TOP VIEW IF LNAIN IF IF LO LO

Transcription

1 -3; Rev ; / EVALUATION KIT AVAILABLE Low-Cost RF Up/Downconverter General Description The performs the RF front-end transmit/ receive function in time-division-duplex (TDD) communication systems. It operates over a wide frequency range and is optimized for RF frequencies around.ghz. Applications include most popular cordless and PCS standards. The includes a low-noise amplifier (LNA), a downconverter mixer, a local-oscillator buffer, an upconverter mixer, and a variable-gain power-amplifier (PA) driver in a low-cost, plastic surface-mount package. The s unique bidirectional, differential port reduces cost and component count by allowing the transmit and receive paths to share the same filter. The LNA has a. typical noise figure and a - input third-order intercept point (IP3). The downconverter mixer has a low. noise figure and input IP3. Image and local-oscillator filtering are implemented off-chip for maximum flexibility. The PA driver amplifier has of gain, which can be reduced over a 3 range. Power consumption is only mw in receive mode and mw in transmit mode and drops to less than 3µW in shutdown mode. For applications requiring separate, single-ended input and output ports, refer to the MAX data sheet. For applications requiring only a receive function, Maxim offers a low-cost downconverter with LNA (see the MAX data sheet). Applications PWT DECT DCS/PCS PHS/PACS ISM-Band Transceivers Iridium Handsets Features Low-Cost Silicon Bipolar Design Integrated Upconvert/Downconvert Function Operates from a Single +.V to +.V Supply 3. Combined Receiver Noise Figure:. (LNA). (mixer) Flexible Power-Amplifier Driver: Output Third-Order Intercept (OIP3) 3 Gain-Control Range Buffer for Low Drive Level Low Power Consumption: mw Receive mw Full-Power Transmit.3µW Shutdown Mode Flexible Power-Down Modes Compatible with MAX/MAX Transceivers Ordering Information PART TEMP. RANGE PIN-PACKAGE EEI - C to + C QSOP E/D - C to + C Dice* *Dice are specified at T A = C, DC parameters only. TOP VIEW Pin Configuration Typical Operating Circuit appears on last page. Functional Diagram LNAIN 3 LNAOUT LNAOUT RXMXIN RXEN 3 RXMXIN RX MIXER LNAIN LNA RXEN TXEN PADROUT POWER MANAGEMENT PA DRIVER TXEN GC TXMXOUT TX MIXER PADROUT 3 PADRIN GC PADRIN TXMXOUT QSOP Maxim Integrated Products For free samples & the latest literature: or phone ---. For small orders, phone -3- ext. 3.

2 ABSOLUTE MAXIMUM RATINGS to...-.3v to V LNAIN Input Power..., Input Power... PADRIN Input Power... RXMXIN Input Power..., Input Power (transmit mode)... Voltage at RXEN, TXEN, GC...-.3V to ( +.3V) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS ( = +.V to +.V, V GC = +3.V, RXEN = TXEN =.V, PADROUT pulled up to with Ω resistor;, pulled up to with Ω resistor, TXMXOUT pulled up to with Ω resistor, LNAOUT pulled up to with Ω resistor, all RF inputs open, T A = - C to + C. Typical values are at + C and = +3.V, unless otherwise noted.) PARAMETER Supply-Voltage Range Digital Input Voltage High Digital Input Voltage Low RXEN Input Bias Current (Note ) TXEN Input Bias Current (Note ) GC Input Bias Current Supply Current, Receive Mode Supply Current, Transmit Mode Supply Current, Standby Mode Supply Current, Shutdown Mode RXEN, TXEN pins RXEN, TXEN pins RXEN =.V TXEN =.V RXEN =.V TXEN =.V RXEN =.V, TXEN =.V = 3.V AC ELECTRICAL CHARACTERISTICS CONDITIONS Continuous Power Dissipation (T A = + C) QSOP (derate mw/ C above + C)...mW Junction Temperature...+ C Operating Temperature Range...- C to + C Storage Temperature...- C to + C Lead Temperature (soldering, sec)...+3 C... ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), T A = + C, unless otherwise noted.) Gain (Note ) Noise Figure Input IP3 PARAMETER W-NOISE AMPLIER (RXEN = high) Output Compression to LNAIN Leakage RECEIVE MIXER (RXEN = high) Conversion Gain (Note ) Noise Figure Input IP3 Input Compression Frequency Minimum Drive Level T A = + C T A = T MIN to T MAX (Note 3) RXEN = high or low CONDITIONS MIN TYP MAX UNITS GC = 3V, TXEN = V 3. µa T A = + C T A = - C to + C Single sideband (Note ) (Notes, ) (Note ) MIN TYP MAX V V V µa µa ma ma µa µa UNITS MHz

