EVALUATION KIT AVAILABLE 1700MHz to 3000MHz High-Linearity, Low LO Leakage Base-Station Rx/Tx Mixer. Maxim Integrated Products 1

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1 1; Rev 0; 12/0 EVALUATION KIT AVAILABLE 100MHz to 00MHz High-Linearity, General Description The high-linearity passive upconverter or downconverter mixer is designed to provide approximately +31dBm of IIP3, +dbc of LO ± 2IF spurious rejection,.db of noise figure,.db of conversion loss, and -2dBm of LO leakage for UMTS/WCDMA, DCS, PCS, and WiMAX base-station applications. With a 100MHz to 00MHz RF frequency range and a 100MHz to 00MHz LO frequency range, this mixer is ideal for high-side LO injection architectures. In addition to offering excellent linearity and noise performance, the also yields a high level of component integration. The integrates baluns in the RF and LO ports, a dual-input LO-selectable switch, an LO buffer, and a double-balanced mixer. The onchip baluns allow for a single-ended RF input for downconversion (or RF output for upconversion), and single-ended LO inputs. The requires a typical 0dBm LO drive, and supply current is rated at a typical 10mA level. The IF port is DC-coupled, making it ideal for direct conversion or modulation. As an upconverter, the device has low output noise floor of less than -10dBc/Hz (-10dBm/Hz when transmitting 0dBm linear RF power). The is available in a 3-pin thin QFN package (mm x mm) with an exposed paddle. Electrical performance is guaranteed over the extended C to + C temperature range. Applications UMTS/WCDMA and 3G Base Stations DCS 100 and EDGE Base Stations PCS 100 and EDGE Base Stations cdmaone TM and cdma00 Base Stations WiMAX Base Stations and Customer Premise Equipment Point-to-Point Microwave Systems Wireless Local Loop Private Mobile Radio Digital and Spread-Spectrum Communication Systems Microwave Links cdmaone is a trademark of CDMA Development Group. cdma00 is a registered trademark of Telecommunications Industry Association. Features +31dBm Typical 3rd-Order Input Intercept Point +23dBm Typical Input 1dB Compression Point 100MHz to 00MHz RF Frequency Range 100MHz to 00MHz LO Frequency Range DC to MHz IF Frequency Range.dB Typical Conversion Loss.dB Typical Noise Figure -10dBc/Hz LO Noise -2dBm LO Leakage at RF Port dbc LO ± 2IF Spurious Suppression -3dBm to +dbm LO Drive +V Single-Supply Operation Built-In SPDT LO Switch with 43dB LO1 to LO2 Isolation and 0ns Switching Time Internal RF and LO Baluns for Single-Ended Inputs External Current-Setting Resistor Provides Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available Ordering Information PART TEMP RANGE PIN- PACKAGE ETX C to + C ETX-T C to + C ETX+ C to + C ETX+T C to + C *EP = Exposed paddle. +Denotes lead-free package. -T = Tape-and-reel package. 3 TQFN-EP* (mm x mm) 3 TQFN-EP* (mm x mm) 3 TQFN-EP* (mm x mm) 3 TQFN-EP* (mm x mm) PKG CODE T3-2 T3-2 T3-2 T3-2 Pin Configuration and Typical Application Circuit appear at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at , or visit Maxim s website at

