MANUFACTURE OF HIGH COMPLEXITY MULTILAYER PRINTED CIRCUIT BOARDS CONTRACT DEVELOPMENT OF ELECTRONICS ELECTRONICS MANUFACTURING SERVICES

Size: px

Start display at page:

Download "MANUFACTURE OF HIGH COMPLEXITY MULTILAYER PRINTED CIRCUIT BOARDS CONTRACT DEVELOPMENT OF ELECTRONICS ELECTRONICS MANUFACTURING SERVICES"

Kimberly May
5 years ago
Views:

1 MANUFACTURE OF HIGH COMPLEXITY MULTILAYER PRINTED CIRCUIT BOARDS CONTRACT DEVELOPMENT OF ELECTRONICS ELECTRONICS MANUFACTURING SERVICES PRINTED CIRCUIT BOARD DESIGN SMT STENCILS MANUFACTURE ELECTRONIC COMPONENTS SUPPLY MICROWAVE FILTERS MANUFACTURE

3 WELCOME TO INSTITUTE OF COMPUTER TECHNOLOGIES Dear partners! "Ukrainian Scientific-Research Institute of Computer Technologies" Ltd (hereinafter Institute of Computer Technologies or IKT) was established by a group of design engineers in The main activity of the company was developing specialized systems for digital data processing as well as design and manufacture of high complexity multilayer printed circuit boards. For the years of systematic development on Ukrainian electronics market there has been adopted a number of principles and priorities that serve as the basis for company's activities and relationship with customers. Engineering support - this is what our customers can always expect. IKT Engineering Department provides technical consultations to customers and full support of projects at all stages of development and production. Quality control this is what our work is built on. At the heart of our company s operation is the quality management system certified according to ISO 9001: 2009, as well as observation and application of international IPC standards. Compliance with deadlines - this is what we provide our customers with, because we know that it affects success of their projects. Thanks to our own representative office in Southeast Asia, placing orders, quality control, packing and shipping of products are done right on schedule. Our customers' confidence - that's what we value most. Due to the confidence of our customers, as well as professionally arranged manufacturing process of PCBs, the amount of placed orders is growing every year. Since 2011 IKT has been on leading positions in terms of the imports volume of printed circuit boards to the domestic market. In 2011 IKT becomes the first Ukrainian company - member of IPC, Association Connecting Electronics Industries. Since January 2016 the company Institute of Computer Technologies has been the official distributor of IPC in Ukraine. The knowledge of IKT engineers, new technologies, the requirements of contemporary standards is what we are ready to share with you at specialized seminars dedicated to the design of printed circuit boards. "Ukrainian Scientific-Research Institute of Computer Technologies" Ltd is the accredited supplier of goods and services for enterprises of Ukrainian national defense concern UKROBORONPROM. IKT offers cooperation in the following areas: Manufacture of high complexity multilayer printed circuit boards Contract development of electronics Printed circuit boards design Software for design of high-speed electronic devices Electronics manufacturing services SMT stencils manufacture Supply of electronic components, cases, switchboards and keypads Microwave filters manufacture Imports from China and Southeast Asia countries We are interested in the success of your projects! IKT team

4 TYPES OF MANUFACTURED PRINTED CIRCUIT BOARDS Multilayer PCBs HDI - high complexity PCBs Impedance controlled PCBs High Frequency PCBs Flex PCBs Rigid-flex PCBs Metal core PCBs Planar transformers Backplanes One and two layer PCBs PCBs with embedded components PCBs with peelable solder mask a 3

PRINTED CIRCUIT BOARDS MANUFACTURE Institute of Computer Technologies has been specializing in design and manufacture of multilayer printed circuit boards of high complexity since 2004.

5 PRINTED CIRCUIT BOARDS MANUFACTURE Institute of Computer Technologies has been specializing in design and manufacture of multilayer printed circuit boards of high complexity since Engineering Department of IKT provides technical consultations to customers and full support of projects at all stages of production. We manufacture printed circuit boards from samples to big batches. Our goal is to provide customers with the best quality, competitive price and maximum level of service. To find out cost of manufacture and time of delivery, please, send the request in convenient for you form to In the inquiry, please, specify the following parameters: PCB type, dielectric material, reliability class PCB dimensions Finished board thickness and tolerance Starting thickness of copper and dielectrics PCB stack-up Surface finish type Minimum track / spacing size Minimum hole size Quantity ordered To make an order, PCB project or design documentation in Gerber format (RS-274X) and a drilling file in Excelon or HPGL format is to be provided. After the analysis of design documentation, the specialists of Institute of Computer Technologies can provide the customer with advice on optimization of the printed circuit board topology. Before the start of printed circuit boards production, the engineers of IKT conduct a final inspection of the design documentation and coordinate the parameters of the printed circuit board with the customer. Quality control of printed circuit boards is carried out in accordance with the requirements of IPC-A-600 Standard. At customer s request, additional printed circuit board s parameters tests are possible. Every batch of PCBs is accompanied with an output control report. The warranty for all printed circuit boards is six months from the date of manufacture. Delivery of printed circuit boards on the territory of Ukraine is free of charge. Delivery terms of prototypes and small batch quantities are from 1.5 weeks with urgent delivery, up to 4 weeks with regular delivery. The term of delivery of large-scale consignments by container transportation is from 2 months. Contact IKT specialists for advice on the manufacture of printed circuit boards. +38 (044) info@ictech.com.ua +38 (044)

6 IPC STANDARDS CHART End-Product Repair IPC-7711/21 Solderability J-STD-002 J-STD-003 Stencil Design Guidelines IPC-7525 Assembly Materials J-STD-004 J-STD-005 IPC-HDBK-005 J-STD-006 IPC-SM-817 IPC-CC-830 HDBK-830 Solder Mask IPC-SM-840 Copper Foils IPC-4562 Requirements and Acceptance for Cable and Wire Harness Assemblies IPC-A-620 Acceptability of Electronic Assemblies IPC-A-610 Requirements for Soldered Electronic Assemblies J-STD-001 Acceptability of Printed Boards IPC-A-600 Qualifications for Printed Boards IPC-6011, 6012, 6013, 6017 Base Materials for Printed Boards IPC-4101, 4104, 4202, 4203 and 4204 Design & Land Patterns IPC-2220 Series BGA, CSP, HDI Flip Chip J-STD-030 IPC-7094 IPC-7095 Components J-STD-020 J-STD-033 J-STD-075 Test Methods IPC-TM-650 IPC-9691 Electrical Test IPC-9252 Surface Treatments IPC-4552 IPC-4553 IPC-4554 High Speed Frequency IPC-2141 IPC-2251 Marking and Labeling J-STD-609 Data transfer and Electronic Product Documentation IPC-2581 Series, IPC-2610 Series Materials Declaration IPC-1751 IPC

PCB MANUFACTURE STANDARDS Due to the insufficient level of development of domestic standards, the lack of normative base on the latest technologies, IKT specialists prefer international standards,

IPC (The Institute for Interconnecting and Packaging Electronic Circuits) is an international association of electronics manufacturers, established in 1957.

printed circuit boards, equipment, materials and electronics manufacturers worldwide. IPC International standards are unified for representatives of the electronics industry worldwide.

7 PCB MANUFACTURE STANDARDS Due to the insufficient level of development of domestic standards, the lack of normative base on the latest technologies, IKT specialists prefer international standards, among which IPC standards are generally used. In 2011 IKT became the first Ukrainian company-member of IPC, international association of electronics manufacturers. IPC (The Institute for Interconnecting and Packaging Electronic Circuits) is an international association of electronics manufacturers, established in IPC Association is the main body for the development of industry standards, regulatory documentation and recommendations to ensure coordination between the manufacturers of electronic components, printed circuit boards, equipment, materials and electronics manufacturers worldwide. IPC International standards are unified for representatives of the electronics industry worldwide. No matter where the design and manufacture of printed circuit boards, assembly of electronic components will be done - with the application of IPC standards, the customer will receive the expected quality, and contractors, regardless of their number, will uniquely interpret the requirements to production. Since January 2016 the company "Ukrainian Scientific Research Institute of Computer Technologies" Ltd has been the official distributor of International association of electronics manufacturers IPC in Ukraine. The list of services provided by IKT for Ukrainian electronics manufacturers, within the framework of the contract signed with the International association IPC: Providing information about planned activities Organization of participation in webinars, exhibitions, conferences and seminars held by International Association of Electronics Manufacturers IPC Consulting on modern standards of PCB design and manufacture, assembly of electronic components Sale of licensed IPC Standards in printed and electronic versions Conducting training sessions on the IPC program for electronics developers and assembly specialists Assistance on the procedure of participation registration in the International association of electronics manufacturers IPC Have you any questions on the application of IPC Standards, please, contact IKT specialists for advice. +38 (044) info@ictech.com.ua +38 (044)

8 TECHNOLOGICAL NORMS OF MULTILAYER PRINTED CIRCUIT BOARDS TOPOLOGY PCB THICKNESS: MAXIMUM SIZE: 620,00 х 813,00 mm 350,00 х 500,00 mm for rigid and rigid-flex PCBs 0.30 mm 8.00 mm for multilayer PCBs MINIMAL DIAMETER OF HOLES, mm: 0.50 for holes with reverse drilling technologies for backplanes 0.20 serial production 0.15 samples production for PCBs based on PTFE and APPE min. diameter of half-holes at the edges of the board maximum diameter of the holes to be filled with resin BOARD THICKNESS TO DRILLING DIAMETER RATIO: Hole diameter Samples and Prototypes Serial production 0,20mm and less 10 :1 8 :1 0,30mm and less 0,80mm and less more than 0,80mm 12 :1 16 :1 20 :1 for backplanes 10 :1 12 :1 15 :1 30 :1 for technology of filling vias with resin for PCBs based on PTFE and APPE 8 :1 8 :1 7

9 TECHNOLOGICAL CAPABILITIES Accuracy of hole sizes: Ø of plated holes - ± 75 μm Ø of non-plated holes - ± 50 μm Ø of plated holes for press-fit - ± 50 μm size of grooves, countersinks and slots - ± 150 μm Accuracy of holes positioning ± 75 μm Accuracy of blind holes and notches ± 100 μm Minimum spacing from plated wall of drilling channel to copper in power layers: in prototypes and samples for boards with number of layers 8 and less μm in prototypes and samples for boards with number of layers 14 and less is 170 μm in prototypes and samples for boards with number of layers more than μm in serial production PCBs with number of layers 8 and less μm in serial production PCBs with number of layers more than μm for laser micro-holes μm Minimum radius of grooves and slots milling mm Minimum dielectric thickness for V-CUT processing: 0.40 mm for one side scribing 0.60 mm for both sides scribing Maximum dielectric thickness for V-CUT processing mm Scribing accuracy: application and alignment of lines mm scribing angle - ± 5 Possible colors for silkscreen printing: white, yellow, black Minimum size of silkscreen elements: in prototypes - not less than 0.70 mm in serial production - not less than 1,00 mm Minimum width of solder mask bridges between pads: for green mask when using base foil 18 μm or less μm for a different color mask when using base foil 18 μm or less μm for mask of all colors when using base foil 35 μm μm for mask of all colors when using base foil 75 μm and more μm Track width and spacing between them: Foil thickness Samples and Prototypes in inner layers, mm 12µм (1/3 oz) 0,075/0,075 18µм (1/2 oz) 0,075/0,075 35µм (1 oz) 0,075/0,100 70µм (2 oz) 0,100/0, µм (3 oz) 0,125/0, µм (6 oz) 0,200/0, µм (9 oz) 0,280/0,610 in outer layers, mm 12µм (1/3 oz) 0,075/0,075 18µм (1/2 oz) 0,085/0,085 35µм (1 oz) 0,115/0,125 70µм (2 oz) 0,150/0, µм (3 oz) 0,175/0, µм (6 oz) 0,255/0, µм (9 oz) 0,330/0,760 Serial production 0,075/0,075 0,075/0,075 0,075/0,100 0,100/0,140 0,125/0,200 0,200/0,400 0,280/0,750 0,075/0,100 0,100/0,150 0,120/0,140 0,150/0,200 0,175/0,300 0,255/0,540 0,330/0,840 Tracks manufacture accuracy: for tracks with width 0.25 mm or less in prototypes and samples - ± 25 μm for tracks with width more than 0.25 mm in prototypes and samples - ± 38 μm In serial products manufacturing precision is regulated by IPC-A-600G standards and is less than ± 20% Min. size of pads for BGA chips: HASL SnPb - not less than mm HASL Pb free - not less than 0,350 mm Immersion surface finishes - not less than 0,175 mm Minimum spacing between adjacent pads: in samples of boards with immersion finish when using base foil of 18 μm or less - 90 μm in serial boards with immersion finish when using base foil of 18 μm and less μm in prototypes with HASL finish when using base foil of 18 μm and less μm in serial boards with HASL finish when using base foil of 18 μm and less μm Minimum size of topology elements not connected to circuits mm +38 (044) info@ictech.com.ua +38 (044)

10 MATERIALS FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS: Type Composition and characteristics Tg ( C) Dk Brand, part number of the substrate material FR4 The basic material. Glass fiber laminate (laminated plastic based on diane epoxy resins, reinforced with fiberglass), with an operating temperature of -50 to +110 C ,2-4,7 Shengyi S1141; IsolaDE104, DE114; KINGBOARD LAMINATES KB-6150; ILM GF212; DooSan DS FR4 halogen free Glass fiber laminate based on modified epoxy resins. Does not contain halogen, antimony, phosphorus. Does not release hazardous substances during combustion ,0-4,6 Nelco N4000EF; Isola DE156, IS500; ITEQ IT-140GBS, IT-140GTC, IT-859GTA FR4 High Tg Glass fiber laminate based on mixtures of diane and multifunctional epoxy resins. Depending on the application modified by bismaleimide, triazine, and other substances. It possesses high thermal stability and higher stability of parameters at high temperatures. It can be used for the manufacture of printed circuit boards, which are mounted on lead-free technology ,6-4,5 Shengyi S1170 S1000; Isola FR408, IS410, FR406, GETEK; ITEQ IT170, IT180, IT150DA; Nelco N4000, N4350, N5000; Panasonic Megtron 4, Megtron 6; Elite EM-827; Grace Electron GA-170; Nanya NP-180; Taiwan Union TU-752, TU-662; Hitachi MCL-BE-67G(H), MCL-E-679(W), MCL-E- 679F(J) FR-4 with high track resistivity Material based on modified epoxy resins. It is used for PСBs with high levels of operating voltage, high humidity ,2-4,7 Shengyi S1160; Kingboard KB-6165; Nelco N ; ITEQ IT158A, IT180A; Isola DE104KF FR-4 for HDI structures Glass fiber laminate of epoxy resins of various compositions. In the manufacture of glass fabrics special types of fabric weaving are used ,2-4,2 Shengyi S6018; ITEQ IT180A, IT200D; Isola FR408HR, PCL-370HR 9

11 TYPES & PARAMETERS OF MATERIALS MATERIALS FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS: Type Composition and characteristics Tg ( C) Dk Brand, part number of the substrate material RCC Material is based on a partially polymerized epoxy resin applied over a copper foil. It does not have a woven substrate. 130 and more 3,2-3,8 PCL-CF-400, PCL-HDI-390; Microwave PTFE, APPE Polymers based on fluorocarbon compounds - Teflon (PTFE), polyester (APPE), reinforced with fiberglass. Printed circuit boards of high reliability, have high dielectric strength, moisture resistance, the possibility of operating under high temperatures and extreme temperatures ,2-4,2 Taconic, TLX series, TLF, TLY, RF, TLC, TLG; Arlon, AD series, Diclad; Taizhou Wangling, F4BK series, TP; Nelco N7000, N8000; Rogers RO5870, Ultralam 2000 Microwave with ceramic filling Polymers based on polycarbonates (carboxylic resin) with a fine-dispersed ceramic filler reinforced with fiberglass ,0-6,0 Rogers RO4350, RO4003, 25FR, 25N; Nelco NH9000 Ceramic-based microwave Composite material based on ceramic with an organic binder. It has small losses ,27-10 Rogers RT6010; TMM; Taconoc CER-10 Pl (polyimide) Films of little thickness made of polymerized polyimide. The material for production of flexible and rigid-flex boards ,3-3,8 Dupont LF series, Pyralux; ThinFlex Polyimide; Shengyi SFH640-2 For manufacture of multilayer printed circuit boards with more than four layers we recommend the use of materials from FR4 High Tg group. Materials of FR4 High Tg group provide: High quality and reliability of multilayer PCB Capability for multiple repairs and reinstallation of BGA components on multilayer PCB Capability for lead-free installation modes on multilayer PCB If you need recommendations for selecting printed circuit board material, please, contact IKT specialists for receiving free consultations. +38 (044) info@ictech.com.ua +38 (044)

