GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS

Size: px
Start display at page:

Download "GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS"

Transcription

1 GLOBAL MARKETS, TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS SMC057C August Margareth Gagliardi Project Analyst ISBN: BCC Research 49 Walnut Park, Building 2 Wellesley, MA USA (toll-free within the USA), or (+1) information@bccresearch.com

2 TABLE OF CONTENTS CHAPTER 1 INTRODUCTION 2 STUDY GOALS AND OBJECTIVES 2 REASONS FOR DOING THIS STUDY 2 INTENDED AUDIENCE 3 SCOPE OF REPORT 4 METHODOLOGY AND INFORMATION SOURCES 5 RELATED BCC RESEARCH REPORTS 6 ANALYST'S CREDENTIALS 7 BCC RESEARCH WEBSITE 8 DISCLAIMER 9 CHAPTER 2 EXECUTIVE SUMMARY 11 SUMMARY TABLE GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, THROUGH 2021 ($ SUMMARY FIGURE GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, ($ CHAPTER 3 OVERVIEW 15 COATINGS AND FILMS 15 THICK, THIN AND ULTRATHIN FILMS 15 COST FACTOR AND MANUFACTURING PROCESSES 16 THICK FILM TECHNOLOGIES 16 TABLE 1 THICK FILM TECHNOLOGIES, 16 THIN, NANO AND ULTRATHIN FILM TECHNOLOGIES 18 Technological and Market Trends in the Thin Film Industry 19 FIGURE 1 GLOBAL THIN FILM METHODS (EQUIPMENT, MATERIALS, SERVICES) MARKET SHARE BY GROUP OF TECHNOLOGIES, (%) MILESTONES IN THE HISTORY OF THICK AND THIN FILM TECHNOLOGIES AND RECENT EVENTS TABLE 2 THICK FILM, THIN FILM AND PRINTING PROCESSES: TECHNOLOGICAL MILESTONES FIGURE 2 GLOBAL THIN FILMS PATENT APPLICATIONS AND PATENTS, (NO. OF PATENTS) APPLICATIONS FOR THIN AND ULTRATHIN FILMS 24 TABLE 3 APPLICATIONS FOR THIN FILMS, 24 ELECTRONICS 25 TABLE 4 THIN FILMS IN ELECTRONICS, 26 OPTOELECTRONICS 28 TABLE 5 THIN FILMS IN OPTOELECTRONICS, 29 MECHANICAL/CHEMICAL 30 TABLE 6 THIN FILMS IN THE MECHANICAL/CHEMICAL SECTOR, 30 SENSORS AND INSTRUMENTATION 31 TABLE 7 THIN FILMS IN THE SENSORS AND INSTRUMENTATION SECTOR, 31 ENERGY 32 TABLE 8 THIN FILMS IN THE ENERGY SECTOR, 32 OPTICAL COATINGS 33 TABLE 9 THIN FILMS IN THE OPTICAL COATINGS SECTOR,

3 LIFE SCIENCES 35 TABLE 10 THIN FILMS IN LIFE SCIENCES, 35 OTHERS 35 TABLE 11 THIN FILMS IN OTHER APPLICATIONS, 36 CHAPTER 4 TECHNOLOGIES AND MATERIALS FOR THIN AND ULTRATHIN FILMS 38 INTRODUCTION 38 THIN FILM FABRICATION 38 FIGURE 3 THIN FILM TYPES BASED ON FABRICATION PROCESS 38 COATINGS 39 TABLE 12 BASIC CONSTRUCTION STEPS OF A THIN FILM DEVICE, 39 SUBSTRATE SELECTION 39 TABLE 13 TYPICAL SUBSTRATE MATERIALS FOR THIN AND ULTRATHIN FILMS, 40 THIN FILM COATING AND PATTERNING 41 Patterned and Unpatterned Thin Films 42 CUTTING, FINISHING AND PACKAGING 42 THIN FILM COATING PROCESSES 42 SUBTRACTIVE METHODS 43 Coating Methods Used in Subtractive Processes 43 TABLE 14 THIN FILM COATING TECHNOLOGIES, 44 Physical Processes 47 Chemical Processes 48 Hybrid Processes 48 Deposition Technologies for Ultrathin Films 48 TABLE 15 DEPOSITION TECHNOLOGIES FOR ULTRATHIN FILMS, 49 TABLE 16 DEPOSITION TECHNOLOGIES FOR ULTRATHIN FILMS, 50 Lithography 50 Optical Lithography 51 Immersion Lithography 51 Nanostencil Lithography 51 Deep Ultraviolet Light Lithography 51 X-Ray Lithography 51 Electron Beam Lithography 51 Reflective E-beam Lithography 52 Ion Beam Lithography 52 Scanning Probe Lithography 52 Dip-pen Nanolithography 52 Nanoimprint 53 Thermoplastic Nanoimprint Lithography 53 Photo Nanoimprint Lithography 53 Laser-assisted Direct Imprint 53 Self-Aligned Imprint Lithography 53 Extreme Ultraviolet Lithography 54 Directed Self Assembly 54 Nanomotor Lithography 54 TABLE 17 LITHOGRAPHIC METHODS, (NM) 55 Etching 55

4 ADDITIVE METHODS 55 TABLE 18 THIN FILM PRINTING TECHNOLOGIES, 55 Production Process for Printed Thin Film Devices 56 TABLE 19 BASIC PRODUCTION PROCESS FOR PRINTED THIN FILM DEVICES 57 Screen Printing 57 TABLE 20 THIN FILMS RECENTLY MANUFACTURED BY SCREEN PRINTING, Stencil Printing 58 TABLE 21 THIN FILMS RECENTLY MANUFACTURED BY STENCIL PRINTING, Gravure 59 Direct Gravure 59 Reverse Gravure 59 Offset Gravure 59 Smooth Roll Gravure 59 Microgravure 60 TABLE 22 THIN FILMS RECENTLY MANUFACTURED BY GRAVURE, Pad Printing 60 Flexography 61 TABLE 23 THIN FILMS RECENTLY MANUFACTURED BY FLEXOGRAPHY, Transfer Printing 61 Offset Lithography 62 Inkjet Printing 62 Continuous Inkjet Printing 62 Drop-on-Demand Inkjet Printing 63 Thermal 63 Piezoelectric 63 Electrostatic 63 Acoustic 63 Phase-Change 63 TABLE 24 THIN FILMS RECENTLY MANUFACTURED BY INKJET PRINTING, Organic Vapor Jet Printing 65 TABLE 25 THIN FILMS RECENTLY MANUFACTURED BY ORGANIC VAPOR JET PRINTING, Laser Printing 65 TABLE 26 THIN FILMS RECENTLY MANUFACTURED BY LASER PRINTING, Micro-Spray Printing 66 Aerosol Jet Printing 66 Electrophotography 66 Ionography 66 Magnetography 67 Nanography 67 Thermography 67 Most Common Printing Processes for Thin Films 67 TABLE 27 FILM OR FEATURE THICKNESS ACHIEVABLE BY DIFFERENT PRINTING METHODS, (NM) FREE-STANDING THIN FILMS 68 THIN FILM DEPOSITION AND FILM RELEASE