2 ABSOLUTE MAXIMUM RATINGS V CC to v to +.V RF (RF is DC shorted to through balun)...0ma LO1, LO2 to...±0.3v RFTAP, IF+, IF- to v to (V CC + 0.3V) LOSEL to v to (V CC + 0.3V) RF, IF, and LO Input Power**...+dBm LO_ADJ Current...mA Continuous Power Dissipation (T A = +0 C) 3-Pin TQFN (derated.3mw/ C above +0 C)...20mW Operating Temperature Range... C to + C Junction Temperature C θ JC C/W θ JA...+3 C/W Storage Temperature Range...- C to +10 C Lead Temperature (soldering, 10s)...+0 C **Maximum reliable continuous input power applied to the RF, IF, and LO ports of this device is +1dBm from a 0Ω source. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS ( Typical Application Circuit, V CC = +4.V to +.V, no RF signals applied, IF+ and IF- DC grounded through a transformer, to + C. A Ω resistor is connected from LO_ADJ to. Typical values are at V CC = +V, T C = + C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V CC 4.. V Supply Current I CC Total supply current ma LOSEL Logic 0 Input Voltage V IL 0. V LOSEL Logic 1 Input Voltage V IH 2 V LOSEL Logic Input Current I IH and I IL µa AC ELECTRICAL CHARACTERISTICS (Downconverter Operation) ( Typical Application Circuit, V CC = +4.V to +.V, RF and LO ports are driven from 0Ω sources, to +3dBm,, f RF = 100MHz to 00MHz, f LO = 100MHz to 00MHz, f IF = 0MHz, f RF < f LO, to + C, unless otherwise noted. Typical values are at V CC = +V,,, f RF = 100MHz, f LO = 2100MHz, f IF = 0MHz, T C = + C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency f RF MHz LO Frequency f LO MHz IF Frequency (Notes 1, 2) f IF 0 MHz DCS 100: P RF = -10dBm,, f IF = 0MHz, f RF = 110MHz to 1MHz. Small-Signal Conversion Loss L C PCS 100: P RF = -10dBm,, f IF = 0MHz, f RF = 10MHz to 110MHz. db UMTS 2100: P RF = -10dBm,, f IF = 0MHz, f RF = 1MHz to 10MHz. DCS 100: f RF = 110MHz to 1MHz ±0. Conversion Loss Variation from Nominal PCS 100: f RF = 10MHz to 110MHz UMTS 2100: f RF = 1MHz to 10MHz ±0. db ±0. 2

3 AC ELECTRICAL CHARACTERISTICS (Downconverter Operation) (continued) ( Typical Application Circuit, V CC = +4.V to +.V, RF and LO ports are driven from 0Ω sources, to +3dBm,, f RF = 100MHz to 00MHz, f LO = 100MHz to 00MHz, f IF = 0MHz, f RF < f LO, to + C, unless otherwise noted. Typical values are at V CC = +V,,, f RF = 100MHz, f LO = 2100MHz, f IF = 0MHz, T C = + C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Conversion Loss Variation Over Temperature to + C 0.00 db/ C T C = + C, DCS 100: f RF = 110MHz to 1MHz. Noise Figure, Single Sideband NF T C = + C, PCS 100: f RF = 10MHz to 110MHz. db T C = + C, UMTS 2100: f RF = 1MHz to 10MHz. Noise Figure Under Blocking Condition (Note 3) P BLOCKER = +dbm at 2100MHz, f RF = 00MHz, f LO = 210MHz, 1 db Input Compression Point (Note 4) IP1dB High-side injection +23 dbm 3rd-Order Input Intercept Point IIP3 High-side injection, f RF1 = 100MHz, f RF2 = 101MHz, 0dBm per tone at RF port 31 dbm 3rd-Order Input Intercept Point Variation to + C ±0. db 2LO - 2RF Spur 3LO - 3RF Spur f RF = 100MHz, f LO = 2100MHz, f SPUR = 00MHz,, f RF = 100MHz, f LO = 2100MHz, f SPUR = MHz,, 3 dbc dbc LO Drive (Note ) P LO dbm LO1-to-LO2 Port Isolation P LO1 = P LO2 = +3dBm, f IF = 0MHz (Note ) 43 db LO Leakage at RF Port P LO = +3dBm, f LO = 220MHz -2-3 dbm LO Switching Time 0% of LOSEL to IF settled within 2 degrees 0 ns LO Leakage at IF Port P LO = +3dBm -3 dbm RF-to-IF Isolation P LO = +3dBm 3 db RF Input Return Loss LO on and IF terminated 1 db LO Input Return Loss RF and IF terminated 14 db IF Return Loss RF and LO terminated in 0Ω, f IF = 0MHz (Note ) db 3