12 TYPES OF CONTACT PADS SURFACE FINISHES: Surface finish type Description Thickness of coating HASL SnPb Coating based on tin-lead eutectic alloy. It is applied by reflow followed by hot air leveling. Excellent solderability, insufficient flatness, incompatibility with lead-free assembly 2,0...40,0 μm at the sites of the small size the thickness is not standardized HASL Lead Free Lead-free coating based on sub-eutectic alloy of tin. It is applied by reflow followed by hot air leveling. Satisfactory solderability, insufficient flatness. It complies with international directives RoHS. Application leads to a high risk of intermetallic compounds formation. 2,0...40,0 μm at the sites of the small size the thickness is not standardized ENIG Immersion gold over sublayer of galvanic nickel. It is used to provide a flat surface of contact areas and long preservation of PCB solderability. Excellent solderability, compatibility with all mounting technologies. Au min 0,05 µм Ni 3..6 µм (IPC-4552) ENEPIG Immersion gold with sublayer of galvanic nickel and palladium. In comparison with ENIG has higher chemical resistance. Provides better maintainability of PCBs. Au min 0,025 µм Pd 0,05..0,15 µм Ni 3..6 µм (IPC-4556) Flash Gold Hard Gold Galvanic gold over sublayer of galvanic nickel. It is used to provide a flat surface of contact pads and long preservation of PCB solderability. Good solderability, compatibility with all mounting technologies. Galvanic gold over sublayer of galvanic nickel. It is used as a topcoat of edge connectors contacts (Gold Fingers technology). It can be used as a selective topcoat of wear-resistant elements of PCBs. It is characterized by the presence of dopant admixtures in its composition. Au 0,025..0,05 µм Ni 3..5 µм Au 0,2..2,0 µм Ni 3..5 µм 11

FINISHING OVERLAYERS TYPES OF CONTACT PADS SURFACE FINISHES: Surface finish type Description Thickness of coating Immersion Tin Provides a flat surface of pads, has a good solderability and a limited

13 FINISHING OVERLAYERS TYPES OF CONTACT PADS SURFACE FINISHES: Surface finish type Description Thickness of coating Immersion Tin Provides a flat surface of pads, has a good solderability and a limited period of time for mounting. Its application leads to a high risk of intermetallic compounds formation. min 1,00 µм (IPC-4554) Immersion TinOm Immersion tin on top of sublayer of organic metal. It provides a flat surface, has good solderability and long period of time for mounting. It reduces the risk of intermetallic compounds formation. min 1,00 µм Immersion Silver It provides a flat surface, has good solderability and long period of time for mounting. The coating is sensitive to compounds of sulfur and halogen in atmosphere. min 0,05 µм (IPC-4553) Soft Gold Galvanic gold over sublayer of galvanic nickel. It is intended for unwelding of chip pins on PCBs by the gold wire with using plasma welding. Au 1,5..3,0 µм Ni 3..5 µм OSP Organic protective coating. Provides a flat surface of pads, has good solderability and low cost. The main disadvantages of the coating are short storage period, impossibility of repairing, risk of intermetallic compounds formation at lead-free technological process. min 0,15 µм Additional features: Peelable solder mask is applied for temporary protection of board areas during mounting, assembly, setting up and starting product operation. It is absent in finished products. Carbon coating is used to make contact pads of keyboards and other elements of PCBs that require high wear resistance. Thickness of coating is 0,10..0,40 µм. Graphite films are used as embedded resistive elements, heating elements. Items on silver paste basis are used to create additional conductive layers, function as webs. Field of application one layer PCBs. If you need advice on the selection of surface finish, please, contact the engineering department of IKT for free consultations. +38 (044) info@ictech.com.ua +38 (044)

PCB FOR LEAD-FREE ASSEMBLY Functional reliability class according to IPC-A-600G 2nd Type of material Ceramic/FR-4 High Tg Part number of the material and manufacturer Rogers RO4450F/IT-180A, ITEQ

Panel dimensions 88,50 х 61,00 ±0,20 mm Warpage of board 0,32% Finished copper thickness in outer / inner layers 51 µм/35 µм Minimum through holes' diameter 0,15 mm Minimum amount of copper on

14 PCB FOR LEAD-FREE ASSEMBLY Functional reliability class according to IPC-A-600G 2nd Type of material Ceramic/FR-4 High Tg Part number of the material and manufacturer Rogers RO4450F/IT-180A, ITEQ Permittivity and losses in ceramic part Dk 3,52±0,05 / Df 0,0040 Number of layers 4 Board thickness 1,00 mm ±10% Ceramic layer thickness 0,10 mm ±0,50% Single board dimensions 12,50 х 28,50 ±0,20 mm Panel dimensions 88,50 х 61,00 ±0,20 mm Warpage of board 0,32% Finished copper thickness in outer / inner layers 51 µм/35 µм Minimum through holes' diameter 0,15 mm Minimum amount of copper on through holes walls 21 µм Minimum track width 0,125 mm Minimum track spacing 0,200 mm Minimum SMD pads' size 0,250 mm Finish type Flash Gold - galvanic gold Gold thickness 0,028 µм Nickel thickness in sublayer 4,34 µм Solder mask LPI PSR-4000 GHP3X green 13

15 RoHS LEAD-FREE TECHNOLOGIES If you plan to export products to the European Union countries use lead-free technologies. In August 2004, the EU Parliament passed a law banning the use of hazardous substances - RoHS (Restriction of Hazardous Substances). The law stipulates that, beginning 2006, all electronic components and equipment supplied to Europe must comply with the requirements of limited content of lead, mercury, cadmium, hexavalent chromium and other hazardous to health and environment substances. These requirements are also accepted in Japan and, with certain reservations, in the USA. The RoHS Directive includes electronic equipment with a working voltage supply of not more than 1000V AC and not more than 1500V DC: Large and small household appliances Computer and telecommunication equipment Consumer goods, toys, equipment for sports and recreation Lighting technology (including electric lamps and household lighting) Electrical and electronic instruments (except for industrial machinery) Manufacturers of electronic components switched to production of lead-free technologies. This entailed the need to select the right materials and components for manufacture of printed circuit boards, as well as use of lead-free mounting technology. The soldering process for lead-free components is different from soldering technology for lead-containing components. The soldering temperature is higher by approximately 20 C.. 40 C, the composition of solder and flux is different, as well as storage and preliminary drying conditions. "Lead" BGA-components cannot be soldered using lead-free technology, because there is a risk of their damage. Lead-free BGA-components cannot be soldered on lead technology solder balls will not melt. The installation of mixed components is not a completely correct technological procedure, especially if the package includes BGA components. We do not recommend the use of mixed components for surface mounting. If the use of mixed equipment is inevitable, try to place on one side of printed circuit board all "lead" components, and on the other - all lead-free. Dielectric and surface finish selection for PCBs that comply with the RoHS directive. Standard FR4 is not always suitable for PCBs that are to be assembled on lead-free technology. For multilayer printed circuit boards, the use of standard materials is extremely limited, and for HDI boards is not possible. The duration and intensity of high-temperature exposure during the installation time for lead-free technology is much higher and, when using conventional FR4, it can lead to damage of vias plating, delamination of board and conductors detaching. Reliability and durability of boards made of materials of FR4 group, when exposure to high-temperature, decrease in many times. For this reason, for multilayer PCBs it is recommended to use such materials as FR4 High Tg with a high glass transition temperature and a low value of temperature coefficient of dielectric linear expansion. In addition to basic materials, one of the important components of printed circuit boards, manufactured according to RoHS, is surface finish of pads. RoHS compliance requires not only RoHS-compliant coating and basic materials, but also an appropriate certificate from the board manufacturer. When placing orders at a manufacturer of printed circuit boards, it is necessary to indicate the requirement on the use of lead-free technologies. +38 (044) info@ictech.com.ua +38 (044)

16 RIGID- FLEX PCBs Functional reliability class according to IPC-A-600G 3rd Type of material, part number, brand Polyimide - IF-2LD / FR4 High Tg - IT-180A, ITEQ Number of layers in flex / rigid part 4/8 Board thickness in flex part 0,38 ± 0,05 mm Board thickness in rigid part 1,50 ± 0,15 mm Single board dimensions 180,50 х 205,00 ±0,10 mm Finished copper thickness in outer / inner layers 52 µм / 35 µм Finished copper thickness in flex part 35 µм Minimum through holes' diameter 0,80 mm Minimum track width 0,350 mm Minimum track spacing 0,350 mm Finish type ENIG - immersion gold Solder mask in rigid part KSM-S6189BK31, green Solder mask in flex part Coverlay IF-FC, colorless 15

17 FLEX AND RIGID-FLEX PRINTED CIRCUIT BOARDS Rigid-flex printed circuit boards - an ideal solution for increasing the reliability of electronic devices and systems by reducing interconnections within electronic module or unit. Advantages of using flex and rigid-flex printed circuit boards: Smaller weight and thickness of electronic modules construction Ability to take a compact form Reduced assembly errors due to lack of wiring Resistance to multiple dynamic bends Materials used to manufacture flex and rigid-flex printed circuit boards: Base - polyimide 13, 25, 50, 75 μm. Dk = 3.5 Adhesive - acrylic 13, 25, 50, 75 μm. Dk = 3.6 Conductive layer - copper 9,18, 35, 70 μm Coating - polyimide 13, 25, 50, 75 μm. Dk = 3.5 Stiffener - polyimide or FR4 with thickness 0,1..1,0 mm Rigid part - laminate with thickness 0,1..0,5 mm Surface finishes recommended for flex and rigid-flex printed circuit boards: Organic coating - OSP Immersion gold - ENIG Immersion silver - ImmAg Features of flex and rigid-flex printed circuit boards: Maximum number of layers: in flex part - 8; in rigid part Minimum hole diameter mm Minimum dielectric thickness in flex part - 25 μm Minimum track width: in flex part - 0,10 mm; in rigid part - 0,075 mm. The stiffener material for flex loops is FR-4 or polyimide with thickness of mm. In places of flexible and rigid part joints silicone rollers are used. Max. panel size is 350,00 x 500,00 mm. Design, manufacture and quality control criteria of rigid-flex printed circuit boards are stated in the international standard IPC-2223A. IKT engineers assist in adaptation and redesign of existing projects for transition to rigid-flex technologies. To receive advice on design and manufacture of rigid-flex PCBs, please, contact IKT engineering department. +38 (044) info@ictech.com.ua +38 (044)

MICROWAVE PCBs Functional reliability class according to IPC-A-600G Type of material 2nd Ceramic Part number of the material and manufacturer Permittivity and losses in ceramic part Rogers RO4003C Dk

18 MICROWAVE PCBs Functional reliability class according to IPC-A-600G Type of material 2nd Ceramic Part number of the material and manufacturer Permittivity and losses in ceramic part Rogers RO4003C Dk 3,38 ± 0,05 / Df 0,0021 Number of layers 2 Board thickness 0,60 mm ±10% Ceramic layer thickness 0,50 mm ±0,50% Single board dimensions 69,40 х 111,20 ±0,20 mm Warpage of board 0,11% Finish copper thickness in outer layers 41 µм Minimum through holes' diameter 0,80 mm Minimum amount of copper on through holes walls 24 µм Minimum track width 0,300 mm Minimum track spacing 0,300 mm Minimum SMD pads' size 0,350 mm Finish type ImmAg - immersion silver Surface ﬁnish thickness 0,021 µм Solder mask 17 LPI LP-4G/G-05A green

19 MICROWAVE PRINTED CIRCUIT BOARDS Institute of Computer Technologies manufactures printed circuit boards on high-frequency materials for HF and microwave devices. A distinctive feature of microwave printed circuit boards is a wide range of high-frequency signals propagated through strip transfer lines. This circumstance is reflected in the peculiarities of microwave boards design and puts forward special requirements to dielectrics parameters and quality of manufacture. High frequency laminates are used in the manufacture of microwave printed circuit boards. These materials are polymeric and ceramic thermoactive laminates reinforced with glass fiber with a small tangent of dielectric loss angle and a wide spectrum of dielectric permittivity. A separate direction is the manufacture of microwave printed circuit boards based on hydrocarbon ceramics. Hydrocarbon ceramics have the best processability, which allows to use it in combined printed circuit boards. Advantages of using high-frequency materials: High stability of electrical parameters over a wide range of temperatures and frequencies High resistance to temperature effects High dimensional stability in various climatic conditions Materials for the manufacture of microwave printed circuit boards: Material Isola G 200/GI 180 Taizhou Wangling F4T, F4BK, TF, TP series Rogers RO4003 Rogers ULTRALAM Nelco N7000 Nelco N9000 Arlon AD320 Arlon AR1000 Taconic TLC Taconic TLY Taconic TLX Taconic RF-35 Rogers TMM10i Taconic CER-10 Dk 3,90-4, ; 9,60; 10,20; 10,50; 11, ,38 2,40-2,60 3,90 2,00-2,60 3,20 10,00 2,75-3,20 2,17-2,40 2,45-2,65 3,50 9,8 10 0,009-0,013 0,001and less 0,0022 0,0019 0,0095 0,0006-0,0022 0,0030 0,0030 0,0030 0,0009 0,0019 0,0028 0,0022 0,0035 Dk - dielectric permittivity CTDk - temperature coefficient Dk (ppm/ o С) Df - loss at 1GHz CTE (X,Y) - coefficient of temperature expansion (ppm/ o С) Feature of microwave printed circuit boards is the absence of solder mask on the entire board or on its significant part, as well as use of thin surface finish coatings, providing a smooth and even surface - immersion tin and immersion silver. At the stage of design preparation, please, check with the specialists of Institute of Computer technologies about peculiarities of the materials used and their availability in the warehouses of producers. It will help to create a correct design of microwave printed circuit boards that does not require improvements and corrections at the stage of preparation for production. Df Thermal conductivity W/m C 0,48-0,64 0,50 0,50-0,24 0,64 0,24 0,22 0,14 0,35 0,76 - Z-Axis CTE ppm/ C 140 0,75-1,00 (%) ,70 (%) (044) info@ictech.com.ua +38 (044)

MULTILAYER HDI PCB PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 1086 RC61 0,080 2 - Core ITEQ IT180A Core 0,10mm 1/H 0,035 0,100 3

20 MULTILAYER HDI PCB PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 1086 RC61 0, Core ITEQ IT180A Core 0,10mm 1/H 0,035 0, ,018 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 3313 RC58 0, ,070 - Core ITEQ IT180A Core 0,80mm 2/2 0, ,070 - PP ITEQ IT180ABS 3313 RC58 0,105 - PP ITEQ IT180ABS 1080 RC62 0, ,035 - Core ITEQ IT180A Core 0,10mm H/1 7 0,100 0,018 - PP ITEQ IT180ABS 1086 RC61 0,080 8 Foil Copper Foil 0,012 - SM HSR-200 GK01S 0,015 - ID CESN5054/CCSN3017 0,025 0,025 0,015 0,075 0,180 0,075 0,095 0,800 0,095 0,075 0,180 0,075 0,015 0,025 Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 8 Board thickness 1,80 mm ±10% Single board dimensions 70,00 х 60,00 ±0,20 mm Panel dimensions 70,00 x 75,00 ±0,20 mm Finish copper thickness in outer layers 40 µм Finish copper thickness in inner layers 35 µм Minimum through holes' diameter 0,20 mm Minimum blind holes' diameter 0,10 mm Minimum track width 0,078 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,225 mm Finish type ENIG - immersion gold Gold thickness 0,028 µм Nickel thickness in sublayer 4,34 µм Solder mask LPI LP-4G/G-05A green Impedance control was done on the board: 50 Ω microstrip line: microstrip width 100 µм on layers L1 and L8, reference layers L2 and L7 strip width 95 µм on layers L3 and L6, reference layers L2/L4 and L5/L7 85 Ω differential pairs: Line 100 µм, spacing 130 µм on layer L8, reference layer L7 100 Ω differential pairs: Line 78 µм, spacing 188 µм on layers L1 and L8, reference layers L2 and L7 Line 87 µм, spacing 168 µм on layer L6, reference layers L5/ L7 On this PCB we applied the technology of vias filling with subsequent alignment and metallization of the surface, in accordance with standard IPC-4761, type VII: 19

