FPF2495 IntelliMAX 28 V Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control

Transcription

1 FPF2495 IntelliMAX 28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control Features V IN: 2.5 V~5.5 V 28 V Absolute Ratings at V OUT Current Capability: 2 A Adjustable Current Limit: 0.05 A ~ 2 A (Typ.) 0.1 A~2 A w ith 10% Accuracy < 0.1A w ith 15% Accuracy R ON: Maximum 100 mω at 5 V IN and 1 A I OUT Output OVP: Min.=5.6 V, Typ.=5.8 V, Max.=6 V No Output Discharge During Off State Open-Drain OCP on FLAGB Thermal Shutdow n Under-Voltage Lockout (UVLO) True Reverse-Current Blocking (TRCB) Logic CMOS IO Meets JESD76 Standard for GPIO Interface and Related Pow er Supply Requirements ESD Protected: Human Body Model: >2 kv Charged Device Model: >2.5 kv IEC Air Discharge: >15 kv IEC Contact Discharge: >8 kv Applications Smart Phones, Tablet PCs Storage, DSLR, and Portable Devices Ordering Information Part Number Operating Temperature Range FPF2495UCX -40 to 85 C Description The FPF2495 advanced load-management sw itch targets applications requiring a highly integrated solution. It disconnects loads pow ered from the DC pow er rail (<6 V) w ith stringent off-state current targets and high load capacitances (<100 µf). The FPF2495 consists of a slew -rate controlled low - impedance MOSFET sw itch (100 mω maximum) and integrated analog features. The slew -rate controlled turn-on characteristic prevents inrush current and the resulting excessive voltage droop on pow er rails. FPF2495 has over-voltage protection and overtemperature protection. The FPF2495 has a True Reverse-Current Blocking (TRCB) function that obstructs unw anted reverse current from VOUT to V IN during ON and OFF states. The exceptionally low off-state current drain (<2 µa maximu m) facilitates compliance w ith standby pow er requirements. The input voltage range operates from 2.5 V to 5.5 VDC to support a w ide range of applications in consumer, optical, medical, storage, portable, and industrial-device pow er management. Sw itch control is managed by a logic input (active HIGH) capable of interfacing directly w ith low -voltage control signal / General-Purpose Input / Output (GPIO) w ithout an external pull-dow n resistor. The device is packaged in advanced, fully green compliant, 1.21 mm x 1.21 mm, Wafer-Level Chip- Scale Package (WLCSP). Package 1.21 mm x 1.21 mm, Waf er-level Chip-Scale Package (WLCSP) Packing Method Top Mark Tape & Reel TH 2012 Semiconductor Components Industries, LLC. Publication Order Number: December-2017, Rev. 2 FPF2495/D

2 Application Diagram Battery 5V Boost Vout AP IO IO C IN Vin ON ISET Figure 1. FPF2495 GND Typical Application VIO Rpull-up Vout OCP FLAGB Note: 1. CIN and C OUT capacitors recommended for improvement of device stability. Functional Block Diagram V IN ON UVLO HV Power Device TRCB IntelliMAX TM FPF2495 Figure 2. Current Limit Charge Pump OVP Control Logic Thermal Shutdown Functional Block Diagram C OUT GND USB Connector OTG Device V OUT I SET OC FLAGB 2

3 Pin Configurations A B C V IN V IN OC FLAGB GND GND I SET V OUT V OUT ON 3 V OUT V OUT ON 2 GND GND I SET 1 V IN V IN OC FLAGB Figure 3. Pin Assignments (Top View) Figure 4. Pin Assignments (Bottom View) Pin Description Pin # Name Description A3, B3 VOUT Switch Output A1, B1 V IN Supply Input: Input to the pow er sw itch A2 B2 GND Ground (true device ground) C3 ON ON/OFF Control Input: Active HIGH - GPIO compatible Logic HIGH Sw itch Enable Logic LOW Sw itch Disable C1 OC FLAGB Fault Output: Active LOW, open-drain output that indicates an input over current. External pull-up resistor to V CC is required. C2 I SET Current Limit Set Input: A resistor from ISET to ground sets the current limit for the sw itch. A B C 3

4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameters Min. Max. Unit VPIN VOUT to GND, VOUT to VIN ON, V IN, FLAGB, I SET to GND ISW Maximum Continuous Sw itch Current (4) 2.2 A tpd Total Pow er Dissipation at TA=25 C 1.0 W TJ Operating Junction Temperature C TSTG Storage Junction Temperature C Θ JA ESD Thermal Resistance, Junction-to-Ambient (1-inch Square Pad of 2 oz. Copper) Electrostatic Discharge Capability IEC System Level Notes: 2. Measured using 2S2P JEDEC std. PCB. 3. Measured using 2S2P JEDEC PCB cold plate method. 4. Maximum Junction Temperature = 85 C. Recommended Operating Conditions Human Body Model, JESD22-A Charged Device Model, JESD22-C Air Discharge (V IN, V ON, V OUT to GND) 15.0 Contact Discharge (V IN, V ON, V OUT to GND) 8.0 V 95 ( 2 ) C/W 110 ( 3 ) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet spec ifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameters Min. Max. Unit V IN Supply Voltage V T A Ambient Operating Temperature C kv 4

