OhmegaPly Embedded Resistor Technology. 1. Electrodeposited thin film resistive material. 2. Standard subtractive PWB processing

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2 OhmegaPly Embedded Resistor Technology 1. Electrodeposited thin film resistive material 2. Standard subtractive PWB processing 3. Surface or embedded resistors 4. Mature technology (36+ years) 5. Field Proven, Excellent Long Term Reliability 1

3 OhmegaPly Manufacturing Overview OhmegaPly is a Nickel Phosphorous (NiP) metal alloy that is electrodeposited onto the matte, or tooth side, of copper foil. The thin film NiP metal alloy/copper foil combination is called OhmegaPly RCM (RESISTOR-CONDUCTOR MATERIAL). The RCM is laminated to a dielectric material (like any other copper foil) and subtractively processed to produce copper circuitry and planar resistors. Because of its thin film nature, it can be embedded within layers without increasing the thickness of the board or occupying any board surface area as is required for discrete chip resistors. COPPER COPPER ELECTROPLATING RCM NICKEL PHOSPHOROUS LAMINATION OHMEGAPLY LAMINATE 2

4 OhmegaPly Sheet Resistivity Offerings Sheet Material Typical Resistivity Tolerance Applications 10 / 3% 25 Ω/ 5% 50 Ω/ 5% 100 Ω/ 5% 250 Ω/ 10% g pp Developed for series termination resistors as ORBIT (Ohmega Resistors Built In Trace) and also used for other applications, like flexible heaters Used primarily for series/parallel termination resistors and power dividers Used primarily as pullup/pulldown resistors for electronic logic circuits High ohmic applications 3

5 Recommended Copper Types Low Profile Modified Low Profile PTFE Hi T g Epoxy Rogers Duroid Polyimide Arlon CLTE Lead-Free Ohmega/Faradflex Rogers 4003 Flex Ceramic-Filled LCP (Rogers Ultralam) 25 ohm per square at 200X 25 ohm per square at 200X 4

6 Advantages of OhmegaPly A. Electrical Advantages 1. Improved line impedance matching, 2. Shorter signal paths and reduced series inductance, 3. Eliminate the inductive reactance of the SMT device, 4. Reduced cross talk, noise and EMI B. PCB Design Advantages 1. Increase active component density & reduced form factors, 2. Improved wireability due to elimination of via. 3. Improved reliability due to elimination of solder joints. C. Improved Reliability 1. Low RTC of <50 PPM (-55 C to 125 C) 2. Life testing: 100,000 hours = +2% at 110 C 3. Stable over wide frequency range: tested beyond to 40+ GHz. 4. Lead-free compatible D. Economic Advantages 1. Elimination of discrete resistors 2. Improved assembly yield 3. Board densification and/or size reduction 5

7 Advantages of PRT D. Economic Advantages 4. Board simplification (double sided SMT to single sided SMT; potential layer and via count reduction ) 5. Deliver tested board to the assemblers E. Minimal Risk 1. Over 36 years of use 2. Predictable Design: Know how to achieve target with simple formula (L/W x Rs) Process: Know how to characterize and compensate Linear relationship: increase 10% resistor length equal to 10% increase in resistance value Yield: standard distribution, tolerance drive yields 3. Proven long term reliability 6

8 PCB processing of OhmegaPly A. Step-By-Step Processes and Required Chemistries. STEP 1: Apply Photoresist to Laminate STEP 2: Print and Develop Composite Image STEP 3: Etch Unwanted Copper Using Any Conventional Etchant (1 st etch) STEP 4: Etch Unwanted Resistive Material with Copper Sulfate Solution (2 nd etching process) STEP 5: Strip Photoresist STEP 6: Apply Photoresist, Print and Develop Conductor Protect Image (2 nd print) STEP 7: Etch Away Copper Over the Designed Resistor Using a Selective Alkaline Etchant (3 rd etch) STEP 8: Strip Photoresist 7

9 Distribution of OhmegaPly Resistor Values 40% 35% 30% 25% 20% 15% 10% 5% 0% TERMINATING PULL - UPS Resistor Type 1 (Ohms) 10 OHMS 30 OHMS 50OHMS 100 OHMS 1Kohm 5 Kohm 10 Kohm 100 K ohm 8