21 HDI HIGH DENSITY INTERCONNECTION PCBs Institute of Computer Technologies manufactures high-complexity printed circuit boards HDI (High Density Interconnection). Distinctive features of printed circuit boards manufactured by HDI technology: Application of microcircuits in miniature cases μbga, QFN, CSP and components with a small pitch and small sizes of SMD-pads High density of topology pattern, which is achieved by small track width and spacing between topology elements less than 0.10 mm Vias of small diameter, made by using high precision mechanical drilling Vias of ultra-small diameter, made by using laser micro via drilling technology Location of micro vias directly in the pads via-in-pad technology Application of complex and high-tech stack-ups in printed circuit boards design Application of blind and buried vias Typical technological capabilities of HDI printed circuit boards manufacture: Blind and buried holes: Up to 3 lamination steps in prototypes; Up to 2 lamination steps in serial products. WFP structures: prototypes: 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3, 4+n+4; serial products: 1+n+1, 1+1+n+1+1, 2+n+2; maximum diameter of buried holes mm; minimum diameter of laser holes mm. The ratio of drilling depth to drilling diameter: up to 1.5:1 in prototypes; up to 1,2:1 in serial products; up to 1:1 for laser micro-vias. Min. pad size for laser vias: 0.15 mm to via diameter in prototypes; 0.20 mm to via diameter in serial products. Minimum depth of blind holes made by drilling with depth control mm Recommendation: before starting design of multilayer HDI PCB, submit the structure of blind and buried holes, as well as stack-up parameters for IKT engineers approval. For advice on design and manufacture of HDI printed circuit boards, please, contact IKT engineering department. +38 (044) info@ictech.com.ua +38 (044)

board dimensions 30,00 х 31,20 ±0,40 mm Panel dimensions 90,00 х 93,60 ±0,40 mm Dielectric thickness 0,075 ±

22 PCB ON COPPER CORE Functional reliability class according to IPC-A-600G 2nd Type of material Cupper core Part number of the material and manufacturer T-500, Totking Number of layers 1 Board thickness 2,00 ± 10% Single board dimensions 30,00 х 31,20 ±0,40 mm Panel dimensions 90,00 х 93,60 ±0,40 mm Dielectric thickness 0,075 ± 10% Minimum track width 0,60 mm Minimum track spacing 0,60 mm Minimum SMD pads' size 0,80 mm 21

23 METAL CORE PRINTED CIRCUIT BOARDS Institute of Computer Technologies manufactures metal core printed circuit boards for functioning in severe operating conditions, which can have both a single layer and multilayer structure. Advantages of metal core printed circuit boards: Non-combustibility and high thermal conductivity Shielding from electromagnetic fields High resistance to vibration and shock loads Good machinability IKT capabilities for manufacture of metal core printed circuit boards: Maximum size of board (panel) - 609x609 mm Minimum board size - 5,00х5,00 mm Maximum board thickness mm Thermal conductivity of dielectric - from 1.0 W / mk to 2.8 W / mk Dielectric thickness - from 60 μm Copper thickness - up to 350 μm (10oz) Base thickness - from 0,8 mm to 3,0 mm Base material: aluminum, copper, iron, steel Minimum size of non-plated holes mm Materials for metal core printed circuit boards manufacture: T-lam SS 1K04; T-lam SS 1K06; T-lam SS 1K08 / Laird (Thermagon) ML99; ML92 / ARLON HT-04503; HT-07006; LTI-04503; LTI-06005; MP-06503; CML / Bergquist IT-859; IT-889 / ITEQ CCAF-01; CCAF-04; CCAF-05; CCAF-06 / CHAO SHUN HRA-5100; HRA-5105; HRA-5110; HRA-5115 / HeroSail (Tongling) VT-44A; VT-4A1; VT-4A2; VT-4A3 / Venteq T-110; T-111; T-112; T-113; T-200; T-300; T-500 / Totking Surface treatment of metal core PCBs: For copper - galvanic nickel, galvanic gold with nickel sublayer For aluminum - anodizing, oxidation, passivation, roughening For iron and steel - galvanic nickel, chrome vanadium coating, powder paints Metal core boards are mainly used for high current technology and have a significant copper thickness of the conductive pattern. Technological requirements for the resolution capability of drawing pattern forming technology are not strict. Сontact IKT engineering department to receive advice on design and manufacture of metal core PCBs. +38 (044) info@ictech.com.ua +38 (044)

MULTILAYER PCB WITH WAVE IMPEDANCE CONTROL PCB Stack-up 0,025 0,010 - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0,010 1 0,018 - Core ISOLA FR408 Core 0,15mm H/H0,150 2 0,018 - PP ISOLA FR408HS01

Core 0,15mm 1/H 0,125 7 0,035 - PP ISOLA FR408HS01 3113 RC53 0,115 8 0,035 - Core ITEQ IT180A Core 0,15mm H/1 0,125 9 0,035 - PP ISOLA FR408HS01 3113 RC53 0,115 10 0,035 - Core ITEQ IT180A Core

24 MULTILAYER PCB WITH WAVE IMPEDANCE CONTROL PCB Stack-up 0,025 0,010 - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0, ,018 - Core ISOLA FR408 Core 0,15mm H/H0, ,018 - PP ISOLA FR408HS RC53 0,115 3 Foil Copper Foil 0,018 - PP ISOLA FR408HS RC53 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/H 0, ,035 - PP ISOLA FR408HS RC53 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/H 0, ,035 - PP ISOLA FR408HS RC53 0, ,035 - Core ITEQ IT180A Core 0,15mm H/1 0, ,035 - PP ISOLA FR408HS RC53 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/H 0, ,035 - PP ISOLA FR408HS RC53 0, ,035 - Core ITEQ IT180A Core 0,15mm H/1 0, ,035 - PP ISOLA FR408HS RC53 0,115 14Foil Copper Foil 0,018 - PP ISOLA FR408HS RC53 0, ,018 - Core ISOLA FR408 Core 0,15mm H/H0, ,018 - SM HSR-200 GK01S 0,010 - ID CESN5054/CCSN3017 0,025 Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 High Tg Part number of the material and manufacturer FR408, ISOLA Number of layers 16 Board thickness 2,20 mm ±10% Single board dimensions 233,35 х 160,00 ±0,20 mm Minimum through holes' diameter 0,20 mm Minimum blind holes' diameter 0,15 mm Minimum track width 0,100 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,300 mm Finish type ENIG - immersion gold The board has a surface milling in the edge area, made with depth control. The thickness of the board in the milling area is 1.60 mm. Impedance control was done on the board: 50 Ω microstrip line: microstrip width µм on layer L1, reference layer - L3 strip width μm on layers L5 and L6, reference layers -L4 and L7 strip width μm on layers L8 and L9, reference layers - L7 and L10 strip width μm on layers L11 and L12, reference layers - L10 and L Ω differential pairs: line μm, spacing μm on layers L5 and L6, reference layers - L4 and L7 line μm, spacing μm on layers L8 and L9, reference layers - L7 and L10 line μm, spacing μm on layers L11 and L12, reference layers - L10 and L13 0,150 0,100 0,100 0,125 0,100 0,125 0,100 0,125 0,100 0,125 0,100 0,125 0,100 0,100 0,150 0,010 0,

25 PCBs WITH WAVE IMPEDANCE CONTROL Institute of Computer Technologies manufactures printed circuit boards with wave resistance (impedance) control of conductors and differential pairs. PCBs with impedance control are made of highly stable materials, special attention is paid to design of PCB stack-up, design of transmission lines. Wave resistance control is necessary on printed circuit boards, where the delay of signal propagation and impedance matching are important: Printed circuit boards with high-speed interfaces Printed circuit boards for measuring equipment Printed circuit boards for transceiver equipment Microwave printed circuit boards Calculation of signal transmission lines characteristics requires the observance of geometric parameters and high accuracy of printed drawing elements sizes when manufacturing boards. This will prevent mismatch of signal transmission lines, ensure achievement of required characteristics and absence of failures in high-performance systems functioning. To reduce error in line impedance value, all technological processes of PCB manufacturing are subjected to additional control. When pressing PCB workpieces, the requirements for presses loading and control of pressing parameters are toughened. These measures help to reduce the error in wave impedance of transmission lines up to 8-10% of calculated values. Additionally, on customer s request, it is possible to ensure tolerance of up to ± 5%. With materials selection for prototypes manufacture and small PCB batches it is possible to achieve higher correspondence between the value of the received wave resistance and the calculated data. The choice of material for manufacture of PCBs with wave impedance control plays an important role, since with the signal frequency increase of the typical material FR4 up to 1 Hz, the value of dielectric constant (Er) decreases linearly. The actual values of Er can fluctuate in limits of ± 25%. Impedance controlled PCBs are manufactured only out of certified types of FR4 material with the normalized and guaranteed by manufacturer Er value. When calculating the impedance, one should take dielectric constant value for maximum frequency of the signal spectrum. When working with digital signals, the front duration is a few nanoseconds, that corresponds to maximum frequencies of about 1 GHz and dielectric permittivity of about 4.0. It is known that wave resistance value depends not only on the type of material, but also on its thickness, since with increasing of the material thickness, the value of wave resistance is increasing too. The calculated wave resistance is also determined by the signal location and reference layers relative to each other, the width of tracks and the spacing between them. Selecting the type of material, its thickness and stack-up calculating of impedance controlled PCB must be done before designing its topology. IKT engineers are ready to provide advice on calculations correction and design of transmission lines at the stage of development and preparation of the project for manufacture. +38 (044) info@ictech.com.ua +38 (044)

PCB WITH PRESSED IN COPPER INSERTS ON WHICH BLIND SLOTS ARE EXECUTED BY MILLING WITH DEPTH CONTROL Functional reliability class according to IPC-A-600G 3rd Type of material Ceramic/FR-4 High Tg Part

26 PCB WITH PRESSED IN COPPER INSERTS ON WHICH BLIND SLOTS ARE EXECUTED BY MILLING WITH DEPTH CONTROL Functional reliability class according to IPC-A-600G 3rd Type of material Ceramic/FR-4 High Tg Part number of the material and manufacturer Rogers RO4350/ IT-180A, ITEQ Permittivity and losses in ceramic part Dk 3,48±0,05 / Df 0,0031 Number of layers 6 Board thickness 2,20 mm ±10% Ceramic layer thickness 0,50 mm ±0,50% Single board dimensions 186,00 х 211,00 ±0,20 mm Warpage of board 0,32% Finished copper thickness in outer / inner layers 51 µм / 35 µм Minimum through holes' diameter 0,25 mm Minimum amount of copper on through holes walls 27 µм Minimum track width 0,200 mm Minimum track spacing 0,200 mm Minimum SMD pads' size 0,210 mm Finish type ENIG - immersion gold Solder mask LPI PSR-4000 GHP3X green 25

ADDITIONAL CAPABILITIES OF PCB MANUFACTURE PRINTED CIRCUIT BOARD OF PLANAR TRANSFORMER WITH THICK COPPER IN OUTER (120 μm) AND INNER (105 μm) LAYERS PCB Stack-up - - ID SM Screenrd Ident LP-4G/G-05A

PrePeg 7628 6 7 - Core FR4 Core - - - PP PP PP PrePeg1080 PrePeg 3113 PrePeg 7628 8 9 - Core FR4 Core - - - PP PP PP PrePeg1080 PrePeg 3113 PrePeg 7628 10 - Core FR4 Core 11 - - - PP PP PP PrePeg1080

0,075 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,025 0,050 0,025 0,068 0,092 0,180 0,430 0,068 0,092 0,180 0,430 0,180 0,092 0,068 0,430 0,180 0,092 0,068 0,430

Number of layers 12 Board thickness 5,85 mm ±5% Single board dimensions 185,00 х 85,00 ±0,25 mm Finish copper thickness in outer layers 120 µм Finish copper thickness in inner layers 105 µм Number of

27 ADDITIONAL CAPABILITIES OF PCB MANUFACTURE PRINTED CIRCUIT BOARD OF PLANAR TRANSFORMER WITH THICK COPPER IN OUTER (120 μm) AND INNER (105 μm) LAYERS PCB Stack-up - - ID SM Screenrd Ident LP-4G/G-05A Foil PP PP PP Copper Foil PrePeg1080 PrePeg 3113 PrePeg Core FR4 Core PP PP PP PrePeg1080 PrePeg 3113 PrePeg Core FR4 Core PP PP PP PrePeg1080 PrePeg 3113 PrePeg Core FR4 Core PP PP PP PrePeg1080 PrePeg 3113 PrePeg Core FR4 Core PP PP PP PrePeg1080 PrePeg 3113 PrePeg Core FR4 Core PP PP PP PrePeg1080 PrePeg 3113 PrePeg Foil Copper Foil - SM LP-4G/G-05A 0,050 0,025 0,105 0,075 0,102 0,200 0,105 0,430 0,105 0,075 0,102 0,200 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,430 0,105 0,200 0,102 0,075 0,105 0,025 0,050 0,025 0,068 0,092 0,180 0,430 0,068 0,092 0,180 0,430 0,180 0,092 0,068 0,430 0,180 0,092 0,068 0,430 0,180 0,092 0,068 0,430 0,180 0,092 0,068 0,025 Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 12 Board thickness 5,85 mm ±5% Single board dimensions 185,00 х 85,00 ±0,25 mm Finish copper thickness in outer layers 120 µм Finish copper thickness in inner layers 105 µм Number of holes 61 Minimum through holes' diameter 1,10 mm Minimum copper thickness on through holes walls 47 µм Minimum track width 2,500 mm Minimum track spacing 1,500 mm Finish type ENIG - immersion gold Gold thickness 0,071 µм Nickel thickness in sublayer 4,49 µм Solder mask LPI LP-4G/G-05A green +38 (044) info@ictech.com.ua +38 (044)

type RA ELS, 35 µм Number of holes 13089 Minimum through holes' diameter 0,20 mm Minimum track width 0,150 mm Minimum track

28 FLEXIBLE CIRCUIT CABLE WITH VIAS LONGER THAN 1 METER Functional reliability class according to IPC-A-600G 3rd Type of material Polyimide, FELIOS FLEX Number of layers 2 Board thickness 0,22 mm ±10% Dimensions of the board 1034,00 х 20,60 ± 0,50 mm Finish type RA ELS, 35 µм Number of holes Minimum through holes' diameter 0,20 mm Minimum track width 0,150 mm Minimum track spacing 0,150 mm Finish type ENIG - immersion gold Gold thickness 0,021 µм Solder mask Polyimide coverlay R-F705, Panasonic 27

ADDITIONAL CAPABILITIES OF PCB MANUFACTURE PRINTED CIRCUIT BOARD MANUFACTURED WITH APPLYING THE COMBINATION OF TECHNOLOGIES OF RIGID-FLEX PCB AND METAL CORE PCB 10 µm 53 µm 50 µm 38 µm 60 µm 25 µm 38

Panasonic R-F775 Copper foil 1/2oz No flow PP 106 Dummy core FR4 Aluminium core Plated L1-L2 holes drill Plated L1-L3 holes drill No flow PP 106 coverlay Pl=1.0mil coverlay adhesive coverlay Pl=1.

