Description. NC7WZ14FHX -40 to +85 C A9 6-Lead, MicroPak2, 1x1mm Body,.35mm Pitch IEEC/IEC. Figure 1. Logic Symbol

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NC7WZ14 TinyLogic UHS Dual Inverter with Schmitt Trigger Inputs Features Ultra-High Speed: t PD 3.2ns (Typical) into 50pF at 5 CC High Output Drive: ±24mA at 3 CC Broad CC Operating Range: 1.65 to 5.

1 NC7WZ14 TinyLogic UHS Dual Inverter with Schmitt Trigger Inputs Features Ultra-High Speed: t PD 3.2ns (Typical) into 50pF at 5 CC High Output Drive: ±24mA at 3 CC Broad CC Operating Range: 1.65 to 5.5 Matches Performance of LCX w hen Operated at 3.3 CC Pow er Dow n High Impedance Inputs/Outputs Over-oltage Tolerance Inputs Facilitate 5 to 3 Translation Proprietary Noise/EMI Reduction Circuitry Ultra-Small MicroPak Packages Space-Saving SC70 Package Description The NC7WZ14 is a dual inverter w ith Schmitt trigger input from ON Semiconductor's Ultra-High Speed (UHS) Series of TinyLogic. The device is fabricated w ith advanced CMOS technology to achieve ultra-high speed w ith high output drive w hile maintaining low static pow er dissipation over a very broad CC operating range. The device is specified to operate over the 1.65 to 5.5 CC range. The inputs and outputs are high-impedance w hen CC is 0. Inputs tolerate voltages up to 7 independent of CC operating voltage. Schmitt trigger inputs achieve typically 1 hysteresis betw een the positive-and negative-going input threshold voltage at 5. Ordering Information Part Number Operating Temperature Top Mark Package NC7WZ14P6X -40 to +85 C Z14 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide NC7WZ14EP6X -40 to +125 C Z14 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide NC7WZ14L6X -40 to +85 C A9 6-Lead MicroPak, 1.00mm Wide NC7WZ14FHX -40 to +85 C A9 6-Lead, MicroPak2, 1x1mm Body,.35mm Pitch Packing Method 3000 Units on Tape & Reel 3000 Units on Tape & Reel 5000 Units on Tape & Reel 5000 Units on Tape & Reel Connection Diagrams IEEC/IEC Figure 1. Logic Symbol 1999 Semiconductor Components Industries, LLC. Publication Order Number: October-2017, Rev. 2 NC7WZ14/D

2 Pin Configurations A Y 1 GND 2 5 CC A Y 2 Figure 2. SC70 (Top iew ) Figure 3. MicroPak (Top Through iew ) AAA Pin One Notes: 1. AAA represents Product Code Top AAAMark representsproduct (see ordering code). Code Top Mark see ordering 2. Orientation of Top Mark determines code Pin One location. Read the top product code mark left to right. Pin One is the low er left pin. Note: Figure Orientation 4. SC70 of Top Pin Mark 1 Orientation determinespin One location. Read the top product code mark left to right, Pin One is the lower left pin (see diagram). Pin Definitions Pin # SC70 Pin # MicroPak Name Description Function Table Y= /A 1 1 A 1 Input 2 2 GND Ground 3 3 A 2 Input 4 4 Y 2 Output 5 5 CC Supply oltage 6 6 Y 1 Output Inputs A L H Output Y H L H = HIGH Logic Level L = LOW Logic Level 2

3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit CC Supply oltage IN DC Input oltage OUT DC Output oltage I IK DC Input Diode Current IN < ma I OK DC Output Diode Current OUT < ma I OUT DC Output Current ±100 ma I CC or I GND DC CC or Ground Current ±50 ma T STG Storage Temperature Range C T J Junction Temperature Under Bias +150 C T L Junction Lead Temperature (Soldering, 10 Seconds) +260 C P D ESD SC70-6 T A =85 C 170 Pow er Dissipation T A =125 C 104 MicroPak MicroPak Human Body Model, JEDEC:JESD22-A Charge Device Model, JEDEC:JESD22-C mw Recommended Operating Conditions (3) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit CC Supply oltage Operating Supply oltage Data Retention IN Input oltage OUT Output oltage 0 CC T A JA Operating Temperature Thermal Resistance Note: 3. Unused inputs must be held HIGH or LOW. They may not float. SC MicroPak MicroPak SC MicroPak MicroPak C C/W

4 DC Electrical Characteristics Symbol Parameter CC () Conditions T A =+25 C +85 C +125 C Min. Typ. Max. Min. Max. Min. Max. Units P Positive Threshold oltage N Negative Threshold oltage H Hysteresis oltage IN= IL, I OH=-100µA OH HIGH Level Output oltage I OH=-4mA I OH=-8mA I OH=-16mA I OH=-24mA I OH=-32mA OL LOW Level Output oltage IN= IH, I OL=100µA I OL=4mA I OL =8mA I OL=16mA I OL=24mA

