Gas Discharge Tube (GDT) Products. CG/CG2 Series. CG/CG2 Series
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- Marvin Blake
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1 Description Littelfuse highly reliable GDTs provide a high degree of surge protection in a small size ideal for board level circuit protection. GDTs function as switches which dissipate a minimum amount of energy and therefore handle currents that far surpass other types of transient voltage protection. Their gas-filled, rugged ceramic metal construction make them well suited to adverse environments. Agency Approvals AGENCY AGENCY FILE NUMBER 2 Electrode GDT Graphical Symbol The CG/CG2 series comes in a variety of forms including surface mount, core, straight and shaped leads, to serve a variety of mounting methods. The CG Series (75-110V) is ideal for protection of test and communication equipment and other devices in which low voltage limits and extremely low arc voltages are required. The CG2 Series (145V-1000V) is ideal for protecting equipment where higher voltage limits and holdover voltages are necessary. Features construction (<1.5pf) mount, and a variety of lead options options Applications and equipment protection 30
2 Electrical Characteristics Part Number DC Breakdown in Volts Device Specifications (at 25 C) Breakdown in Volts Breakdown In Volts Kv/μsec) Insulation Resistance Capacitance Arc Voltage (on state Voltage) Surge Life 10/1000μs) Nominal Discharge Life Ratings Nominal AC Discharge (10x1sec AC Dischage (9 cycle DC Holdover Voltage 2 MIN TYP MAX MAX MIN MAX TYP TYP CG CG CG90 SN CG CG CG2145 SN CG CG2230 SN CG CG2250 SN CG CG2300 SN CG CG2350 SN CG CG CG2470 SN CG CG2600 SN (at 50V) (at 100V) 1.5 pf 15 V 400 shots 10 shots (@20kA) 3 CG shots 10 A CG (@10kA) 65 A 20 A 100 A Max Discharge 52 V 4kA 80 V 135 V 2.5kA Product Characteristics Materials Product Marking LS, Axial: Core: MS: LF Logo, Voltage and date code; Black in positive print Glow to arc transition current Glow Voltage Storage and Operational Temperature Maximum Follow On 1 31
3 Device Dimensions Leaded 'L' Type Straight Axial Devices Leaded 'LS' Type Shaped Lead Devices PROFILE VIEW 0.81 DIA. TYP. [0.032] TOP VIEW PROFILE VIEW 6.07 ± 0.3 [0.239 ± 0.012] TOP VIEW 8.10 Max. [0.319 DIA Max.] 8.10 DIA. MAX. [0.319] 8.40 ± 0.3 [0.331 ± 0.012] 6.07 ± 0.15 [0.239 ± 0.006] 62 ± Surfaces 9.85 ± 0.30 [0.388 ± 0.012] 0.40 ± 0.03 [ ± ] 8.4 ± 0.3 [0.331 ± 0.012] 0.80 [0.032] ± 0.30 [0.439 ± 0.012] Core Devices SOLDER PAD LAYOUT 9.85 [0.388] TOP VIEW PROFILE VIEW SEMI PROFILE VIEW 8.10 Max. [0.032 Max.] 8.10 Max ± 0.15 [0.239 ± ] 5.89 [0.232] 8.60 [0.339] [0.459] 1.80 [0.071] 0.47 ± 0.1 [0.019 ± ] 'MS' Type Devices TOP VIEW 8.30 ± 0.1 [0.327 ± ] PROFILE VIEW SEMI PROFILE VIEW 4 ± 0.2 [0.157 ± ] 5.58 [0.220] R5.29 [R0.208] 6.05 ± 0.2 [0.238 ± ] ø8.30± ± 0.2 [0.366 ± ] 0.47 ± 0.1 [0.019 ± ] SOLDER PAD LAYOUT 2.29 [0.090] 8.71 [0.343] 5.89 [0.232] 32