10 Ohms Per Square Sheet resistivity (stated in Ohms per square) is dimensionless A square area of resistive material = sheet resistivity of resistive material Eg E.g., a25 /(Ohms/Square) sheet resistance L1 = W1 L2 = W2 L3 =W3 N1 = 1 N2 = 2 N3 =3 R1 = 25 Ohms R2 = 25 Ohms R3 = 25 Ohms Resistor value = sheet resistivity it x ratio of element length to width (R =Rs x L/W) E.g., a 25 / sheet resistivity Length = (30 mils) Width = (15mils) Resistor value = 25 / x (30mils/15mils) = 25 / x 2 squares = 50 ohms 9

11 Ohms Per Square Termination and pull-up resistors in an ATM switching card. 10

12 Recommended Power Density POWER DENSITY OF OHM/SQ. MATERIAL VERSUS DIFFERENT RESISTOR AREA 25 C AMBIENT y = 76.5x Ohm/Sq. 25 Ohm/Sq. Powe er Density (mw W/mil 2 ) y = 61.2x y = 54.5x y = 45.9x Ohm/Sq. 100 Ohm/Sq. 250 Ohs/Sq. y = 39.7x Resistor Area (mil 2 ) 11

13 Recommended Power Density 600 POWER DENSITY OF OHM/SQ. MATERIAL VERSUS DIFFERENT RESISTOR AREA AT 100 C AMBIENT 10 ohm/sq ohm/sq. y = 65.52x52x ohm/sq. 100 oh/sq. Pow wer Density (m mw/mm 2 ) y = 52.42x y = 46.65x y = 39.31x ohm/sq. y = 34.07x Resistor Area (mm 2 ) 12

14 Resistor Footprint Calculator A - DESIGN SPECIFICATION Please enter the resistance value (R ) in Ohm, power rating (P) in milliwatt, and maximum tolerance (t ) in percent for each desired resistor (R 1, R 2, R 3, R 4 & R 5 ) in table 1 below, and exit the cell to allow the program performs the calculations. R 1 R 2 R 3 R 4 R 5 Resistance Value (R) in Ohm Power Rating (P) in mw Maximum Tolerance (t) in % Table 1. For designer to enter the resistance, power rating and percent tolerance values of desired resistors B - RECOMMENDED MINIMUM WIDTH AND LENGTH OF DESIRED RESISTORS Sheet R 1 R 2 R 3 R 4 R 5 Resistivities W 1 L 2 W 2 L 2 W 3 L 3 W 4 L 4 W 5 L 5 (Ohm/Sq.) (Mil) (Mil) (Mil) (Mil) (Mil) (Mil) (Mil) (Mil) (Mil) (Mil) t* t* t* t* t* t* t* t* t* t* t* t* P* t* t* t* t* P* P* t* P* t* t* P* t* Table 2. The recommended minimum width and length for each desired resistor which is calculated by the program base on the given values by the designer in table 1. 13

15 Standard CAD Layout Tools OhmegaPly resistor design is compatible with standard CAD tools. Instructions are available for OhmegaPly design in: 1. Mentor 2. Allegro 3. Intergraph, Classic 4. Pad s Power PCB 5. VeriBest 14

16 Ohmega Resistor Built in Trace (ORBIT ) 15

17 Ohmega Resistor Built in Trace (ORBIT ) 22 ohms resistor Enlargement of ORBIT as series terminating resistors. 16

18 Ohmega Heaters OhmegaPly as a heater element Advantages are: Low Power Requirement Fast Heat Rise Excellent Thermal Stability % change in resistance after 500 hours at 200 ºC 17

OhmegaFlex TM Heaters TE EMPERATURE RISE C 270 240 210 180 150 120 90 60 30 0 TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series C Circular Heaters 0.0 1.0 2.0 3.0 4.

( ) CURRENT (Amp) DISSIPATION (W) RISE (C) RISE TIME (Sec) I1 I2 I3 P1 P2 P3 T1 T2 T3 Time1 Time2 Time3 A 4.7 0.32 0.64 0.96 0.48 1.91 4.31 40 100 180* 60 60 30 B 4.8 0.21 0.46 0.71 0.21 1.

57 36 150 264 30 30 60 F 182 0.05 0.12 0.16 0.45 2.66 4.95 52 165 250 30 30 60 G 150 007 0.07 016 0.16 021 0.21 067 0.67 384 3.84 683 6.83 53 175 250 30 40 60 H 147 0.07 0.16 0.20 0.68 3.92 6.