4 AC ELECTRICAL CHARACTERISTICS (Upconverter Operation) ( Typical Application Circuit, V CC = +4.V to +.V, to +3dBm,, f RF = 100MHz to 00MHz, f LO = 100MHz to 00MHz, f IF = 0MHz, f RF = f LO - f IF, to + C, unless otherwise noted. Typical values are at V CC = +V,,, f RF = 210MHz, f LO = 220MHz, f IF = 0MHz, T C = + C, unless otherwise noted.) (Note 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Compression Point IP1dB 23 dbm 3rd-Order Input Intercept Point LO ± 2IF Spur LO ± 3IF Spur IIP3 Two tones: f IF1 = 0MHz, f IF2 = 1MHz, P IF = +dbm/tone, f LO = 22MHz, LO - 2IF 0 LO + 2IF 0 LO - 3IF 3 LO + 3IF 4 2 dbm Output Noise Floor P OUT = 0dBm -10 dbm/hz dbc dbc Note 1: All limits reflect losses of external components. Output measurement taken at IF port of Typical Application Circuit. Note 2: The lower IF frequency limit of 0MHz is limited by the external IF transformer. Note 3: Measured with external LO source noise filtered so its noise floor is not a contributor. Measured with: f RF = 00MHz, f BLOCKER = 2100MHz, f LO = 210MHz, using a 10MHz SAW filter on the IF port. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 21. Note 4: Maximum reliable continuous input power applied to the RF or IF port of this device is +1dBm from a 0Ω source. Note : Typical Operating Characteristics show LO drive extended to +dbm Note : Measured IF port at IF frequency. f LO1 and f LO2 are offset by 1MHz. Note : IF return loss can be optimized by external matching components. Typical Operating Characteristics ( Typical Application Circuit, C2 not installed, RFTAP =, V CC = +.0V,, LOSEL = 0 (LO2 selected), P RF = 0dBm, f LO > f RF, f IF = 0MHz, unless otherwise noted.) Downconverter Curves CONVERSION LOSS vs. RF FREQUENCY T C = + C toc01 CONVERSION LOSS vs. RF FREQUENCY toc02 CONVERSION LOSS vs. RF FREQUENCY toc03 CONVERSION LOSS (db) T C = + C CONVERSION LOSS (db), 0dBm, +3dBm CONVERSION LOSS (db) V CC = 4.V,.0V,.V

5 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 not installed, RFTAP =, V CC = +.0V,, LOSEL = 0 (LO2 selected), P RF = 0dBm, f LO > f RF, f IF = 0MHz, unless otherwise noted.) Downconverter Curves INPUT IP3 (dbm) INPUT IP3 vs. RF FREQUENCY T C = + C T C = + C toc04 INPUT IP3 (dbm) INPUT IP3 vs. RF FREQUENCY P LO = +3dBm toc0 INPUT IP3 (dbm) INPUT IP3 vs. RF FREQUENCY V CC = 4.V V CC =.V V CC =.0V toc NOISE FIGURE vs. RF FREQUENCY T C = + C toc NOISE FIGURE vs. RF FREQUENCY toc NOISE FIGURE vs. RF FREQUENCY V CC =.0V toc0 NOISE FIGURE (db) T C = + C NOISE FIGURE (db), 0dBm, +3dBm NOISE FIGURE (db) V CC =.V V CC = 4.V LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY T C = + C T C = + C toc10 2LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY P LO = +3dBm toc11 2LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY V CC =.V V CC =.0V V CC = 4.V toc12

6 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 not installed, RFTAP =, V CC = +.0V,, LOSEL = 0 (LO2 selected), P RF = 0dBm, f LO > f RF, f IF = 0MHz, unless otherwise noted.) Downconverter Curves 2LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY LOSEL = "1" (LO1 SELECTED) T C = + C T C = + C, + C toc13 2LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY LOSEL = "1" (LO1 SELECTED) P LO = +3dBm toc14 2LO - 2RF RESPONSE (dbc) 2LO - 2RF RESPONSE vs. RF FREQUENCY LOSEL = "1" (LO1 SELECTED) V CC =.V V CC = 4.V,.0V,.V toc1 3LO - 3RF RESPONSE (dbc) 3LO - 3RF RESPONSE vs. RF FREQUENCY T C = + C T C = + C toc1 3LO - 3RF RESPONSE (dbc) 3LO - 3RF RESPONSE vs. RF FREQUENCY, +3dBm toc1 3LO - 3RF RESPONSE (dbc) 3LO - 3RF RESPONSE vs. RF FREQUENCY V CC =.0V V CC =.V V CC = 4.V toc1 INPUT P1dB (dbm) INPUT P 1dB vs. RF FREQUENCY T C = + C T C = + C toc1 INPUT P1dB (dbm) INPUT P 1dB vs. RF FREQUENCY P LO = +3dBm toc INPUT P1dB (dbm) INPUT P 1dB vs. RF FREQUENCY V CC =.V V CC =.0V V CC = 4.V toc

