inemi Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications

Transcription

1 inemi Roadmap Facilitates Commercialization of Large Area Flexible Electronics Applications From Concept to Product many routes can be taken and a roadmap simplifies the process Masahiro Tsuriya, inemi Daniel Gamota, Chair Margaret Joyce, Co-Chair Jie Zhang, Co-Chair

2 Large Area Flexible Electronics Roadmap History 09/2005 inemi takeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG 01/2006 Flexible Electronics TWG formed 01/ st Edition inemi Roadmap released 01/ nd Edition inemi Roadmap released 01/ nd Edition inemi Roadmap released 04/ th Edition inemi Roadmap released 1 st Edition Released at APEX 2007

3 inemi Large Area Flexible Electronics Roadmap

4 hift in Roadmap Topic Participation Movement Along upply Chain Materials ubstrates Packaging Processing/ Equipment Platforms Testing Equipment Applications 2007 Roadmap greatest participation in Materials Roadmap greatest participation shifted to ubstrates and Processing Equipment Roadmap greatest participation shifted to Processing Equipment and Applications Roadmap greatest participation shifted to Applications and tandards.

5 Roadmap Contents ituation Analysis Business Issues & Drivers Overview Functional Inks ubstrates Packaging/Barriers Manufacturing Platforms and Processing Equipment Testing and Quality Control Tools Large Area Flexible Electronics Reliability tandards

6 Roadmap Contents Roadmap of Quantified Key Attribute Needs, Gaps, and howstoppers Functional Inks: Technology Requirements ubstrates: Technology Requirements Packaging/Barriers: Technology Requirements Manufacturing Platforms and Processing Equipment: Technology Requirements In-line Characterization Tools: Technology Requirements Off-line Characterization Tools: Technology Requirements Devices and Circuits: Technology Requirements Flexible Electronics: Technology Requirements Reliability: Technology Requirements tandards: Technology Requirements

7 inemi Roadmap Format - ubstrates Introduction 1) Polymer (PET, PEN, PI) 2) Metal (Al, ) 3) Paper (natural, synthetic) 4) Textiles (woven, non-woven) 5) Glass (silica) 6) Ceramics (alumina) Application/ubstrate Properties RFID tag moothness Barrier Properties Optical Transparency Dimensional tability Thermal tability Mechanical trength/ Flexibility Antenna Circuitry OLEDs 1 1 D 1 1 AP Display Backplanes Inorganic Passive 2 3 D 2 2 AP Active 1 2 D 1 1 AP Organic Active 1 1 D 1 2 AP Organic Photovoltaics 2 1 D Batteries very important, 2 medium and 3 less important, AP application and product specific and D design specific

8 inemi Roadmap Format - ubstrates ituation Analysis ubstrates tatus and Current Developments Polymer Films Polyesters: Applications Properties Major Past and Current Developments hrinkage in MD at 150 o C after 30 mins (%) Non stabilised PET and PEN shrink at Tg This limits processing to Tg 18-20ppm/ o C 1000ppm Moisture pickup at 20 o C, 40%RH Upper temperature for processing, o C 0.05% 0.1% 1000ppm 20-25ppm/ o C 150 o C o C 0.7% 0.7% Haze % 4GPa 78 o C 120 o C 5GPa 1GPa Youngs Modulus at 20 o C, GPa Youngs Modulus at 150 o C, GPa 3GPa

9 inemi Roadmap Format - ubstrates Roadmap of Key Technology Needs for ubstrates Roadmap of Quantified Key Attribute Needs, Gaps, and howstoppers ubstrates Polyester Technology Requirements Needs, Gaps, and howstoppers tate of the Art (2009) Mid term (2014) Long term (2019) Attributes Attributes Technology needs Attributes Technology needs urface morphology: roughness bare foil 50nm RM 15 nm RM Development of advanced foil manufacturing technologies 5 nm RM Development of advanced, yet low cost, polishing technologies Flatness (per 500mm of length): 2.0mm 1.0mm Development of advanced foil manufacturing technologies 0.5mm Development of advanced foil manufacturing and inspection technologies Coefficient of thermal expansion: 10ppm/ o C <5ppm Development and scale-up of alternative materials <5ppm Development and scale-up of alternative materials