5 Peeling 69 Lift-Off 69 Laser Lift-Off 69 Substrate Compression 69 Self-limiting Surface Modification 69 Chemical Dissolution 70 FILTRATION 70 FLOW COATING 70 FLOATING 70 TABLE 28 METHODS FOR FABRICATION OF FREE-STANDING THIN FILMS, 70 TABLE 29 FREE-STANDING THIN FILMS: FILM COMPOSITION AND APPLICATIONS, THIN FILM MATERIALS 72 MATERIALS FOR THIN-FILM COATINGS BY PHYSICAL PROCESSES 73 TABLE 30 PHYSICAL PROCESSES: TYPICAL DEPOSITION MATERIALS FOR THIN FILMS, MATERIALS FOR THIN-FILM COATINGS BY CHEMICAL PROCESSES 81 Chemical Vapor Deposition 81 TABLE 31 MATERIALS FOR THIN FILMS USED IN CHEMICAL VAPOR DEPOSITION, Functional Group Sources 82 Metal Sources 83 Metal Hydrides and Halides 83 Metalorganic Precursors 83 TABLE 32 COMMON METALORGANIC PRECURSORS, 85 Chemical Solution Deposition 86 Sol-gel Methods 86 Organic-Inorganic Hybrids 87 Metalorganic Deposition 87 TABLE 33 MATERIALS FOR THIN FILMS USED IN CHEMICAL SOLUTION DEPOSITION, Plating Type Methods 88 Electroplating 88 Electroless Plating 89 Electrophoretic Deposition 89 TABLE 34 MATERIALS FOR THIN FILMS USED IN PLATING TYPE METHODS, 90 Other Chemical Processes 91 Liquid Phase Epitaxy 91 Liquid Phase Deposition 91 Interfacial Polymerization 91 Langmuir-Blodgett Deposition 91 Self-Assembled Monolayer Deposition 92 Layer-by-Layer Assembly 92 Flame Hydrolysis 92 Spray Pyrolysis 93 Laser Reactive Deposition 93 TABLE 35 MATERIALS FOR THIN FILMS USED IN OTHER CHEMICAL PROCESSES,

6 MATERIALS FOR THIN FILM PRINTING 94 Nano Inks 95 TABLE 36 TYPES OF NANOMATERIALS, 95 TABLE 37 NANOMATERIALS FOR THIN FILMS, 96 Precursor Inks 98 Molecular Inks 98 LATEST TECHNOLOGICAL DEVELOPMENTS FROM 2014 TO 98 NANOWIRE INK FOR TRANSPARENT CONDUCTIVE FILMS 98 LOW-TEMPERATURE COPPER NANO INK 99 INK FOR INKJET PRINTING OF OPTOELECTRONIC DEVICES 100 CONDUCTIVE NANO INK FOR FLEXIBLE TOUCH SENSORS 101 AMINO-SILYL AMINE COMPOUND FOR ATOMIC LAYER DEPOSITION 102 COLLOIDAL IRON PYRITE FOR THIN-FILM SOLAR CELLS 102 TRIPHENYLAMINE DERIVATIVE FOR ELECTROLUMINESCENT DEVICES 103 OTHER RELEVANT R&D ACTIVITIES 104 TABLE 38 OTHER RELEVANT R &D ACTIVITIES, 104 TECHNOLOGICAL TRENDS FOR THIN FILM MATERIALS 105 FIGURE 4 TECHNOLOGICAL TRENDS IN THE THIN FILM INDUSTRY 105 CHAPTER 5 GLOBAL MARKETS 109 ANALYSIS OUTLINE 109 GLOBAL MARKET SUMMARY 109 TABLE 39 GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, THROUGH 2021 ($ FIGURE 5 GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, ($ CURRENT MARKET STATUS 111 CURRENT MARKET SUMMARY 111 TABLE 40 GLOBAL MARKET FOR THIN FILM MATERIALS, THROUGH ($ FIGURE 6 GLOBAL MARKET FOR THIN FILM MATERIALS, ($ 112 Revenues by Application 113 TABLE 41 GLOBAL MARKET FOR THIN FILM MATERIALS BY APPLICATION, THROUGH ($ FIGURE 7 GLOBAL THIN FILM MATERIALS MARKET SHARE BY APPLICATION, (%) Revenues by Deposition Technology 115 TABLE 42 GLOBAL MARKET FOR THIN FILM MATERIALS BY DEPOSITION TECHNOLOGY, THROUGH ($ FIGURE 8 GLOBAL THIN FILM MATERIALS MARKET SHARE BY DEPOSITION TECHNOLOGY, (%) Revenues by Film Thickness 118 TABLE 43 GLOBAL MARKET FOR THIN FILM MATERIALS BY FILM THICKNESS, THROUGH ($ FIGURE 9 GLOBAL THIN FILM MATERIALS MARKET SHARE BY FILM THICKNESS, (%) Revenues by Region 120 TABLE 44 GLOBAL THIN FILM MATERIALS MARKET BY REGION, THROUGH ($

7 FIGURE 10 GLOBAL THIN FILM MATERIALS MARKET SHARE BY REGION, (%) 120 MARKET GROWTH TRENDS 121 ELECTRONICS 121 Semiconductor Devices 121 TABLE 45 GLOBAL SEMICONDUCTORS MARKET BY REGION, THROUGH 2021 ($ MEMS and NEMS 122 TABLE 46 GLOBAL MEMS AND NEMS MARKET BY TYPE, THROUGH 2021 ($ Printed Circuits 123 Data Storage Devices 123 Hard Disk Drives 123 TABLE 47 GLOBAL PRODUCTION OF HARD DISK DRIVES BY TYPE, THROUGH 2021 (MILLION UNITS) Optical Storage Media 124 TABLE 48 GLOBAL PRODUCTION OF OPTICAL STORAGE MEDIA BY TYPE, THROUGH 2021 (MILLION UNITS) OPTOELECTRONICS 125 Advanced Displays 125 TABLE 49 GLOBAL ADVANCED DISPLAYS MARKET BY TYPE, THROUGH 2021 ($ Solid-state Lighting 127 Lasers 127 Optical Waveguides 127 TABLE 50 GLOBAL MARKET FOR OPTICAL FIBERS, THROUGH 2021 ($ MILLIONS/MILLION KILOMETERS) MECHANICAL/CHEMICAL 127 TABLE 51 GLOBAL AEROSPACE MARKET BY REGION, THROUGH 2021 ($ 128 TABLE 52 GLOBAL MARKET FOR PROTECTIVE COATINGS BY APPLICATIONS TYPE, THROUGH 2021 ($ ENERGY 129 Photovoltaic Cells 129 TABLE 53 GLOBAL PRODUCTION OF PHOTOVOLTAIC MODULES BY TYPE, THROUGH 2021 (MW) Flexible Solar Cells 130 Photothermal Devices 130 Batteries 131 Fuel Cells 131 TABLE 54 GLOBAL FUEL CELLS MARKET BY TYPE, THROUGH 2021 ($ 132 Thermoelectric Devices 132 OPTICAL COATINGS 132 Flat Glass 132 TABLE 55 GLOBAL FLAT GLASS MARKET BY SECTOR, THROUGH 2021 ($ 133 Eyewear 133 LIFE SCIENCES 134 Implantable Devices 134 TABLE 56 GLOBAL IMPLANTABLE DEVICES: MARKET BY REGION, THROUGH 2021 ($ Medical Instruments

8 Membranes 134 Advanced Drug Delivery Systems 135 Wearable Medical Devices 135 Wound Treatment 135 SENSORS AND OTHER APPLICATIONS 135 Sensors 135 TABLE 57 GLOBAL SENSORS MARKET BY TYPE, THROUGH 2021 ($ 136 Biosensors 136 TABLE 58 GLOBAL BIOSENSORS AND OTHER COMMON SENSORS MARKET BY TYPE, THROUGH 2021 ($ Other Industry Segments 137 TABLE 59 GLOBAL OTHER INDUSTRY SECTORS MARKET BY TYPE, THROUGH 2021 ($ TECHNOLOGICAL TRENDS 137 On-going Miniaturization in the Semiconductor Industry 137 Increasing Demand for Flexible Devices 138 Fast Growing Market for Transparent Electronics 139 Nanotechnology 139 TABLE 60 THE NANOTECHNOLOGY INDUSTRY, 140 TABLE 61 GLOBAL NANOTECHNOLOGY MARKET BY SEGMENT, THROUGH 2021 ($ FIGURE 11 GLOBAL NANOTECHNOLOGY MARKET SHARE BY SEGMENT, (%) 142 Manufacturing Efficiency, Product Mix and Environmental Factors 143 Others 143 REGIONAL TRENDS 143 MARKET FORECAST 144 REVENUES BY APPLICATION 144 TABLE 62 GLOBAL THIN FILM MATERIALS MARKET BY APPLICATION, THROUGH 2021 ($ FIGURE 12 GLOBALTHIN FILM MATERIALS MARKET SHARE BY APPLICATION, 2021 (%) Revenues by Deposition Technology 146 TABLE 63 GLOBAL THIN FILM MATERIALS MARKET BY DEPOSITION TECHNOLOGY, THROUGH 2021 ($ FIGURE 13 GLOBAL THIN FILM MATERIALS MARKET SHARE BY DEPOSITION TECHNOLOGY, 2021 (%) Revenues by Film Thickness 148 TABLE 64 GLOBAL THIN FILM MATERIALS MARKET BY FILM THICKNESS, THROUGH 2021 ($ FIGURE 14 GLOBAL THIN FILM MATERIALS MARKET SHARE BY FILM THICKNESS, 2021 (%) Revenues by Region 150 TABLE 65 GLOBAL THIN FILM MATERIALS MARKET BY REGION, THROUGH 2021 ($ FIGURE 15 GLOBAL THIN FILM MATERIALS MARKET SHARE BY REGION, 2021 (%) CHAPTER 6 GLOBAL INDUSTRY STRUCTURE 153 LEADING SUPPLIERS OF THIN FILM MATERIALS 153 TABLE 66 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS, 153

