The Company. CISTELAIER was established in 1998 by merging two Italian companies operating in the Printed Circuit Boards manufacturing, say:

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2 The Company CISTELAIER was established in 1998 by merging two Italian companies operating in the Printed Circuit Boards manufacturing, say: Cistel, founded in 1976 in Genoa and Laier, founded in 1986 in Modena Two Business Units: Genoa and Modena, where the Headquarters are located The overall headcount is 135 people, more than 10% are employed in R&D and Engineering Dept On average, the 75% of the current production is made up of medium-high layer count Multilayers and Rigid-Flex, with several standard and exotic materials Cistelaier is part of FinMasi, a large industrial Italian group with an overall turnover of 270M, operating in different sectors, among the others: Steel: first and secondary services Electronics: PCBs; industrial sensors (standard and on demand)

3 Our Mission Offering our service flexibility and engineering capability Sharing our know-how in technology and manufacturing, as we recognize the PCB as a strategic electronic component becoming more and more an active and integrated element Continually investing resources to assure the Customer the state of art technology Supporting our Customer with CO-DESIGN projects, to help him manage the ever increasing complexity of electronic devices

4 Quality System Management Cistelaier quality system is ISO 9001 recognised Since 1998 Cistelaier has been recognized from Underwriters Laboratories with the UL94V-0 certification and UL796 DSR extension for rigid boards (file number E73444) UL 94V-0 for rigid-flex approval within December Other standards which Cistelaier complies with: MIL-P and MIL-P (military standard for rigid and rigid-flex boards) IPC 6012, IPC 6013, etc All printed circuit boards are produced in compliance with IPC A600G standards, Class 2 or 3 according to customer s specifications. Additionally, Cistelaier is implementing a new Integrated Quality Management System including four different standards, within July 2010: Automotive: ISO/TS16949:2008 Railway: IRIS International Railway Industry Standard Aerospace: UNI EN 9100: 2008 Medical devices: UNI EN ISO 13485: 2004 Besides, Cistelaier plans to get NadCap accreditation by May 2011.

5 Product Portfolio Cistelaier can offer the customer a broad portfolio of PCBs, manufactured with either standard FR4 or high-tech materials (i.e. Polyimide, Teflon, Kapton, Thermount, Rogers): Rigid Multi-Layer boards and Rigid-Flex Multi-Layers with: controlled impedance and press-fit holes mixed materials (i.e. Thermount/Rogers/HTg FR4) HDI technology (Blind/Buried Vias) SBU technology (up to 3N3 type) Heat Sink (internal and external) 32 layers (up to 40) Special types: Thick copper technology (up to 500 micron) Double copper thickness on the same inner laminate Aluminium-backed boards: SS, DS and Multilayer

6 Wide range of Base Materials for PCB up to 1 metre long (rigid and rigid-flex) From standard FR4 to some materials especially designed for High Speed and HDI: FR4 standard ITEQ IT140; ISOLA Duraver ML104i - Tg 140 C High Tg epoxy (with and withour filler): ITEQ IT180; ISOLA IS420; ARLON 45N - Tg 180 C Epoxy for Lead-free process: ITEQ IT158; ISOLA DE104I - Tg 160 C High speed digital applications 10 GHz: ISOLA IS620; NELCO N ; ITEQ IT200DK Resin coated copper foil RCC B-stage Polyclad PCL-CF-400 BT resin ISOLA Gould TCR adn Shipley INSITE Embedded resistor 3M Capacitor Laminates High-performances materials for avionics/military application: Polyimide Resin System: Arlon 33N, 35N, 85N; Hitachi MCL-I-671; Arlon EP; Arlon Kevlar 45NK (Tg 170 C and 4.7 ppm/ C) Epoxy and Polyimide Thermount : ARLON 55NT/85RT. Arlon New Thermount 85XT Copper/Invar/Copper : tipically 150 m thick - 17/120/17 m) Thick copper: up to 500 microns, for BusBar application also Substrates in Kapton for flexible circuits: Flexible Laminates- Kapton : DuPont PYRALUX LF; PYRALUX FR; PYRALUX AP: Pyralux APR ( for embedded componenst) High Frequency materials Teflon based and non-teflon based: Rogers: Duroid Copper/Brass supported; RO3003 Arlon: AR350; AR600; AR1000; DiClad 527 Rogers: RO4350; RO4003;TMM10 Arlon: 25N; 25FR Taconic: RF25A2; TACLAM Specialty materials for microwave applications: GORE Microlam and Speedboard