29 ADDITIONAL CAPABILITIES OF PCB MANUFACTURE PRINTED CIRCUIT BOARD MANUFACTURED WITH APPLYING THE COMBINATION OF TECHNOLOGIES OF RIGID-FLEX PCB AND METAL CORE PCB 10 µm 53 µm 50 µm 38 µm 60 µm 25 µm 38 µm 60 µm 60 µm 1200 µm 60 µm 60 µm 18 µm 50 µm 18 µm 60 µm 60 µm 38 µm 50 µm 53 µm 10 µm Plated through holes drill Solder mask Copper foil 1/2oz FR4 H/H TU-768 Copper foil 1/2oz No flow PP 106 Panasonic R-F775 Copper foil 1/2oz No flow PP 106 Dummy core FR4 Aluminium core Plated L1-L2 holes drill Plated L1-L3 holes drill No flow PP 106 coverlay Pl=1.0mil coverlay adhesive coverlay Pl=1.0mil coverlay adhesive 25 µm 25 µm Copper foil 1/2oz copper foil 1/2oz copper foil 1/2oz 18 µm Panasonic R-F775 Polyimide (double side) Polyimide (double side) 50 µm Copper foil 1/2oz Plated L4-L5 holes drill 18 µm No flow PP 106 No flow PP µm Copper foil 1/2oz FR4 H/H TU-768 Plated L6-L7 holes drill Stiffener FR4 600 µm Copper foil 1/2oz Plated L4-L7 holes drill Plated L4-L7 holes drill Plated through holes drill Functional reliability class according to IPC-A-600G 3rd Type of material, part number and manufacturer in rigid part FR-4 High Tg, IT-180A, ITEQ plus aluminum core with exposure on the surface in flex part Polyimide, R-F775, Panasonic Number of layers 7 in rigid part, 1 layer in flex part + stiffener Board thickness 2,10 mm ±10% in rigid part 0,12 mm ±10% in flex part 0,80 mm ±10% in flex part with stiffener Single board dimensions 175,00 х 77,00 ±0,15 mm Finished copper thickness in outer / inner layers 38 µм / 18 µм Aluminum core thickness 1,00 mm Number of holes 593 Minimum through / blind / buried holes' diameter 0,80 mm / 0,20 mm / 0,25 mm Minimum copper thickness on through holes walls 29 µм Minimum copper thickness on blind holes walls 25 µм Minimum track width 0,200 mm Minimum track spacing 0,200 mm Finish type ENIG - immersion gold +38 (044) info@ictech.com.ua +38 (044)

MULTILAYER HDI PRINTED CIRCUIT BOARD WITH SUNK ASSEMBLY SITES ON LAYER INT1 AND ON LAYER INT2 PCB Stack-up - ID Screened Ident - SM LP Mask 1 - Core FR4Core IT-180 A - PP

FR4Core IT-180 A - PP PrePreg 1080IT-180A 7-8 Core FR4Core IT-180 A - PP PrePreg 1080IT-180A 9 - Core FR4Core IT-180 A 10 - PP PrePreg 3313IT-180A 11Foil Copper Foil - PP

0,018 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,036 0,075 0,048 0,025 0,050 0,050 0,025 0,210 0,068 1,100 0,068 0,064 0,064 0,075 0,064 0,075 0,064 0,075 0,064 0,064

board dimensions Panel dimensions Minimum through holes' diameter Minimum blind holes' diameter Minimum hidden holes' diameter Minimum track width Minimum track spacing

30 MULTILAYER HDI PRINTED CIRCUIT BOARD WITH SUNK ASSEMBLY SITES ON LAYER INT1 AND ON LAYER INT2 PCB Stack-up - ID Screened Ident - SM LP Mask 1 - Core FR4Core IT-180 A - PP PrePreg 1080NF VT Core FR4Core IT-180 A - PP PrePreg 1080NF VT47 3 Foil Copper Foil - PP PrePreg 1080IT-180A 4 Foil Copper Foil - PP PrePreg 3313IT-180A 5-6 Core FR4Core IT-180 A - PP PrePreg 1080IT-180A 7-8 Core FR4Core IT-180 A - PP PrePreg 1080IT-180A 9 - Core FR4Core IT-180 A 10 - PP PrePreg 3313IT-180A 11Foil Copper Foil - PP PrePreg 1080IT-180A 12Foil Copper Foil - SM LP Mask - ID Screened Ident 0,050 0,025 0,018 0,210 0,075 0,018 1,100 0,075 0,012 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,018 0,075 0,036 0,075 0,048 0,025 0,050 0,050 0,025 0,210 0,068 1,100 0,068 0,064 0,064 0,075 0,064 0,075 0,064 0,075 0,064 0,064 0,025 0,050 Functional reliability class according to IPC-A-600G Type of material Part number of the material and manufacturer Number of layers Board thickness Single board dimensions Panel dimensions Minimum through holes' diameter Minimum blind holes' diameter Minimum hidden holes' diameter Minimum track width Minimum track spacing Finish type 3rd FR4 High Tg IT-180A, ITEQ 12, HDI 2+(1+b8+1) 2,40 mm 25 х 25 mm 130 х 76 mm 0,50 mm 0,10 mm 0,15 mm 0,090 mm 0,065 mm ENEPIG (Au, Pd-0,05..0,1µm / Ni-3..5µm) 29

ADDITIONAL CAPABILITIES OF PCB MANUFACTURE BOARDS FOR MICROWAVE APPLICATIONS BASED ON CERAMIC

PCBs based on ceramic materials has a number of features.

chippings, tuberosity and other defects often occur.

contour processing accuracy: Accuracy of contour size: ± 0.

31 ADDITIONAL CAPABILITIES OF PCB MANUFACTURE BOARDS FOR MICROWAVE APPLICATIONS BASED ON CERAMIC MATERIALS WITH VERY HIGH DEGREE OF CONTOUR PROCESSING ACCURACY Contour processing of microwave PCBs based on ceramic materials has a number of features. Due to high hardness and brittleness of the dielectric while processing circuit contours chippings, tuberosity and other defects often occur. IKT supplies for its customers PCBs on microwave ceramic materials with a very high degree of contour processing accuracy: Accuracy of contour size: ± 0.10 mm Accuracy of chamfers and other mechanical processing elements dimensions: ± 0,15 mm At customer s request, it is possible to make bevels, chamfers and other elements of construction. +38 (044) info@ictech.com.ua +38 (044)

32 DEFENSE INDUSTRY 31

EXAMPLES OF PRINTED CIRCUIT BOARDS NAVIGATION RECEIVER PCB Mobile GPS / GLONASS navigation system PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM PSR-4000 GHP3X/CA-40 GHP3 0,015 1 Foil Copper Foil

IT180ABS 3313 RC58 0,090 6 - Core 0,018 7 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0,090 8 - Core 0,018 9 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313

14Foil Copper Foil 0,012 - SM PSR-4000 GHP3X/CA-40 GHP3 0,015 - ID CESN5054/CCSN3017 0,025 PCB OF KEYBOARD UNIT User interface unit of on-board radio station 0,025 0,015 0,083 0,100 0,083 0,100 0,083

material and manufacturer IT-180A, ITEQ Number of layers 14 Board thickness 1,60 mm ±10% Single board dimensions 68,00 х 146,50 ±0,15 mm Warpage of board 0,30% Finish copper thickness in outer layers

33 EXAMPLES OF PRINTED CIRCUIT BOARDS NAVIGATION RECEIVER PCB Mobile GPS / GLONASS navigation system PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM PSR-4000 GHP3X/CA-40 GHP3 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 3313 RC58 0, Core 0,018 3 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0, Core 0,018 5 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0, Core 0,018 7 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0, Core 0,018 9 ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0, Core 0, ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0, Core 0, ITEQ IT180A Core 0,10mm H/H 0,100 0,018 - PP ITEQ IT180ABS 3313 RC58 0,090 14Foil Copper Foil 0,012 - SM PSR-4000 GHP3X/CA-40 GHP3 0,015 - ID CESN5054/CCSN3017 0,025 PCB OF KEYBOARD UNIT User interface unit of on-board radio station 0,025 0,015 0,083 0,100 0,083 0,100 0,083 0,100 0,086 0,100 0,083 0,100 0,083 0,100 0,083 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 14 Board thickness 1,60 mm ±10% Single board dimensions 68,00 х 146,50 ±0,15 mm Warpage of board 0,30% Finish copper thickness in outer layers 38 µм Finish copper thickness in inner layers 18 µм Number of holes 2752 Minimum through holes' diameter 0,20 mm Minimum copper thickness on through holes walls 24 µм Minimum track width 0,100 mm Minimum track spacing 0,110 mm Minimum SMD pads' size 0,280 mm Finish type ENIG - immersion gold Gold thickness 0,068 µм Nickel thickness in sublayer 4,80 µм Solder mask LPI PSR-4000 GHP3X/CA-40 GHP3 green Panel dimensions 80,00 х 156,50 ±0,15 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 30 Thickness of web 0,50 mm Cutter diameter 2,00 mm Diameter of holes for separation 0,80 mm The board complies with RoHS Directive on the content of harmful substances. TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 Part number of the material and manufacturer S1141, Shengyi Number of layers 2 Board thickness 1,50 mm ±10% Single board dimensions 64,70 х 42,00 ±0,20 mm Warpage of board 0,30% Finish copper thickness in outer layers 40 µм Number of holes 146 Minimum through holes' diameter 0,40 mm Minimum copper thickness on through holes walls 31 µм Minimum track width 0,240 mm Minimum track spacing 0,200 mm Minimum SMD pads' size 0,285 mm Finish type Flash Gold galvanic gold Gold / nickel thickness 0,057 / 3,47 µм Finish type Hard Gold hard galvanic gold selective applying Gold / nickel thickness 2,68 / 3,49 µм Solder mask LPI LP-4G/G-05A green The board complies with RoHS Directive on the content of harmful substances. +38 (044) info@ictech.com.ua +38 (044)

34 MEDICAL EQUIPMENT 33

EXAMPLES OF PRINTED CIRCUIT BOARDS PROCESSOR PCB MRI device control unit PCB Stack-up - ID CESN5054/CCSN3017 - SM KSM-S6188 1 Foil Copper Foil - PP ITEQ IT180ABS 3313 RC58 2 - Core ITEQ IT180A Core

0,30mm H/H 7 - PP ITEQ IT180ABS 3313 RC58 8 Foil Copper Foil - SM KSM-S6188 - ID CESN5054/CCSN3017 0,025 0,015 0,018 0,100 0,018 0,300 0,018 0,100 0,085 0,018 0,210 0,018 0,085 0,100 0,035 0,300

material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 8 Board thickness 1,60 mm ±10% Single board dimensions 153,16 х 62,99 ±0,15 mm Warpage of board 0,15%

35 EXAMPLES OF PRINTED CIRCUIT BOARDS PROCESSOR PCB MRI device control unit PCB Stack-up - ID CESN5054/CCSN SM KSM-S Foil Copper Foil - PP ITEQ IT180ABS 3313 RC Core ITEQ IT180A Core 0,30mm H/H 3 - PP ITEQ IT180ABS 3313 RC58 - PP ITEQ IT180ABS 1080 RC Core ITEQ IT180A Core 0,21mm H/H 5 - PP ITEQ IT180ABS 1080 RC62 - PP ITEQ IT180ABS 3313 RC Core ITEQ IT180A Core 0,30mm H/H 7 - PP ITEQ IT180ABS 3313 RC58 8 Foil Copper Foil - SM KSM-S ID CESN5054/CCSN3017 0,025 0,015 0,018 0,100 0,018 0,300 0,018 0,100 0,085 0,018 0,210 0,018 0,085 0,100 0,035 0,300 0,035 0,100 0,018 0,015 0,025 0,025 0,015 0,092 0,300 0,095 0,081 0,210 0,081 0,095 0,300 0,092 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 8 Board thickness 1,60 mm ±10% Single board dimensions 153,16 х 62,99 ±0,15 mm Warpage of board 0,15% Finish copper thickness in outer layers 35 µм Finish copper thickness in inner layers 18 µм Number of holes 1103 Minimum through holes' diameter 0,25 mm Minimum copper thickness on through holes walls 24 µм Minimum track width 0,150 mm Minimum track spacing 0,105 mm Minimum SMD pads' size 0,150 mm Finish type ENIG - immersion gold Gold thickness 0,101 µм Nickel thickness in sublayer 3,49 µм Solder mask LPI KSM-S6188 green Panel dimensions 159,16 х 125,98 ±0,15 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 30 Thickness of web 0,40 mm The board complies with RoHS Directive on the content of harmful substances. Impedance control was not done. RIGID-FLEX PRINTED CIRCUIT BOARD Ultrasonic diagnostic device sensor PCB Stack-up 25,0 μm plating plating 18,0 μm copper layer 1 layer 1 copper 150,0 μm Core Core 100,0 μm prepreg silicone liner silicone liner prepreg 60,0 μm no flow PP coverlay PI coverlay PI 12,5 no flow PP coverlay adhesive coverlay adhesive 25,0 18,0 μm copper rigid layer 2 - flex layer 1 copper 18,0 25,0 μm Polyimide Polyimide 25,0 18,0 μm copper layer 3 silicone liner silicone liner copper 18,0 60,0 μm no flow PP no flow PP 100,0 μm prepreg prepreg 150,0 μm Core Core 18,0 μm copper layer 4 total flex thickness: 0,100 mm layer 4 copper 25,0 μm plating total rigid thickness: 0,800 mm plating TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material Polyimide/FR4, Part number of the material and manufacturer AP8515, DuPont, IT-158, ITEQ Number of layers in flex/rigid part 2/4 Board thickness in flex/rigid part 0,140/1,10 ± 0,10 mm Single board dimensions 157,00 х 50,00 ±0,10 mm Finish copper thickness in outer layers 38,6 µм Finish copper thickness in inner layers 18 µм Finished copper thickness in flex part 18 µм Number of holes 659 Minimum through holes' diameter 0,20 mm Minimum track width 0,100 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,220 mm Finish type ENIG - immersion gold Gold thickness 0,042 µм Nickel thickness in sublayer 3,54 µм Solder mask in rigid part KSM-S6189BK31, blue Solder mask in flex part CoverlayFR7013, colorless Panel dimensions 180,00 х 74,00 ± 0,20 mm Method of separating the board from the panel Routing Cutter diameter 2,00 mm +38 (044) info@ictech.com.ua +38 (044)

36 TELECOMMUNICATIONS AND CONNECTION 35

EXAMPLES OF PRINTED CIRCUIT BOARDS DIGITAL SIGNAL PROCESSING BOARD VoIP Input / Output Module PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0,015 1 Foil Copper Foil 0,012 - PP ITEQ

0,250 5 0,035 - PP ITEQ IT180ABC 2116 RC58 0,117 - PP ITEQ IT180ABC 2116 RC58 0,117 6 0,035 - Core ITEQ IT180A Core 0,21mm 1/1 0,210 7 0,035 - PP ITEQ IT180ABC 2116 RC58 0,117 8 Foil Copper Foil

37 EXAMPLES OF PRINTED CIRCUIT BOARDS DIGITAL SIGNAL PROCESSING BOARD VoIP Input / Output Module PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM HSR-200 GK01S 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABC 2116 RC58 0, ,035 - Core ITEQ IT180A Core 0,21mm 1/1 0, ,035 - PP ITEQ IT180ABC 2116 RC58 0,117 - PP ITEQ IT180ABC 2116 RC58 0, ,035 - Core ITEQ IT180A Core 0,25mm 1/1 0, ,035 - PP ITEQ IT180ABC 2116 RC58 0,117 - PP ITEQ IT180ABC 2116 RC58 0, ,035 - Core ITEQ IT180A Core 0,21mm 1/1 0, ,035 - PP ITEQ IT180ABC 2116 RC58 0,117 8 Foil Copper Foil 0,012 - SM HSR-200 GK01S 0,015 - ID CESN5054/CCSN3017 0,025 RF PCB Module of receiver microwave path μm no flow PP no flow PP rigid layer 2 - flex layer 1 silicone liner silicone liner no flow PP 0,025 0,015 0,108 0,210 0,108 0,108 0,250 0,105 0,105 0,210 0,108 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 8 Board thickness 1,60 mm ±10% Single board dimensions 178,31 х 126,39 ±0,15 mm Warpage of board 0,23% Finish copper thickness in outer layers 40 µм Finish copper thickness in inner layers 35 µм Number of holes 2622 Minimum through holes' diameter 0,25 mm Minimum copper thickness on through holes walls 20 µм Minimum track width 0,100 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,250 mm Finish type ENIG - immersion gold Gold thickness 0,062 µм Nickel thickness in sublayer 5,21 µм Finish type of edge connector Hard Gold Gold thickness 0,74 µм Nickel thickness in sublayer 5,39 µм Parameters of the slotted connector chamfer 30 х 0,80 mm Solder mask LPI HSR-200 GK01S green The board complies with RoHS Directive on the content of harmful substances. Impedance control was done on the board: outer layers and 100 Ω differential pairs line 100 µм, spacing 150 µм on layer L1, reference layer L2 line 100 µм, spacing 150 µм on layer L8, reference layer L7 inner layers 100 Ω differential pairs: line 100 µм, spacing 100 µм on layer L3, reference layers L2 and L4 On this PCB we applied the technology of vias filling with subsequent alignment and metallization of the surface, in accordance with standard IPC-4761, type VII: TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer PTFE, AD255C от Arlon Permittivity of the material and losses in it (10GHz) 2,55/0,0018 Number of layers 2 Board thickness 1,60 ±0,10 mm Single board dimensions 186,00 х 96,00 ±0,20 mm Warpage of board 0,45% Finish copper thickness 52 µм Surface finish type and thickness HASL (Sn63/Pb37), 6,70 µм Number of holes 742 Minimum through holes' diameter 1,00 mm Minimum copper thickness on through holes walls 24 µм +38 (044) info@ictech.com.ua +38 (044)