7 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 not installed, RFTAP =, V CC = +.0V,, LOSEL = 0 (LO2 selected), P RF = 0dBm, f LO > f RF, f IF = 0MHz, unless otherwise noted.) Downconverter Curves LO SWITCH ISOLATION (db) LO SWITCH ISOLATION vs. LO FREQUENCY T C = + C T C = + C toc22 LO SWITCH ISOLATION (db) LO SWITCH ISOLATION vs. LO FREQUENCY , 0dBm, +3dBm toc23 LO SWITCH ISOLATION (db) LO SWITCH ISOLATION vs. LO FREQUENCY V CC = 4.V,.0V,.V toc LO LEAKAGE AT IF PORT vs. LO FREQUENCY - T C = + C toc LO LEAKAGE AT IF PORT vs. LO FREQUENCY - toc2 LO LEAKAGE AT IF PORT vs. LO FREQUENCY - toc LO LEAKAGE (dbm) - T C = + C LO LEAKAGE (dbm) -, 0dBm, +3dBm LO LEAKAGE (dbm) - V CC = 4.V,.0V,.V LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY T C = + C - T C = + C toc2 LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY P LO = +3dBm toc2 LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY V CC = 4.V,.0V,.V -0 toc

8 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 not installed, RFTAP =, V CC = +.0V,, LOSEL = 0 (LO2 selected), P RF = 0dBm, f LO > f RF, f IF = 0MHz, unless otherwise noted.) Downconverter Curves RF-TO-IF ISOLATION (db) RF-TO-IF ISOLATION vs. RF FREQUENCY T C = + C T C = + C MAX343 toc31 RF-TO-IF ISOLATION (db) RF-TO-IF ISOLATION vs. RF FREQUENCY, 0dBm, +3dBm toc32 RF-TO-IF ISOLATION (db) RF-TO-IF ISOLATION vs. RF FREQUENCY V CC = 4.V,.0V,.V toc33 RF PORT RETURN LOSS (db) RF PORT RETURN LOSS vs. RF FREQUENCY, 0dBm, +3dBm toc34 IF PORT RETURN LOSS (db) V CC =.V IF PORT RETURN LOSS vs. IF FREQUENCY LOW FREQ MATCH SET BY T1 V CC =.0V V CC = 4.V toc3 LO SELECTED RETURN LOSS (db) LO SELECTED RETURN LOSS vs. LO FREQUENCY, +3dBm toc IF FREQUENCY (MHz) LO UNSELECTED RETURN LOSS (db) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY, 0dBm, +3dBm toc3 SUPPLY CUIRRENT (ma) SUPPLY CURRENT vs. TEMPERATURE (T C ) V CC = 4.V V CC =.V V CC =.0V toc TEMPERATURE ( C)

9 Typical Operating Characteristics ( Typical Application Circuit, C2 = 22pF, V CC = +.0V,, LOSEL = 1 (LO1 selected),, f RF = f LO - f IF, f IF = 0MHz, unless otherwise noted.) Upconverter Curves CONVERSION LOSS (db) CONVERSION LOSS vs. RF FREQUENCY T C = + C T C = + C toc3 CONVERSION LOSS (db) CONVERSION LOSS vs. RF FREQUENCY, 0dBm, +3dBm, +dbm toc40 CONVERSION LOSS (db) CONVERSION LOSS vs. RF FREQUENCY V CC = 4.V,.0V,.V toc INPUT IP3 vs. RF FREQUENCY T C = + C T C = + C toc INPUT IP3 vs. RF FREQUENCY, +3dBm, +dbm toc INPUT IP3 vs. RF FREQUENCY toc44 INPUT IP3 (dbm) INPUT IP3 (dbm) INPUT IP3 (dbm) V CC = 4.V,.0V,.V LO + 2IF REJECTION (dbc) LO + 2IF REJECTION vs. RF FREQUENCY T C = + C T C = + C toc LO + 2IF REJECTION (dbc) LO + 2IF REJECTION vs. RF FREQUENCY P LO = +dbm P LO = +3dBm toc4 LO + 2IF REJECTION (dbc) LO + 2IF REJECTION vs. RF FREQUENCY V CC =.V V CC =.0V V CC = 4.V toc

