VIN VOUT + + GND SHDN AIC1733. Low Noise Low Dropout Linear Regulator

Transcription

1 500m, ow Dropout inear Regulator with Shutdown FETURES ctive ow Shutdown Control. Very ow Quiescent Current. Very ow Dropout Voltage of 650mV at 500m Output Current (3.0V Output Version) 1.3V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V Output Voltage. Short Circuit and Thermal Protection. ±2% Output Tolerance. Miniature Package: SOT-23-5, TO-252-5, SOT-89-5 PPICTIONS PD DSC Notebook Pagers Personal Communication Equipment Cordless Telephones Portable Instrumentation Portable Consumer Equipment Battery Powered Systems DESCRIPTION IC1733 is a 500m low noise, low dropout linear regulator, and is housed in small SOT-23-5 package. The device is in the ON state when the SHDN pin is set to logic high level. n internal P-MOSFET pass transistor is used to achieve 650mV low dropout voltage at 500m load current. It offers high precision output voltage of ±2%. The quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. The internal reverse bias protection eliminates the requirement for a reverse voltage protection diode. The high ripple rejection and low noise of IC1733 provide enhanced performance for critical applications. The noise bypass pin can be connected an external capacitor to reduce the output noise level. TYPIC PPICTION CIRCUIT V IN C IN 1µF VIN VOUT + + GND C OUT 4.7µF (Note1) V OUT SHDN SHDN IC1733 BP C BP 0.1µF ow Noise ow Dropout inear Regulator nalog Integrations Corporation Si-Soft Research Center DS-1733G , No.1, i-hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C. TE: FX:

2 ORDERING INFORMTION IC1733-XXXXXX PIN CONFIGURTION PCKING TYPE TR: TPE & REE BG: BG PCKGE TYPE X5: SOT-89-5 V: SOT-23-5 E5: TO SOT-23-5 TOP VIEW 1: VIN 2: GND 3: SHDN 4: BP 5: VOUT P: ED FREE COMMERCI G: GREEN PCKGE (TO is NOT available in GREEN PCKGE) OUTPUT VOTGE 13: 1.3V 28: 2.8V 15: 1.5V 30: 3.0V 18: 1.8V 33: 3.3V 25: 2.5V SOT-89-5 TOP VIEW 1: VIN 2: GND 3: SHDN 4: BP 5: VOUT (Of a unit of 0.1V within the voltage range from 1.3V to 3.3V, additional voltage versions for this product line may be available on demand with prior consultation with IC.) Example: IC PX5TR 1.8V Version, in SOT-89-5 ead Free Package & Tape & Reel Packing Type IC PVTR 1.8V Version, in SOT-23-5 ead Free Package & Tape & Reel Packing Type TO TOP VIEW 1: SHDN 2: VIN 3: GND 4: VOUT 5: N/C SOT-89-5 Marking Part No. Marking Part No. Marking Part No. Marking IC CX5 EI13 IC PX5 EI13P IC GX5 EI13G IC CX5 EI15 IC PX5 EI15P IC GX5 EI15G IC CX5 EI18 IC PX5 EI18P IC GX5 EI18G IC CX5 EI25 IC PX5 EI25P IC GX5 EI25G IC CX5 EI28 IC PX5 EI28P IC GX5 EI28G IC CX5 EI30 IC PX5 EI30P IC GX5 EI30G IC CX5 EI33 IC PX5 EI33P IC GX5 EI33G SOT-23-5 Marking Part No. Marking Part No. Marking Part No. Marking IC CV EE13 IC PV EE13P IC GV EE13G IC CV EE15 IC PV EE15P IC GV EE15G IC CV EE18 IC PV EE18P IC GV EE18G IC CV EE25 IC PV EE25P IC GV EE25G IC CV EE28 IC PV EE28P IC GV EE28G IC CV EE30 IC PV EE30P IC GV EE30G IC CV EE33 IC PV EE33P IC GV EE33G 2

3 BSOUTE MXIMUM RTINGS Supply Voltage V Shutdown Terminal Voltage.....8V Noise Bypass Terminal Voltage.....5V Operating Temperature Range ºC~85ºC Maximum Junction Temperature 125 C Storage Temperature Range ºC~150ºC ead Temperature (Soldering, 10 sec) 260 C Thermal Resistance (Junction to Case) SOT C /W TO C /W SOT C /W Thermal Resistance Junction to mbient SOT C /W TO C /W SOT C /W (ssume no ambient airflow, no heatsink) bsolute Maximum Ratings are those values beyond which the life of a device may be impaired. TEST CIRCUIT Refer to TYPIC PPICTION CIRCUIT. 3