38 AEROSPACE INDUSTRY 37

EXAMPLES OF PRINTED CIRCUIT BOARDS PCB OF SIGNAL PROCESSING MODULE The block of multichannel high-frequency ADC PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil

IT180A Core 0,21mm H/H 0,210 5 0,018 - PP ITEQ IT180ABC 2116 RC58 0,120 - PP ITEQ IT180ABS 3313 RC58 0,090 6 0,035 - Core ITEQ IT180A Core 0,21mm 1/1 0,210 7 0,035 - PP ITEQ IT180ABS 3313 RC58 0,090

0,21mm H/H 0,210 11 0,018 - PP ITEQ IT180ABC 2116 RC58 0,120 12 Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 RF PCB Antenna array element 0,108 0,210 0,077 0,108 0,210

39 EXAMPLES OF PRINTED CIRCUIT BOARDS PCB OF SIGNAL PROCESSING MODULE The block of multichannel high-frequency ADC PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABC 2116 RC58 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABC 2116 RC58 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABC 2116 RC58 0,120 - PP ITEQ IT180ABS 3313 RC58 0, ,035 - Core ITEQ IT180A Core 0,21mm 1/1 0, ,035 - PP ITEQ IT180ABS 3313 RC58 0,090 - PP ITEQ IT180ABC 2116 RC58 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABC 2116 RC58 0,120 - PP ITEQ IT180ABS 1080 RC62 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABC 2116 RC58 0, Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 RF PCB Antenna array element 0,108 0,210 0,077 0,108 0,210 0,108 0,081 0,210 0,072 0,096 0,210 0,108 0,008 0,210 0,108 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 3rd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 12 Board thickness 2,25 mm ±10% Single board dimensions 230,00 х 190,00 ±0,10 mm Warpage of board 0,29% Finish copper thickness in outer layers 40 µм Finish copper thickness in inner layers 35 µм and 18 µм Number of holes 3126 Minimum through holes' diameter 0,25 mm Minimum copper thickness on through holes walls 29 µм Minimum track width 0,100 mm Minimum track spacing 0,115 mm Minimum SMD pads' size 0,250 mm Finish type ENIG - immersion gold Gold / nickel thickness 0,067 / 4,52 µм Solder mask LPI LP-4G/G-05A blue The board complies with RoHS Directive on the content of harmful substances. Impedance control was done on the board: Outer layers 50 Ω microstrip line: microstrip width 0,175 mm on layers L1/L12, reference layers L2/L Ω differential pairs: line 100 µм, spacing 145 µм on layers L3, reference layers L2 and L4 Inner layers 50 Ω strip lines: strip width 165 µм on layers L3, reference layers L2 and L4 strip width 172 µм on layers L5, reference layers L4 and L6 strip width 172 µм on layers L8, reference layers L7 and L9 strip width 165 µм on layers L10, reference layers L9 and L Ω differential pairs: line 120 µм, spacing 175 µм on layers L3, reference layers L2 and L4 line 125 µм, spacing 170 µм on layers L5, reference layers L4 and L6 line 125 µм, spacing 170 µм on layers L8, reference layers L7 and L9 line 120 µм, spacing 175 µм on layers L10, reference layers L9 and L11 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FLAN-2,8 Material permittivity (10 GHz) 2,8 ±2% Number of layers 2 Board thickness 4,00 ±0,10 mm Board dimensions 85,00 х 85,00 ±0,20 mm Finish copper thickness 36 µм Finish type Immersion Silver Surface finish thickness 0,21 µм Minimum through holes' diameter 1,20 mm The PCB has blind, non-plated holes: diameter 5,00 mm depth 1,50 mm +38 (044) info@ictech.com.ua +38 (044)

40 ENERGY INDUSTRY 39

EXAMPLES OF PRINTED CIRCUIT BOARDS MEZZANINE BOARD Module of Digital Control Unit PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 106 RC68

IT180ABC 2116 RC55 0,105 6 0,035 - Core ITEQ IT180A Core 0,10mm 1/1 0,100 7 0,035 - PP ITEQ IT180ABC 2116 RC55 0,105 8 0,018 - Core ITEQ IT180A Core 0,21mm H/H 0,210 9 0,018 - PP ITEQ IT180ABS 1080

0,015 0,060 0,078 0,210 0,095 0,100 0,100 0,100 0,095 0,210 0,078 0,060 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and

41 EXAMPLES OF PRINTED CIRCUIT BOARDS MEZZANINE BOARD Module of Digital Control Unit PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 106 RC68 0,065 - PP ITEQ IT180ABS 1080 RC62 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABC 2116 RC55 0, ,035 - Core ITEQ IT180A Core 0,10mm 1/1 0, ,035 - PP ITEQ IT180ABC 2116 RC55 0, ,035 - Core ITEQ IT180A Core 0,10mm 1/1 0, ,035 - PP ITEQ IT180ABC 2116 RC55 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 106 RC68 0, Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 MEASURING DEVICE PCB Measuring device for high-voltage insulation 0,025 0,015 0,060 0,078 0,210 0,095 0,100 0,100 0,100 0,095 0,210 0,078 0,060 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer FR-4 High Tg, IT-180A, ITEQ Number of layers 10 Board thickness 1,45 mm ±10% Single board dimensions 55,00 х 38,00 ±0,20 mm Warpage of board 0,30% Finish copper thickness in outer layers 39 µм Finish copper thickness in inner layers 35 µм and 18 µм Number of holes 2110 Minimum through holes' diameter 0,20 mm Minimum amount of copper on through holes walls 26 µм Minimum hidden holes' diameter 0,110 mm Minimum track spacing 0,090 mm Minimum SMD pads' size 0,350 mm Finish type ENIG - immersion gold Gold thickness 0,063 µм Nickel thickness in sublayer 4,242 µм Solder mask LPI LP-4G/G-05A green Peelable mask blue Panel dimensions 65,00 х 78,00 ±0,15 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 30 Thickness of web 0,40 mm Cutter diameter 2,00 mm The board complies with RoHS Directive on the content of harmful substances. Impedance control was done on the board: Inner layers 100 Ω differential pairs: line 105 µм, spacing 135 µм on layer L3, reference layers L2 and L5 line 105 µм, spacing 135 µм on layer L8, reference layers L6 and L9 90 Ω differential pairs: line 120 µм, spacing 105 µм on layer L3, reference layers L2 and L5 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer FR-4, S1141, Shengyi Number of layers 2 Board thickness 1,60 ± 0,10 mm Single board dimensions 167,64 х 208,28 ±0,20 mm Finish copper thickness in outer layers 40 µм Number of holes 705 Minimum through holes' diameter 0,50 mm Minimum copper thickness on through holes walls 24 µм Minimum track width 0,250 mm Minimum track spacing 0,230 mm Minimum SMD pads' size 0,380 mm Finish type HASL (Sn63/Pb37) Surface finish thickness 7,06 µм Solder mask LPI LP-4G/G-05A red +38 (044) info@ictech.com.ua +38 (044)

42 GUARDING AND SECURITY 41

EXAMPLES OF PRINTED CIRCUIT BOARDS COMMUNICATION UNIT BOARD GSM gateway of security signaling PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 -

Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 GROUP PANEL OF SENSOR BOARDS Fire alarm sensor 0,090 0,090 0,450 0,090 0,090 0,015 0,025 TECHNICAL SPECIFICATIONS:

73,70 х 29,00 ±0,10 mm Warpage of board 0,11% Finish copper thickness in outer layers 45 µм Finish copper thickness in inner layers 18 µм Number of holes 468 Minimum through holes' diameter 0,20 mm

43 EXAMPLES OF PRINTED CIRCUIT BOARDS COMMUNICATION UNIT BOARD GSM gateway of security signaling PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 3313 RC58 0,100 - PP ITEQ IT180ABS 3313 RC58 0, ,018 - Core ITEQ IT180A Core 0,45mm H/H 0, ,018 - PP ITEQ IT180ABS 3313 RC58 0,100 - PP ITEQ IT180ABS 3313 RC58 0,100 4 Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 GROUP PANEL OF SENSOR BOARDS Fire alarm sensor 0,090 0,090 0,450 0,090 0,090 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 3rd Type of material, PN and manufacturer FR-4 High Tg, IT-180A, ITEQ Number of layers 4 Board thickness 1,00 ±0,10mm Single board dimensions 73,70 х 29,00 ±0,10 mm Warpage of board 0,11% Finish copper thickness in outer layers 45 µм Finish copper thickness in inner layers 18 µм Number of holes 468 Minimum through holes' diameter 0,20 mm Number of half-holes on each side Plated half-holes' diameter 0,80 mm Minimum copper thickness on through holes walls 31 µм Minimum track width 0,080 mm Minimum track spacing 0,090 mm Minimum SMD pads' size 0,260 mm Finish type ENIG - immersion gold Gold thickness 0,062 µм Nickel thickness in sublayer 4,58 µм Solder mask LPI LP-4G/G-05A green Panel dimensions 89,70 х 60,00 ±0,10 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 20 Thickness of web 0,42 mm Cutter diameter 2,00 mm TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FR-4 Part number of the material and manufacturer KB-6150, Kingboard Laminates Number of layers 2 Board thickness 1,10 ± 0,10 mm Single board dimensions 57,00 х 51,00 ±0,20 mm Warpage of board 0,30% Finish copper thickness in outer layers 59 µм Number of holes 1680 Minimum through holes' diameter 0,30 mm Minimum copper thickness on through holes walls 22,6 µм Minimum track width 0,200 mm Minimum track spacing 0,200 mm Minimum SMD pads' size 0,650 mm Finish type Lead-free HASL Surface finish thickness 5,63 µм Solder mask LPI LP-4G/G-05A black Panel dimensions 285,00 х 212,00 ±0,15 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 30 Thickness of web 0,40 mm Cutter diameter 2,00 mm +38 (044) info@ictech.com.ua +38 (044)

44 INDUSTRIAL ELECTRONICS 43

EXAMPLES OF PRINTED CIRCUIT BOARDS SENSOR SIGNALS PROCESSING PCB NC machine PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,018 - PP ITEQ IT180ABS 3313 RC58

0,30mm 1/1 0,300 5 0,035 - PP ITEQ IT180ABS 7628 RC45 0,180 - PP ITEQ IT180ABS 3313 RC58 0,100 6 Foil Copper Foil 0,018 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 0,025 0,015 0,090 0,162

Number of layers 6 Board thickness 1,60 mm ±10% Single board dimensions 260,00 х 115,00 ±0,10 mm Warpage of board 0,24% Finish copper thickness in outer layers 41 µм Finish copper thickness in inner

pads' size 0,245 mm Finish type ENIG - immersion gold Gold thickness 0,062 µм Nickel thickness in sublayer 4,35 µм Solder mask LPI LP-4G/G-05A green The board complies with RoHS Directive on the

CONTROL PCB Drive gear of milling NC machine TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G Type of material Part number of the material and manufacturer 3rd FR-4 High

45 EXAMPLES OF PRINTED CIRCUIT BOARDS SENSOR SIGNALS PROCESSING PCB NC machine PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,018 - PP ITEQ IT180ABS 3313 RC58 0,100 - PP ITEQ IT180ABS 7628 RC45 0, ,035 - Core ITEQ IT180A Core 0,30mm 1/1 0, ,035 - PP ITEQ IT180ABS 3313 RC58 0,100 - PP ITEQ IT180ABS 1080 RC62 0, ,035 - Core ITEQ IT180A Core 0,30mm 1/1 0, ,035 - PP ITEQ IT180ABS 7628 RC45 0,180 - PP ITEQ IT180ABS 3313 RC58 0,100 6 Foil Copper Foil 0,018 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 0,025 0,015 0,090 0,162 0,300 0,900 0,077 0,300 0,162 0,090 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer FR-4 High Tg, IT-180A, ITEQ Number of layers 6 Board thickness 1,60 mm ±10% Single board dimensions 260,00 х 115,00 ±0,10 mm Warpage of board 0,24% Finish copper thickness in outer layers 41 µм Finish copper thickness in inner layers 35 µм Number of holes 3340 Minimum through holes' diameter 0,20 mm Minimum copper thickness on through holes walls 23 µм Minimum track width 0,090 mm Minimum track spacing 0,105 mm Minimum SMD pads' size 0,245 mm Finish type ENIG - immersion gold Gold thickness 0,062 µм Nickel thickness in sublayer 4,35 µм Solder mask LPI LP-4G/G-05A green The board complies with RoHS Directive on the content of harmful substances. CONTROL PCB Drive gear of milling NC machine TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G Type of material Part number of the material and manufacturer 3rd FR-4 High Tg IT-180A, ITEQ Number of layers 10 Board thickness 1,60 mm ±10% Single board dimensions 233,35 х 221,00 ±0,20 mm Warpage of board 0,23% Finish copper thickness in outer layers 50 µм Finish copper thickness in inner layers 35 µм Number of holes 2180 Minimum through holes' diameter 0,25 mm PCB Stack-up - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,018 - PP ITEQ IT180ABS 3313 RC58 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/1 0, ,035 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 1080 RC62 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/1 0, ,035 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 1080 RC62 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/1 0, ,035 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 1080 RC62 0, ,035 - Core ITEQ IT180A Core 0,15mm 1/1 0, ,035 - PP ITEQ IT180ABS 3313 RC58 0, Foil Copper Foil 0,018 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 0,025 0,015 0,090 0,150 0,077 0,077 0,150 0,068 0,068 0,150 0,077 0,077 0,150 0,090 0,015 0,025 Minimum copper thickness on through holes walls 30 µм Minimum track width 0,150 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,300 mm Finish type ENIG - immersion gold Gold thickness 0,056 µм Nickel thickness in sublayer 3,15 µм Solder mask LPI LP-4G/G-05A green The board complies with RoHS Directive on the content of harmful substances. Impedance control was not done. On this PCB we applied the technology of vias filling with subsequent alignment and metallization of the surface, in accordance with standard IPC-4761, type VII: +38 (044) info@ictech.com.ua +38 (044)

46 AUTOMOTIVE INDUSTRY 45

EXAMPLES OF PRINTED CIRCUIT BOARDS MOTHERBOARD Onboard multimedia system PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 1086

0,018 - Core ITEQ IT180A Core 0,21mm H/H 0,210 6 0,018 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 106 RC68 0,065 7 0,018 - Core ITEQ IT180A Core 0,21mm H/H 0,210 8 0,018 - PP ITEQ IT180ABC

controller of the vehicle - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 7628 RC45 0,130 - PP ITEQ IT180ABS 7628 RC45 0,130 2 0,035 - Core ITEQ IT180A

0,059 0,077 0,210 0,068 0,052 0,210 0,108 0,081 0,015 0,025 PCB Stack-up 0,025 0,015 0,166 0,166 1,100 0,166 0,166 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to

Warpage of board 0,21% Finish copper thickness in outer layers 40 µм Finish copper thickness in inner layers 35 µм and 18 µм Number of holes 9694 Minimum through holes' diameter 0,50 mm Minimum

copper on blind holes walls 18 µм Minimum track width 0,120 mm Minimum track spacing 0,105 mm Minimum SMD pads' size 0,210 mm Finish type ENIG - immersion gold Gold thickness 0,064 µм Nickel

