Roadmap & Research Priorities Created by Alan Rae

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1 Roadmap & Research Priorities 2011 Created by Alan Rae

2 Topics Background inemi operation; Source(s) and Fit of Research Roadmap Research Priorities by Research Areas Design Manufacturing Materials & Reliability Sustainability Challenge Area Examples Printable electronics Rare earth shortages What this means to SMTA members

3 Roadmaps ITRS Semiconductor inemi Product emulator IPC Board, packaging and assembly Many other specialized roadmaps e.g. optoelectronics, MEMS, printed electronics Each roadmap team has representatives on the other roadmaps 2011 inemi individuals, 310 corporations,18 countries inemi Roadmap identifies gaps and showstoppers Operational, Tactical, Strategic Parsed into Technical Plan (Internal) + Research Plan

4 How it works

inemi Organization Regional Steering Committees

financial ethics & responsibility Focus Area

priorities Ensure membership support Direct

Emulator Groups Technology Needs 21 Technology

Research Committee Stimulate research to

Direct Collaborative R&D The Technical Plan &

5 inemi Organization Regional Steering Committees Help ensure that inemi addresses member needs in Europe & Asia Board of Directors Set strategic objectives & priorities Ensure financial ethics & responsibility Focus Area Steering Committees Drive progress on key priorities Ensure membership support Direct Roadmap Development Product Needs 6 Product Emulator Groups Technology Needs 21 Technology Working Groups Technical Committee Develop & integrate technology strategies & plans Drive/coordinate all technical activities Research Committee Stimulate research to address gaps identified by inemi roadmaps Direct Collaborative R&D The Technical Plan & Gaps are Defined By: 8 Technology Integration Groups Gap Analysis Workshop Identified Gaps Member Identified Needs

6 INEMI s Research Committee Alan Rae, TPF Enterprises Chair Bob Pfahl, inemi Secretary Carol Handwerker, Purdue University Co-Chair Bill Bader, INEMI Barbara Goldstein, NIST Lili Deligianni, IBM Bob Hilty, TE Electronics D.H.R. Sarma, Delphi Jie Xue, Cisco Mahadevan Iyer, TI Rao Tummala, Georgia Tech. Ravi Mahajan, Intel Rolf Aschenbrenner, Fraunhofer, IZM Voya Markovich, Endicott Interconnect Technologies 6 6

7 High Level Trends Automotive EV, displays, LED lighting, sensors Ready to go lead free? Office equipment Desktop laptop tablet bandwidth, power, touchscreen Servers power, thermal management, bandwidth The end of through-hole? (again)

Trends - Continued Netcom Wireless telecom, infrastructure, enterprise access everywhere, 4G + LTE, network bandwidth 40 100 200 Gb, WiMAX, Smart Grid, Cloud Medical

8 Trends - Continued Netcom Wireless telecom, infrastructure, enterprise access everywhere, 4G + LTE, network bandwidth Gb, WiMAX, Smart Grid, Cloud Medical Implantable, portable, imaging wide range, some life critical; sensors, operating environment e.g. hyperbaric, data management, supply chain, printed electronics; iphone apps

Trends - Continued Consumer / Portable Overlap with other PEGs medical, automotive + ITRS Thin / lightweight / power use/ bandwidth / displays Major driver of 3D packaging, flex, OLED Aerospace /

9 Trends - Continued Consumer / Portable Overlap with other PEGs medical, automotive + ITRS Thin / lightweight / power use/ bandwidth / displays Major driver of 3D packaging, flex, OLED Aerospace / Defense Lead-free global supply chain transition Counterfeit Unmanned Harsh environment, size / weight / power (US Navy) Conflict minerals and rare earths Data / bandwidth needs vs. thermal management Scaleback and program curtailment

10 Who Uses the Roadmap? Roadmap Published and available for sale on the inemi web site for companies to examine trends and needs Research Priorities Published and available for download free For companies, universities and government agencies and laboratories to establish their research and funding priorities Technical Plan Restricted to inemi members Identifies opportunities for collaborative projects

11 2011 Research Priorities inemi Focus Areas Miniaturization Environment Alternative Energy Medical Download free at Emerging Technologies MEMS Printable Electronics Solid State Illumination Advanced Optoelectronics Research Priorities Research Areas Design Manufacturing Process Materials & Reliability Sustainability

12 Research Priorities by Research Needs

Design Model lifetime reliability of wind and solar balance of system components Models of component reliability for high voltage DC solar and wind systems Predictive models of complex medical

13 Design Model lifetime reliability of wind and solar balance of system components Models of component reliability for high voltage DC solar and wind systems Predictive models of complex medical systems for reliability and mechanical and electrical performance Predictive modeling based on laminate materials properties that the inemi HF Leadership WG is developing. Stress free packaging of MEMS