19 OhmegaFlex TM Heaters TE EMPERATURE RISE C TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series C Circular Heaters POWER DISSIPATION (WATT) A B C D CIRCULAR HEATERS HEATER RESISTANCE APPLIED D.C POWER TEMPERATURE TEMPERATURE No. ( ) CURRENT (Amp) DISSIPATION (W) RISE (C) RISE TIME (Sec) I1 I2 I3 P1 P2 P3 T1 T2 T3 Time1 Time2 Time3 A * B * C * D * ARC HEATERS E F G H * Maximum operating temperature ERATURE RISE C TEMP TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series C Arc Heaters POWER DISSIPATION (WATT) E F G H 18

OhmegaFlex TM Heaters TEM MPERATURE RISE C 270 240 210 180 150 120 90 60 30 0 TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series S Rectangular Heaters 0.0 1.0 2.0 3.0 4.0 5.

( ) CURRENT (Amp) DISSIPATION (W) RISE (C) RISE TIME (Sec) I1 I2 I3 P1 P2 P3 T1 T2 T3 Time1 Time2 Time3 1 4.5 0.11 0.22 0.67 0.06 0.22 2.00 34 58 230 40 45 60 2 9 0.17 0.33 0.48 0.25 1.00 2.

25 0.34 0.38 3.94 7.45 50 122 183 40 50 40 SERPENTINE HEATERS 7 62 0.03 0.13 0.18 0.06 1.03 1.95 32 135 202 30 30 30 8 342 0.05 0.10 0.13 0.95 3.58 5.66 63 158 225 30 30 50 9 435 0.04 0.10 0.11 0.

20 OhmegaFlex TM Heaters TEM MPERATURE RISE C TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series S Rectangular Heaters POWER DISSIPATION (WATT) RECTANGULAR HEATERS HEATER RESISTANCE APPLIED D.C POWER TEMPERATURE TEMPERATURE No. ( ) CURRENT (Amp) DISSIPATION (W) RISE (C) RISE TIME (Sec) I1 I2 I3 P1 P2 P3 T1 T2 T3 Time1 Time2 Time SERPENTINE HEATERS ATURE RISE C TEMPER TEMPERATURE RISE VERSUS POWER DISSIPATION of 10 ohm/sq OhmegaFlex TM Series S Serpentine Heaters POWER DISSIPATION (WATT)

21 Applications for Ohmega Heaters OhmegaPly Heater element OhmegaPly Heater element 20

22 OhmegaPly Resistor Designs Surface resistor application Potentiometer (35 mm SLR camera). 21

23 OhmegaPly Resistor Designs MEMS Microphone 22

24 OhmegaPly Resistor Designs Interposer board. 23

25 OhmegaPly Resistor Designs Parallel termination resistors in a BGA package. 24

26 OhmegaPly Resistor Designs Series termination resistors in a BGA package. 25

27 OhmegaPly Resistor Designs Pull-up resistors in an avionic application 26

28 OhmegaPly Resistor Designs Buried resistor application 2 X 3 Probe Card. 27

29 OhmegaPly Resistor Designs Series termination resistors for telecom switching card 28

30 OhmegaPly Resistor Designs OhmgaPly Resistors in Flex Circuit 29

31 OhmegaPly Flex Circuit Applications Ohmega-Ply RCM Ni-P Embedded Resistors MULTILAYER FLEX TAPE APPLICATIONS 35 mm Tape BGA - 1mm Pitch Reel to Reel Process Capability ETCHED RESISTOR TOLERANCES Nominal Value - ohms: Aspect ratio (# of squares): Resistor width - mils: Resistor Length - mils: Mean value (ohms) 35 ohms 44 ohms 54 ohms 78 ohms 105 ohms Percent tolerance +/- 50% +/- 25% +/- 20% +/- 15% +/- 10% Ohmega-Ply RCM 1/2R25 {Half ounce - 25 ohms/square} Resistive -Conductive-Material Note: Percent tolerance decreases with resistor width and length. Mean value can be corrected by artwork compensation. 30

32 OhmegaPly Resistor Designs CLTE CLTE FIRST LAMINATION 7 CLT CORE MATERIAL VENDER COPPER PLATED COPPER OHMEGA LAYER 55NI PREPREG ABLEFILL SPEEDBOARD 8 FINAL LAMINATION OhmegaPly resistor in microwave application for Globalstar antenna. Figure 8 Layer stackup. 31

33 OhmegaPly in Microwave Applications x Enlargement of a four-up array 16-way power divider with 50 /sq OhmegaPly resistors 32