9 TABLE 67 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS BY PROCESS, TABLE 68 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS BY PROCESS AND REGION, OTHER PLAYERS IN THE THIN FILM INDUSTRY 165 TABLE 69 OTHER RELEVANT INDUSTRY PLAYERS, 165 COMPANY PROFILES 172 AIR LIQUIDE 172 AIR PRODUCTS AND CHEMICALS 173 AKZONOBEL 174 ALFA AESAR 175 ATOTECH 176 BASF 176 CORNING PRECISION MATERIALS KOREA 177 DAIDO STEEL 178 DOW 179 HERAEUS 180 TABLE 70 HERAEUS STANDARD TARGET MATERIALS, 181 JX NIPPON MINING & METALS 182 KOBE STEEL 183 LINDE 184 MACDERMID 184 MATERION 185 TABLE 71 MATERION TECHNOLOGIES 186 MITSUI KINZOKU 187 PRAXAIR 187 TOSOH 189 ULVAC 190 TABLE 72 ULVAC SPUTTERING TARGETS, 191 UMICORE 192 TABLE 73 UMICORE SPUTTERING TARGETS, CHAPTER 7 PATENT ANALYSIS 195 INTRODUCTION 195 SUMMARY OF RECENTLY AWARDED PATENTS 195 TABLE 74 THIN AND ULTRATHIN FILMS - RECENTLY AWARDED U.S. PATENTS 195 GENERAL TRENDS 201 TABLE 75 U.S. PATENT TRENDS FOR THIN AND ULTRATHIN FILMS, FIGURE 16 U.S. PATENT TRENDS FOR THIN AND ULTRATHIN FILMS, (NUMBER OF PATENTS) TRENDS BY COUNTRY AND REGION 203 FIGURE 17 PATENT SHARE OF THIN AND ULTRATHIN FILMS BY REGION (%) 203 FIGURE 18 PATENT SHARE OF THIN AND ULTRATHIN FILMS BY COUNTRY (%) 204 TRENDS BY ASSIGNEE 204 TABLE 76 ASSIGNEES OF U.S. PATENTS RELATED TO THIN AND ULTRATHIN FILMS 205 TRENDS BY PATENT CATEGORY 207 FIGURE 19 SHARES OF THIN AND ULTRATHIN FILMS PATENTS IN U.S. BY CATEGORY (%)

10 TRENDS BY DEPOSITION METHOD 208 FIGURE 20 SHARES OF THIN AND ULTRATHIN FILMS PATENTS IN U.S. BY DEPOSITION METHOD (%) 209

11 LIST OF TABLES TABLE HEADING SUMMARY TABLE GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, THROUGH 2021 ($ TABLE 1 THICK FILM TECHNOLOGIES, 16 TABLE 2 THICK FILM, THIN FILM AND PRINTING PROCESSES: TECHNOLOGICAL MILESTONES TABLE 3 APPLICATIONS FOR THIN FILMS, 24 TABLE 4 THIN FILMS IN ELECTRONICS, 26 TABLE 5 THIN FILMS IN OPTOELECTRONICS, 29 TABLE 6 THIN FILMS IN THE MECHANICAL/CHEMICAL SECTOR, 30 TABLE 7 THIN FILMS IN THE SENSORS AND INSTRUMENTATION SECTOR, 31 TABLE 8 THIN FILMS IN THE ENERGY SECTOR, 32 TABLE 9 THIN FILMS IN THE OPTICAL COATINGS SECTOR, 34 TABLE 10 THIN FILMS IN LIFE SCIENCES, 35 TABLE 11 THIN FILMS IN OTHER APPLICATIONS, 36 TABLE 12 BASIC CONSTRUCTION STEPS OF A THIN FILM DEVICE, 39 TABLE 13 TYPICAL SUBSTRATE MATERIALS FOR THIN AND ULTRATHIN FILMS, 40 TABLE 14 THIN FILM COATING TECHNOLOGIES, 44 TABLE 15 DEPOSITION TECHNOLOGIES FOR ULTRATHIN FILMS, 49 TABLE 16 DEPOSITION TECHNOLOGIES FOR ULTRATHIN FILMS, 50 TABLE 17 LITHOGRAPHIC METHODS, (NM) 55 TABLE 18 THIN FILM PRINTING TECHNOLOGIES, 55 TABLE 19 BASIC PRODUCTION PROCESS FOR PRINTED THIN FILM DEVICES 57 TABLE 20 THIN FILMS RECENTLY MANUFACTURED BY SCREEN PRINTING, TABLE 21 THIN FILMS RECENTLY MANUFACTURED BY STENCIL PRINTING, TABLE 22 THIN FILMS RECENTLY MANUFACTURED BY GRAVURE, TABLE 23 THIN FILMS RECENTLY MANUFACTURED BY FLEXOGRAPHY, TABLE 24 THIN FILMS RECENTLY MANUFACTURED BY INKJET PRINTING, TABLE 25 THIN FILMS RECENTLY MANUFACTURED BY ORGANIC VAPOR JET PRINTING, TABLE 26 THIN FILMS RECENTLY MANUFACTURED BY LASER PRINTING, TABLE 27 FILM OR FEATURE THICKNESS ACHIEVABLE BY DIFFERENT PRINTING METHODS, (NM) TABLE 28 METHODS FOR FABRICATION OF FREE-STANDING THIN FILMS, 70 TABLE 29 FREE-STANDING THIN FILMS: FILM COMPOSITION AND APPLICATIONS, TABLE 30 PHYSICAL PROCESSES: TYPICAL DEPOSITION MATERIALS FOR THIN FILMS, TABLE 31 MATERIALS FOR THIN FILMS USED IN CHEMICAL VAPOR DEPOSITION, 82 TABLE 32 COMMON METALORGANIC PRECURSORS, 85 TABLE 33 MATERIALS FOR THIN FILMS USED IN CHEMICAL SOLUTION DEPOSITION, TABLE 34 MATERIALS FOR THIN FILMS USED IN PLATING TYPE METHODS, 90 TABLE 35 MATERIALS FOR THIN FILMS USED IN OTHER CHEMICAL PROCESSES, 93 TABLE 36 TYPES OF NANOMATERIALS, 95 TABLE 37 NANOMATERIALS FOR THIN FILMS, 96 TABLE 38 OTHER RELEVANT R &D ACTIVITIES, 104 TABLE 39 GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, THROUGH 2021 ($

