AIC mA, 3μA Ultra Low Quiescent Curent LDO Voltage Regulator FEATURES GENERAL DESCRIPTION APPLICATIONS TYPICAL APPLICATION CIRCUIT

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1 350m, 3μ Ultra ow Quiescent Curent O Voltage Regulator FTURS Input Voltage 2.0V~6.8V Output Voltage 0.8V~5.0V 550mV Typical ropout Voltage at 350m load current and 3.3V output voltage Ultra ow Quiescent Current: 3μ ine Regulation, typical: 2mV oad Regulation, typical: 2mV Current imiting and Thermal Protection Stable with 1μF Input & Output Ceramic Capacitor vailable in SOT-23, SOT-23-5, SOT-89, FN-6 2mmx2mm GNR SCRIPTION The IC1702 is an Ultra ow Quiescent Current, low dropout voltage regulator. The output voltages are of 0.8V, 1.0V, 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 3.0V, 3.3V and 5V. ropout voltage of 200mV is guaranteed at 350m output current and 3.3V output voltage. The low quiescent and wide input voltage range make this device ideal for portable microprocessor applications. The IC1702 requires output ceramic capacitor of a minimum 1μF for stability. Built-in output current limiting and thermal limiting provide maximal protection to the IC1702 against fault conditions. PPICTIONS Smoke etectors Battery-Powered larms / Smart Battery Packs Ps / Handy Terminals Real-time Clocks/ CMOS Backup Pow aptop, Palmtops, Notebook Computer TYPIC PPICTION CIRCUIT nalog Integrations Corporation 31, No.1 i-hsin Rd. I, Science Park, Hsinchu 300, Taiwan S-1702G T: FX:

2 ORRING INFORMTION IC1702-XX X XX XX PIN CONFIGURTION PCKING TYP TR: TP & R BG: BG PCKG T YP U3: SOT-23 X3: SOT-89 : FN-6 (2*2) SOT-23 TOP VIW 1: GN 2: VOUT 3: VIN G: Green Package OUTPUT VOTG 08: 0.8V 10: 1.0V 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 30: 3.0V 33: 3.3V 50: 5.0V SOT-89 TOP VIW 1: GN 2: VIN 3: VOUT FN-6 (2mmx2mm) TOP VIW (Of a unit of 0.1V within 0.8~5.0V, additional voltage versions are available on demand) VIN NC VOUT NC 5 GN 4 NC xample : IC GU3TR 1.8V Output Voltage, Green SOT-23 Package Tape & Reel Packing Type 2

3 IC1702X-XX X XX XX PIN CONFIGURTION PCKING TYP TR: TP & R BG: BG PCKG T YP V5: SOT-23-5 SOT-23-5 TOP VIW 1: VIN 2: GN 3: N 4:NC 5:VOUT G: Green Package OUTPUT VOTG 08: 0.8V 10: 1.0V 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 30: 3.0V 33: 3.3V 50: 5.0V (Of a unit of 0.1V within 0.8~5.0V, additional voltage versions are available on demand) NB TYP : Chip nable ow H: Chip nable High xample : IC1702H-18GV5TR 1.8V Output Voltage, Chip nable High Green SOT-23-5 Package Tape & Reel Packing Type 3

4 BSOUT MXIMUM RTINGS Input Voltage... 7V N Pin Voltage... 7V Operating Temperature Range ºC~85ºC Maximum Junction Temperature ºC Storage Temperature Range ºC~150ºC ead Temperature (Soldering, 10 sec) ºC Thermal Resistance (Junction to Case) SOT ºC /W SOT ºC /W FN ºC /W Thermal Resistance (Junction to mbient) SOT ºC /W (ssume no ambient airflow, no heat sink) SOT ºC /W FN ºC /W bsolute Maximum Ratings are those values beyond which the life of a device may be impaired. 4