10 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 = 22pF, V CC = +.0V,, LOSEL = 1 (LO1 selected),, f RF = f LO - f IF, f IF = 0MHz, unless otherwise noted.) Upconverter Curves LO - 2IF REJECTION (dbc) LO - 2IF REJECTION vs. RF FREQUENCY T C = + C T C = + C toc4 LO - 2IF REJECTION (dbc) LO - 2IF REJECTION vs. RF FREQUENCY P LO = +3dBm P LO = +dbm toc4 LO - 2IF REJECTION (dbc) LO - 2IF REJECTION vs. RF FREQUENCY V CC =.V V CC = 4.V V CC =.0V toc LO + 3IF REJECTION (dbc) LO + 3IF REJECTION vs. RF FREQUENCY T C = + C T C = + C toc1 LO + 3IF REJECTION (dbc) LO + 3IF REJECTION vs. RF FREQUENCY, 0dBm, +3dBm, +dbm toc2 LO + 3IF REJECTION (dbc) LO + 3IF REJECTION vs. RF FREQUENCY V CC = 4.V,.0V,.V toc LO - 3IF REJECTION (dbc) LO - 3IF REJECTION vs. RF FREQUENCY T C = + C, + C toc4 LO - 3IF REJECTION (dbc) LO - 3IF REJECTION vs. RF FREQUENCY, 0dBm, +3dBm, +dbm toc LO - 3IF REJECTION (dbc) LO - 3IF REJECTION vs. RF FREQUENCY V CC = 4.V,.0V,.V toc

11 Typical Operating Characteristics (continued) ( Typical Application Circuit, C2 = 22pF, V CC = +.0V,, LOSEL = 1 (LO1 selected),, f RF = f LO - f IF, f IF = 0MHz, unless otherwise noted.) Upconverter Curves LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY T C = + C T C = + C toc LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY P LO = +3dBm P LO = +dbm toc 00 LO LEAKAGE AT RF PORT (dbm) LO LEAKAGE AT RF PORT vs. LO FREQUENCY V CC = 4.V,.0V,.V toc IF LEAKAGE (dbm) IF LEAKAGE AT RF vs. LO FREQUENCY, + C, + C toc0 IF LEAKAGE (dbm) IF LEAKAGE AT RF vs. LO FREQUENCY, 0dBm, +3dBm, +dbm toc1 IF LEAKAGE (dbm) IF LEAKAGE AT RF vs. LO FREQUENCY V CC = 4.V,.0V,.V toc

12 PIN NAME FUNCTION 1,, 10, 11, 12, 1, 1,, 22, 24,, 2, 2, 2, 31 3 Pin Description These pins have no internal connection and can be left open or connected to ground. It is suggested that these pins be grounded back to the exposed paddle where possible to improve pinto-pin isolation. Power-Supply Connection. Connected to external power supply (V). Bypass to with a 0.01µF, 1, 21, V CC capacitor as close to the pin as possible. RFTAP Center Tap of the Internal RF Balun. Connected to internal RF balun center tap. RF Single-Ended 0Ω RF Input/Output. DC grounded internally. 13, 14 IF+, IF- ( p or ts) Differential IF Ports (0Ω). 0V common-mode voltage. 1 LO_ADJ Adjust LO Drive. A Ω ±1% resistor connected from this pin to ground sets the LO driver bias. A 1.1V DC voltage appears across this resistor. 1 LO1 Local Oscillator Input 1. Drive LOSEL high to select LO1. 23 LOSEL Local Oscillator Select. Logic 0 selects LO2 and 1 selects LO1. LO2 Local Oscillator Input 2. Drive LOSEL low to select LO2. EP Exposed Paddle. Ground the exposed paddle using multiple ground vias. Detailed Description The can operate as either a downconverter or an upconverter mixer that provides.db of conversion loss with a typical.db noise figure. IIP3 is +31dBm for both upconversion and downconversion. The integrated baluns and matching circuitry allow for 0Ω single-ended interfaces to the RF port and two LO ports. The RF port can be used as an input for downconversion or an output for upconversion. A singlepole, double-throw (SPDT) switch provides 0ns switching time between the two LO inputs with 43dB of LO-to-LO isolation and -2dBm of LO leakage. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the s inputs to a -3dBm to +dbm range. The IF port incorporates a differential output for downconversion, which is ideal for providing enhanced IIP2 performance. For upconversion, the IF port is a differential input. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS/WCDMA and 2G/2.G/3G DCS 100, PCS 100, cdma00, and WiMAX base stations. The is specified to operate over a 100MHz to 00MHz RF input range, a 100MHz to 00MHz LO range, and an IF range of near 0MHz to MHz. The external IF component sets the lower frequency range. RF Port and Balun For using the as a downconverter, the RF input is internally matched to 0Ω, requiring no external matching components. A DC-blocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. The RF return loss is typically 1dB over the entire 100MHz to 00MHz RF frequency range. For upconverter operation, the RF port is a single-ended output similarly matched to 0Ω. An optional L-C BPF can be installed at the RF port to improve some upconverter performance. LO Inputs, Buffer, and Balun The is optimized for a 100MHz to 00MHz LO range. As an added feature, the includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 0ns, which is more than adequate for typical GSM applications. If frequency-hopping is not employed, simply set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logichigh selects LO1, logic-low selects LO2. LO1 and LO2 inputs are internally matched to 0Ω, requiring only a 22pF DC-blocking capacitor. To avoid damage to the 12