3 AC ELECTRICAL CHARACTERISTICS (continued) ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), all impedance measurements made directly to pin (no matching network), T A = + C, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX TRANSMIT MIXER (TXEN = high) Conversion Gain (Note ) T A = + C...3 T A = T MIN to T MAX.. Output IP3 (Notes, ). Output Compression Point -. Leakage - Noise Figure Single sideband.3 Frequency (Notes, ) F OUT = - =.GHz -. Intermod Spurious Response F OUT = -3 =.GHz - (Note ) F OUT = 3- =.GHz - PA DRIVER (TXEN = high) Gain (Note ) T A = + C 3. T A = T MIN to T MAX.3 Output IP3 (Note ) Output Compression Point.3 Gain-Control Range 3 Gain-Control Sensitivity (Note ) CAL-OSCILLATOR INPUTS (RXEN = TXEN = high) Input Relative VSWR Receive mode (TXEN = low). Transmit mode (RXEN = low). POWER MANAGEMENT (RXEN = TXEN = low) Receiver Turn-On Time (Notes, ) RXEN = low to high.. µs Transmitter Turn-On Time (Notes, ) TXEN = low to high.3. µs UNITS MHz c /V Note : Power delivered to SMA connector of EV kit. Power delivered to IC is approximately. less due to balun losses. Note : Guaranteed by design and characterization. Note 3: Two tones at.ghz and.ghz at -3 per tone. Note : Two tones at.ghz and.ghz at - per tone. Note : Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the Typical Operating Characteristics for graphs of port impedance versus frequency. Note : At this drive level, the mixer conversion gain is typically lower than with - drive. Note : Two tones at MHz and MHz at -3 per tone. Note : Transmit mixer output at -. Note : Calculated from measurements taken at V GC =.V and V GC =.V. Note : Time from RXEN = low to RXEN = high transition until the combined receive gain is within of its final value. Measured with pf blocking capacitors on LNAIN and LNAOUT. Note : Time from TXEN = low to TXEN = high transition until the combined transmit gain is within of its final value. Measured with pf blocking capacitors on PADRIN and PADROUT. 3

4 Typical Operating Characteristics ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), all impedance measurements made directly to pin (no matching network), T A = + C, unless otherwise noted.) TRANSMITTER SUPPLY CURRENT (ma) STANDBY SUPPLY CURRENT (µa) TRANSMIT-MODE SUPPLY CURRENT =.V =.V = 3.V STANDBY SUPPLY CURRENT RXEN = TXEN =.V 3 =.V =.V = 3.V - - RECEIVE SUPPLY CURRENT (ma) IMPEDANCE (Ω) 3 RECEIVE-MODE SUPPLY CURRENT =.V =.V = 3.V LNA INPUT IMPEDANCE SHUTDOWN SUPPLY CURRENT (µa) IMPEDANCE (Ω) SHUTDOWN SUPPLY CURRENT RXEN = TXEN = =.V = 3.V =.V LNA OUTPUT IMPEDANCE LNA GAIN () 3 LNA GAIN pf SHUNT CAPACITOR AT LNA INPUT USING EV KIT MATCHING CIRCUIT (OPTIMIZED FOR.GHz) LNA GAIN () 3 LNA GAIN =.V =.V = 3.V - INPUT IP3 () LNA INPUT IP3 =.V = 3.V - - =.V -