34 OhmegaPly in Microwave Applications Insertion Loss vs Frequency Rogers 0.020" RT/d 6202 with four copper types Av verage db / inc ch Ohmega on low Reverse profile copper treated foil (smooth) Ohmega modified on high profile low profile ED foil copper (rough) 1/2 oz. Rolled (smooth) 1/2 oz. ED (rough) Calculated smooth Calculated rough Frequency, GHz 33

35 OhmegaPly in Microwave Applications INSERTION LOSS vs FREQUENCY ARLON " CLTE-XT Average db/inch oz ED (control) OhmegaPly 1R25 modified low profile OhmegaPly 1A50 ultra low profile OhmegaPly 1R25 low profile 1oz RT (control) Frequency (GHz) 34

36 Mars Express with OhmegaPly in Beagle 2 Lander Lander PAW Ohmega-Ply resistors on inner layer of boards Mars Express orbiter Beagle 2 Lander with instruments on its robotic arm X-Ray Spectrometer (XRS) with Ohmega-Ply resistors Ohmega-Ply resistors on inner layer XRS Electronic lander PC board X-Ray Spectrometer with cover to Ohmega-Ply resistors in electronic Top view of PAW (position measure the elements in rocks lander PC board adjustable workbench) All images all Rights Reserved Beagle 2 April,

37 Application of OhmegaPly on Lead-Free Dielectrics OhmegaPly Resistors on Inner Layer of DRAM Design OhmegaPly Resistors Enlargement of Above Design 36

38 Application of OhmegaPly on Lead-Free Dielectrics Resistive stability after solder float (% R) Thermal stress test-to-failure to failure. Compare FR4 to a Lead-Free laminate. Test at T seconds versus T seconds. Preconditioning; baking versus no-baking Failure means resistor becomes unstable or open. The result was that t the lead-free laminate was clearly l superior at T288. Surviving 25 cycles. 37

39 Application of OhmegaPly on Lead-Free Dielectrics Results of Lead-Free Assembly Simulation SUBSTRATE % R AT % R AT % R AT % R AT % R AT % R AT % R AT TEST METHOD CONDITION 1 CYCLE 2 CYCLE 5 CYCLE 10 CYCLE 15 CYCLE 20 CYCLE 25 CYCLE FR T sec no bake Lead Free T288, 10 sec 5 hr bake Lead Free T288, 10 sec no bake FR open T288, 10 sec 5 hr bake FR open T288, 10 sec no bake Memory board, 10 layers with one layer of 22 ohm resistors, 23 mils x 10 mils. Built using Double Treat 1/2A50ohm OhmegaPly NiP laminate. The FR-4 PCB used a standard multifunctional epoxy laminate. The "lead-free" PCB used a phenolic-cured laminate. Testing per IPC-TM-650, Method , baking was performed at 125 dc. 38

40 OhmegaPly Reliability Data A. OhmegaPly Specifications and Properties OhmegaPly has been used in numerous applications for over 30 years; exhibiting excellent performance and dependability. Due to its absolute long-term reliability under a variety of severe environmental conditions, OhmegaPly is used in numerous critical products (space-base, aerospace, avionics, etc.) where the utmost in reliability is required. The estimated failure rate for OhmegaPly resistors is less than resistor elements per 1 million operating hours (this is based on test results where over 1 trillion component hours have been accumulated without a field failure). Field failure is defined as resistor failure that is caused by the resistive material itself, and not other sources of printed circuit board failure (opens, shorts, defective base material, excessive power surges, improper operating conditions, etc.). OHMEGAPLY RCM PROPERTIES AND SPECIFICATIONS Remark and Condition Sheet Resistivities iti Material Tolerance +/-3 +/-5 +/-5 +/-5 +/-10 Load Life Cycling Test Ambient Temp: 70C ( R%) <0.3 <5 <5 <5 0.5 On Cycle: 1.5 hrs (after 1087 hrs) (after 1000 hrs) Off Cycle: 1.5 hrs Length Of Test: hrs Current Noise Index in db <-16 <-15 <-15 <-15 <-15 Voltage Applied: 10 ohm/sq.: 53.2V 25 ohm/sq.: 5.6V, 100 ohm/sq.: 7.9V Short Time Overload ( R%) Power:2.5 X Rated Time: 5 sec Resistance Temperature Characteristic(RTC) Hot Cycle: 25, 50, C PPM/ C Cold Cycle: 25, 0,-25, -55 C 39