12 TABLE HEADING TABLE 40 GLOBAL MARKET FOR THIN FILM MATERIALS, THROUGH ($ 112 TABLE 41 GLOBAL MARKET FOR THIN FILM MATERIALS BY APPLICATION, THROUGH ($ TABLE 42 GLOBAL MARKET FOR THIN FILM MATERIALS BY DEPOSITION TECHNOLOGY, THROUGH ($ TABLE 43 GLOBAL MARKET FOR THIN FILM MATERIALS BY FILM THICKNESS, THROUGH ($ TABLE 44 GLOBAL THIN FILM MATERIALS MARKET BY REGION, THROUGH ($ TABLE 45 GLOBAL SEMICONDUCTORS MARKET BY REGION, THROUGH 2021 ($ TABLE 46 GLOBAL MEMS AND NEMS MARKET BY TYPE, THROUGH 2021 ($ 123 TABLE 47 GLOBAL PRODUCTION OF HARD DISK DRIVES BY TYPE, THROUGH 2021 (MILLION UNITS) TABLE 48 GLOBAL PRODUCTION OF OPTICAL STORAGE MEDIA BY TYPE, THROUGH 2021 (MILLION UNITS) TABLE 49 GLOBAL ADVANCED DISPLAYS MARKET BY TYPE, THROUGH 2021 ($ TABLE 50 GLOBAL MARKET FOR OPTICAL FIBERS, THROUGH 2021 ($ MILLIONS/MILLION KILOMETERS) TABLE 51 GLOBAL AEROSPACE MARKET BY REGION, THROUGH 2021 ($ 128 TABLE 52 GLOBAL MARKET FOR PROTECTIVE COATINGS BY APPLICATIONS TYPE, THROUGH 2021 ($ TABLE 53 GLOBAL PRODUCTION OF PHOTOVOLTAIC MODULES BY TYPE, THROUGH 2021 (MW) TABLE 54 GLOBAL FUEL CELLS MARKET BY TYPE, THROUGH 2021 ($ 132 TABLE 55 GLOBAL FLAT GLASS MARKET BY SECTOR, THROUGH 2021 ($ 133 TABLE 56 GLOBAL IMPLANTABLE DEVICES: MARKET BY REGION, THROUGH 2021 ($ TABLE 57 GLOBAL SENSORS MARKET BY TYPE, THROUGH 2021 ($ 136 TABLE 58 GLOBAL BIOSENSORS AND OTHER COMMON SENSORS MARKET BY TYPE, THROUGH 2021 ($ TABLE 59 GLOBAL OTHER INDUSTRY SECTORS MARKET BY TYPE, THROUGH 2021 ($ TABLE 60 THE NANOTECHNOLOGY INDUSTRY, 140 TABLE 61 GLOBAL NANOTECHNOLOGY MARKET BY SEGMENT, THROUGH 2021 ($ TABLE 62 GLOBAL THIN FILM MATERIALS MARKET BY APPLICATION, THROUGH 2021 ($ TABLE 63 GLOBAL THIN FILM MATERIALS MARKET BY DEPOSITION TECHNOLOGY, THROUGH 2021 ($ TABLE 64 GLOBAL THIN FILM MATERIALS MARKET BY FILM THICKNESS, THROUGH 2021 ($ TABLE 65 GLOBAL THIN FILM MATERIALS MARKET BY REGION, THROUGH 2021 ($ TABLE 66 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS, 153 TABLE 67 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS BY PROCESS, 160 TABLE 68 GLOBAL LEADING SUPPLIERS OF THIN FILM MATERIALS BY PROCESS AND REGION, TABLE 69 OTHER RELEVANT INDUSTRY PLAYERS, 165 TABLE 70 HERAEUS STANDARD TARGET MATERIALS,

13 TABLE HEADING TABLE 71 MATERION TECHNOLOGIES 186 TABLE 72 ULVAC SPUTTERING TARGETS, 191 TABLE 73 UMICORE SPUTTERING TARGETS, 193 TABLE 74 THIN AND ULTRATHIN FILMS - RECENTLY AWARDED U.S. PATENTS 195 TABLE 75 U.S. PATENT TRENDS FOR THIN AND ULTRATHIN FILMS, TABLE 76 ASSIGNEES OF U.S. PATENTS RELATED TO THIN AND ULTRATHIN FILMS 205

14 LIST OF FIGURES FIGURE TITLE SUMMARY FIGURE GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, ($ FIGURE 1 GLOBAL THIN FILM METHODS (EQUIPMENT, MATERIALS, SERVICES) MARKET SHARE BY GROUP OF TECHNOLOGIES, (%) FIGURE 2 GLOBAL THIN FILMS PATENT APPLICATIONS AND PATENTS, (NO. OF PATENTS) FIGURE 3 THIN FILM TYPES BASED ON FABRICATION PROCESS 38 FIGURE 4 TECHNOLOGICAL TRENDS IN THE THIN FILM INDUSTRY 105 FIGURE 5 GLOBAL MARKET FOR THIN FILM MATERIALS BY SEGMENT, ($ FIGURE 6 GLOBAL MARKET FOR THIN FILM MATERIALS, ($ 112 FIGURE 7 GLOBAL THIN FILM MATERIALS MARKET SHARE BY APPLICATION, (%) 114 FIGURE 8 GLOBAL THIN FILM MATERIALS MARKET SHARE BY DEPOSITION TECHNOLOGY, (%) FIGURE 9 GLOBAL THIN FILM MATERIALS MARKET SHARE BY FILM THICKNESS, (%) FIGURE 10 GLOBAL THIN FILM MATERIALS MARKET SHARE BY REGION, (%) 120 FIGURE 11 GLOBAL NANOTECHNOLOGY MARKET SHARE BY SEGMENT, (%) 142 FIGURE 12 GLOBALTHIN FILM MATERIALS MARKET SHARE BY APPLICATION, 2021 (%) 145 FIGURE 13 GLOBAL THIN FILM MATERIALS MARKET SHARE BY DEPOSITION TECHNOLOGY, 2021 (%) FIGURE 14 GLOBAL THIN FILM MATERIALS MARKET SHARE BY FILM THICKNESS, 2021 (%) FIGURE 15 GLOBAL THIN FILM MATERIALS MARKET SHARE BY REGION, 2021 (%) 151 FIGURE 16 U.S. PATENT TRENDS FOR THIN AND ULTRATHIN FILMS, (NUMBER OF PATENTS) FIGURE 17 PATENT SHARE OF THIN AND ULTRATHIN FILMS BY REGION (%) 203 FIGURE 18 PATENT SHARE OF THIN AND ULTRATHIN FILMS BY COUNTRY (%) 204 FIGURE 19 SHARES OF THIN AND ULTRATHIN FILMS PATENTS IN U.S. BY CATEGORY (%) FIGURE 20 SHARES OF THIN AND ULTRATHIN FILMS PATENTS IN U.S. BY DEPOSITION METHOD (%)

EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS

EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS EMERGING INKJET PRINTING TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS AVM091B November 2014 Andrew McWilliams Project Analyst ISBN: 1-56965-999-0 BCC Research 49 Walnut Park, Building 2 Wellesley, MA

More information

Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire

Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire 2017. 04. 25 Seung-Hyun Lee, PhD Senior Researcher Dept. Printed Electronics Korea Institute

More information

PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs

PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES Simon Perraud, Ph.D. Vice president for European affairs ABOUT LITEN Liten is the research institute of CEA devoted to clean energy

More information

The Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics

The Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics The Department of Advanced Materials Engineering Materials and Processes in Polymeric Microelectronics 1 Outline Materials and Processes in Polymeric Microelectronics Polymeric Microelectronics Process

More information

Nanostencil Lithography and Nanoelectronic Applications

Nanostencil Lithography and Nanoelectronic Applications Microsystems Laboratory Nanostencil Lithography and Nanoelectronic Applications Oscar Vazquez, Marc van den Boogaart, Dr. Lianne Doeswijk, Prof. Juergen Brugger, LMIS1 Dr. Chan Woo Park, Visiting Professor

More information

Nanotechnology, the infrastructure, and IBM s research projects

Nanotechnology, the infrastructure, and IBM s research projects Nanotechnology, the infrastructure, and IBM s research projects Dr. Paul Seidler Coordinator Nanotechnology Center, IBM Research - Zurich Nanotechnology is the understanding and control of matter at dimensions