5 CTRIC CHRCTRISTICS (V IN =V out +1V, C IN =C OUT =1μF, T =25 C, unless otherwise specified.) (Note1) PRMTR CONITIONS SYMBO MIN. TYP. MX. UNITS Operating Voltage V IN V Output Voltage ccuracy 1.0V, V IN = + 1.0V < 1.0V, V IN = 2.0V % ine Regulation I OUT = 1m, (Note2) V IR 2 15 mv oad Regulation I OUT =1m~350m V OR 2 20 mv ropout Voltage = 3.3V, I OUT =350m V ROP 550 mv Current imit 1.5V, V IN = + 1.0V I I m < 1.5V, V IN = 2.5V I I 350 m Short Circuit Current =0V (Note 3) I SHORT 350 m Output Voltage Temperature Coefficient GN Pin Current -40 C T 125 C TC 100 ppm/ C I OUT =1m 3 6 μ I OUT =350m (Note 3) I GN 3 6 μ Shutdown Standby Current V N =0 or V N =V IN I STBY 0.2 μ Ripple Rejection F=1kHz, C OUT =1μF PSRR 40 db Shutdown Pin Current V N = V IN 6.8V or GN I N n Shutdown xit elay Time I OUT = 30m t 0.5 ms Max Output ischarge Resistance to GN during Shutdown V N threshold RSON_C MP Ω High threshold V NH 1.6 V ow threshold V N 0.4 V Thermal Shutdown Temperature Thermal Shutdown Hysteresis T S 135 T S 25 Note 1: Specifications are production tested at T =25 C. Specifications over the -40 C to 85 C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 2: 1.0V, V IN = + 1.0V to 6.8V < 1.0V, V IN = 2.0V to 6.8V Note 3: 1.5V, V IN = + 1.0V < 1.5V, V IN = 2.5V 5

6 TYPIC PRFORMNC CHRCTRISTICS Output Voltage Variation (%) , V IN =6.0V =1.2V, V IN, V IN Temperature ( O C) Quiescent Current ( ) , V IN =6.0V, V IN =1.2V, V IN Temperature ( O C) Fig.1 Output Voltage Variation vs. Temperature Fig.2 Quiescent Current vs. Temperature Quiescent Current ( ) =1.2V Ground Current ( ) , V IN, V IN =6.0V =1.2V, V IN Input Voltage (V) oading Current (m) Fig.3 Quiescent Current vs. Input Voltage Fig.4 Ground Current vs. oading Current oading Current = 350m ropout Voltage (V) ropout Voltage (V) Temperature ( O C) oading Current (m) Fig.5 ropout Voltage vs. Temperature Fig.6 ropout Voltage vs. oading Current 6

7 TYPIC PRFORMNC CHRCTRISTICS (Continued) Current imit (m) , V IN =6.0V, V IN =1.2V, V IN Temperature ( O C) Current imit (m) =1.2V Input Voltage (V) Fig.7 Current imit vs. Temperature Fig.8 Current imit vs. Input Voltage V IN I O =10m to 350m V IN I O =1m to 50m =1.2V =1.2V I OUT I OUT Fig.9 oad Transient Response at V IN, =1.2V Fig.10 oad Transient Response at V IN, =1.2V V IN I O =10m to 350m V IN I O =1m to 50m I OUT I OUT Fig.11 oad Transient Response at V IN, Fig.12 oad Transient Response at V IN, 7

8 TYPIC PRFORMNC CHRCTRISTICS (Continued) V IN =6.0V I O =10m to 350m V IN =6.0V I O =1m to 50m I OUT I OUT Fig.13 oad Transient Response at V IN =6.0V, Fig.14 oad Transient Response at V IN =6.0V, I O =10m V IN =2.0V to 3.0V V IN I O =10m V IN =4.0V to 5.0V V IN =1.2V =1.2V Fig.15 ine Transient Response at =1.2V, I OUT =10m Fig.16 ine Transient Response at =1.2V, I OUT =10m I O =10m V IN =4.5V to 5.5V V IN I =10m O V IN =5.5V to 6.0V V IN Fig.17 ine Transient Response at, I OUT=10m Fig.18 ine Transient Response at, I OUT=10m 8