7 HDI PCB High Density Interconnect Characterization Design Approach Capability Build up Vias Formation

8 High Density Interconnect Printed Circuit Board HDI is used to reduce size and weight, as well as to enhance electrical performances. High density interconnects (HDI) are defined as substrates or boards with a higher wiring density per unit area than conventional printed circuit boards (PCB); they have finer lines and spaces (<100µm), smaller vias (<150µm) and capture pads (<400µm), and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. In addition to HDI, terms such as "build-up board" in Japan and "sequential build-up (SBU)" or "microvia technology" in the U.S. can be used interchangeably

9 How to approach HDI Printed Circuit Board? Cistelaier Co-Design and DFM Validation.. Co-Design and DFM analysis in the early stages of PCB design in order to check the manufacturability aspects of he design DFM validation is part of every PCB layout process and ensures that the designs will smoothly pass PCB anufacturing, assembly and testing (boundary scan technology) The design validation includes: checks on tracks/spacings, unterminated traces, copper features, route cleanup, iducials, drill features, soldermask/solderpaste openings, impedance/stack requirements and many other onstraints which influence manufacturability... Cistelaier R&D Vision: providing best technology for future interconnection needs! Cistelaier Research & Development is the driving force to identify new technology options and create new interconnection solutions. We do this by continuously scanning and developing potential novel technologies, and monitoring closely the application scenarios offered by the advancements in avionics/military, telecom, automotive and other business sectors. Our goal is to provide insight into new technologies, reduce the cycle time to introduction of new technologies into the production and thereby enable the continued support of our customers.

10 Wide range of Base Materials for PCB up to 1 metre long (rigid and rigid-flex) From the standard FR4 to some High Speed Digital and HDI special designed: FR4 standard ITEQ IT140; ISOLA Duraver ML104i - Tg 140 C High Tg epoxy (with and withour filler): ITEQ IT180; ISOLA IS420; ARLON 45N - Tg 180 C Epoxy for Lead-free process: ITEQ IT158; ISOLA DE104I - Tg 160 C High speed digital applications 10 GHz: ISOLA IS620; NELCO N ; ITEQ IT200DK Resin coated copper foil RCC B-stage Polyclad PCL-CF-400 BT resin ISOLA Gould TCR adn Shipley INSITE Embedded resistor 3M Capacitor Laminates High-performances materials for avionic/military application: Polyimide Resin System: Arlon 33N, 35N, 85N; Hitachi MCL-I-671; Arlon EP; Arlon Kevlar 45NK (Tg 170 C and 4.7 ppm/ C) Epoxy and Polyimide Thermount : ARLON 55NT/85RT. Arlon New Thermount 85XT Copper/Invar/Copper : tipically 150 m thick - 17/120/17 m) Thick copper: up to 500 microns, for BusBar application also Substrates covering Kapton for flexible circuits: Flexible Laminates- Kapton : DuPont PYRALUX LF; PYRALUX FR; PYRALUX AP: Pyralux APR ( for embedded componenst) High Frequency materials Teflon based and non-teflon based: Rogers: Duroid Copper/Brass supported; RO3003 Arlon: AR350; AR600; AR1000; DiClad 527 Rogers: RO4350; RO4003;TMM10 Arlon: 25N; 25FR Taconic: RF25A2; TACLAM Specialty materials for microwave applications: GORE Microlam and Speedboard

11 Technical Capability UNITS = m Cistelaier spa Standard Advanced Enginnering R&D Classification Track & Gap Ring Rigid pcb !! Hole Diameter " #$#%&'&( )&'&&( # via (*+,-&& )(*+&,-&& # (*+,-& )(*+&,-&& # * * *+-& )("&&& Drill - Cu && IAR+75 IAR+75 IAR+75 IAR+75 IAR+75 IAR+75 IAR+68 IAR+60 IAR+50 &.&.-&/012 IAR+50 IAR+50 IAR+50 IAR+50 IAR+50 IAR+50 IAR+50 IAR+50 IAR+50 &.&.-&/ Cu Thickness ) &( Solder Mask && 3+4' && 3+4') && &5!"4&&565/7$ Build )( & >3.20 > ( & ,5 5 5 )(& Ring ML Flex & Flex-Rigid Flex layers ( for rest = 0 ) should be 50 m bigger then on rigid layers