10 Functional Inks Attributes High performance Long shelf life and pot life olution processable Compatibility with other functional inks (chemical and electrical interfacial integrity) Robust synthesis/formulating routes Materials and device stability in-air Compatible with large area scalable processing platforms emiconductor Inks R ilver Nanoparticle Conductive Inks n R

11 Traditional Electronics Processes Thin Film Deposition Physical Vapor Deposition (sputtering, pulsed laser, etc.) Chemical Vapor Deposition (PECVD) Molecular Beam Epitaxy (MBE) Atomic Layer Deposition (ALD) pin coating Pattern Transfer Photolithography Nanolithography oft Lithography Liquid Imaging Implantation Ion Implantation Diffusion Furnace Manufacturing Platforms and Processing Equipment Emerging Electronics Processes Gravure Flexography creen Jetting Embossing Removal Reactive Ion Etch Dry Etch, Wet Etch Plasma Ashing Chemical Mechanical Planarization ubstrate must be compatible to fabrication process temperature, materials, process environment, handling, etc.

12 Manufacturing Platforms and Processing Equipment Key Technology Needs for Imaging ystem ystem Attribute pecification Reduction ratio 2:1 (reduces reticle image) Resolution 4.0 µm line/space pattern Available depth of focus 25 µm at +/- 10% dose points Numerical Aperture 0.15 Image field size 80 mm round; 56.5mm square Image stitching error ± 1.0 µm Overlay accuracy ± 1.0 µm cale compensation ± 400 ppm Wavelength G-Line (436 nm) Power at image plane 180 mw/cm 2 Uniformity ± 3% Azores pecification Document.. Deposition Technology Evaporation puttering PECVD ALD Thin Film Deposition Technologies Description Pros Cons Formation of a film by the boiling or sublimation of a source material followed by condensation on a target substrate. Ejection of atoms from a target material via momentum transfer of bombarding ions to the surface of the target. Deposition of thin-films from a gas state via the reaction of chemical constituents within a reactive plasma. Gas phase deposition which breaks the chemical formation of thin films into two discrete half reactions. Wide range of materials. Very good for metal and organic deposition. Fast, low temperature deposition possible. Wide range of multicomponent materials. Excellent control of stochiometry. High deposition rates (esp. with elevated T) Exceptional thickness control and step coverage. Process T as low as ambient. Dissimilar materials may require markedly varying source technology. Potential for ion damage of underlying films. Requires specialized precursor materials. Control of film density at low T problematic. Low deposition rate. eshan, K. (2002). Handbook of Thin-Film Deposition Processes and Techniques - Principles, Methods, Equipment and Applications (2nd Edition).

13 In-Line/Off-Line Characterization Tools Critical Parameters Resolution L Registration Layer thickness Orientation of features ource Drain Dimensions of features Processing conditions Dielectric Gate a Material quality (pot life) ubstrate In-process electrical testing Final product electrical testing b

14 In-Line/Off-Line Characterization Tools Material Attributes Rheology Curing/intering/Annealing temperature and schedules olution stability/shelf-life Process Parameters Excitation frequency Meniscus oscillation Droplet pinch-off Deposition Issues Material/substrate wettability Droplet evaporation Coffee tain phenomena Development of Characterization Tools and tandard Operating Procedures based on materials and processes.

15 In-Line/Off-Line Characterization Tools ystem Attributes Web scratch identification Defect mapping Inspection width of 6 (extendable) Web handling: widths up to 24 Target defect size to detect: (1 to 5) μm Minimum defect size: 3 μm Pass/fail sensitivity parameters automated cratch detection algorithm ( 1 x 10 μm) Interleaf capable web handling R2R Defect Inspection ystem (Flexible Electronics Roadmap Chapter Figure 13).