5 NOISE FIGURE () Typical Operating Characteristics (continued) ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), all impedance measurements made directly to pin (no matching network), T A = + C, unless otherwise noted.) LNA NOISE FIGURE. FREQUENCY (MHz) - OUTPUT COMPRESSION POINT () LNA OUTPUT COMPRESSION POINT vs. SUPPLY VOLTAGE SUPPLY VOLTAGE (V) - IMPEDANCE (Ω) PA DRIVER INPUT IMPEDANCE IMPEDANCE (Ω) OUTPUT IP3 () PA DRIVER OUTPUT IMPEDANCE PA DRIVER OUTPUT IP3 =.V =.V = 3.V GAIN () PA DRIVER GAIN () 3 3 PA DRIVER GAIN USING EV KIT MATCHING NETWORK (OPTIMIZED FOR.GHz) PA DRIVER GAIN =.V = 3.V =.V - - GAIN () OR OUTPUT IP3 () OUTPUT COMPRESSION POINT () PA DRIVER GAIN AND OUTPUT IP3 vs. GC VOLTAGE GAIN IP GC VOLTAGE (V) PA DRIVER OUTPUT COMPRESSION vs. SUPPLY VOLTAGE V GC =.V V GC =.V SUPPLY VOLTAGE (V) - -

6 Typical Operating Characteristics (continued) ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), all impedance measurements made directly to pin (no matching network), T A = + C, unless otherwise noted.) CONVERSION GAIN () NOISE FIGURE () PA DRIVER NOISE FIGURE RECEIVE MIXER CONVERSION GAIN RXEN = V CC =.V toc INPUT IP3 () NOISE FIGURE () 3 3 PA DRIVER NOISE FIGURE vs. GAIN-CONTROL VOLTAGE GAIN-CONTROL VOLTAGE (V) RECEIVE MIXER INPUT IP3 =.V = 3.V =.V - IMPEDANCE (Ω) toc3 CONVERSION GAIN () RECEIVE MIXER INPUT IMPEDANCE MAXA RECEIVE MIXER CONVERSION GAIN vs. RF FREQUENCY EV KIT MATCHING NETWORK AT RXMXIN AND OUT = MHz NARROW BAND MATCH AT RXMXIN, EV KIT MATCH AT, RF toc GAIN AND NOISE FIGURE () 3 RECEIVE MIXER GAIN AND NOISE FIGURE vs. POWER NOISE FIGURE GAIN POWER () toc IMPEDANCE (Ω) OR OUTPUT IMPEDANCE toc SINGLE-ENDED FREQUENCY (MHz) IMPEDANCE (Ω) 3 - TRANSMIT MIXER OUTPUT IMPEDANCE

7 Typical Operating Characteristics (continued) ( EV kit, = +3.V, V GC = +.V, RXEN = TXEN = low, all measurements performed in Ω environment, f =.GHz, P = -, f LNAIN = f PADRIN = f RXMXIN =.GHz, P LNAIN = -3, P PADRIN = P RXMXIN = -, f, = MHz, P = -3 (Note ), all impedance measurements made directly to pin (no matching network), T A = + C, unless otherwise noted.) CONVERSION GAIN () TRANSMIT MIXER CONVERSION GAIN =.V =.V - - toc CONVERSION GAIN () 3 TRANSMIT MIXER CONVERSION GAIN vs. RF FREQUENCY NARROW BAND AT TXMXOUT, EV KIT MATCH AT, EV KIT MATCH NETWORK AT TXMXOUT AND, = MHz RF toc OUTPUT IP3 () TRANSMIT MIXER OUTPUT IP3 =.V = 3.V - - =.V toc3 GAIN AND NOISE FIGURE () TRANSMIT MIXER GAIN AND NOISE FIGURE vs. POWER NF GAIN POWER () MAXtoc3 IMPEDANCE (Ω) OR OUTPUT IMPEDANCE SINGLE-ENDED toc FREQUENCY (MHz) RETURN SS () PORT RETURN SS 3 3 RXEN =