5 Symbol Parameter CC () Conditions T A =+25 C +85 C +125 C Units Min. Typ. Max. Min. Max. Min. Max. I IN Input Leakage Current 4.50 I OL=32mA to 5.5 IN=5.5, GND ±0.1 ±1.0 ±2.0 µa I OFF Power Off Leakage Current 0 IN or OUT= µa I CC Quiescent Supply Current 1.65 to 5.50 IN=5.5, GND µa 5

6 AC Electrical Characteristics Symbol Parameter CC () Conditions 1.65 T A =+25 C +85 C +125 C Min. Typ. Max. Min. Max. Min. Max Units Figure t PLH, t PHL Propagation Delay C L=15pF, 2.50 ± 0.20 R L=1M ± ns Figure 5 Figure ± ± 0.30 CL=50pF, Figure ± 0.50 R L= Figure 6 C IN Input Capacitance pf C PD Power Dissipation Capacitance (4) pf Figure 7 Note: 4. C PD is defined as the value of the internal equivalent capacitance w hich is derived from dynamic operating current consumption (I CCD ) at no output loading and operating at 50% duty cycle. C PD is related to I CCD dynamic operating current by the expression: I CCD =(C PD )( CC )(f IN )+(I CC static). Note: 5. CL includes load and stray capacitance; Input PRR=1.0MHz; t W =500ns Figure 5. AC Test Circuit Figure 6. AC Waveforms Note: 6. Input=AC Waveform; t r =t f =1.8ns; PRR=variable; Duty Cycle =50%. Figure 7. I CCD Test Circuit 6

7 Physical Dimensions 2.00±0.20 A SYMM CL MIN 6 4 B PIN ONE 1.25± (0.25) A B MIN LAND PATTERN RECOMMENDATION SEE DETAIL A C SEATING PLANE 0.10 C 2.10±0.30 GAGE PLANE 0.20 (R0.10) NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO EIAJ SC-88, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. D) DRAWING FILENAME: MKT-MAA06ARE DETAIL A SCALE: 60X Figure 8. 6-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. Tape and Reel Specification Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 7

8 Physical Dimensions 2X 1.45 B 2X (1) (0.254) 1.00 (0.49) 5X (0.75) PIN 1 IDENTIFIER 5 DETAIL A TOP IEW 0.55MAX C X A (0.52) 1X PIN C B A (0.30) 6X RECOMMENED LAND PATTERN X X Notes: (0.05) 6X 0.5 BOTTOM IEW X 45 CHAMFER 1. CONFORMS TO JEDEC STANDARD M0-252 ARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M FILENAME AND REISION: MAC06ARE4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. 5X (0.13) 4X Figure 9. 6-Lead, MicroPak, 1.0mm Wide DETAIL A PIN 1 TERMINAL Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision an d/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, whi ch covers ON Semiconductor products. Tape and Reel Specification Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 8

9 Physical Dimensions X 1.00 B A 5X 0.40 PIN 1 MIN 250uM X TOP IEW 2X 6X 0.19 RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB 0.90 C 0.55MAX 5X 0.52 SIDE IEW 0.73 (0.08) 4X DETAIL A X 1X X 0.25 NOTES: BOTTOM IEW 0.60 (0.08) 4X A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D. LANDPATTERN RECOMMENDATION IS BASED ON FSC DESIGN. E. DRAWING FILENAME AND REISION: MGF06ARE C B A.05 C 0.075X45 CHAMFER (0.05) 6X X ALTERNATIE LAND PATTERN FOR UNIERSAL APPLICATION Figure Lead, MicroPak2, 1x1mm Body,.35mm Pitch DETAIL A PIN 1 LEAD SCALE: 2X Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision an d/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, whi ch covers ON Semiconductor products. Tape and Reel Specification Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed 9

10 ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patent-marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor E. 32nd Pkwy, Aurora, Colorado USA Phone: or Toll Free USA/Canada Fax : or Toll Free USA/Canada orderlit@onsemi.com N. Amer ic an Tec hnic al Suppor t: Toll Free USA/Canada. Eur ope, Middle East and Afr ic a Tec hnic al Suppor t: Phone: Japan Customer Foc us Center Phone: ON Semic onduc tor Website: om Or der Liter atur e: For additional information, please contact your local Sales Representative 10

NC7WZ04/D. TinyLogic UHS Dual Inverter. NC7WZ04 TinyLogic UHS Dual Inverter. Features. Description. Ordering Information. Connection Diagrams

NC7WZ04/D. TinyLogic UHS Dual Inverter. NC7WZ04 TinyLogic UHS Dual Inverter. Features. Description. Ordering Information. Connection Diagrams NC7WZ04 TinyLogic UHS Dual Inverter Features Ultra-High Speed: t PD 2.3ns (Typical) into 50pF at 5 CC High Output Drive: ±24mA at 3 CC Broad CC Operating Range: 1.65 to 5.5 Matches Performance of LCX w