4 EECTRIC CHRCTERISTICS (C IN =1µF, C OUT =4.7µF, T J =25 C, unless otherwise specified) (Note2) PRMETER TEST CONDITIONS SYMBO MIN. TYP. MX. UNIT Quiescent Current I OUT = 0m, V IN = 3.6~7V I Q µ Standby Current V IN = 3.6~7V, output OFF I STBY 0.1 µ GND Pin Current I OUT = 0.1~500m I GND µ Continuous Output Current V IN = 5V I OUT 500 m Output Current imit V IN = 5V, V OUT = 0V I I m Output Voltage Tolerance V IN = 5V, no load V OUT -2 2 % Temperature Coefficient TC ppm/ºc ine Regulation V IN = V OUT(TYP) + 1V to 7V V IR 3 10 mv oad Regulation Dropout Voltage V IN = V OUT + 1.2V (Vout 2.5V) V IN = V OUT + 1.8V (Vout 2.4V) I OUT = 0.1~500m 3.0V V OUT 3.3V 2.5V V OUT 2.9V I =500m 2.0V V OUT 2.4V 1.3V V OUT 1.9V V OR mv V DROP mv Noise Bypass Terminal Voltage V REF 1.23 V Output Noise C BP = 0.1µF, f = 1KHz,V IN = 5V n 0.46 µv Hz Ripple Rejection f = 1KHz, Ripple = 0.5V P-P, C BP = 0.1µF RR 55 db Shutdown Pin Current I SHDN 0.1 µ Shutdown Pin Voltage (ON) Output ON V SHDN (ON) 1.6 V Shutdown Pin Voltage (OFF) Shutdown Exit Delay Time Output OFF C BP = 0.1µF, C OUT = 1µF, I OUT =30m V SHDN (OFF) 0.6 V t 300 µs Thermal Shutdown Temperature T SD 155 ºC Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested. Note 2: Specifications are production tested at T =25 C. Specifications over the -40 C to 85 C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 4

5 TYPIC PERFORMNCE CHRCTERISTICS V 600 IC T =80 C Quiescent current (µ) V VDROP (mv) T =50 C T =-40 C T =20 C V IN (V) Fig. 1 Quiescent Current vs. V IN I OD (m) Fig. 2 V DROP vs. I OD Ground Current (µ) V 3.3V V IN =5V T=25 C I OD (V) Fig. 3 Ground Current vs. I OD Short Circuit Current (m) V V Input Voltage(V) Fig. 4 Input Voltage vs. Short Circuit Current Ground Current (µ) IC m 300m Quiescent Current ((µ) V 3.3V m 36 V IN =5V Temperature ( C) Fig. 5 Ground Current vs. Temperature Temperature ( C) Fig. 6 Quiescent vs. Temperature 5

6 TYPIC PERFORMNCE CHRCTERISTICS (Continued) Current imit (m) V IN =5V V IN =6V V IN =7V Temperature ( C) Fig. 7 Current imit vs. Temperature Output Voltage (V) IC Temperature ( C) Fig. 8 V OUT vs. Temperature V IN =5V IC IC Output Voltage (V) V IN =5V VDROP (V) T=-40 o C 1.20 T =20 o C T=50 o C T=85 o C Temperature ( C) Fig. 9 V OUT vs. Temperature I OUT(m) Fig. 10 V DROP vs. I OD IC T=50 o C T =85 o C VDROP (mv) T =20 o C T=-40 o C IOUT(m) Fig. 11 V DROP vs. I OD 6

7 TYPIC PERFORMNCE CHRCTERISTICS (Continued) I OUT =30m,C OUT =1µF V OUT I OUT =30m C OUT =4.7µF V OUT V SHDN V SHDN Fig. 12 Shutdown Exit Time Fig. 13 Shutdown Exit Time I OUT =30m,C OUT =10µF V OUT Vin=V OUT +2V Vin=V OUT +1V V SHDN V OUT =3.3V C IN =1µF, C OUT =1µF Iout=50m Fig. 14 Shutdown Exit Time Fig. 15 ine Transient Response Vin=V OUT +2V Vin=V OUT +2V Vin=V OUT +1V Vin=V OUT +1V V OUT =3.3V C IN =1µF, C OUT =4.7µF V OUT =1.5V C IN =1µF, C OUT =1µF Iout=50m Iout=50m Fig. 16 ine Transient Response Fig. 17 ine Transient Response 7