41 OhmegaPly Reliability Data OHMEGA-PLY RCM PROPERTIES AND SPECIFICATIONS Remark and Condition Sheet Resistivities MIL-STD A Humidity Test ( R%) Temp: 40 C Relative Humidity: 95% Time: 240 hrs MIL-STD B Thermal Shock ( R%) No of Cycles: 25 Hot Cycle Temp: 125 C Cold Cycle Temp: -65 C IPC-TM-650 METHOD Hot Oil ( R%) Temp: 260 C Immersion: 20 C MIL-STD D 210D Solder Float ( R%) Temp: 260 C Immersion: 20 Second Resistance to Solvent MIL-STD A ( R%) Immersion: 15 mins Toluence 1-1-1: 0.2 Trichloroethan: N/A 0.0 N/A N/A N/A Acetone: 0.2 Freon: 0.0 Capacitance(pF) (at 5 Hz) ~0 ~1 ~1 ~1 ~1 Inductance (nh) (at 5 Hz) < ~0.6 < ~0.6 < ~0.6 < ~0.6 < ~0.6 B. OEM Long Term Reliability Test Data 1. Cray Research In a study of the stability of buried OhmegaPly resistors used for ECL termination, Cray concluded that the OhmegaPly resistors would operate well beyond all normal voltages and temperatures, and there have been no reports of a resistor failure due to resistive material. Cray Research also found that incorporating the OhmegaPly 40

42 OhmegaPly Reliability Data resistors into the internal plane of a multilayer board substantially improved the signal quality for high speed devices. Cray Research used OhmegaPly in millions of multilayer circuit boards since 1982 with absolute field reliability of the resistive elements. 2. Alcatel Bell Researchers at Alcatel Bell tested OhmegaPly resistors for broadband (45 MHz-5 GHz) telecom applications to compare the reliability of OhmegaPly to 0805 discrete thick film chip resistors rated at 125mW. OhmegaPly was as good as, or better than, the chip resistor in all performed tests. Type of Test Measured max./min. R Ohmega Specifications Thick film chip R (0805) (Alcatel Tested) Humidity Test After 21 days: After 10 days: After 56 days: Temp: 40 C 0.22% for 25 Ohm/sq. 0.5% for 25 Ohm/sq. ± 1.5% Relative Humidity: 93% 0.07% for 100 Ohm/sq. 1.0% for 100 Ohm/sq. 0.10% for 250 Ohm/sq. After 56 days: 0.74% for 25 Ohm/sq. 0.14% for 100 Ohm/sq. 0.22% for 250 Ohm/sq. Thermal Cycling After 100 Cycles After 25 Cyles Hot Cycle Temp: 125 C % for 25 Ohm/sq % for 25 Ohm/sq. Cold Cycle Temp: -25 C 0.03 % for 100 Ohm/sq. 1% for 100 Ohm/sq ± 25% % for 250 Ohm/sq. Aging Wihout Load After 100 Hrs. Temp: 125 C 0.10% for 25 Ohm/sq Not specified Not specified 0.08% for 100 Ohm/sq % for 250 Ohm/sq Solder Heat/Float % for 25 Ohm/sq 0.5% for 25 Ohm/sq Temp: 260 C 0.01% for 100 Ohm/sq 1% for 100 Ohm/sq ± 25% Immersion: 20 sec % for 250 Ohm/sq 41

43 OhmegaPly Reliability Data 3. IBM IBM built and tested a numbers of evaluation boards that incorporated OhmegaPly into multiple internal layers of a multilayer design. This effort was to see what effect, if any, there was on the assembly (and rework) process due to the embedded resistors. In addition, standard environmental stress testing was performed (including thermal cycling, thermal shock, vibration testing and torque testing). The findings of their published report showed no significant resistance change on the resistors from the assembly process and stress test. 4. Unisys In evaluating the long term drift characteristics of OhmegaPly on high Tg, low DC substrate, Unisys concluded that powered (22 ma), Ni-P buried resistors, fabricated using ammoniacal etch process and fully aqueous resist, when placed in a 55 C cabinet environment, will drift < 2 % in 100,000 hours (11.4 years). 5. Dassault (Thales) Dassault Electronique did a 2 year study of OhmegaPly for an active phased array antenna (X-band). The resistors were used in a stripline configuration a PTFE substrate (Rogers RT Duroid 6002 and fusion bonded inside a multilayer package). Ohmega-Ply was compared to chip resistors and screen printed polymer inks. OhmegaPly was selected for use due to superior tolerance and stability (compared to printed polymer inks) and space saving, parasitic reduction, and solder joint removal (compared to chip resistors). The results of testing are as follows: Etching Minimum Tolerance After Influence of Ohmega- Shift of Resistor Thermal Coefficient of Power No shift in microwave Tolerance Resistor Width Fusion Bonding Ply Foil Layer on Values After 500 Resistance Within the Handling performance of two ports Microwave Properties Thermal Cyles Range (-55 C, +125 C) power divider, when (-55 C,+125 C) Ohmega Foil Technology is tested under the following conditions: 5% 200 m 7% NO Microstrip: +2% Microstrip: ± 6% 300 mw 500 thermal cycles Stripline: +3% Stripline: ± 7% (- 55 C, +125 C) 500 hours at 125 C 40 days 40 C, 95% RH 48 hours salt spray 42