12 Technology Parameters Symbol Parame te r Value Symbol Parame te r Value I max Max thickness 5.2 mm h min Min. Palted Trough Hole (depending I Th.ss) 0.10m m I min Min thickness ( kapton adhesivelessfilm) mm b Min. Vias laser 75um q Min. innerlayer thickness 0.05 mm j/n Min. Copper in the though and burried hole > 20um w Min. insulation thickness - prepreg 0.05 mm m Min. Copper in blind vias > 12um e Min. line dimens ion base on 9um CU 75um g/p Minimum anular ring on trough hole > +150um s Min. line dimens ion base on 17um CU 75um c/d Minimum anular ring on laservias > +100um f Min. line dimens ion base on 9um CU 75um r Minimum copper thickness innerlayer 12um t Min. line dimens ion base on 17um CU 75um z Minimum copper thickness outlayer 9um h max Max. Plated Trough Hole unlim ited y Minimum opening obn solder mask on vias 100um

13 Standard Build up his construction describes an HDI board in which there are both blind vias and through vias used for nterconnection. Type 1 constructions describe the fabrication of a single blind via layer on either one or oth sides of an PCB substrate core. he PCB substrate is typically manufactured using conventional PCB techniques and laser via hole echnology. The substrate can have as few as one circuit layer or may be as complex as any number of nner layers.

14 Sequential Build up 1+N+1 ype II constructions have the same number of HDI layers as Type I: has two buried vias in the core ubstrate formed prior to applying the HDI dielectric layers. Both vias connect layer 2 to layer n-1; the uried via on the left is filled with HDI dielectric resin: completed filling is guarantee with vacuum press; the ight one is filled with different resin, this operation can be made using resin from Peters or Taiyo. This way t is possible to laser drill over the pad that is plated and reduce space during the design.

15 Sequential Build up X+N+X Type III constructions describe an HDI in which there are plated microvias, paste/resin filled holes and through vias used for interconnection. Type III constructions are distinguished by having at least two microvia layers on at least one side of a substrate core. The sub-strate core is usually manufactured using conventional PCB techniques, may be rigid or flexible, and have as few as one or as many as any number of layers with buried vias.

16 Other Build-up options for HDI! xamples of multilayers with double construction for Avionic application on EFA Project. Multilayer board with double blind vias, 20 layer: Lay up board with 4 Copper/Invar/copper layer; 2 stack up board with capped vias on both side; Polyimide construction for avionic application; ltilayer board 12 layer, High TG material : stack up board with capped vias on one side; rilled blind vias; teq IT180 construction for Military application; Multilayer board with double blind vias, 22 layer: 2 stack up board with capped vias on both side; all Nelco N construction for Telecom application;

17 Microvias: different technologies with advantages and disadvantages µ µnelco N µ $µiteq IT180 "! " % µ µ! " " #

18 Copper filling, do you really need it? " # ' " (# ) *, ( " * - * Blind µvias laser 100µm on High TG Material, copper filled: SBU 3+N+3 Stacked Blind µvias laser 75µm on RCC Foil, copper filled Blind µvias laser 100µm on High TG 75µm, copper filled

19 . Some solutions from our R&D department!." " /&+ /&+ * + 01µ " 2µ *1µ3

20 .. playing around a hole! Sequential build-up 4 layer Rigid Flex: Laser vias from layer 1 to layer 2: 75µm; Laser vias from layer 1 to layer 3: 125µm; Insulation Layer: Rigid 60um-Kapton 75µm; equential build-up 2+n+2; Laser vias rom layer 1 to layer 3:125µm; nsulation layers 2x60µm; Sequential build-up 14 layer Rigid Flex: Blind Vias mechanically made on mixed Layup Boards: Ro4350+High TG material 1µ / 4

21 Some technology snapshots.. Sequential build-up 3+n+3; Laser via 75µm; Insulation layers 50 µm Multilayer all with Rogers 4350 and High TG materials; 16 layer for High speed board with blind viad filled with prepreg resin: reverse Layup all with inner layer Multilayer 8 layer: Arlon 35N+CIC+RO4003 Sequential build-up with burried and blind vias and cavityfor package heat dissipation Burried vias filled with resin