8 Pin Description PIN, 3,,,,,, 3,, NAME LNAIN FUNCTION Ground. Connect to the PC board ground plane with minimal inductance. RF Input to LNA. AC couple to this pin. At.GHz, LNAIN can be easily matched to Ω with one external shunt pf capacitor. Supply Voltage (.V to.v). Bypass to at each pin with a pf capacitor as close to each pin as possible. 3, RXEN TXEN GC PADROUT PADRIN TXMXOUT Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and RXEN are both at a logic high, the part is placed in standby mode, with a µa (typical) supply current. If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a.µa (typical) supply current. Ω Local-Oscillator () Input Port. AC couple to this pin. Ω Inverting Local-Oscillator Input Port. For single-ended operation, connect directly to. If a differential signal is available, AC couple the inverted signal to this pin. Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN and RXEN are both at a logic high, the part is placed in standby mode, with a µa (typical) supply current. If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a.µa (typical) supply current. Gain-Control Input for PA Driver. By applying an analog control voltage between V and.v, the gain of the PA driver can be adjusted over a 3 range. Connect to for maximum gain. Power Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to to match PADROUT to Ω. This also provides DC bias. See the Typical Operating Characteristics for a plot of PADROUT Impedance vs. Frequency. PA Driver Input Grounds. Connect to the PC board ground plane with minimal inductance. RF Input to Variable-Gain Power Amplifier Driver. Internally matched to Ω. AC couple to this pin. This input typically provides a : VSWR at.ghz. AC couple to this pin. See the Typical Operating Characteristics for a plot of PADRIN Impedance vs. Frequency. RF Output of Transmit Mixer (upconverter). Use an external shunt inductor to as part of a matching network to Ω. This also provides DC bias. AC couple to this pin. See the Typical Operating Characteristics for a plot of TXMXOUT Impedance vs. Frequency. Differential Port of Transmit (Tx) and Receive (Rx) Mixers, Inverting Side. In Rx mode, this output is an open collector and should be pulled up to with an inductor. This inductor can be part of the matching network to the desired impedance in both Tx and Rx modes. Additionally, a resistor may be placed across and to set a terminating impedance. In Tx mode, this input is internally AC-coupled; however, AC couple to this pin externally. For single-ended operation, connect this port to and bypass with pf capacitor to. Differential Port of Tx and Rx Mixers, Noninverting Side. In Rx mode, this output is an open collector and should be pulled up to with an inductor. This inductor can be part of the matching network to the desired impedance in both Tx and Rx modes. Additionally, a resistor may be placed across and to set a terminating impedance. In Tx mode, this input is internally AC coupled; however, AC couple to this pin externally.

9 Pin Description (continued) PIN NAME RXMXIN LNAOUT FUNCTION RF Input to Receive Mixer (downconverter). This input typically requires a matching network for connecting to an external filter. AC couple to this pin. See the Typical Operating Characteristics for a plot of RXMXIN Impedance vs. Frequency. Receive Mixer Input Ground. Connect to the PC board ground plane with minimal inductance. LNA Output Ground. Connect to the PC board ground plane with minimal inductance. LNA Output. AC couple to this pin. This output typically provides a VSWR of better than : at frequencies from.ghz to 3GHz with no external matching components. At other frequencies, a matching network may be required to match LNAOUT to an external filter. Consult the Typical Operating Characteristics for a plot of LNA Output Impedance vs. Frequency. Detailed Description The consists of five major components: a transmit mixer followed by a variable-gain poweramplifier (PA) driver as well as a low-noise amplifier (LNA), receive mixer, and power-management section. The following sections describe each of the blocks in the Functional Diagram. Low-Noise Amplifier (LNA) The LNA is a wideband, single-ended cascode amplifier that can be used over a wide range of frequencies. Refer to the LNA Gain vs. Frequency graph in the Typical Operating Characteristics. Its port impedances are optimized for operation around.ghz, requiring only a pf shunt capacitor at the LNA input for a VSWR of better than : and a noise figure of.. As with every LNA, the input match can be traded off for better noise figure. PA Driver The PA driver has typically of gain, which is adjustable over a 3 range via the GC pin. At full gain, the PA driver has a noise figure of 3. at.ghz. For input and output matching information, refer to the Typical Operating Characteristics for plots of PA Driver Input and Output Impedance vs. Frequency. Bidirectional Port The has a unique bidirectional differential port, which can eliminate the need for separate transmit and receive filters, reducing cost and component count. Consult the Typical Operating Circuit for more information. For single-ended operation, connect the unused port to VCC and bypass with a pf capacitor to. In receive mode, the and pins are open-collector outputs that need external inductive pull-ups to VCC for proper operation. These inductors are typically used as part of an matching network. In transmit mode, and are high-impedance inputs that are internally AC coupled to the transmit mixer. This internal AC coupling prevents the DC bias voltage required for the receive mixer outputs from reaching the transmit mixer inputs. Receive Mixer The receive mixer is a wideband, double-balanced design with excellent noise figure and linearity. Inputs to the mixer are the RF signal at the RXMXIN pin and the inputs at and. The downconverted output signal appears at the port. For more information, see the Bidirectional Port section. The conversion gain of the receive mixer is typically. with a. noise figure. RF Input The RXMXIN input is typically connected to the LNA output through an off-chip filter. This input is externally matched to Ω. See the Typical Operating Circuit for an example matching network and the Receive Mixer Input Impedance vs. Frequency graph in the Typical Operating Characteristics. Local-Oscillator Inputs The and pins are internally terminated with Ω on-chip resistors. AC couple the local-oscillator signal to these pins. If a single-ended source is used, connect directly to ground. Transmit Mixer The transmit mixer takes an signal at the port and upconverts it to an RF frequency at the TXMXOUT pin. For more information on the port, see the Bidirectional Port section. The conversion gain is typically., and the output compression point is typically. at.ghz.