5 Electrical Characteristics Unless otherw ise noted; V IN=2.5 to 5.5 V, T A=-40 to +85 C; typical values are at V IN=5 V and T A=25 C. Symbol Parameters Condition Min. Typ. Max. Unit Basic Operation V IN Input Voltage V IQ(OFF) Off Supply Current VON=GND, V OUT=Open 1 2 μa I SD(OFF) Shutdow n Current V IN=5.5 V, V OUT=0 V, V ON=GND μa IQ Quiescent Current IOUT=0 ma μa R ON On Resistance VIN=5.0 V, I OUT=1 A VIN=3.7 V, IOUT=1 A R ON On Resistance (6) V IN=5.0 V, I OUT=1.5 A 70 mω VIH V IL VIL_FLAG I FLAGB_LK ON Input Logic HIGH Voltage ON Input Logic LOW Voltage FLAGB Output Logic LOW Voltage FLAGB Output HIGH Leakage Current VIN=2.5 V to 5.5 V 1.15 V VIN=2.5 V to 5.5 V 0.65 V VIN=5 V, ISINK=10 ma V IN=2.5 V, I SINK=10 ma VIN=5 V, Sw itch On 1 μa I ON On Input Leakage V ON=0 V to V IN 1.0 μa R ON_PD Pull-Dow n Resistance at ON Pin Over-Voltage Protection V OV_TRIP OUT HYS Output OVP Lockout Output OVP Hysteresis VIN=2.5~5.5 V, V ON=HIGH, TA=-40 to 85 C mω V 14 MΩ VOUT Rising Threshold V OUT Falling Threshold 5.50 VOUT Falling Threshold 0.3 V (6) IOUT=0.5 A, CL=1 µf, TA=25 C, VOUT f rom tovp OVP Response Time 5.5 V to 6.0 V Over-Current Protection ILIM V UVLO Current Limit Under-Voltage Lockout 1 4 (6) μs VIN=5 V, RSET=20000 Ω, (5) VOUT=1.68 to 5 V w ith 15% Accuracy V IN=5 V, R SET=2100 Ω, (5) VOUT=1.68 to 5 V w ith 10% Accuracy V IN=5 V, R SET=1070 Ω, (5) VOUT=1.68 to 5 V w ith 10% Accuracy V IN Increasing 2.4 V IN Decreasing 2.2 V UVLO_HYS UVLO Hysteresis 200 mv VT_RCB V R_RCB RCB Protection Trip Point RCB Protection Release Trip Point VOUT - VIN 50 mv VIN - V OUT 50 mv V ma Continued on the following page V 5

6 Electrical Characteristics (Continued) Unless otherw ise noted; V IN=2.5 to 5.5 V, T A=-40 to +85 C; typical values are at V IN=5 V and T A=25 C. Symbol Parameters Conditions Min. Typ. Max. Unit VRCB_HYS RCB Hysteresis 100 mv t RCB Default RCB Response Time VIN=5 V, V ON=High/Low 2 µs IRCB RCB Current VON=0 V, VOUT=5.5 V, 7 μa t HOCP tocp toc_flag TSD Hard Over-Current Response Time Over-Current Response Time Over-Current Flag Response Time Thermal Shutdow n Dynamic Characteristics t DON Turn-On Delay ( 6, 7 ) Moderate Over-Current Condition, IOUT ILIM, VOUT=0 V Moderate Over-Current Condition, IOUT I LIM V OUT V IN When Over-Current Occurs to Flag Pulling LOW Shutdow n Threshold 150 Return from Shutdow n 130 Hysteresis 20 6 µs 7 µs 8 ms t ON Turn-On Time ( 6, 8 ) VIN=5 V, RL=100 Ω, CL=1 µf, 1.36 ms t DOFF Turn-Off Delay ( 7, 6 ) TA=25 C, R SET=2040 Ω 0.01 ms C 0.67 ms tr VOUT Rise Time ( 6, 7 ) 0.69 ms t F V OUT Fall Time ( 7, 6 ) 0.22 ms t OFF Turn-Off Time ( 9, 6 ) 0.23 ms tdon Turn-On Delay ( 7,10) ms t R V OUT Rise Time ( 7,10) ms t ON Turn-On Time ( 8,10) V IN=5 V, R L=3.8 Ω, C L=10 µf, T A= ms t DOFF Turn-Off Delay ( 7,10) 40 to 85 C, RSET=634 Ω 4 10 μs tf VOUT Fall Time ( 7,10) μs toff Turn-Off Time ( 9,10) μs Notes: 5. Characterization based on 1% tolerance resistor. 6. This parameter is guaranteed by design and characterization; not production tested. 7. tdon/tdoff/tr/tf are defined in Figure 5 below. 8. ton=tr + tdon. 9. toff=t F + t DOFF. 10. This parameter is guaranteed by design. 6

7 Timing Diagram Operation and Application Description Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current w hen the sw itch turns on into discharge load capacitor; a capacitor must be placed in betw een the VIN and GND pins. A high-value capacitor on CIN can be used to reduce the voltage drop in highcurrent applications. Output Capacitor An output capacitor should be placed betw een the V OUT and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND w hen the sw itch is on. This capacitor also prevents reverse inrush current from creating a voltage spike that could damage the device in the case of a VOUT short. Fault Reporting V ON V OUT 10% 90% Upon the detection of an over-current, OC_FLA GB signal the fault by activating LOW. 10% 10% tdon ton tr 90% tdoff Figure 5. Timing Diagram toff 90% Current Limiting w here: t DON = Delay On Time t R = V OUT Rise Time t ON = Turn-On Time t DOFF = Delay Off Time t F = V OUT Fall Time t OFF = Turn Off Time The current limit ensures that the current through the sw itch does not exceed the maximum set value, w hile not limiting the minimum value. The current at w hich the part s limit is adjustable through the selection of the external resistor connected to the ISET pin. Infor mation for selecting the resistor is found in the section below. The device acts as a constant-current source w hen the load draw s more than the maximum value set by the device until ther mal shutdow n occurs. The device recovers if the die temperature drops below the threshold temperature. Under-Voltage Lockout (UVLO) The under-voltage lockout turns the sw itch off if the input voltage drops below the lockout threshold. With the ON pin active, the input voltage rising above the UVLO threshold releases the lockout and enables the sw itch. True Reverse-Current Blocking The true reverse-current blocking feature protects the input source against current flow from output to input regardless of w hether the load sw itch is on or off. Thermal Shutdown tf The ther mal shutdow n protects the die from internally or externally generated excessive temperature. Dur ing an over-temperature condition, the sw itch is turned off. The sw itch automatically turns on again if the temperature of the die drops below the threshold temperature. 7

8 Setting Current Limit The current limit is set w ith an external resistor connected betw een the ISET and GND pins. The resistor is selected using Table 1. Resistor tolerance of 1% or less is recommended. Table 1. Current Limit Settings by R SET (11) R SET Ω Min. Current Limit (ma) Typ. Current Limit (ma) Max. Current Limit (ma) Note: 11. Table values based on 1% tolerance resistor. 12. For 50 ma setting, tolerance is ±15% w ith 1%. 8 Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance may have on nor mal and short-circuit operation. Using w ide traces for VIN, VOUT, GND helps minimize parasitic electrical effects along w ith minimizing the case-toambient thermal impedance. FPF2495 IntelliMAX 28 V Over-Voltage, Over-Current Protection Load Switch with Adjustable Current Limit Control

9 Typical Performance Characteristics T A=25 C. Figure 6. t ON Response Figure 7. OVP Response (Increase VOUT to OVP Trip Point) Figure 8. OC_FLAGB Response Time (Toggle RLOAD from High to Low Resistance) Figure 10. tocp Response Time 9 Figure 9. t OFF Response FPF2495 IntelliMAX 28 V Over-Voltage, Over-Current Protection Load Switch with Adjustable Current Limit Control

10 Product-Specific Dimensions D E X Y 1210 µm ±30 µm 1210 µm ±30 µm 205 µm 205 µm 10 FPF2495 IntelliMAX 28 V Over-Voltage, Over-Current Protection Load Switch with Adjustable Current Limit Control

11 Physical Dimensions 2X PIN A1 INDEX AREA 0.05 C 0.03 C C E TOP VIEW A B D F 2X SEATING PLANE D 0.03 C 0.06 C E SIDE VIEWS A1 Ø0.20 Cu Pad 0.40 NOTES: Ø0.30 Solder Mask LAND PATTERN RECOMMENDATION (NSMD PAD TYPE) 0.378± ±0.021 A. NO JEDEC REGISTRATION APPLIES. Ø0.260± X B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE C PER ASMEY14.5M, B (Y)±0.018 D. DATUM C IS DEFINED BY THE SPHERICAL 0.40 A CROWNS OF THE BALLS. F E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS ( MICRONS). (X)±0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC009ABrev2 Figure Ball, WLCSP, 3x3 Array, 0.4 mm Pitch, 250 µm Ball FPF2495 IntelliMAX 28 V Over-Voltage, Over-Current Protection Load Switch with Adjustable Current Limit Control

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