8 TYPIC PERFORMNCE CHRCTERISTICS (Continued) C OUT =4.7µF Vin=V OUT +2V V OUT Vin=V OUT +1V I OUT =180m V OUT =1.5V C IN =1µF, C OUT =4.7µF IIout=50m I OUT =120m Fig. 18 ine Transient Response Fig. 19 oad Transient Response C OUT =1µF V OUT I OUT =180m I OUT =120m Fig. 20 oad Transient Response 8

9 BOCK DIGRM VIN Current imiting BP V REF 1.23V - + Error mp. VOUT SHDN Power Shutdown Thermal imiting GND PIN DESCRIPTIONS PIN 1 : VIN - Power supply input pin. Bypass with a 1µF capacitor to GND PIN 2 : GND - Ground pin. PIN 3 : SHDN - ctive-ow shutdown input pin. PIN 4 : BP - Noise bypass pin. n external bypass capacitor connected to BP pin reduces noises at the output. PIN 5 : VOUT - Output pin. Sources up to 500 m. DETIED DESCRIPTIONS OF TECHNIC TERMS as the input voltage changes from V DROPOUT VOTGE (V DROP ) IN = V OUT + 1V to V The dropout voltage is defined as the difference IN = 7V and I OUT = 1m. between the input voltage and output voltage at OD REGUTION which the output voltage drops 100mV. Below oad regulation is the ability of the regulator to this value, the output voltage will fall as the input maintain a constant output voltage as the load voltage reduces. It depends on the load current current changes. pulsed measurement with an and junction temperature. input voltage set to V IN = V OUT + V DROP can minimize temperature effects. The load regulation INE REGUTION is specified by the output current ranging from ine regulation is the ability of the regulator to 0.1m to 500m. maintain a constant output voltage as the input voltage changes. The line regulation is specified 9

10 CURRENT IMIT (I I ) IC1733 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. THERM PROTECTION Thermal sensor protects device when the junction temperature exceeds T J = +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. fter the IC s junction temperature cools by 15ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a continuous operation, do not exceed the absolute maximum junction-temperature rating of T J = 150ºC, or damage may occur to the device. PPICTION INFORMTION INPUT-OUTPUT CPCITORS inear regulators require input and output capacitors to maintain stability. Input capacitor at 1µF with a 4.7uF aluminum electrolytic output capacitor is recommended. NOISE BYPSS CPCITOR 0.1µF bypass capacitor at BP pin reduces output voltage noise. nd the BP pin has to connect a capacitor to GND. POWER DISSIPTION The maximum power dissipation of IC1733 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = I OUT (V IN -V OUT ). The maximum power dissipation is: P MX (T = (Rθ J JB T) + Rθ B ) Where T J -T is the temperature difference between the die junction and the surrounding air, Rθ JB is the thermal resistance of the package, and Rθ B is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. s a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature 10

11 PHYSIC DIMENSIONS SOT-23-5 (unit: mm) D S Y M B O MIN. SOT-25 MIIMETERS MX E1 E b e1 e SEE VIEW B c D b E E WITH PTING c BSE MET SECTION - e e BSC 1.90 BSC 0.60 REF 0.60 θ VIEW B θ GUGE PNE SETING PNE Note : 1. Refer to JEDEC MO Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 11

12 TO (unit: mm) E b3 3 c2 S Y M B O MIN. TO MIIMETERS MX D b H b c c D e WITH PTING SEE VIEW B b E e H BSC 2.67 REF 0.51 BSC c BSE MET q 0 8 SECTION - θ GUGE PNE SETING PNE VIEW B Note: 1. Refer to JEDEC TO-252D and B. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 12

13 SOT-89-5 (unit: mm) D D1 C S Y M B O MIN. SOT-89-5 MIIMETERS MX B C E H D D E e 1.50 BSC e BSC e H e B Note: 1. Refer to JEDEC TO Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Note: Information provided by IC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an IC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. ife Support Policy: IC does not authorize any IC product for use in life support devices and/or systems. ife support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 13