13 part, voltage MUST be applied to V CC before digital logic is applied to LOSEL. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +dbm. The on-chip low-loss balun along with an LO buffer drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. High-Linearity Mixer The core of the is a double-balanced, high-performance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. Differential IF The mixer has a DC to MHz IF frequency range where the low-end frequency depends on the frequency response of the external IF components. Note that these differential ports are ideal for providing enhanced IIP2 performance. Single-ended IF applications require a 1:1 balun to transform the 0Ω differential IF impedance to 0Ω single-ended system. After the balun, the IF return loss is better than db. The user can use a differential IF amplifier on the mixer IF ports, but a DC block is required on both IF+ and IF- ports to keep external DC from entering the IF ports of the mixer. The mixer requires a DC ground return on either the RF tap pin (short tap to ground) or on each IF differential port (1kΩ resistor or an inductor from each IF differential pin to ground). Applications Information Input and Output Matching The RF and LO inputs are internally matched to 0Ω. No matching components are required. Return loss at the RF port is typically 1dB and return loss at the LO ports are typically 14dB. RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 0Ω (differential). For evaluation, an external low-loss 1:1 (impedance ratio) balun transforms this impedance to a 0Ω single-ended output (see the Typical Application Circuit). Bias Resistor Bias current for the on-chip LO buffer is optimized by fine-tuning the off-chip resistor on pin 1 (R1). The current in the buffer amplifier can be reduced by raising the value of this resistor but performance (especially IP3) degrades. Doubling the value of this resistor reduces the current in the device by approximately half. Additional Tuning Components The mixer performance can be further enhanced with the use of external components. The values of these components depend on the application and the frequency band of interest. Consult the factory for further details. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The evaluation kit can be used as a reference for board layout. Gerber files are available upon request at Power-Supply Bypassing Proper voltage supply bypassing is essential for highfrequency circuit stability. Bypass each V CC pin and TAP with the capacitors shown in the Typical Application Circuit. See Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the s 3-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. 13

14 Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION C1 4pF Microwave capacitor (0402) C2*, C4, C, C 22pF Microwave capacitors (0402) C3 Not used Microwave capacitor (003) C, C, C 0.01µF Microwave capacitors (0402) R1 Ω Ω ±1% resistor (0402) PROCESS: SiGe BiCMOS Chip Information T1 1:1 Transformer (0:0) M/A-COM MABAES002 U1 Maxim IC *Ground pin for downconverter operation. Pin Configuration TOP VIEW V CC RFTAP EXPOSED PADDLE RF IF+ IF- VCC LO_ADJ VCC LO LOSEL V CC 1 LO

15 VCC Typical Application Circuit V CC C U1 2 C 3 4 V CC LO SELECT C4 C3 RF C1 V CC C2 RFTAP RF EXPOSED PADDLE C C V CC IF+ IF- VCC LO_ADJ LO2 LO LOSEL V CC LO1 LO1 R1 V CC C NOTE: PINS 1, 2, 3, 4,,, 10, 11, 12, 1, 1,, 22, 24,, 2, 2, 2, 31, 32, 33, 34, 3, 3 OF U1 HAVE NO INTERNAL CONNECTIONS. THESE PINS CAN BE CONNECTED BACK TO THE GROUNDED EXPOSED PADDLE WHERE POSSIBLE TO IMPROVE PIN-TO-PIN ISOLATION. T IF 1

16 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to D D/2 E/2 E (ND-1) X e (NE-1) X e k C L D2 QFN THIN.EPS D2/2 e b L k C L E2 E2/2 e L C L C L L1 L L e e A1 A2 A PACKAGE OUTLINE 3, 40, 4L THIN QFN, xx0.mm F 1 2 1

17 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.M ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD -1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0. mm AND 0. mm FROM TERMINAL TIP.. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.. DRAWING CONFORMS TO JEDEC MO2, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN FOR REFERENCE ONLY. PACKAGE OUTLINE 3, 40, 4L THIN QFN, xx0.mm F 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 1 San Gabriel Drive, Sunnyvale, CA Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. M. Reduta