Features. = +25 C, 50 Ohm System, Vcc= 5V

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1 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz Typical Applications Prescaler for DC to X Band PLL Applications: Satellite Communication Systems Fiber Optic Pt-Pt and Pt-MPt Radios VSAT Functional Diagram Features Ultra Low SSB Phase Noise: -15 dbc/hz Wide Bandwidth Output Power: -6 dbm Single DC Supply: +5V S8G SMT Package General Description Electrical Specifications, T A = +25 C, 5 Ohm System, Vcc= 5V Parameter The HMC6S8G is a low noise Divide-by-8 Static Divider with InGaP GaAs HBT technology in an 8 lead surface mount plastic package. This device operates from DC (with a square wave input) to 12 GHz input frequency with a single +5.V DC supply. The low additive SSB phase noise of -15 dbc/hz at 1 khz offset helps the user maintain good system noise performance. C onditions M in. T yp. Max. Maximum Input Frequency 12 1 GHz M inimum Input Frequency Sine Wave Input. [1] GHz Input Power Range Units 1 to 7 GHz -15 > dbm 7 to 11 GHz -1 > dbm 11 to 12 GHz -5 > -8 dbm Output Power Reverse Leakage SSB Phase Noise (1 khz offset) Output Transition Time 12 GHz -9-6 dbm Both RF Outputs Terminated 65 db Pin= dbm, 6 GHz -15 dbc/hz Pin= dbm, Fout= 882 MHz 1 ps Supply Current (Icc) 7 ma 1. Divider will operate down to DC for square-wave input signal Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax:

2 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz GaAs MMIC SUB-HARMONICALLY PUMPED MIXER GHz Input Sensitivity Window, T= 25 C Input Sensitivity Window vs. Temperature INPUT POWER (dbm) -1-2 Recommended Operating Window INPUT POWER (dbm) -1-2 Min Pin +25 C Max Pin +25 C Min Pin +85 C Max Pin +85 C Min Pin -4 C Max Pin -4 C OUTPUT POWER (dbm) Output Power vs. Temperature +25 C +85 C -4 C Output Harmonic Content, Pin= dbm, T= 25 C OUTPUT LEVEL (dbm) Pfeedthru 2nd Harmonic rd Harmonic SSB PHASE NOISE (dbc/hz) SSB Phase Noise Performance, Pin= dbm, T= 25 C OFFSET FREQUENCY (Hz) Reverse Leakage, Pin= dbm, T= 25 C POWER LEVEL (dbm) Both Output Ports Terminated One Output Port Terminated Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax:

3 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz Output Voltage Waveform, Pin= dbm, Fout= 882 MHz, T= 25 C Absolute Maximum Ratings 2 RF Input (Vcc = +5V) Vcc +1 dbm +5.5V AMPLITUDE (mv) VLogic Storage Temperature Operating Temperature Vcc -1.6V to Vcc -1.2V -65 to +15 deg C -4 to +85 deg C Typical Supply Current vs. Vcc TIME (ns) Pin Locations & Outline Drawing V cc (V) Icc (ma) Note: Divider will operate over full voltage range shown above 1. MATERIAL: A. PACKAGE BODY - LOW STRESS INJECTION -MOLDED PLASTIC, SILICA & SILICONE INPREGNATED. B. LEADFRAME MATERIAL: COPPER ALLOY 2. PLATING: LEAD-TIN SOLDER PLATE. DIMENSIONS ARE IN INCHES (MILLIMETERS) 4. CHARACTERS TO BE HELVETICA MEDIUM,. HIGH USING WHITE INK, LOCATED APPROX AS SHOWN. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.25mm PER SIDE Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax:

4 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz Pin Description Pin Number Function Description Interface Schematic 1 O UT Divided output 18 out of phase with pin. 2 N / C No connection. OUT 4 VCC Divided Output. Supply voltage 5V ±.25V can be applied to pin 4 or 6. 5 I N RF Input must be DC blocked. 6 V CC Supply voltage 5V ±.25V can be applied to pin 4 or 6. 7 IN RF Input 18 out of phase with pin 5 for differential ground for single ended operation. operation. AC 8 GND Ground: Backside of package has exposed metal ground must be connected to ground. slug which 12 Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax:

5 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz HMC6S8G Evaluation PCB The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 5 ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A suffi cient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J provide differential output signals. Evaluation Circuit Board Layout Design Details Item J1 - J Description PC Mount SMA RF Connector C 1 - C4 1 pf Capacitor, 42 Pkg. C 5 1 pf Capacitor, 6 Pkg. C6 1 µf Tantalum Capacitor U1 HMC6S8G Divide-by-8 PCB* Eval Board * Circuit Board Material: Rogers Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax:

6 v1.71 HMC6S8G DIVIDE-BY-8, DC GHz HMC6S8G Application Schematic 12 Elizabeth Drive, Chelmsford, MA 1824 Phone: Fax: