NC7SZ157 TinyLogic UHS 2-Input Non-Inverting Multiplexer

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1 NC7SZ157 TinyLogic UHS 2-Input Non-Inverting Multiplexer Features Broad CC Operating Range: 1.65 to 5.5 Ultra High-Speed Pow er Dow n High-Impedance Inputs/Outputs Over-oltage Tolerance Inputs Facilitate 5 to 3 Translation Proprietary Noise/EMI Reduction Circuitry Ultra-Small MicroPak Packages Space-Saving SC70 Package Ordering Information Part Number Top Mark Eco Status Description The NC7SZ157 is a single, high performance, 2-to-1 CMOS non-inverting multiplexer from ON Semiconductor s Ultra-High Speed series of TinyLogic. The dev ice is fabricated w ith advanced CMOS technology to achieve ultra high speed w ith high output drive w hile maintaining low static pow er dissipation over a broad CC operating range. The device is specified to operate over the 1.65 to 5.5 CC operating range. The inputs and outputs are high impedance w hen CC is 0. Inputs tolerate voltages up to 5.5 independent of CC operating range. Package NC7SZ157P6X ZF7 RoHS 6-Lead SC70, EIAJ SC-88, 1.25mm Wide NC7SZ157L6X B9 RoHS 6-Lead MicroPak, 1.00mm Wide NC7SZ157FHX B9 Green 6-Lead, MicroPak2, 1x1mm Body,.35mm Pitch Packing Method 3000 Units on Tape & Reel 5000 Units on Tape & Reel 5000 Units on Tape & Reel 2000 Semiconductor Components Industries, LLC. Publication Order Number: November-2017, Rev. 2 NC7SZ157/D

2 Connection Diagrams Pin Configurations IEEE/IEC Figure 1. Logic Symbol Figure 2. SC70 (Top iew ) Figure 3. MicroPak (Top Through iew ) Figure 4. Pin 1 Orientation Notes: 1. AAA represents product code top mark (see Ordering Information). 2. Orientation of top mark determines pin one location. 3. Reading the top mark left to right, pin one is the low er left pin. Pin Definitions Pin # SC70 Pin # MicroPak Name Description Function Table 1 1 I1 Data Input 2 2 GND Ground 3 3 I0 Data Input 4 4 Z Output 5 5 CC Supply oltage 6 6 S Control Input Inputs 2 Output S I 1 I 0 Z = (I 0 ) (S) + (I 1 ) (S) L X L L L X H H H L X L H H X H H = HIGH Logic Level L = LOW Logic Level X = Don t Care

3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit CC Supply oltage IN DC Input oltage OUT DC Output oltage I IK DC Input Diode Current IN ma IOK DC Output Diode Current OUT ma IOUT DC Output Current ±50 ma ICC or IGND DC CC or Ground Current ±50 ma TSTG Storage Temperature Range C T J Junction Temperature Under Bias +150 C T L Junction Lead Temperature (Soldering, 10 Seconds) +260 C P D ESD Pow er Dissipation at +85 C SC MicroPak MicroPak Human Body Model, JEDEC:JESD22-A Charge Device Model, JEDEC:JESD22-C Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet spec ifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. mw Symbol Parameter Conditions Min. Max. Unit CC Supply oltage Operating Supply oltage Data Retention IN Input oltage OUT Output oltage 0 CC T A Operating Temperature C tr, tf JA Input Rise and Fall Times Thermal Resistance CC at 1.8 ± 0.15, 2.5 ± CC at 3.3 ± CC at 5.0 ± SC MicroPak MicroPak ns/ C/W 3

4 DC Electrical Characteristics Symbol Parameter CC Conditions IH IL OH OL I IN I OFF I CC HIGH Level Input oltage LOW Level Input oltage HIGH Level Output oltage LOW Level Output oltage Input Leakage Current Power Off Leakage Current Quiescent Supply Current T A=+25 C T A=-40 to +85 C Min. Typ. Max. Min. Max to CC 0.75 CC 2.30 to CC 0.70 CC 1.65 to CC 0.25 CC 2.30 to CC 0.30 CC IN= IL or IH I OH= -100µA I OH= -4mA IN= IL I OH= -8mA or IH I OH= -16mA I OH= -24mA I OH= -32mA IN= IL or IH I OL= 100µA I OL= 4mA IN= IL I OL= 8mA or IH I OL= 16mA I OL= 24mA I OL= 32mA Units 0 to 5.50 IN=5.5, GND ±0.1 ±1 µa 0 IN or OUT= µa 1.65 to 5.50 IN=5.5, GND 10 µa 4

5 AC Electrical Characteristics Symbol Parameter CC Conditions t PLH, t PHL Propagation Delay S to Z Propagation Delay I n to Z Propagation Delay S to Z Propagation Delay I n to Z 1.80 ± 0.15 T A=+25 C T A=-40 to +85 C Min. Typ. Max. Min. Max ± 0.20 C L=15pF, ± 0.30 R L=1M, ± ± ± 0.50 C L=15pF, ± 0.30 R L=1M, ± ± 0.30 C L=50pF, ± 0.50 R L=500, ± 0.30 C L=50pF, ± 0.50 R L=500, C IN Input Capacitance pf C PD Power Dissipation Capacitance ( 4 ) Units ns Figure Figure 5 Figure 6 pf Figure 7 Note: 4. C PD is defined as the value of the internal equivalent capacitance w hich is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: I CCD=(C PD)( CC)(f IN)+(I CCstatic). Note: 5. C L includes load and stray capacitance. Input PRR=1.0MHz, tw=500ns. Figure 5. AC Test Circuit Figure 6. AC Waveforms Note: 6. Input=AC Waveform; PRR=ariable; Duty Cycle=50%. Figure 7. ICCD Test Circuit 5

6 Physical Dimensions PIN ONE (0.25) GAGE PLANE C ± SEATING PLANE A B 1.25± A B (R0.10) 0.10 C SYMM CL ± MIN 0.40 MIN LAND PATTERN RECOMMENDATION SEE DETAIL A NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO EIAJ SC-88, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. D) DRAWING FILENAME: MKT-MAA06ARE DETAIL A SCALE: 60X Figure 8. 6-Lead, SC70, EIAJ SC-88, 1.25mm Wide Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. Tape and Reel Specifications Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 6

7 Physical Dimensions 2X DETAIL A Notes: (0.05) 6X 0.55MAX C 1.45 TOP IEW BOTTOM IEW B 2X CONFORMS TO JEDEC STANDARD M0-252 ARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M X A (0.49) 5X (0.52) 1X PIN C B A 5X 5X (0.13) 4X X 45 CHAMFER (1) (0.30) 6X RECOMMENED LAND PATTERN X (0.75) DETAIL A PIN 1 TERMINAL MAC06AREC Figure 9. 6-Lead, MicroPak, 1.0mm Wide Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. Tape and Reel Specifications Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 7

8 Physical Dimensions DETAIL A 5X Figure Lead, MicroPak2, 1x1mm Body,.35mm Pitch Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. Tape and Reel Specifications Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 8

9 ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patent-marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor E. 32nd Pkwy, Aurora, Colorado USA Phone: or Toll Free USA/Canada Fax : or Toll Free USA/Canada orderlit@onsemi.com N. Amer ic an Technical Support: Toll Free USA/Canada. Eur ope, Middle East and Afr ica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semic onductor Website: Or der Literature: For additional information, please contact your local Sales Representative 9

NC7WZ04/D. TinyLogic UHS Dual Inverter. NC7WZ04 TinyLogic UHS Dual Inverter. Features. Description. Ordering Information. Connection Diagrams

NC7WZ04/D. TinyLogic UHS Dual Inverter. NC7WZ04 TinyLogic UHS Dual Inverter. Features. Description. Ordering Information. Connection Diagrams NC7WZ04 TinyLogic UHS Dual Inverter Features Ultra-High Speed: t PD 2.3ns (Typical) into 50pF at 5 CC High Output Drive: ±24mA at 3 CC Broad CC Operating Range: 1.65 to 5.5 Matches Performance of LCX w