47 EXAMPLES OF PRINTED CIRCUIT BOARDS MOTHERBOARD Onboard multimedia system PCB Stack-up 0,025 0,015 - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 1086 RC61 0,090 2 Foil Copper Foil 0,012 - PP ITEQ IT180ABC 2116 RC58 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABS 106 RC68 0,065 - PP ITEQ IT180ABS 1080 RC62 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABS 1080 RC62 0,085 - PP ITEQ IT180ABS 106 RC68 0, ,018 - Core ITEQ IT180A Core 0,21mm H/H 0, ,018 - PP ITEQ IT180ABC 2116 RC58 0,120 9 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 1086 RC61 0, Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 BOARD OF CONTROL UNIT Onboard electronics controller of the vehicle - ID CESN5054/CCSN3017 0,025 - SM LP-4G/G-05A 0,015 1 Foil Copper Foil 0,012 - PP ITEQ IT180ABS 7628 RC45 0,130 - PP ITEQ IT180ABS 7628 RC45 0, ,035 - Core ITEQ IT180A Core 1,10mm 1/1 1, ,035 - PP ITEQ IT180ABS 7628 RC45 0,130 - PP ITEQ IT180ABS 7628 RC45 0,130 4 Foil Copper Foil 0,012 - SM LP-4G/G-05A 0,015 - ID CESN5054/CCSN3017 0,025 0,077 0,102 0,210 0,059 0,077 0,210 0,068 0,052 0,210 0,108 0,081 0,015 0,025 PCB Stack-up 0,025 0,015 0,166 0,166 1,100 0,166 0,166 0,015 0,025 TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 10 Board thickness 1,50 mm ±10% Single board dimensions 90,00 х 52,00 ±0,20 mm Warpage of board 0,21% Finish copper thickness in outer layers 40 µм Finish copper thickness in inner layers 35 µм and 18 µм Number of holes 9694 Minimum through holes' diameter 0,50 mm Minimum amount of copper on through holes walls 24 µм Minimum hidden holes' diameter 0,20 mm Minimum amount of copper on hidden holes walls 20 µм Minimum blind holes' diameter 0,10 mm Minimum amount of copper on blind holes walls 18 µм Minimum track width 0,120 mm Minimum track spacing 0,105 mm Minimum SMD pads' size 0,210 mm Finish type ENIG - immersion gold Gold thickness 0,064 µм Nickel thickness in sublayer 4,053 µм Solder mask LPI LP-4G/G-05A green TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material FR-4 High Tg Part number of the material and manufacturer IT-180A, ITEQ Number of layers 4 Board thickness 2,00 mm ±10% Single board dimensions 149,20 х 81,95 ±0,20 mm Warpage of board 0,25% Finish copper thickness in outer layers 45 µм Finish copper thickness in inner layers 35 µм Number of holes 2014 Minimum through holes' diameter 0,40 mm Minimum copper thickness on through holes walls 28 µм Minimum track width 0,200 mm Minimum track spacing 0,170 mm Minimum SMD pads' size 0,250 mm Finish type Sn63Pb37 HASL Surface finish thickness 2,261 µм Solder mask LPI LP-4G/G-05A green Panel dimensions 159,20 х 165,90 ±0,20 mm Method of separating the board from the panel VCUT+Routing V-CUT angle 30 Thickness of web 0,52 mm Cutter diameter 2,00 mm The board complies with RoHS Directive on the content of harmful substances. +38 (044) info@ictech.com.ua +38 (044)

48 OPTICAL ELECTRONIC SYSTEMS 47

EXAMPLES OF PRINTED CIRCUIT BOARDS TWO-LAYER FLEX PRINTED CIRCUIT Switching subsystem of optical head drives PCB Stack-up stiffener (PI) 127um 127,0 μm Adhesive 40um 40,0 μm 12,5 μm coverlay PI 12,5

25,0 μm coverlay adhesive 12,5 μm coverlay PI 50,0 μm 3M 9460PC 150,0 μm stiffener (FR-4) MULTILAYER RIGID-FLEX PCB WEB camera PCB Stack-up 25,0 μm plating plating 18,0 μm copper layer 1 layer 1

49 EXAMPLES OF PRINTED CIRCUIT BOARDS TWO-LAYER FLEX PRINTED CIRCUIT Switching subsystem of optical head drives PCB Stack-up stiffener (PI) 127um 127,0 μm Adhesive 40um 40,0 μm 12,5 μm coverlay PI 12,5 μm 25,0 μm coverlay adhesive 25,0 μm 35,0 μm copper layer1 0,313 mm 35,0 μm 13,0 μm adhesive 13,0 μm 12,5 μm Polyimide 0,184 mm 12,5 μm 13,0 μm adhesive 0,384 mm 13,0 μm 35,0 μm copper layer2 35,0 μm 25,0 μm coverlay adhesive 12,5 μm coverlay PI 50,0 μm 3M 9460PC 150,0 μm stiffener (FR-4) MULTILAYER RIGID-FLEX PCB WEB camera PCB Stack-up 25,0 μm plating plating 18,0 μm copper layer 1 layer 1 copper 50,0 μm Core Core silicone liner silicone liner 50,0 μm no flow PP coverlay PI coverlay PI no flow PP 12,5 coverlay adhesive coverlay adhesive 25,0 18,0 μm copper rigid layer 2 - flex layer 1 copper 18,0 12,5 μm coverlay adhesive 12,5 50,0 μm Polyimide Polyimide 50,0 12,5 μm coverlay adhesive 12,5 18,0 μm copper rigid layer 3 - flex layer 2 copper 18,0 coverlay adhesive coverlay adhesive 25,0 50,0 μm no flow PP coverlay PI coverlay PI no flow PP 12,5 silicone liner silicone liner 410,0 μm Core Core 18,0 μm copper layer 4 layer 4 copper 100,0 μm prepreg total flex thickness:0,20 mm prepreg 18,0 μm copper layer 5 total rigid thickness:1,00 mm layer 5 copper 100,0 μm Core Core 18,0 μm copper layer 6 layer 6 copper 25,0 μm plating plating TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material Polyimide Part number of the material and manufacturer SFH640-2, Shengyi Number of layers 2 Board thickness in flex/rigid/connector part 0,20/0,40/0,30 ± 0,10 mm Single board dimensions 50,00 х 67,00 ±0,20 mm Finish copper thickness in outer layers 33,4 µм Number of holes 12 Minimum through holes' diameter 2,00 mm Minimum track width 0,500 mm Minimum track spacing 0,200 mm Minimum SMD pads' size 0,680 mm Finish type Flash Gold galvanic gold Gold thickness 0,042 µм Nickel thickness in sublayer 4,42 µм Finish type of connector Hard Gold galvanic gold Gold thickness 2,41 µм Nickel thickness in sublayer 4,46 µм Solder mask Coverlay SF302C, colorless Panel dimensions 182,00 х 157,00 ± 0,20 mm Method of separating the board from the panel Routing Cutter diameter 1,60 mm TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Part number of the material and manufacturer FR7092R, Dupont DURAVER B-DE 117, Isola Number of layers in flex/rigid part 2/6 Board thickness flex/rigid part 0,18/1,00 ± 0,10 mm Single board dimensions 32,50 х 21,60 ±0,10 mm Finish copper thickness in outer layers 38,6 µм Finish copper thickness in inner layers 18 µм Finished copper thickness in flex part 18 µм Number of holes 2580 Minimum through holes' diameter 0,20 mm Minimum track width 0,100 mm Minimum track spacing 0,100 mm Minimum SMD pads' size 0,180 mm Finish type ENIG - immersion gold Gold / nickel thickness 0,057 / 4,58 µм Solder mask in rigid part KSM-S6189BK31, blue Solder mask in flex part Coverlay FR7013, colorless Panel dimensions 118,20 х 97,80 ± 0,20 mm Method of separating the board from the panel Routing Impedance control was done on the board: outer layers 50 Ω microstrip line: microstrip width 0,100 mm on layers L1/L6, reference layers L2/L5 90 Ом differential pairs: line 150 µм, spacing 150 µм on layers L1/L6, reference layers L2/L5 100 Ω differential pairs: line 120 µм, spacing 160 µм on layers L1/L6, reference layers L2/L5 In flex part 100 Ω differential pairs: line 110 µм, spacing 160 µм on layers FL2 (L3), reference layers FL1 (L2) +38 (044) info@ictech.com.ua +38 (044)

50 LED TECHNOLOGIES 49

EXAMPLES OF PRINTED CIRCUIT BOARDS Institute of Computer Technologies offers comprehensive solutions for manufacturers of LED lighting equipment.

Electronic components assembly and wiring of crystals on a printed circuit board IKT engineers provide advice in the following areas: Selection of LEDs based on a product s

Recommendations on the size and shape of a product s enclosure, based on thermal operating conditions LIGHTING MODULE BOARD Round LED lamp LIGHTING MODULE BOARD LED lamp of

Number of layers 1 Board thickness 1,50 ± 10% Single board dimensions Ø 22,90 ± 0,20 mm Dielectric thickness 0,075 ± 10% Finish copper thickness in outer layers 70 µм Number

Surface finish thickness 4,26 µм Solder mask LPI LP-4G/G-05A white TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and

80 ± 10% Single board dimensions 85,00 x 324,00 ± 0,40 mm Dielectric thickness 0,10 ± 10% Minimum through holes' diameter 3,50 mm Minimum track width 0,600 mm Minimum track

51 EXAMPLES OF PRINTED CIRCUIT BOARDS Institute of Computer Technologies offers comprehensive solutions for manufacturers of LED lighting equipment. List of IKT services for lighting equipment manufacturers: Design of LED lighting solutions Supply of printed circuit boards, LEDs, electronic components and power sources Electronic components assembly and wiring of crystals on a printed circuit board IKT engineers provide advice in the following areas: Selection of LEDs based on a product s parameters Selection of current sources based on a product s parameters Printed circuit board topology design Calculation of thermal parameters of product s operation Recommendations on the size and shape of a product s enclosure, based on thermal operating conditions LIGHTING MODULE BOARD Round LED lamp LIGHTING MODULE BOARD LED lamp of complex geometric shape TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer Aluminum core, VT-44A, Ventec Number of layers 1 Board thickness 1,50 ± 10% Single board dimensions Ø 22,90 ± 0,20 mm Dielectric thickness 0,075 ± 10% Finish copper thickness in outer layers 70 µм Number of holes 144 Minimum through holes' diameter 1,20 mm Minimum track width 0,500 mm Minimum track spacing 0,500 mm Minimum SMD pads' size 0,800 mm Finish type Lead-free HASL Surface finish thickness 4,26 µм Solder mask LPI LP-4G/G-05A white TECHNICAL SPECIFICATIONS: Functional reliability class according to IPC-A-600G 2nd Type of material, PN and manufacturer Aluminum core VT-44A, Ventec Number of layers 1 Board thickness 1.80 ± 10% Single board dimensions 85,00 x 324,00 ± 0,40 mm Dielectric thickness 0,10 ± 10% Minimum through holes' diameter 3,50 mm Minimum track width 0,600 mm Minimum track spacing 0,600 mm Minimum SMD pads' size 0,500 mm Finish type ENIG - immersion gold Solder mask LPI LP-4G/G-05A white Panel dimensions 220,00 x 337,00 ±0,40 mm Please, contact IKT specialists for more information on comprehensive solutions for LED lighting. +38 (044) info@ictech.com.ua +38 (044)

HISTORY OF THE SEMINARS HELD BY IKT September 20, 2016 Location - Kharkiv, Premier Palace Conference Hall Topic of the

Design of multilayer printed circuit boards with high-speed digital interfaces» July 11, 2016 Location - Kirovograd,

development and manufacture of electronic devices» October 12, 2015 Location - Kiev, conference hall «Rus Accord Hotel»

on printed circuit boards» June 15, 2015 Location - Kiev, conference hall «Rus Accord Hotel» Topic of the seminar:

Ways to reduce the cost of electronic products with ensuring their quality and reliability» November 17, 2014 Location -

printed circuit boards with components in BGA package.

52 HISTORY OF THE SEMINARS HELD BY IKT September 20, 2016 Location - Kharkiv, Premier Palace Conference Hall Topic of the seminar: «Features of design creating of complex multilayer printed boards with the use of components in BGA packages. Design of multilayer printed circuit boards with high-speed digital interfaces» July 11, 2016 Location - Kirovograd, PrJSC RPC «Radiy» Topic of the seminar: «Practical aspects of PCB design and the use of IPC standards on stages of development and manufacture of electronic devices» October 12, 2015 Location - Kiev, conference hall «Rus Accord Hotel» Topic of the seminar: «Application of IPC standards throughout the chain of design and production of electronic devices on printed circuit boards» June 15, 2015 Location - Kiev, conference hall «Rus Accord Hotel» Topic of the seminar: «Modern technologies of PCB production. Ways to reduce the cost of electronic products with ensuring their quality and reliability» November 17, 2014 Location - Kiev, conference hall «Rus Accord Hotel» Topic of the seminar: «Features of creation of the design of complex multilayer printed circuit boards with components in BGA package. Design of multilayer printed circuit boards with high-speed digital interfaces» October 16, 2013 Location - Kiev, «Ibis Kiev Shevchenko Boulevard» Topic of the seminar: «Practical aspects of PCB design. Ensuring quality and reliability. Design and manufacture of flexi-rigid PCBs» 51

53 IKT SEMINARS Institute of Computer Technologies invites developers and manufacturers of electronics to visit specialized seminars on design and manufacture of printed circuit boards. IKT engineers are ready to share practical experience in the following areas: Modern standards on design and manufacture of printed circuit boards. Ensuring the quality of printed circuit boards and reliability of electronic units at all stages of production. Technological features and limitations in design of printed circuit boards, application of DFM (Design for Manufacturing) and DFA (Design for Assembling) concepts. Efficient use of modern technologies in design of multilayer PCBs with packages QFN, BGA, LCC, etc. Features of design of PCBs with high-density interconnections. Typical solutions for HDI-designs creation. Design of complex PCBs for high-speed equipment. Creation of DDR memory topology, ensuring operability of HyperTransport, FireWire, i.link, mlan, USB 3.0, PCI Express, DVI, Serial ATA, SAS, RapidIO and other interfaces. Design of printed circuit boards on microwave materials. Specificity of RF materials application in PCB design. Design of flexible printed circuit boards and loops. Rigid-flex boards design - technological limitations and features of materials. Design of printed circuit boards for lighting, power modules and drivers. Solutions for increase of load capacity and thermal conductivity of boards. Modern means of modeling parameters and operating modes of printed circuit boards. Format of IKT seminars: The educational part that includes handouts prepared by IKT specialists or invited foreign experts. Exhibition of technical solutions with samples of printed circuit boards, on examples of which capabilities of modern manufacturers and new technological solutions are demonstrated. Technical advice on design, manufacture and PCB supply issues of seminar visitors current projects. Communication platform between developers, where you can find new business partners, exchange professional experience with colleagues. Innovative technologies, experience and practical examples of our developments is unique material for design engineers to ensure quality and reliability of printed circuit boards, beginning with the design phase. Engineering department of IKT is ready to prepare and conduct on-site seminars on enterprises of customers. To have an on-site seminar at your enterprise, please, send the application in electronic format with indication of the desired topic of the seminar to the address: info@ictech.com.ua. Please, follow the seminars schedule and register to participate on the website (044) info@ictech.com.ua +38 (044)

MODULE 15F6UVMEV2P - 6U / 4HP / HybridVME Function purpose: DSP+ADC Analog Input: ADC / 12-bit / 40MSPS / 50 Ohm DSP resources: FPGA-4х Xilinx Virtex II Pro / XC2VP30 +

Ethernet 100BASE-TX SerDes HD SDI / Coax 75Ohm / 3Gbps RS422 / RS485 Flash memory: NOR / BPI / х16 / 8MB Power supply: ±5V / +3.