More information

University of California, Berkeley Department of Mechanical Engineering. ME 290R Topics in Manufacturing, Fall 2014: Lithography

University of California, Berkeley Department of Mechanical Engineering. ME 290R Topics in Manufacturing, Fall 2014: Lithography University of California, Berkeley Department of Mechanical Engineering ME 290R Topics in Manufacturing, Fall 2014: Lithography Class meetings: TuTh 3.30 5pm in 1165 Etcheverry Tentative class schedule

More information

Module - 2 Lecture - 13 Lithography I

Module - 2 Lecture - 13 Lithography I Nano Structured Materials-Synthesis, Properties, Self Assembly and Applications Prof. Ashok. K.Ganguli Department of Chemistry Indian Institute of Technology, Delhi Module - 2 Lecture - 13 Lithography

More information

Large Area, Flexible Electronics TWG. Chair: Dan Gamota, Jabil

Large Area, Flexible Electronics TWG. Chair: Dan Gamota, Jabil Large Area, Flexible Electronics TWG Chair: Dan Gamota, Jabil Large Area Flexible Electronics Roadmap History 09/2005 inemi Stakeholders identify Flexible Electronics as Future Growth Market and authorize

More information

Before the era of digital printing all printing technologies depended on a physical image carrier which was called a printform. In letterpress, this

Before the era of digital printing all printing technologies depended on a physical image carrier which was called a printform. In letterpress, this 1 When Time Life published a list of the 100 most important events of the last millennium, mankind s marquee accomplishments ranked in the top third, but not at the top. Instead, the events at the top

More information

Contents. Contents. Preface... xi. PART A: OVERVIEW 1 Introduction... 1

Contents. Contents. Preface... xi. PART A: OVERVIEW 1 Introduction... 1 Contents Preface... xi PART A: OVERVIEW 1 Introduction... 1 1.1 Scope...1 1.2 Innovation and Patents...1 1.3 Prediction of Trends...1 1.4 Innovators...2 1.5 Comments on Presentation...3 1.5.1 Subject Classification...3

More information

Micro-Nanofabrication

Micro-Nanofabrication Zheng Cui Micro-Nanofabrication TECHNOLOGIES AND APPLICATIONS ^f**"?* ö Springer Higher Education Press -T O Table of Content Preface About the Author Chapter 1 Introduction 1 1.1 Micro-nanotechnologies

More information

Emerging Print Technologies & Applications

Emerging Print Technologies & Applications Emerging Print Technologies & Applications By: Pivotal Resources USA, Inc. 2901 Richmond Road #353 Lexington, KY 40509 (859) 230-0093 2013 PRIMIR/NPES EMERGING PRINT TECHNOLOGIES & APPLICATIONS TABLE OF

More information

Printing versus coating technology Which way Printed Electronics with solution coating will go?

Printing versus coating technology Which way Printed Electronics with solution coating will go? Printing versus coating technology Which way Printed Electronics with solution coating will go? Frank Schäfer, Andrea Glawe, Dr. Daniel Eggerath, KROENERT GmbH& Co KG, Schuetzenstrasse 105, 22761 Hamburg

More information

National Centre for Flexible Electronics

National Centre for Flexible Electronics National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances

More information

Printed Electronics Product Types & Markets. Vince Cahill, VCE Solutions

Printed Electronics Product Types & Markets. Vince Cahill, VCE Solutions Printed Electronics Product Types & Markets Vince Cahill, VCE Solutions Printed Electronic Product Types Printed circuits boards Printed logic / memory Printed batteries Membrane switches Photovoltaics

More information

MEMS in ECE at CMU. Gary K. Fedder

MEMS in ECE at CMU. Gary K. Fedder MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems

More information

Introduction to Microdevices and Microsystems

Introduction to Microdevices and Microsystems PHYS 534 (Fall 2008) Module on Microsystems & Microfabrication Lecture 1 Introduction to Microdevices and Microsystems Srikar Vengallatore, McGill University 1 Introduction to Microsystems Outline of Lecture

More information

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626 OPTI510R: Photonics Khanh Kieu College of Optical Sciences, University of Arizona kkieu@optics.arizona.edu Meinel building R.626 Announcements Homework #3 is due today No class Monday, Feb 26 Pre-record

More information

shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS

shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS WHO ARE WE? XTPL S.A. is a company operating in the nanotechnology segment. The interdisciplinary team of XTPL develops on a global scale

More information

Accelerating Scale Up of Large Area Electronics

Accelerating Scale Up of Large Area Electronics Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved. Who are CPI? CPI is a UK technology innovation

More information

Printing Processes and their Potential for RFID Printing

Printing Processes and their Potential for RFID Printing Printing Processes and their Potential for RFID Printing Anne Blayo and Bernard Pineaux, EFPG 1 - Printing processes - A.Blayo and B. Pineaux - soc -EUSAI - 12th October 2005, Grenoble Outline General

More information

PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!

PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell! Where were we? Simple Si solar Cell! Two Levels of Masks - photoresist, alignment Etch and oxidation to isolate thermal oxide, deposited oxide, wet etching, dry etching, isolation schemes Doping - diffusion/ion

More information

SOFTWARE-DEFINED RADIO: TECHNOLOGIES AND GLOBAL MARKETS

SOFTWARE-DEFINED RADIO: TECHNOLOGIES AND GLOBAL MARKETS SOFTWARE-DEFINED RADIO: TECHNOLOGIES AND GLOBAL MARKETS IFT113A February 2015 Leonidas Sivridis Project Analyst ISBN: 1-62296-033-5 BCC Research 49 Walnut Park, Building 2 Wellesley, MA 02481 USA 866-285-7215

More information

write-nanocircuits Direct-write Jaebum Joo and Joseph M. Jacobson Molecular Machines, Media Lab Massachusetts Institute of Technology, Cambridge, MA

write-nanocircuits Direct-write Jaebum Joo and Joseph M. Jacobson Molecular Machines, Media Lab Massachusetts Institute of Technology, Cambridge, MA Fab-in in-a-box: Direct-write write-nanocircuits Jaebum Joo and Joseph M. Jacobson Massachusetts Institute of Technology, Cambridge, MA April 17, 2008 Avogadro Scale Computing / 1 Avogadro number s? Intel

More information

Printable, Novel CNT Inks with V2V Technology

Printable, Novel CNT Inks with V2V Technology Printable, Novel CNT Inks with V2V Technology William J. Hurley, Jr., PhD Chasm Technologies, Inc. Canton, MA June 23, 2010 New England Nanomanufacturing Summit 1 Outline CHASM Overview Alliance with SWeNT

More information

Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography

Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography Semiconductor Manufacturing Technology Michael Quirk & Julian Serda October 2001 by Prentice Hall Chapter 15 Photolithography: Resist Development and Advanced Lithography Eight Basic Steps of Photolithography

More information

Micro-PackS, Technology Platform. Security Characterization Lab Opening

Micro-PackS, Technology Platform. Security Characterization Lab Opening September, 30 th 2008 Micro-PackS, Technology Platform Security Characterization Lab Opening Members : Micro-PackS in SCS cluster From Silicium to innovative & commucating device R&D structure, gathering

More information

A process for, and optical performance of, a low cost Wire Grid Polarizer

A process for, and optical performance of, a low cost Wire Grid Polarizer 1.0 Introduction A process for, and optical performance of, a low cost Wire Grid Polarizer M.P.C.Watts, M. Little, E. Egan, A. Hochbaum, Chad Jones, S. Stephansen Agoura Technology Low angle shadowed deposition

More information

Measurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation

Measurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation 238 Hitachi Review Vol. 65 (2016), No. 7 Featured Articles Measurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation AFM5500M Scanning Probe Microscope Satoshi Hasumura

More information

Robert G. Hunsperger. Integrated Optics. Theory and Technology. Sixth Edition. 4ü Spri rineer g<