22 .. And different thermal dissipation pad design! / 5%$ ( & µ µ/6 "! " 7µ,

23 High Density Interconnect Printed Circuit Board Flex and Rigid Flex examples of HDI application

24 Flex and Rigid Flex HDI application Why Flex and Flex-Rigid Technology? Flex& Flex-Rigid PCB s have been widely used in a variety of applications and markets for many years where space and size is critical to its function as an interconnect either between connectors or to other rigid PCB s. At Cistelaier, we are seeing more and more customers migrate to Flex& Flex-Rigids due to the benefits of its construction also on commercial use, some examples as follows: 3D Interconnect 1 part component (as apposed to multiple rigid PCB s and wiring looms) Increased reliability - Space saver Reduced labour costs at assembling - Fully tested as one pc component - 1 part inventory Product realisation utilises the same controlled and audited manufacturing processes as used for conventional Multi- Layer technologies; Cistelaier have approached technologies manufactured range: Very simple double-sided Flex for Commercial applications Multi-Layer Flex-Rigids for Formula 1, Military Flight Complex Blind and Micro Vias for Medical, Aerospace and Semiconductor applications.

25 Rigid Flex in HDI application This Rigid flex, for Semiconductor application, is a 6 layer board with laser via in pad µbga 0,5 mm component. Line 75 µm Space 75 µm Laser Vias 100 µm kapton Ap8525 High TG material. TG 180

26 Rigid Flex in HDI application This Rigid flex, for Medical application, is a 6 layer board with double sequenze of laser via and buried vias on flex material: Line 75 µm Space 75 µm Laser Vias 100 µm kapton Ap Cu/50K/17Cu High TG material. TG 180 This Rigid flex, for Motorsport application, is a 8 layer board with laser via and buried vias: Line 75 µm Space 75 µm Laser Vias 100 µm 2 x kapton Ap Cu/50K/17Cu Polyimmide base material TG 250

27 Rigid Flex in HDI application.not a synonym of small! This Rigid flex is a 9 layer board with buried and blind vias for Military Radar application; this boards is long 865mm and has 4 layer on flex material, impedance line with 10% of tolerance; there is also an integrated 500µm Copper BusBar for power distribution. Only copper lines come out from pcb border for a direct connection and soldering.

28 Rigid Flex in HDI application.not a synonym of small! Main Characteristics: 9 Layer Rigid Flex Kapton Adhesiveless+ High TG Laminates; Burried vias 150µm on inner layer; Blind Vias on BusBar 200oµm; Impedance controlled track: 6 Mils; Dimension: 865 mm long; Only copper traces ( BusBar) come out from pcb border for a direct connection and soldering.

29 High Density Interconnect Printed Circuit Board When power meets the HDI concept

30 High Frequency and High Power All modern power supply, DCDC converters are now the best example for HDI application in power modules. To maximize the power fully buried vias layup is usually used, both for planar and inductors planar design need, to minimize the space using via in pad Multilayer board, 16 layer for DC-DC Converter : Heavy copper:3 and 6 Oz; High TG material Burried vias Multilayer board, 14 layer for Planar transformer application : 2 Heavy copper layer 5 and 6 Oz; High TG material

31 High Density Interconnect Printed Circuit Board What we see in the near future.

32 Line forming technology and trends ith current Direct Laser Imaging technology, 1 nd 2 mils line space are not a limit; the roblem will be the etching, and for this reason roduction cycle is going in the direction of dditive process. e will metallize special base material ncladded specially designed with a minimum -3um of chemical copper, then after imaging, e will make plating of 5 10um to form the ine.

33 for the future! Our R&D department is hardly working on reduction of line/space and mixed layup structure with inside low thickness prepreg to minimize aspect ratio for total sequential build up. Outerlayers Plated Lines 1.5mils on Outerlayers Plated Lines/Space 40µm Outerlayers On Fully SBU Plated Lines/Space 1.5mils Low Dielectric Thickness 30µm Component Footprint 50µm

34 .embedded components + 8, 9:& (" 5*. ; * # -( ' *

35 Contacts For any additional needs, please contact us: Cistelaier S.p.A. Via Gandhi Modena Italy Tel +39 (0) Fax +39 (0) Or visit our web site: Export Sales Manager: Mr Andrea QUEIROLO a.queirolo@cistelaier-prod.com Italy Sales Manager: Mr Fernando CAVANI f.cavani@cistelaier-prod.com Product Manager: Mr Luca PAGNANI l.pagnani@cistelaier-prod.com Area Manager for Germany/Austria: Mr Ernst WINKLER winkler-e@t-online.de Area Manager for France: M. Michel BUIA buia@wanadoo.fr