.85 С MODULE 09F6UVPXAK7DSP - 6U / 4HP / HybridVPX Function purpose: DSP+ADC Analog Input: 24 x ADC / 12bit / 65MSPS / 50 Ohm DSP resources: FPGA Xilinx Kintex 7 /

54 MODULE 15F6UVMEV2P - 6U / 4HP / HybridVME Function purpose: DSP+ADC Analog Input: ADC / 12-bit / 40MSPS / 50 Ohm DSP resources: FPGA-4х Xilinx Virtex II Pro / XC2VP хZBTSRAM / х36 / 36Mb / 200MHz + 4xSDRAM / x64 / 64Mb / 133MHz DSP ADSP21062 / 160MHz / 1800MIPS I/O resources: CPU PowerPC PPC405GPr + SDRAM / x32 / 512KB / 143MHz Ethernet 100BASE-TX SerDes HD SDI / Coax 75Ohm / 3Gbps RS422 / RS485 Flash memory: NOR / BPI / х16 / 8MB Power supply: ±5V / +3.3V Cooling: convective Operating temperature: С MODULE 09F6UVPXAK7DSP - 6U / 4HP / HybridVPX Function purpose: DSP+ADC Analog Input: 24 x ADC / 12bit / 65MSPS / 50 Ohm DSP resources: FPGA Xilinx Kintex 7 / XC7K325T + 2 x DDR3 SDRAM / x16 / 1Gb / 800MHz DSP TMS320C6672 / 1.25GHz / 80 GMAC / 1.2GHz + 4 x DDR3 SDRAM / x16 / 1Gb / 1333MHz I/O resources: 2 x Ethernet 1000BASE-TX 4 x LVDS 650 Mbps 3 x RS422 / RS485 Flash memory: NOR / BPI / x16 / 128MB Power supply: +5V Cooling: convective Operating temperature: С 53

55 CONTRACT DEVELOPMENT OF ELECTRONICS Institute of Computer Technologies provides services on contract development of electronic modules, PCBs and mezzanines, as well as complex system solutions for commercial and industrial applications. IKT specialization: Digital signal processing systems based on DSP processors and FPGA Analog-to-digital and digital-to-analog conversion systems Embedded systems based on SoC and SoM processors for various applications Computer systems for industrial use according to specifications: ANSI/VITA 46.x - VPX Base Standard ANSI/VITA 65 - OpenVPX PICMG 2.x - CompactPCI CPCI-S.0 - CompactPCI Serial AMC.x - Advanced MC Mezzanine, PCI Express, Ethernet and Storage ANSI/VITA FPGA Mezzanine Card (FMC) Advantages of cooperation with IKT: Highly efficient development process Big experience of the company in the field of development Application of proven technology solutions Technologies: Mathematical methods and means of tasks solutions justification Simulation and functional modeling Heat generation and electromagnetic interference modeling Cross-cutting complex design in modern CAD / CAM systems Optimization by specified criteria: cost, productivity, reliability Development Cycle: Development of system architecture, structure of individual unites and blocks, choice of elemental base, development of electrical schematic diagram, PCB layout Development of projects for FPGA in standardized hardware description languages VHDL Development of complete software package: software for specialized processors, technological software for testing of module, drivers and software for computers Production of a prototype, preparation and release of design and software documentation At the end of the development process, customer receives exclusive rights of ownership, transfer to third parties, change and modernization of the project, replication and commercial distribution of the product, unless otherwise specified in the contract. Contact IKT specialists for more information on contract development of electronics. +38 (044) info@ictech.com.ua +38 (044)

MODULE 03F3UVPXS6VPLM - 3U / 4HP / VPX Function purpose: Video processing DSP resources: FPGA Spartan-6 / 75T / 100T / 150T + SDRAM / х16 / 256Mb / DDR2-667 DSP

/ Coax 75Ohm / 3Gbps VGA / 10-bit DAC RS422 LVDS GPIO Flash memory: NOR / BPI / х16 / 32MB Power supply: +5V Cooling: convective / conductive Operating temperature: -40.

166MHz + 2x SDRAM / x32 / 512KB / 143MHz I/O resources: FPGA Virtex-2Pro / P20 + 4x SDRAM / x32 / 512KB / 143MHz CPU PowerPC PPC405GPr + SDRAM / x32 / 512KB / 143MHz PCI

56 MODULE 03F3UVPXS6VPLM - 3U / 4HP / VPX Function purpose: Video processing DSP resources: FPGA Spartan-6 / 75T / 100T / 150T + SDRAM / х16 / 256Mb / DDR2-667 DSP TMS320DM SDRAM / х32 / 512MB / DDR2-667 (TMS320C667x+SDRAM/x32/512MB/DDR3-1333) I/O resources: PCI Express / х1 / Gen1 (5-Slot Full-Mesh P2P) 2x SerDes HD / SD SDI / Coax 75Ohm / 3Gbps VGA / 10-bit DAC RS422 LVDS GPIO Flash memory: NOR / BPI / х16 / 32MB Power supply: +5V Cooling: convective / conductive Operating temperature: С MODULE 04F6UCPCIV2PPLM - 6U / 4HP / CompactPCI Function purpose: Multichannel digital filter DSP resources: FPGA 3x Virtex-2 / х ZBT SRAM / х36 / 128KB / 166MHz + 2x SDRAM / x32 / 512KB / 143MHz I/O resources: FPGA Virtex-2Pro / P20 + 4x SDRAM / x32 / 512KB / 143MHz CPU PowerPC PPC405GPr + SDRAM / x32 / 512KB / 143MHz PCI / х32 / 66 MHz Ethernet 100BASE-TX RS422 / RS485 Flash memory: NAND / х8 / 128MB Power supply: ±5V / +3.3V Cooling: convective Operating temperature: С 55

EXAMPLES OF CONTRACT DEVELOPMENT OF ELECTRONICS MODULE 01F3UCPCIV4PLM - 3U / 4HP / CompactPCI Function purpose: DSP+ADC Analog Input: 2 х ADC / 14bit / 210MSP S / 50 Ohm DSP resources: FPGA Virtex-4

Ethernet 100BASE-TX SerDes / 25m / UTP CAT5e / 1.5 Gbps RS422 / RS485 Flash memory: NOR / BPI / х16 / 8MB Power supply: ±5V / +3.3V Cooling: convective Operating temperature: -40.

57 EXAMPLES OF CONTRACT DEVELOPMENT OF ELECTRONICS MODULE 01F3UCPCIV4PLM - 3U / 4HP / CompactPCI Function purpose: DSP+ADC Analog Input: 2 х ADC / 14bit / 210MSP S / 50 Ohm DSP resources: FPGA Virtex-4 / SX35 + 2хZBTSRAM / х36 / 36Mb / 200 MHz DSP TMS320C6416 / 600 MHz / 4800 MIPS + SDRAM / x64 / 64MB / 133MHz I/O resources: FPGA Virtex-4 / FX12 + SDRAM / x16 /16MB /133MHz PCI / х32 / 66MHz Ethernet 100BASE-TX SerDes / 25m / UTP CAT5e / 1.5 Gbps RS422 / RS485 Flash memory: NOR / BPI / х16 / 8MB Power supply: ±5V / +3.3V Cooling: convective Operating temperature: С MODULE 07F3UVPXV6APLM - 3U / 4HP / VPX Function purpose: DSP+ADC Analog Input: 2 x ADC / 12bit / 500MSPS / 50 Ohm DSP resources: FPGA Xilinx Virtex 6 / XC6VLX240T 2 x QDR SRAM / x36 / 18Mb / 300MHz I/O resources: 4 x RocketIO 5 Gbps 6 x LVDS 650 Mbps RS232 Flash memory: NOR / BPI / x16 / 128MB Power supply: +5V Cooling: convective / conductive Operating temperature: С +38 (044) info@ictech.com.ua +38 (044)

58 PCB DESIGN Interactive tracing ANALYSIS OF PCB TOPOLOGY 3D visualization 57

59 PRINTED CIRCUIT BOARDS DESIGN Institute of Computer Technologies provides topology design services of printed circuit boards of various types and levels of complexity: Multilayer PCBs with impedance control Boards with blind and buried vias, HDI (high-density boards) Backplanes Flex and rigid-flex PCBs Microwave boards, analog and analog-digital boards Boards with high-speed digital and analog-to-digital interfaces Within the PCB design service, the following tasks are completed: Calculation and design of multilayer PCB stack-up Development of high-speed circuits and differential pairs design Analysis and modeling of interference immunity Analysis and modeling of signal integrity Modeling and calculation of heat generation During design of printed circuit boards, engineers of Institute of Computer Technologies are guided by the requirements of IPC standards. Development is carried out taking into account the requirements of manufacturability and PCB assembly (DFM and DFA principles). Institute of Computer Technologies provides PCB redesign services. Redesign of printed circuit boards does not imply significant changes in the circuit design solutions of a project and is necessary in the following cases: The finished project contains obsolete, discontinued components that need to be replaced The finished project needs to be optimized for batch production: replacement of THT elements for SMT-components for automatic assembly, replacement of hard for procurement components on their analogs The finished project was prepared in outdated CAD-systems and it needs to be converted into modern apps Design documentation of the project is partially or completely lost and needs to be restored Terms of PCB design and redesign: Number of pads up to weeks Number of pads from to weeks Number of pads from to weeks Recommendation: provide the most complete information on the project. Detailed specifications for PCB design reduce the number of co-ordinations and, as a result, reduces the time and cost of work Contact IKT engineering department for free advice on PCB design. +38 (044) info@ictech.com.ua +38 (044)

60 Altium Designer 17 3D visualization P-CAD 2006 DRC stage for optimization of PCB for production 59

61 SOFTWARE ALTIUM DESIGNER AND P-CAD Institute of Computer Technologies offers Altium Limited (Altium Designer and P-CAD) software in Ukraine. Altium Designer is a comprehensive system for design of high-speed electronic devices based on printed circuit boards, that allows a developer to create projects, starting with schematic and VHDL-description of FPGA, to carry out simulation of the received circuits and VHDL-codes and prepare the files for production. Controlling the integrity of the project allows to track changes in parts of the project and synchronize them. Altium Designer Software Unlimited license for Altium Designer for commercial use PCSL / Altium Designer - Standalone Perpetual Commercial License PCSR / Altium Designer - Private Server Perpetual Commercial License PCSD / Altium Designer - On-Demand Perpetual Commercial License Annual commercial licenses with transition to unlimited license after the 3rd payment TCSL / Altium Designer - Standalone Time-based Commercial License TCSL / Altium Designer - Private Server Time-based Commercial License TCSL / Altium Designer - On-Demand Time-based Commercial License Types of licenses: Standalone License - ideal for one workplace and individual design. A single license does not require a permanent Internet connection. Once activated, this license can be saved, copied and restored. Private License Server - easily shared license within your personal local network by using the private license server Altium. This type of license is ideal for those who want flexible access to their license from various machines, but has not opportunity to connect to the licenses server ON-DEMAND Altium. On-demand License - get rid of unnecessary work and let us manage your licenses using the ON-DEMAND Altium license server. A license of this type is ideal for teams of designers who need maximum flexibility when working with different machines with permanent internet connection. Institute of Computer Technology offers a transition from the legal version of P-CAD to the current version of Altium Designer and the legalization of existing copies of P-CAD for commercial use: Transition from the legal version of P-CAD to the current version of Altium Designer UPCAD-Promo* / Legacy Upgrade from P-CAD to Altium Designer Standalone Perpetual *To confirm legality, you must provide existing certificate or serial number of P-CAD. Legalization of the existing copy of P-CAD product for commercial use: PAC-Promo** / P-CAD Authorization Certificate, single seat (CIS only) **Under this license, companies can only legalize copies of P-CAD products for commercial use (private legalization is not allowed). The user receives the due form certificate, allowing to use the old versions of P-CAD on a certain number of PCs To obtain advice on licensing and purchasing software Altium Limited in Ukraine - contact the specialists of IKT. +38 (044) info@ictech.com.ua +38 (044)

Automatic screen printer ASM DEK E Repeatability of a printed circuit board and a stencil matching: > 2.0 Cmk @ ±12.

62 NEW PRODUCTION LINE «IKT ELECTRONICS» Putting into operation in January 2018 Equipment set: 1. Single magazine line loader Nutec NTE 0710LL Length of boards: mm Width of boards: mm Magazine dimensions (max.): 535x530x570 mm 2. Automatic screen printer ASM DEK E Repeatability of a printed circuit board and a stencil matching: > 2.0 ±12.5μm, (±6 Sigma) Speed of squeegee motion: from 2 mm/s to 300 mm/s Print cycle time: 11 seconds 3. Connecting conveyor 500 mm Nutec NTE 0410L 4. Automatic Placement Machine ASM SIPLACE E CP12/PP Mountable components: х98 mm Accuracy (3σ): 37,5 µм Installation speed: cph 5. Connecting conveyor 500 mm Nutec NTE 0410L 6. Automatic Placement Machine ASM SIPLACE E CP12/PP 7. Inspection conveyor 1000 mm Nutec NTE 0510ICL 8. Reflow Soldering System Vitronics Soltec Centurion CT 1040 Number of vertical heating zones: 10 Number of vertical cooling zones: 4 Total working zone length: mm 9. Single magazine line loader Nutec NTE 0710UL Length of boards: mm Width of boards: mm Magazine dimensions (max.): 535x530x570 mm 61

63 ELECTRONICS MANUFACTURING SERVICES Institute of Computer Technologies provides electronics manufacturing services. Production sites are equipped with modern, reliable and high-tech production complex with all necessary equipment for automated and manual assembly. Technological capabilities of assembly production: Capability PCB dimensions (max) BGA assembly ubga assembly Lead free packages CCGA, CSP, LGA assembly Assembly of microchips with small pitch Assembly of small sized passive components Lead free assembly Mixed BGA assembly (with lead and lead-free) Non-standard elements assembly Press-fit connectors pressing in BGA repairing and reballing Manufacture of cable-harness products Parameter 508x508x5,0mm pitch up to 0,4 mm yes yes up to 0,4 mm from yes yes yes yes yes yes Acceptance criterion / quality control IPC A-600 Requirements for soldering and electronic assemblies acceptance criteria: IPC A-610, J-STD-001 BGA, CSP, HDI, Flip Chip: J-STD-030 IPC-7094, IPC-7095 Components J-STD-020, J-STD-033, J-STD-075 IPC 7711, 7721 IPC A-620 Additional options: Cleaning of printed circuits Application of waterproof coatings Enclosure assembly Adjustment of electronic blocks Climatic and functional testing of products Assembly production specializes in the manufacture of technologically complex electronic modules. For compliance of the products with international standards these systems were implemented: Certified Quality Management System ISO 9001:2015 Electrostatic Protection System ANSI ESD S20.20 Quality control system for finished products according to IPC standards Institute of Computer Technologies provides full or partial completion of customers projects with electronic components. The standard time for assembly works is 2 weeks. If the question of quality is in the first place for you, we will be glad to see your enterprise among our customers. +38 (044) info@ictech.com.ua +38 (044)

64 STAINLESS STEEL STENCILS Production time from 3 working days STENCILS ON ALUMINUM FRAME Production time from 8 working days MULTILEVEL STENCILS Production time from 5 working days 63

65 SMT STENCILS MANUFACTURE Institute of Computer Technologies provides service of manufacture SMT stencils out of stainless steel by laser cutting. Stencils made of stainless steel Thickness of material for manufacture of stainless steel stencil: 0,050 mm (recommended with reinforcement of the stencil) 0,080 mm (recommended with reinforcement of the stencil) 0,100 mm (recommended with reinforcement of the stencil) 0,120 mm 0,127 mm 0,150 mm 0,200 mm 0,300 mm Stencil edge reinforcement is carried out by means of welding on additional steel strips of 0.2 mm thickness in the area of perforation apertures. Stencils on aluminum frame Variants of the aluminum profile section: 20х30 mm 30х40 mm 40х40 mm Maximum frame size 736x736 mm. Stencils on their own frame retain a constant tension of the metal in operation process for a long time. It is recommended to use stencils on frame for large-scale assembly of electronic products. Multi-level stencils Multi-level stencil is used when it is necessary to apply to a printed circuit board solder paste with different layer thickness. This need arises when assembly of individual electronic components with special requirements for the amount of solder paste is carried out. Multilevel stencils can be manufactured both with lowering of separate apertures and with raising. It is also possible to produce a stencil with several levels of thickness variation. To order stencils, one must provide design documentation files in the formats CAM350, GERBER, AutoCAD DXF, Corel Draw. To eliminate micro-roughness and smooth out sharp edges, we recommend stencils with electropolishing option. This will ensure better application of soldering paste and prevent sticking of paste in narrow places and apertures corners. All stencils go through quality control on a special automatic optical inspection system (AOI). IKT specialists will provide advice on design of stencils, taking into account requirements for specific automatic assembly lines on which the use of produced stencil is planned. +38 (044) info@ictech.com.ua +38 (044)

ELECTRONIC COMPONENTS Direct deliveries from

MANUFACTURE OF ENCLOSURES AND THEIR PARTS Examples

block for elements of power supply AA Enclosure

special requirements of the customer Material: Size:

coating Material: Size: PС 90х55х14 mm Material:

66 ELECTRONIC COMPONENTS Direct deliveries from warehouses of official world distributors MANUFACTURE OF ENCLOSURES AND THEIR PARTS Examples of products Navigation device enclosure Battery block for elements of power supply AA Enclosure cover of navigation device Enclosure part with special requirements of the customer Material: Size: Coating: PС + Soft-touch 130х55х30 mm rubber spray coating Material: Size: PС 90х55х14 mm Material: Size: PC 72х40х20 mm Material: PС Size: 120х73х15 mm Filler: GFR 10% 65