Robert G. Hunsperger. Integrated Optics. Theory and Technology. Sixth Edition. 4ü Spri rineer g< Robert G. Hunsperger Integrated Optics Theory and Technology Sixth Edition 4ü Spri rineer g< 1 Introduction 1 1.1 Advantages of Integrated Optics 2 1.1.1 Comparison of Optical Fibers with Other Interconnectors

More information

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components

More information

GLOBAL MARKETS AND TECHNOLOGIES FOR INORGANIC METAL FINISHING PROCESSES -- FOCUS ON THERMAL SPRAY, CERAMIC COATING AND OTHER TECHNOLOGIES

GLOBAL MARKETS AND TECHNOLOGIES FOR INORGANIC METAL FINISHING PROCESSES -- FOCUS ON THERMAL SPRAY, CERAMIC COATING AND OTHER TECHNOLOGIES GLOBAL MARKETS AND TECHNOLOGIES FOR INORGANIC METAL FINISHING PROCESSES -- FOCUS ON THERMAL SPRAY, CERAMIC COATING AND OTHER TECHNOLOGIES MFG031A October 2012 Srinivasa Rajaram Project Analyst ISBN: 0-89336-221-2

More information

RF/MICROWAVE HYBRIDS Basics, Materials and Processes

RF/MICROWAVE HYBRIDS Basics, Materials and Processes RF/MICROWAVE HYBRIDS Basics, Materials and Processes RF/MICROWAVE HYBRIDS Basics, Materials and Processes by Richard Brown Richard Brown Associates, Inc. Shelton, CT KLUWER ACADEMIC PUBLISHERS NEW YORK,

More information

Organic and flexible Electronics in Saxony www.invest-in-saxony.com WElCOME Organic electronics are based on the discovery that specific organic materials possess semiconducting properties. Functional

More information

Photolithography Technology and Application

Photolithography Technology and Application Photolithography Technology and Application Jeff Tsai Director, Graduate Institute of Electro-Optical Engineering Tatung University Art or Science? Lind width = 100 to 5 micron meter!! Resolution = ~ 3

More information

Nanofluidic Diodes based on Nanotube Heterojunctions

Nanofluidic Diodes based on Nanotube Heterojunctions Supporting Information Nanofluidic Diodes based on Nanotube Heterojunctions Ruoxue Yan, Wenjie Liang, Rong Fan, Peidong Yang 1 Department of Chemistry, University of California, Berkeley, CA 94720, USA

More information

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology

Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm TM Technology Scott Goodwin 1, Erik Vick 2 and Dorota Temple 2 1 Micross Advanced Interconnect Technology Micross

More information

Pattern Coating by Slot-Die SCOTT A. ZWIERLEIN FRONTIER INDUSTRIAL TECHNOLOGY, INC. AIMCAL FALL TECHNICAL CONFERENCE 2013

Pattern Coating by Slot-Die SCOTT A. ZWIERLEIN FRONTIER INDUSTRIAL TECHNOLOGY, INC. AIMCAL FALL TECHNICAL CONFERENCE 2013 Pattern Coating by Slot-Die SCOTT A. ZWIERLEIN FRONTIER INDUSTRIAL TECHNOLOGY, INC. AIMCAL FALL TECHNICAL CONFERENCE 2013 Program: Slot-Die Coating Overview Industries for slot-die coating Stripe coating

More information

Glass Substrates for Semiconductor Manufacturing

Glass Substrates for Semiconductor Manufacturing Glass Substrates for Semiconductor Manufacturing The first REPORT analyzing in detail the glass wafer for wafer level packaging and micro structuring technologies applications 2013 Content of the report

More information

Photolithography I ( Part 1 )

Photolithography I ( Part 1 ) 1 Photolithography I ( Part 1 ) Chapter 13 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science

More information

All-Glass Gray Scale PhotoMasks Enable New Technologies. Che-Kuang (Chuck) Wu Canyon Materials, Inc.

All-Glass Gray Scale PhotoMasks Enable New Technologies. Che-Kuang (Chuck) Wu Canyon Materials, Inc. All-Glass Gray Scale PhotoMasks Enable New Technologies Che-Kuang (Chuck) Wu Canyon Materials, Inc. 1 Overview All-Glass Gray Scale Photomask technologies include: HEBS-glasses and LDW-glasses HEBS-glass

More information

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process Section 2: Lithography Jaeger Chapter 2 Litho Reader The lithographic process Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered with silicon dioxide barrier layer Positive photoresist

More information

Silicon Light Machines Patents

Silicon Light Machines Patents 820 Kifer Road, Sunnyvale, CA 94086 Tel. 408-240-4700 Fax 408-456-0708 www.siliconlight.com Silicon Light Machines Patents USPTO No. US 5,808,797 US 5,841,579 US 5,798,743 US 5,661,592 US 5,629,801 US

More information

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Pooran Joshi, Stephen Killough, and Teja Kuruganti Oak Ridge National Laboratory FIIW 2015 Displays and PV

More information

Flexible Substrates and SCB-Technology

Flexible Substrates and SCB-Technology Flexible Substrates and SCB-Technology Substrate Technology As requirements are increasing, so are electronic systems becoming smaller and smaller and more complex. In its role as innovative forerunner

More information

Nanoscale Lithography. NA & Immersion. Trends in λ, NA, k 1. Pushing The Limits of Photolithography Introduction to Nanotechnology

Nanoscale Lithography. NA & Immersion. Trends in λ, NA, k 1. Pushing The Limits of Photolithography Introduction to Nanotechnology 15-398 Introduction to Nanotechnology Nanoscale Lithography Seth Copen Goldstein Seth@cs.cmu.Edu CMU Pushing The Limits of Photolithography Reduce wavelength (λ) Use Reducing Lens Increase Numerical Aperture

More information

Smart Textiles and New Ways of Production

Smart Textiles and New Ways of Production Smart Textiles and New Ways of Production Craig Lawrance Technical Manager, Textile Centre of Excellence craiglawrance@textile training.com 20th June2017 4th Thematic Presentation, Chemnitz Smart Textiles

More information

Major Fabrication Steps in MOS Process Flow

Major Fabrication Steps in MOS Process Flow Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide Silicon substrate Oxidation (Field oxide) Photoresist Coating Mask-Wafer Alignment

More information

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1 Section 2: Lithography Jaeger Chapter 2 Litho Reader EE143 Ali Javey Slide 5-1 The lithographic process EE143 Ali Javey Slide 5-2 Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered

More information

MICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS

MICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS MICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS Vladimír KOLAŘÍK, Stanislav KRÁTKÝ, Michal URBÁNEK, Milan MATĚJKA, Jana CHLUMSKÁ, Miroslav HORÁČEK, Institute of Scientific Instruments of the

More information

NanoFabrication Kingston. Seminar and Webinar January 31, 2017 Rob Knobel Associate Professor, Dept. of Physics Queen s University

NanoFabrication Kingston. Seminar and Webinar January 31, 2017 Rob Knobel Associate Professor, Dept. of Physics Queen s University NanoFabrication Kingston Seminar and Webinar January 31, 2017 Rob Knobel Associate Professor, Dept. of Physics Queen s University What is NFK? It s a place, an team of experts and a service. The goal of

More information

RIT. Printing. Project Goals. Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles

RIT. Printing. Project Goals. Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles Printing Radio Frequency Identification (RFID) Tag Antennas Using Inks Containing Metal Nanoparticles Bruce E. Kahn Rochester Institute of Technology bkahn@mail.rit.edu http://www.rit.edu/~bekpph/ RIT

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Room-temperature continuous-wave electrically injected InGaN-based laser directly grown on Si Authors: Yi Sun 1,2, Kun Zhou 1, Qian Sun 1 *, Jianping Liu 1, Meixin Feng 1, Zengcheng Li 1, Yu Zhou 1, Liqun

More information

EE 143 Microfabrication Technology Fall 2014

EE 143 Microfabrication Technology Fall 2014 EE 143 Microfabrication Technology Fall 2014 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 EE 143: Microfabrication