10 RF Output The transmit mixer output appears on the TXMXOUT pin, an open-collector output that requires an external pull-up inductor for DC biasing, which can be part of an impedance matching network. Consult the Typical Operating Characteristics for a plot of TXMXOUT Impedance vs. Frequency. Advanced System Power Management RXEN and TXEN are the two separate power-control inputs for the receiver and transmitter. If both inputs are at logic, the part enters shutdown mode, and the supply current drops below µa. When one input is brought to logic, the corresponding function is enabled. If RXEN and TXEN are both set to logic, the part enters standby mode, as described in the Standby Mode section. Table summarizes these operating modes. Power-down is guaranteed with a control voltage at or below.v. The power-down function is designed to reduce the total power consumption to less than µa in less than.µs. Complete power-up happens in the same amount of time. Standby Mode When the TXEN and RXEN pins are both set to logic, all functions are disabled, and the supply current drops to µa (typ); this mode is called Standby. This mode corresponds to a standby mode on the compatible transceiver chips MAX and MAX. Applications Information Extended Frequency Range The has been characterized at.ghz for use in PCS-band applications. However, it operates over a much wider frequency range. The LNA gain and noise figure, PA driver gain, and mixer conversion gain are plotted over a wide frequency range in the Typical Operating Characteristics. When operating the device Table. Advanced System Power- Management Function RXEN TXEN FUNCTION Shutdown Transmit Receive Standby mode at RF frequencies other than those specified in the AC Electrical Characteristics table, it may be necessary to design or alter the matching networks on the RF ports. If the frequency is different from that specified in the AC Electrical Characteristics table, the, matching network must also be altered. The Typical Operating Characteristics provide port impedance data versus frequency on all RF and ports for use in designing matching networks. The port ( and ) is internally terminated with Ω resistors and provides a VSWR of approximately.: to GHz and : up to 3GHz. Layout Issues A properly designed PC board is essential to any RF/microwave circuit. Be sure to use controlled impedance lines on all high-frequency inputs and outputs. Use low-inductance connections to ground on all pins, and place decoupling capacitors close to all VCC connections. For the power supplies, a star topology works well. Each VCC node in the circuit has its own path to the central VCC and a decoupling capacitor that provides a low impedance at the RF frequency of interest. The central VCC node has a large decoupling capacitor as well. This provides good isolation between the different sections of the. The EV kit layout can be used as a guide to integrating the into your design.

11 Typical Application Block Diagram ANTENNA RF BPF T/R LNAIN TXEN RXEN RF BPF POWER MANAGEMENT MATCH MAX MATCH BPF CAL OSCILLATOR PA DRIVER PA MATCH PADROUT RF BPF GC RF BPF MATCH

12 Typical Operating Circuit LNA INPUT (.GHz) pf pf 3 LNAIN LNAOUT pf LNA OUTPUT pf RXMXIN 3 3.nH pf Rx MIXER INPUT (.GHz) nh INPUT pf nh nh pf pf MHz pf pf nh pf SAW FILTER (Ω) pf nh PA OUTPUT (.GHz) pf TXEN RXEN GC 3 PADROUT TXEN RXEN GC TXMXOUT PADRIN pf pf.nh 3.nH pf PA DRIVER INPUT Tx MIXER OUTPUT (.GHz)

13 Package Information QSOP.EPS 3

14 NOTES