraser University, Burnaby, British Columbia

More information

Reg. No. : Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Second Semester

Reg. No. : Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Second Semester WK 5 Reg. No. : Question Paper Code : 27184 B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER 2015. Time : Three hours Second Semester Electronics and Communication Engineering EC 6201 ELECTRONIC DEVICES

More information

CHAPTER 8 The PN Junction Diode

CHAPTER 8 The PN Junction Diode CHAPTER 8 The PN Junction Diode Consider the process by which the potential barrier of a PN junction is lowered when a forward bias voltage is applied, so holes and electrons can flow across the junction

More information

LECTURE 4 SPICE MODELING OF MOSFETS

LECTURE 4 SPICE MODELING OF MOSFETS LECTURE 4 SPICE MODELING OF MOSFETS Objectives for Lecture 4* Understanding the element description for MOSFETs Understand the meaning and significance of the various parameters in SPICE model levels 1

More information