More information

Coating of Si Nanowire Array by Flexible Polymer

Coating of Si Nanowire Array by Flexible Polymer , pp.422-426 http://dx.doi.org/10.14257/astl.2016.139.84 Coating of Si Nanowire Array by Flexible Polymer Hee- Jo An 1, Seung-jin Lee 2, Taek-soo Ji 3* 1,2.3 Department of Electronics and Computer Engineering,

More information

IMAGING SILICON NANOWIRES

IMAGING SILICON NANOWIRES Project report IMAGING SILICON NANOWIRES PHY564 Submitted by: 1 Abstract: Silicon nanowires can be easily integrated with conventional electronics. Silicon nanowires can be prepared with single-crystal

More information

Chemistry and Technology of Printing and Imaging Systems

Chemistry and Technology of Printing and Imaging Systems 'ч. Chemistry and Technology of Printing and Imaging Systems Edited by Zeneca Specialties Manchester BLACKIE ACADEMIC & PROFESSIONAL An Imprint of Chapman & Hall London Glasgow Weinheim New York Tokyo

More information

Technology. Chapter 20 Printed Graphic Communication

Technology. Chapter 20 Printed Graphic Communication Technology Chapter 20 Printed Graphic Communication Tools: Printer (color optional) 4 sheets of 8.5 x 11 paper Scissors Directions: 1. Print 2. Fold paper in half vertically 3. Cut along dashed lines These

More information

Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique

Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique Sensors and Materials, Vol. 18, No. 3 (2006) 125 130 MYU Tokyo 125 S & M 0636 Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique Jung-Hun Kim,

More information

Strategies for low cost imprint molds

Strategies for low cost imprint molds Strategies for low cost imprint molds M.P.C. Watts, Impattern Solutions, 9404 Bell Mountain Drive Austin TX 78730 www.impattern.com ABSTRACT The Cost of ownership (COO) due to the mold can be minimized

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION SUPPLEMENTARY INFORMATION doi:10.1038/nature11293 1. Formation of (111)B polar surface on Si(111) for selective-area growth of InGaAs nanowires on Si. Conventional III-V nanowires (NWs) tend to grow in

More information

Deformable Membrane Mirror for Wavefront Correction

Deformable Membrane Mirror for Wavefront Correction Defence Science Journal, Vol. 59, No. 6, November 2009, pp. 590-594 Ó 2009, DESIDOC SHORT COMMUNICATION Deformable Membrane Mirror for Wavefront Correction Amita Gupta, Shailesh Kumar, Ranvir Singh, Monika

More information

David B. Miller Vice President & General Manager September 28, 2005

David B. Miller Vice President & General Manager September 28, 2005 Electronic Technologies Business Overview David B. Miller Vice President & General Manager September 28, 2005 Forward Looking Statement During the course of this meeting we may make forward-looking statements.

More information

CLAIMS 1. A suspension board with circuit, characterized in that, it comprises a metal support layer, an insulating layer formed on the metal support

CLAIMS 1. A suspension board with circuit, characterized in that, it comprises a metal support layer, an insulating layer formed on the metal support [19] State Intellectual Property Office of the P.R.C [51] Int. Cl 7 G11B 5/48 H05K 1/11 [12] Patent Application Publication G11B 21/16 [21] Application No.: 00133926.5 [43] Publication Date: 5.30.2001

More information

ML² Multi Layer Micro Lab

ML² Multi Layer Micro Lab Deliverable 4.5 ML² Multi Layer Micro Lab D4.5 - Report on product range for UV curing lacquers, validated for ML² devices 1. Introduction... 2 2. UV embossing lacquer chemistry... 2 2.1. The main components

More information

UVISEL. Spectroscopic Phase Modulated Ellipsometer. The Ideal Tool for Thin Film and Material Characterization

UVISEL. Spectroscopic Phase Modulated Ellipsometer. The Ideal Tool for Thin Film and Material Characterization UVISEL Spectroscopic Phase Modulated Ellipsometer The Ideal Tool for Thin Film and Material Characterization High Precision Research Spectroscopic Ellipsometer The UVISEL ellipsometer offers the best combination

More information

Making a Material Difference

Making a Material Difference Making a Material Difference Founded as a QinetiQ corporate investment in January 2002 Spun out in 2007 Locations: Rochester, NYS, USA (HQ and Production) Farnborough and Malvern, UK (R&D, Production and

More information

Processes for Flexible Electronic Systems

Processes for Flexible Electronic Systems Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes

More information

A Laser-Based Thin-Film Growth Monitor

A Laser-Based Thin-Film Growth Monitor TECHNOLOGY by Charles Taylor, Darryl Barlett, Eric Chason, and Jerry Floro A Laser-Based Thin-Film Growth Monitor The Multi-beam Optical Sensor (MOS) was developed jointly by k-space Associates (Ann Arbor,

More information

Fabrication of micro structures on curve surface by X-ray lithography

Fabrication of micro structures on curve surface by X-ray lithography Fabrication of micro structures on curve surface by X-ray lithography Yigui Li 1, Susumu Sugiyama 2 Abstract We demonstrate experimentally the x-ray lithography techniques to fabricate micro structures

More information

Module 11: Photolithography. Lecture11: Photolithography - I

Module 11: Photolithography. Lecture11: Photolithography - I Module 11: Photolithography Lecture11: Photolithography - I 1 11.0 Photolithography Fundamentals We will all agree that incredible progress is happening in the filed of electronics and computers. For example,

More information

Clean Room Technology Optical Lithography. Lithography I. takenfrombdhuey

Clean Room Technology Optical Lithography. Lithography I. takenfrombdhuey Clean Room Technology Optical Lithography Lithography I If the automobile had followed the same development cycle as the computer, a Rolls Royce would today cost $100, get a million miles per gallon, and

More information

Lecture 7. Lithography and Pattern Transfer. Reading: Chapter 7

Lecture 7. Lithography and Pattern Transfer. Reading: Chapter 7 Lecture 7 Lithography and Pattern Transfer Reading: Chapter 7 Used for Pattern transfer into oxides, metals, semiconductors. 3 types of Photoresists (PR): Lithography and Photoresists 1.) Positive: PR

More information

Printed Electronics: success stories and future commercial applications

Printed Electronics: success stories and future commercial applications Printed Electronics: success stories and future commercial applications Dr Guillaume Chansin @gchansin June 2017 Helping you profit from emerging technologies Advantages of printed electronics Mass production

More information

The Development of the Semiconductor CVD and ALD Requirement

The Development of the Semiconductor CVD and ALD Requirement The Development of the Semiconductor CVD and ALD Requirement 1 Linx Consulting 1. We create knowledge and develop unique insights at the intersection of electronic thin film processes and the chemicals

More information

Transistor was first invented by William.B.Shockley, Walter Brattain and John Bardeen of Bell Labratories. In 1961, first IC was introduced.