67 ELECTRONIC COMPONENTS SUPPLY MANUFACTURE OF ENCLOSURES Institute of Computer Technologies offers direct supplies of electronic components from warehouses of official world distributors, including highly reliable components manufactured in accordance with MIL, ESA standards. Electronic components Active components - STMicroelectronics, Texas Instruments, Linear Technology, Xilinx, International Rectifier, Lattice, NXP, Traco Power and others. Passive components - AVX, CTS Tusonix, Exxelia, Lifasa, NDK, Pulse Electronics, Samsung Electro-Mechanics, Teapo, Vishay, Wima, Yageo and others. Power electronics and power supplies - Traco Electronics AG, VPT Inc., GE Energy, and Power semiconductors from SEMIKRON and Infineon. In addition, we supply components for power supplies from STMicroelectronics and Linear Technology. Electromechanical components - Schroff, Rittal, Bopla, Rose, Phoenix Contact, Harting, Molex, Tyco Electronics, Samtec, Omron, APC International Ltd. and others. Components and modules of wireless communication - Gemalto, Glead, High-Flying, Navia and others. List of services provided by IKT specialists for electronic components supply projects: Information support of customers Providing samples at development and product design stage Registration of projects by manufacturers in order to provide special prices to consumers Full completion of the project in accordance with the specification Ensuring supplies on an agreed schedule Manufacture of enclosures and their parts Institute of Computer Technologies offers services in manufacture of enclosures and their parts for radio-electronic and digital equipment according to the technical task of a customer. Types of manufactured enclosures: Plastic enclosures (ABS, ABS + PC, PC, PMMA, POM, PPS) Aluminum enclosures, incl. moulded under pressure Stainless steel cases Enclosures with protection, in accordance with international standards IEC (IP67, IP65, etc.) To get quotation on enclosures or their parts manufacture, it is necessary to provide to IKT design documentation for your product - 3D model, drawing, technical task specifying the material and color(s) in the RAL layout, as well as additional requirements, if there are any. Terms of manufacture and delivery for each specific order are agreed in advance at the stage of project approval. Institute of Computer Technologies also offers a wide range of ready-made plastic cases of standard sizes from catalogs of world manufacturers. For obtaining information on the product range of serially produced enclosures and components, please, contact IKT specialists. Contact IKT specialists for more information on electronic components supply and manufacture of enclosures. +38 (044) info@ictech.com.ua +38 (044)

68 PRODUCT EXAMPLES Silicone keypads, membrane switchboards, capacitive sensor and decorative panel 67

69 KEYPADS, SENSORS, DECORATIVE COATINGS Institute of Computer Technologies offers services on manufacture of keypads, capacitive sensors and decorative panels according to customers specifications. Silicone keypads Silicone keypads are used in devices where high resistance of keys to pressings is required. Areas of application: cash registers, POS-terminals, telecommunication devices, remote controls, input devices for access control systems and fire-security systems. The advantages of silicone keypads include: operability in a wide range of temperature, relatively low cost within serial volumes, resistance to aggressive environments, impermeability, noiselessness, big structural strength, possibility of keypad manufacture of any size and shape, simple installation of keypads in enclosures of the finished products. Membrane switchboards Membrane switchboards are used in many devices as universal components of a sufficiently low cost. Areas of application: automotive industry, medical equipment, industrial equipment, guarding and security, testing and measuring equipment, household appliances, defense industry. Advantages of membrane keyboards include: protection from dust, moisture and oil, impermeability, ease of operation (they are thin and easy to clean). Membrane switchboards have attractive appearance due to variety of design options and color solutions. Capacitive sensors Capacitive sensors are used in various electronic devices for entering information. Areas of application: industrial equipment, medical equipment, mining equipment, guarding and security, test and measuring equipment, home appliances, defense industry. Compared with electromechanical analogs, capacitive sensors are more reliable devices and, at the same time, have lower cost. Modern touch technologies allow to create keys, matrix switches, sliders and control panels of various shapes. Decorative film coatings Decorative film coatings are used in the manufacture of electronic devices for decorative purposes and display of information. They may have varying degrees of resistance to mechanical stress and aggressive environments. Dimensions, shape, color, windows for displays and indicators are manufactured according to customer requirements. The outer side of the front film is an image, internal side is the adhesive layer for mounting on the enclosure of the device. Surface can be glossy, matte, bulging. It is possible to use LEDs inside the film coating. Areas of application: automotive industry, medical equipment, industrial equipment, guarding and security, testing and measuring equipment, home appliances, defense industry. Manufacture of keyboards, capacitive sensors and decorative coatings is carried out on enterprises that are certified in accordance with the requirements of ISO Address IKT specialists for obtaining additional information on manufacture technologies, technical capabilities and delivery dates of the above products. +38 (044) info@ictech.com.ua +38 (044)

70 SERIAL PRODUCTION OF THREE-, FOUR- AND FIVE-POLE MONOLITHIC MICROWAVE FILTERS Part number Central frequency, MHz Band pass, MHz Insertion loss, db, not more Cutoff (db) min, MHz Bandpass flatness db max VSWR not more Overall dimensions, mm 3PM1344E37B 1334,0 20 1,0 40,0 db ± 66,0 1,0 1,0 18,5 x 6,5 x 9,3 3PM1555E37B 1555,0 4 8,0 40,0 db ± 55,0 3,0 1,9 18,4 x 7,0 x 8,5 3PM1589E37B 1590,0 40 1,5 40,0 db ± 180,0 1,0 1,6 18,4 x 7,0 x 8,8 3PM1189E37B 1189,5 51 1,5 35,0 db ± 175,0 3,0 1,5 12,5 x 4,5 x 12,0 4PM1575E37B 1575,0 20 4,5 35,0 db ± 45,0 1,1 1,5 17,0 x 4,8 x 9,1 4PM1602E37B 1601,5 17 4,5 40,0 db ± 100,0 1,1 1,5 17,0 x 4,8 x 9,1 4PM836E37B 838,0 35 3,0 60,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 15,0 4PM881E37B 881,0 35 3,0 60,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 14,7 4PM897E37B 897,0 35 3,0 60,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 14,7 4PM942E37B 942,0 35 3,0 60,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 14,5 4PM1729E37B 1729,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 8,0 4PM1766E37B 1766,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,8 4PM1824E37B 1824,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,6 4PM1861E37B 1861,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,4 4PM1865E37B 1865,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,4 4PM1895E37B 1895,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,2 4PM1945E37B 1945,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 7,0 4PM1975E37B 1975,0 38 3,0 45,0 db ± 100,0 1,0 1,5 25,0 x 6,8 x 6,8 4PM2245E37B 2245,0 90 1,0 20,0 db ± 100,0 0,5 1,3 25,0 x 6,0 x 7,0 5PM1575E37B 1575,0 20 4,0 43,5 db ± 45,0 1,0 1,5 31,0 x 7,0 x 9,0 5PM1601E37B 1600,5 15 4,5 43,5 db ± 45,0 1,0 1,5 31,0 x 7,0 x 9,0 5PM1602E37B 1601,5 17 4,0 43,5 db ± 43,5 1,0 1,5 31,0 x 7,0 x 9,0 5PM1588E37B 1588,0 40 2,5 40,0 db ± 85,0 1,0 1,6 31,0 x 7,0 x 8,5 5PM1589E37B 1590,0 40 2,5 40,0 db ± 85,0 1,0 1,6 31,0 x 7,0 x 8,5 5PM1593E37B 1595,5 51 2,5 40,0 db ± 94,5 1,0 1,6 31,0 x 6,6 x 10,0 5PM1238E37B 1248,5 27 2,5 40,0 db ± 88,5 1,0 1,6 31,0 x 6,6 x 10,0 5PM2068E37B 2067,5 83 1,5 30,0 db ± 130,0 0,8 1,4 31,0 x 7,0 x 7,0 5PM1736E37B 1756,0 16 4,0 40,0 db ± 47,0 1,0 1,5 31,0 x 6,9 x 8,1 5PM1783E37B 1783,3 11 4,0 35,0 db ± 47,0 1,0 1,5 31,0 x 6,6 x 8,1 5PM1796E37B 1796,3 13 4,0 40,0 db ± 60,0 0,3 1,5 31,0 x 6,9 x 7,9 69

71 PRODUCTION OF CERAMIC MICROWAVE FILTERS Institute of Computer Technologies offers a wide range of monolithic and compound bandpass ceramic microwave filters. When manufacturing microwave filters, IKT uses high-quality heat-stable ceramic materials based on aluminum oxides, barium titanate, titanium, zinc, etc. This allows us to use our products as parts of radio electronic devices with signal power up to 15 W at frequencies up to 10 GHz in a wide temperature range. Metallization of ceramic resonators is carried out with special compositions, providing the best electrical properties and mechanical strength. This enables soldering method without the use of low-melting solders and special means, and also glue mounting of microwave filters. Advantages of IKT microwave filters: Small size and light weight Wide operating frequency range (from 0.7 to 2.6 GHz) and temperatures ( C) Low bandwidth loss (from 0.5 to 4.5 db) Mechanical strength and high reliability Compound microwave filters for surface mounting on printed circuit boards: Part number Central frequency, MHz Band pass, MHz Insertion loss, db, not more Cutoff (db) min, MHz Bandpass flatness db max VSWR not more Overall dimensions, mm 1225B3 1223,0 62 1,4 40,0 db ± 177,0 1,0 1,5 8,3 x 3,65 x 7,0 1583B3 1587,5 90 1,4 32,0 db ± 162,5 1,0 1,5 8,3 x 3,65 x 5,4 1238B2 1242,5 35 1,5 35,0 db ± 227,5 0,5 1,5 8,2 x 4,4 x 12,2 1238B4 1242,5 35 3,0 40,0 db ± 97,5 1,0 1,6 4,9 x 12,2 x 16,2 1589B2 1587,5 45 1,5 26,5 db ± 300,0 0,5 1,5 8,2 x 4,9 x 9,8 1589B4 1587,5 45 3,0 40,0 db ± 147,5 1,0 1,5 17,2 x 4,9 x 9,8 H3804M 1236,0 36 2,6 40,0 db ± 86,0 1,0 2,2 16,2 x 4,5 x 12,2 H8504M 1587,5 45 2,6 40,0 db ± 117,5 1,0 2,2 16,2 x 4,5 x 9,6 The stages of quality control of microwave filters (in accordance with the requirements of GOST ): Solderability monitoring after storage Checking the mass and electrical parameters Mechanical strength test by sinusoidal vibration Mechanical strength test during transportation Functional test at high operating temperature (+85 С) Functional test at low operating temperature (-55 С); Functional test in temperature changing conditions (-60 to +90 C). IKT offers services in design and manufacture of microwave filters according to the technical task of the customer. +38 (044) info@ictech.com.ua +38 (044)

partners CARGO DELIVERY FROM CHINA AND SOUTHEAST ASIA Air and sea

72 COMPLEX OF SERVICES FOR WORKING WITH CHINA AND COUNTRIES OF SOUTHEAST ASIA Import from China and Southeast Asia, search for business partners CARGO DELIVERY FROM CHINA AND SOUTHEAST ASIA Air and sea transportation, delivery of goods in assorted lading container 71

73 IMPORT FROM CHINA AND COUNTRIES OF SOUTHEAST ASIA Institute of Computer Technologies offers service of import from China and countries of Southeast Asia. Working with us, you get officially imported goods in your warehouse under the contract with the company-resident of Ukraine. We carry out financial transactions related to purchase of currency, transfer of money to manufacturers, payment of customs fees and transportation services, taking all the risks that this process entails. IKT provides professional comprehensive support for import transactions. More than 10 years of work in the field of import operations allow us to guarantee delivery of the appropriate quality goods you need within the agreed time, without problems and delays in transit. Search for business partners in China IKT provides services on finding business partners in China and countries of Southeast Asia. We will release you from unnecessary communication with foreign companies representatives. Please, set a specific goal and we will organize a comprehensive support of your orders - from searching for manufacturer to quality control of the finished product before shipment. Range of services: Audit of manufacturers according to specified criteria, providing detailed information and contacts Obtaining official prices from manufacturers Obtaining the necessary certificates for the supplied products Coordination of the terms of production and payment terms Financial support of transactions At customer s request, we will conduct manufacturer s inspection and arrange delivery of catalogs and product samples to Ukraine. Cargo delivery Institute of Computer Technologies offers effective solutions in the field of assorted lading logistics by sea transport, and also carries out air transportation at favorable tariffs. For small quantities of goods, we offer a service for delivery of goods in assorted lading container - this will allow you to optimize the cost of delivery by paying only for the necessary volume and weight of the cargo in the container. Range of delivery services: Selection of the optimal logistics route for cargo delivery to Ukraine Consolidation of cargo Preparing of export documents Certification and insurance of cargo Official customs clearance and import registration in Ukraine Certification, licensing documents for the sale of goods in Ukraine Delivery of goods to the warehouse of a recipient Contact IKT specialists for more information on the services on working with China and countries of Southeast Asia. +38 (044) info@ictech.com.ua +38 (044)

74 Business direction was started: Manufacture of multilayer printed circuit boards Business direction was started: Electronics manufacturing services Business direction was started: Microwave filters manufacture IKT became the first Ukrainian company member of IPC, International Association of Electronics Manufacturers Importer of the Year 2011* Institute of Computer Technologies was established Business direction was started: Contract development of electronics Batch PCB supplies from China and South Korea were set up Office premises in Chernihiv were purchased Business direction was started: Printed Circuit Boards Design Cooperation with manufacturers of printed circuit boards from Germany, Austria, Italy and Israel was established JANUARY 2018 OPENING A NEW EMS DEPARTMENT - IKT ELECTRONICS * The leader in terms of PCB shipments to Ukraine according to official data of Ukraine State Statistics by the H.S. code (Printed Circuit Boards).

HISTORY OF THE COMPANY INSTITUTE OF COMPUTER TECHNOLOGIES IKT seminar was held on the topic: Practical aspects of PCB design. Ensuring quality and reliability.

75 HISTORY OF THE COMPANY INSTITUTE OF COMPUTER TECHNOLOGIES IKT seminar was held on the topic: Practical aspects of PCB design. Ensuring quality and reliability. Design and manufacture of rigid-flex boards Importer of the Year 2013* 2013 Joint seminar of IKT and IPC was held on the topic: «Application of IPC standards throughout the chain of design and production of electronic devices on printed circuit boards» Participation in the fair «ARMS AND SECURITY 2014» IKT seminar was held on the topic: «Modern technologies of PCB production. Ways to reduce the cost of electronic products with ensuring their quality and reliability» Business direction was started: Import from China and countries of Southeast Asia IKT Kiev Regional Department of Sales was established Business direction was started: Supply of electronic components, enclosures and keypads Business direction was started: CAD software distribution for electronics developers IKT received Certificate of quality management system compliance to ISO 9001: 2015 Participation in the fair «ARMS AND SECURITY 2017» New office building was set to work Office and industrial premises were purchased Importer of the Year 2012* IKT received Certificate of quality management system compliance to ISO 9001: 2009 Catalog of IKT was published Business direction was started: Development of appliсation and embedded software Participation in the fair «EIA 2014» Participation in the fair «LED EXPO» IKT seminar was held on the topic: «Features of creation of the design of complex multilayer printed circuit boards with components in BGA package. Design of multilayer printed circuit boards with high-speed digital interfaces» Participation in the fair «EEBC 2014» IKT Kiev Regional Department of Sales moved to new office premises IKT received status of Official Distributor in Ukraine of IPC International Association of Electronics Manufacturers IKT seminar was held on the topic: «Practical aspects of PCB design and the use of IPC standards on stages of development and manufacture of electronic devices» Participation in the fair «Arms and Security 2016» IKT seminar was held on the topic: «Features of design creating of complex multilayer printed boards with the use of components in BGA packages. Design of multilayer printed circuit boards with high-speed digital interfaces» Participation in the fair «SECURITY 2014»

Technical Capabilities Non Standard Technologies. CML pcbs from just around the corner

Technical Capabilities Non Standard Technologies PAGE 1 Capabilities Rigid Layer Count 1-12 layer (above 12 layer see HDI) 0.4-3.2 mm (> 3.2 mm on request) Finished Board Thickness Tolerance: +/-10% Core