14 Manufacturing High current density device packaging Technique for "Warm Assembly" of electronic assemblies Cost-effective process for yielding separated highpurity base metals (i.e., ferrous, aluminum, copper) and nonmetal materials from sorted electronic equipment and components Advances in 3D/TSV packaging Vacuum control of packaged MEMS Recycling (recovery) processes for REM and other critical materials High volume, low-cost testing methods for MEMS Advanced test solutions for high density boards

Materials and Reliability Alternative materials to REM (rare earth metals) for electronics Better understanding of Pb-free failure distributions and failure modes Develop the use of postconsumer

15 Materials and Reliability Alternative materials to REM (rare earth metals) for electronics Better understanding of Pb-free failure distributions and failure modes Develop the use of postconsumer electronic plastics and the use of recycled plastics in electronics Evaluate and recommend improved materials to qualify for use in implantable devices Understanding and predicting material properties that vary with thickness Surface finishes for conductors and dielectrics meeting adhesion and thermal stability requirements Next generation of solder materials that are lower cost, lower processing temperature, and improved deposition

Sustainability Ensure a sustainable supply of key Electronic Materials: Cd, Te, In, Se, Ga, Ge, and rare earths Develop simplified Life Cycle Analyses for key electronic materials including mined

16 Sustainability Ensure a sustainable supply of key Electronic Materials: Cd, Te, In, Se, Ga, Ge, and rare earths Develop simplified Life Cycle Analyses for key electronic materials including mined metal, petroleum based organic materials, and biomaterials Develop a simplified Life Cycle Analysis for additional key product segments Improve the understanding of the environmental impact of the use phase of electronic products

17 Large Area Flexible (Printable) Electronics

18 Why Print Electronics? Additive processes Low cost potential roll to roll Reduced environmental impact potential Fast Large area capability (displays, lighting) Critical to solar Ag current collector efficiency on c-si Can be used for thin film cells e.g. CIGS NanoSolar or NextGen (inorganic-organic matrix)

19 Which Printing Techniques?

20 Which Products Are / Will Be Printed? Displays Folding keyboards / flip phones Solar panels RFID tags On Glass Ceramics Polymers Paper Textiles Metals

21 Display Materials (Lux Research)

22 The Challenges Competing technologies Sputtering, CVD, PVD, photolithography Materials needs Function, form, cost Takt time / Cycle Time Most electronics processes minutes Most print processes fractions of seconds Demand or lack thereof

Process Needs Ink jet 0.001-0.04 Pa.s. (~10cps) Screen print 0.

23 Process Needs Ink jet Pa.s. (~10cps) Screen print Pa.s (~200,000cps) Offset litho up to 100 Pa.s Plus solvent compatibility, rate of evaporation, tackiness, nozzle blocking, hydrophilic/hydrophobic and active material content

24 Material Needs Compatible with ink processing Complex formulations Compatible with substrates Temperature, adhesion/wetting Compatible with cycle times Rapid processing Compatible with functional requirements Conductivity, electron mobility (Purdue / TPF)

25 Rare Earth & Strategic Minerals Critical to Electronics & Solar RE, Ga, In, Ge, Se, Te, Li

26 Strategic Metal replacement Rare Earths China Consolidates Grip on Rare Earths New York Times : September 15, 2011 By closing or nationalizing dozens of the producers of rare earth metals which are used in energy-efficient bulbs and many other green-energy products China is temporarily shutting down most of the industry and crimping the global supply of the vital resources. China has been imposing tariffs and quotas on its rare earth exports for several years, curtailing global supplies and forcing prices to rise eightfold to fortyfold during that period for the various 17 rare earth elements.

28 Why use Rare Earths? In Magnets AlniCo =5, SmCo=30, NdFeB=60 MGOe

29 Mining Recycled Electronics

30 Conflict Minerals and Unintended Consequences? Ta, Nb, Sn, Au, W

31 So what do roadmaps mean to SMTA members?

Roadmaps Accessing roadmaps Allows you to anticipate what your customers will ask for Also regulators and other stakeholders 20 10 0 2010 2025

32 Roadmaps Accessing roadmaps Allows you to anticipate what your customers will ask for Also regulators and other stakeholders Recycled Discarded Million tons recycled and discarded (Pike Research 2011) Participation Networking and a chance to participate, learn and influence!

33 Thank You! Acknowledgements inemi Roadmap Team, Research Committee and Technical Committee Colleagues at numerous other companies and institutions.

Nanotechnology and its effect on Electronics Manufacturing

Nanotechnology and its effect on Electronics Manufacturing Dr. Alan Rae Vice President, Market & Business Development, NanoDynamics, Inc. Dr. Robert C. Pfahl, Jr. VP of Operations, inemi Topics Covered