Transistor was first invented by William.B.Shockley, Walter Brattain and John Bardeen of Bell Labratories. In 1961, first IC was introduced. Unit 1 Basic MOS Technology Transistor was first invented by William.B.Shockley, Walter Brattain and John Bardeen of Bell Labratories. In 1961, first IC was introduced. Levels of Integration:- i) SSI:-

More information

microelectronics services high-tech requires high-precision microelectronics services

microelectronics services high-tech requires high-precision microelectronics services ELECTRICAL & ELECTRONICS microelectronics services high-tech requires high-precision microelectronics services WORLDWIDE Analysis, TESTING & CERTIFICATION LOCALLY AVAILABLE worldwide Electrical and electronic

More information

EE143 Fall 2016 Microfabrication Technologies. Lecture 3: Lithography Reading: Jaeger, Chap. 2

EE143 Fall 2016 Microfabrication Technologies. Lecture 3: Lithography Reading: Jaeger, Chap. 2 EE143 Fall 2016 Microfabrication Technologies Lecture 3: Lithography Reading: Jaeger, Chap. 2 Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1-1 The lithographic process 1-2 1 Photolithographic

More information

ADVANCED TECHNOLOGY MADE IN GERMANY DTF is located in Dresden (Saxony) a center of vacuum- and thin film technologies

ADVANCED TECHNOLOGY MADE IN GERMANY DTF is located in Dresden (Saxony) a center of vacuum- and thin film technologies ADVANCED TECHNOLOGY MADE IN GERMANY DTF is located in Dresden (Saxony) a center of vacuum- and thin film technologies DTF TECHNOLOGY GMBH your competent partner for vacuum- and thin film technologies DTF

More information

RealNano & ACINTECH Projektbeispiele für Nanotechnologie in der Mikroelektronik

RealNano & ACINTECH Projektbeispiele für Nanotechnologie in der Mikroelektronik RealNano & ACINTECH Projektbeispiele für Nanotechnologie in der Mikroelektronik Reinhold Ebner, Anton Köck, Stefan Defregger Materials Center Leoben Forschung GmbH Roseggerstrasse 12 A-8700 Leoben www.mcl.at

More information

attocube systems Probe Stations for Extreme Environments CRYOGENIC PROBE STATION fundamentals principles of cryogenic probe stations

attocube systems Probe Stations for Extreme Environments CRYOGENIC PROBE STATION fundamentals principles of cryogenic probe stations PAGE 88 & 2008 2007 PRODUCT CATALOG CRYOGENIC PROBE STATION fundamentals...................... 90 principles of cryogenic probe stations attocps I.......................... 92 ultra stable cryogenic probe

More information

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems Herzlich willkommen Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium Sören Fricke Section Head Large Area & Flexible Systems Agroscope Tänikon, 05.09.2017 Motivation Printed Sensors can be

More information

1.1 PHILOSOPHY OF MICRO/NANOFABRICATION

1.1 PHILOSOPHY OF MICRO/NANOFABRICATION CHAPTER Introduction 1 C H A P T E R C O N T E N T S 1.1 Philosophy of Micro/Nanofabrication... 1 1.2 The Industry Science Dualism... 5 1.3 Industrial Applications... 8 1.4 Purpose and Organization of

More information

Nanoimprint lithography with a focused laser beam for the fabrication of micro-/nano-hybrid patterns

Nanoimprint lithography with a focused laser beam for the fabrication of micro-/nano-hybrid patterns Supplementary Material (ESI) for Lab on a Chip This journal is The Royal Society of Chemistry 20XX Nanoimprint lithography with a focused laser beam for the fabrication of micro-/nano-hybrid patterns Hyungjun

More information

Innovative Technology for Innovative Science Hands-on in a Nanoscience Classroom

Innovative Technology for Innovative Science Hands-on in a Nanoscience Classroom Innovative Technology for Innovative Science Hands-on in a Nanoscience Classroom Presented by Jennifer F. Wall, Ph.D. Imaging Possibilities Optical 2 mm Electron 500 microns Atomic Force 10 microns Scanning

More information

Development of Nanoimprint Mold Using JBX-9300FS

Development of Nanoimprint Mold Using JBX-9300FS Development of Nanoimprint Mold Using JBX-9300FS Morihisa Hoga, Mikio Ishikawa, Naoko Kuwahara Tadahiko Takikawa and Shiho Sasaki Dai Nippon Printing Co., Ltd Research & Development Center Electronic Device

More information

Optical Bus for Intra and Inter-chip Optical Interconnects

Optical Bus for Intra and Inter-chip Optical Interconnects Optical Bus for Intra and Inter-chip Optical Interconnects Xiaolong Wang Omega Optics Inc., Austin, TX Ray T. Chen University of Texas at Austin, Austin, TX Outline Perspective of Optical Backplane Bus

More information

Index. Page numbers in bold refer to figures and page numbers in italic refer to tables.

Index. Page numbers in bold refer to figures and page numbers in italic refer to tables. Index Page numbers in bold refer to figures and page numbers in italic refer to tables. Air permeance 66, 135-6 AFM 60,60-1 'Apron size press' 84, 85 Atomic force microscopy (AFM) 60,60- Barrier dispersion

More information

True Three-Dimensional Interconnections

True Three-Dimensional Interconnections True Three-Dimensional Interconnections Satoshi Yamamoto, 1 Hiroyuki Wakioka, 1 Osamu Nukaga, 1 Takanao Suzuki, 2 and Tatsuo Suemasu 1 As one of the next-generation through-hole interconnection (THI) technologies,

More information

Flip chip Assembly with Sub-micron 3D Re-alignment via Solder Surface Tension

Flip chip Assembly with Sub-micron 3D Re-alignment via Solder Surface Tension Flip chip Assembly with Sub-micron 3D Re-alignment via Solder Surface Tension Jae-Woong Nah*, Yves Martin, Swetha Kamlapurkar, Sebastian Engelmann, Robert L. Bruce, and Tymon Barwicz IBM T. J. Watson Research

More information

Triple i - The key to your success

Triple i - The key to your success Triple i - The key to your success The needs and challenges of today s world are becoming ever more demanding. Standards are constantly rising. Creativity, reliability and high performance are basic prerequisites

More information

Commercial Printing Processes

Commercial Printing Processes es 2007 26 minutes Program Synopsis This program guides students through a selection of printing / finishing process that provide an understanding of how each printing / finishing equipment functions to

More information

Project Staff: Timothy A. Savas, Michael E. Walsh, Thomas B. O'Reilly, Dr. Mark L. Schattenburg, and Professor Henry I. Smith

Project Staff: Timothy A. Savas, Michael E. Walsh, Thomas B. O'Reilly, Dr. Mark L. Schattenburg, and Professor Henry I. Smith 9. Interference Lithography Sponsors: National Science Foundation, DMR-0210321; Dupont Agreement 12/10/99 Project Staff: Timothy A. Savas, Michael E. Walsh, Thomas B. O'Reilly, Dr. Mark L. Schattenburg,

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Transfer printing stacked nanomembrane lasers on silicon Hongjun Yang 1,3, Deyin Zhao 1, Santhad Chuwongin 1, Jung-Hun Seo 2, Weiquan Yang 1, Yichen Shuai 1, Jesper Berggren 4, Mattias Hammar 4, Zhenqiang

More information

Chapter 3 Fabrication

Chapter 3 Fabrication Chapter 3 Fabrication The total structure of MO pick-up contains four parts: 1. A sub-micro aperture underneath the SIL The sub-micro aperture is used to limit the final spot size from 300nm to 600nm for

More information

FINDINGS. REU Student: Philip Garcia Graduate Student Mentor: Anabil Chaudhuri Faculty Mentor: Steven R. J. Brueck. Figure 1

FINDINGS. REU Student: Philip Garcia Graduate Student Mentor: Anabil Chaudhuri Faculty Mentor: Steven R. J. Brueck. Figure 1 FINDINGS REU Student: Philip Garcia Graduate Student Mentor: Anabil Chaudhuri Faculty Mentor: Steven R. J. Brueck A. Results At the Center for High Tech Materials at the University of New Mexico, my work

More information

PRINTED ELECTRONICS 3

PRINTED ELECTRONICS 3 PRINTED ELECTRONICS 3 4 INKTEC PRINTED ELECTRONICS 5 6 INKTEC PRINTED ELECTRONICS 7 InkTec Leads New Paradigm in Printed Electronic Materials Applications OTFT, Memory Cell, Display, RFID and so on Product

More information

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies Industrialization of Micro-Electro-Mechanical Systems Werner Weber Infineon Technologies Semiconductor-based MEMS market MEMS Market 2004 (total 22.7 BUS$) Others mostly Digital Light Projection IR Sensors

More information

The Cornell NanoScale Facility: NNCI Overview

The Cornell NanoScale Facility: NNCI Overview The Cornell NanoScale Facility: NNCI Overview Prof. Christopher Ober Lester B. Knight Director CNF: founded 1977 CNF Highlights 2017 is CNF s 40 th Anniversary as an NSF funded User Facility Using NNCI

More information