9 TYPIC PRFORMNC CHRCTRISTICS (Continued) PSRR (db) V IN C IN =C OUT =1 F I O =350m I O =1m -60 I O =150m k 10k 100k 1M Frequency (Hz) PSRR (db) =1.2V V IN C IN =C OUT =1 F I O =350m I O =1m I O =150m k 10k 100k 1M Frequency (Hz) Fig 19. PSRR vs. Frequency Fig 20. PSRR vs. Frequency V N (ctive ow) =1.2V V IN V IN V N (ctive High) I O =150m I O =150m Fig.21 Start-Up Waveform at =1.2V, I OUT =150m Fig.22 Start-Up Waveform at, I OUT =150m V IN =6.0V V N (ctive High) I O =150m 1V/IV (0,0) 100m/IV I OUT Fig.23 Start-Up Waveform at, I OUT =150m Fig.24 Current Foldback at V IN, 9

10 BOCK IGRM N/N nable Shutdown ogic Current imit V IN Reference Voltage - rror mp + GN PIN SCRIPTION VIN PIN Power supply input pin. Bypass with a 1µF ceramic capacitor to GN VOUT PIN Regulator Output pin. Sources up to 350m. N PIN Chip nable (ctive High). This pin isn t allowed to float. N PIN Chip nable (ctive ow). This pin isn t allowed to float. GN PIN Ground. 10

11 PPICTION INFORMTION The IC1702 is a high performance linear regulator that provides low-dropout voltage and low quiescentcurrent. The device is available in a fixed output voltages ranging from 0.8V to 5.0V, and the device can supply loads up to 350m. condition. When the junction temperature exceeds T J =135ºC, the thermal-limiting circuit turns off the pass transistor and allows the IC to cool. For continuous load condition, maximum rating of junction temperature must not be exceeded. Capacitor Selection inear regulators require input and output capacitors to maintain stability. Input capacitor with a 1 F, output capacitor with a 1 F ceramic output capacitor is recommended. When choosing the input and output ceramic capacitors, X5R and X7R types are recommended because they retain their capacitance over wider ranges of voltage and temperature than other types. Current imit The IC1702 includes a current limiter, which monitors and controls the maximum output current. If the output is overloaded or shorted to ground, this can protect the device from being damaged. ropout Voltage The minimum input-output voltage differential (dropout) determines the lowest usable supply voltage. The dropout voltage is a function of drain-to-source on resistance multiplied by the load current. Thermal Protection The IC1702 includes a thermal-limiting circuit, which is designed to protect the device against overload PPICTION CIRCUIT Power issipation The maximum power dissipation of IC1702 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = I OUT (V IN - ) The maximum power dissipation is: (TJ-max - T ) PMX Rθ J Where T J-max is the maximum allowable junction temperature (135 C), and T is the ambient temperature suitable in application. s a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. 11

12 PHYSIC IMNSIONS (unit: mm) SOT-23 PCKG OUTIN RWING e e1 b WITH PTING c 1 S VIW B BS MT SCTION - 1 VIW B θ GUG PN STING PN S Y M B O 1 MIN SOT-23 MIIMTRS MX Note: 1. Refer to JC MO imension "" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. imension "1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. b c 1 e BSC e BSC RF θ

13 SOT-23-5 PCKG OUTIN RWING b 2 WITH PTING e1 e S VIW B c 1 BS MT SCTION - 1 VIW B θ GUG PN STING PN Note : 1. Refer to JC MO imension "" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. imension "1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. b c e S Y M B O e1 1 θ MIN SOT-23-5 MIIMTRS 0.95 BSC 1.90 BSC 0.60 RF MX

14 SOT-89 PCKG OUTIN RWING 1 C H e e1 S Y M B O MIN. SOT-89 MIIMTRS MX B B C B1 B 1 e BSC e BSC H Note: 1. Refer to JC TO imension "" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. imension "" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 14

15 FN 6-2x2x mm PCKG OUTIN RWING PIN#1 3 e 1 TOP VIW BOTTOM VIW S Y M B O FN 6-2x2x mm MIN. MIIMTRS MX b BSC 0.35 b STING PN BSC BSC SI VIW 2 e BSC Note : 1. IMNSION N TORNCING CONFORM TO SM Y14.5M CONTROING IMNSIONS:MIIMTR,CONVRT INCH IMNSION R NOT NCSSRIY XCT. 3.IMNSION b PPIS TO MTIZ TRMIN N IS MSUR BTWN 0.10 N 0.25 mm FROM TRMIN TIP. Note: Information provided by IC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an IC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. ife Support Policy: IC does not authorize any IC product for use in life support devices and/or systems. ife support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 15