44 OhmegaPly Reliability Data 6. Rogers Corporation In an internal study, Rogers evaluated OhmegaPly resistors on polyimide /Pyralux. They found the following change in a resistor that was 0.25 x 4.0 in size with a flex radius of 0.25 (the flex rate was 10 cycles/minute): Number of Flex Cycles % Change in Resistance , , * With Coverlay 250, * 0.0* 7. Delphi Delco Electronics Systems In evaluating material for the Advanced Embedded Passives Technology (AEPT) project, Delphi Delco performed ESD test on embedded resistors and capacitors in PWB, and OhmegaPly was chosen as benchmarks for resistor. The resistance changes after 8kV discharge for OhmegaPly is shown in table A. The results indicated that OhmegaPly is ESD stable for the testing voltage range from 2kV to 8kV. OhmegaPly Resistor Width % change in resistance 10 mil mil mil mil 0.09 Resistance change after 8 kv ESD discharge. 43

45 OhmegaPly Reliability Data 8. OhmegaPly for lead-free assembly. Highly Accelerated Thermal Shock Test (HATS) CHANGE IN RESISTANCE SS AFTER 1000 CYCLESC Resistor Network % change in Resistance Test Result Test Condiltion Pass 15 Coupons Per Resistor Network Pass Total Cycle Time: minutes Pass High Temperature: +145 C Pass Low Temperature: 40 C High Temperature Extended Dwell Time: 0.25 minutes Low Temperature Extended Et dddwell lltime: minutes 44

46 OhmegaPly Cost Analysis A. Traditional Cost Model (direct replacement of discrete resistor with Ohmega-Ply) Volume: Prototype Low Medium High OhmegaPly Material (Cents/in 2 ) $0.20 $0.14 $0.10 $0.07 Board Convesion Cost Adder $0.40 $ $0.30 $ $0.20 $ $0.15 TYPICAL BOARD COST ADDER PER LAYER OF VARIOUS (DISCOUNT) LEVELS Discrete Resistor Cost At $0.01/Discrete At $0.05/Discrete Ohmega-Ply Cost Adder Prototype Low Volume Cent ts/in Medium Volume High Volume Component Density/in 2 45

47 OhmegaPly Cost Analysis B. Technology Tradeoff Cost Model (enhanced PCB design using OhmegaPly to replace discrete resistors) Following is a comparison of some board technologies (per square inch of board area). The comparison is based on an application requiring 10 resistors per square inch of board area: Substrate type Cost addder Total cost SMT cost Total cost, bare substrate bare board (resistor) board + resistor Standard 6-layer with SMT --- $0.12 $0.20 $0.32 Standard 6-layer with Ohmega $0.20 $ $0.32 Microvia 4-layer with SMT $0.46 $0.58 $0.20 $0.66 Sequentialbuild 6-layer $0.49 $0.61 $0.20 $0.81 (buried vias with SMT) Use of OhmegaPly in design may: Reduce board area Reduce layer count Allow for discrete SMT to become single side SMT Improve loaded board testability Allow for more traditional PCB technology (through hole versus HDI) 46

48 Summary and Conclusions 1. Thin Film Resistive Material 2. Standard Subtractive PWB Processing 3. Surface or Embedded Resistors 4. Mature Technology (36+ years) 5. Field Proven, Excellent Long Term Reliability 6. Performance Enhancing, Cost Effective Resistor Technology in High Speed/High Density Circuit Designs 47

Embedded Thin Film Resistors

Embedded Thin Film Resistors An Update on Current Applications & Design Bruce Mahler Vice President Ohmega Technologies, Inc. IPC Designers Council Orange County Chapter July 19, 2017 NiP Thin Film Resistive