4 Temperature Gas Discharge Tube (GDT) Products Soldering Parameters - Reflow Soldering (Surface Mount Devices) Reflow Condition - Temperature Min (T s(min) ) 150 C T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max) ) 200 C - Time (Min to Max) (t s ) Average ramp up rate (Liquidus Temp (T L ) to peak T L T S(max) T S(min) Preheat t L Ramp-down T S(max) to T L - Ramp-up Rate 5 C/second max t S - Temperature (T L ) (Liquidus) 217 C Reflow - Temperature (t L ) Peak Temperature (T P ) C 25 time to peak temperature (t 25ºC to peak) Time Time within 5 C of actual peak Temperature (t p ) Ramp-down Rate Time 25 C to peak Temperature (T P ) Do not exceed Soldering Parameters - Wave Soldering (Thru-Hole Devices) 300 Recommended Process Parameters: Temperature ( C) - Measured on bottom side of board Wave Parameter Preheat: Solder Pot Temperature: Solder Dwell Time: Lead-Free Recommendation 100 C 150 C 2-5 seconds Time (Seconds) Preheat Time Dwell Time Cooling Time Soldering Parameters - Hand Soldering 33
5 Packaging Dimensions For 'L' Type Axial Lead Items <1.2 Max. Lead Bend [ ] <0.8 Max 52.4 [2.063] ] Direction of Feed 22.8 [0.898] 6.4 [0.252] 5.0 Pitch [0.197] Core and 'MS' Type Items 0.4 ± 0.05 [0.016 ± 0.002] 10x4 ± 0.1 = 40 ± 0.2 [10 x ± = ± 0.008] 1.75 ± 0.1 [0.069 ± 0.004] 1.5 DIA. MAX. [0.059] 4 ± 0.1 [0.157 ± 0.004] [10.83] 76.0 [2.99] [3.94] 25.0 [0.98] 8.5 ± 0.1 [0.335 ± 0.004] 7.5 ± 0.1 [0.295 ± 0.004] / -0.1 [ / ] 17.7 [0.697] Direction of Feed 8.6 ± 0.1 [0.339 ± 0.004] 1.5 DIA. MAX. [0.059] 12 ± 0.1 [0.472 ± 0.004] For 'LS' Type Shaped Lead Items 1.9 [0.075] 0.5 ± 0.05 [0.020 ± 0.002] 1.75 ± 0.1 [0.069 ± 0.004] 11.5 ± 0.1 [0.453 ± 0.004] 10x4 ± 0.1 = 40 ± 0.2 [10x.157 ± = ± 0.008] 1.5 DIA. MAX. [0.059] 4 ± 0.1 [0.157 ± 0.004] [10.82] 76.0 [2.99] [3.93] 25.0 [0.98] ± 0.1 [0.463 ± 0.004] 8 ± 0.1 [0.315 ± 0.004] / -0.1 [ / ] 25.7 [1.01] Direction of Feed 0.5 ± 0.01 [0.020 ± 0.004] 9 ± 0.1 [0.354 ± 0.004] 1.5 DIA. MAX. [0.059] 16 ± 0.1 [0.630 ± 0.004] 34
6 Part Numbering System and Ordering Information Series CG -- for 75, 90, or 110V CG2 -- for 145V to 1000V Breakdown Voltage Lead Option Code (Blank) = No Leads / Core L = Straight Leads LS = Shaped Leads MS = Surface Mount CG2 XXX XX * XX Option Code* SN = denotes different DC Breakover Voltage Limit. Please refer to Electrical Characteristics table for additional information. Packaging Option Code (Blank) = No Leads / Core, Bulk Bag pcs L(Blank) = Straight Lead, Tray - 50 pcs LTR = Straight Lead, Tape & Reel per EIA RS-296-E per reel LTE = Straight Lead, Tape & Reel per IEC per reel LS(Blank) = Shaped Lead (see LS dimensions), Tape & Reel per reel Examples: CG75 CG2230L CG2800LTR Notes: CG/CG2 devices with other breakdown voltages in the V range are available upon request. 35
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