16 Electrical Design, Layout, and imulation Tools PDF/JDF Interface emiconductor/ Microelectronics Layout oftware Process and Device Modeling CADENCE PPICE UPREM FLOOP CAD file/gerber file Pre-Press Production ystems RIPing BIT map file Imaging device (CtP, Film setter) Plate Cylinder Film Graphic Arts File Conversion TIFF file emiconductor/microelectronics Layout oftware OrCAD L Edit GerbTool Graphics AutoCAD Graphic Arts oftware Illustrator Photoshop Quark In Design Potential flow processes for circuit layout data conversion to R2R printing manufacturing (Flexible Electronics Roadmap Chapter: Figure 4). Pre-Press Production ystems Kodak Prinergy AGFA Apogee Esko Artwork Common software for microelectroinics, graphic arts, and printing (Flexible Electronics Roadmap Chapter: Table 2).

17 Electrical Design, Layout, and imulation Tools Circuit Design Circuit imulation Measured imulated Confirmation of Experimental to imulation Circuit Layout

18 Products and Applications Lighting & Displays RF Enabled ensors Photovoltaics

19 Reliability Testing Methods and Equipment Reliability Testing Parameters Air to air temperature cycling (- 20 C to +60 C, 30 min dwell) Liquid to liquid thermal shock (- 20 C to +60 C, 5 min dwell) Flexure (30 degree off-axis bend) Humidity exposure (60 C at 90% R.H.) Oxygen exposure olvent resistance (Bleach, water, ammonia, etc.) Tearing, crumpling, crushing Reliability is application specific

20 tandards Development Community ATM GIA IEC NPE Printed Electronics tandards IEEE NIT IPC JPCA JAPERA tandards community expanding to include representatives from various organizations.

21 IPC D61 ubcommittee Design Guidelines for Printed Electronics (IPC/JPCA-2291) Motivation Establish a design process flow to facilitate the practice of printed electronics. Requirements Performance pecifications Materials election Design and Architecture Manufacturing Process Layout Ballot for IPC/JPCA-2291 closes in May

22 IPC D62 ubcommittee Printed Electronics Base Materials (IPC/JPCA-4921) Motivation Base (substrate) material strongly influences final device performance. Materials Requirements Chemical Electrical Mechanical Optical Approved by Consensus Body Ballot Closed on June 1, 2012 (Released to Public July 2012). 22

23 IPC D63 ubcommittee Printed Electronics Functional Materials (IPC/JPCA-4591) Motivation Multiple classes of conductive functional materials available. Requirements Mechanical Properties Electrical Properties Optical Properties Test Vehicle Designs helf and Working Life Approved by Consensus Body Ballot Closed on October 8, 2012 (Released to Public December 2012). 23

24 IPC D64 ubcommittee Printed Electronics Final Assembly (IPC/JPCA-6901) Motivation Provide developers the tools to design and manufacture printed electronics assemblies. Requirements Classification ystem - Market Classification ystem - Level Performance Criteria Testing Methods D64 ubcommittee identifying the necessary technical structure to design and manufacture printed electronics assemblies that meet conformance to industry established metrics as determined by industry accepted testing methods. 24

25 IPC PE tandards Portfolio Near term needs D60 D61 D62 D63 D64 D65 D66 Design Guidelines for Printed Electronics (IPC-2291) Requirements for Printed Electronics Base Materials (IPC-4921) Requirements for Printed Electronics Functional Materials (IPC-4591) Performance Requirements for Printed Electronics Assemblies (IPC-6901) Test Methods for Printed Electronics Process Guidelines for Printed Electronics * *D-66 subcommittee formed, 1 st JPCA PE in Tokyo, 4 June 2013 D65 gathering members and background data 25

26 Large Area Flexible Electronics Top Four Needs and Gaps #1 In-line inspection and testing equipment #2 imulation and design tools #2 Robust R2R, roll-fed, and large format manufacturing platforms #4 Higher performance inks (semiconducting, OLED, PV active, etc.)

27 Masahiro Tsuriya Daniel Gamota Bob Pfahl