Quad Input 28 Gb/s Broadband 8 V Lithium Niobate Modulator Driver Amplifier

Transcription

1 Description Quad Input 28 Gb/s Broadband 8 V Lithium Niobate Modulator Driver Amplifier The OA3MHQM is a small, four channel, high performance, broadband 28 Gb/s Lithium Niobate optical modulator driver with low jitter, 8 V amplitude and excellent gain and group delay flatness. It is designed for 40 to 100 Gb/s Ethernet QPSK and DQPSK SONET optical modulator driver applications. It is ideally suited for integration into small form-factor (SFF) transponders. Application The OA3MHQM is offered in a small modularized package with excellent performance, intended for transponder integration. The OA3MHQM has gain and power ideally suited for driving either 40G electro-absorption modulators or Lithium Niobate modulators. It can be used for differential modulators or with other complex modulation schemes. It has low power dissipation, ample drive level, low added jitter, fast rise/fall times, and is easy to use with simple bias voltages. Key 25 C Each channel Vd 1 =6.0 V, Vd 2 =7.5 V, Vg 1 =Vg 2 =adjusted for optimum amplitude and jitter. Zo=50 Ω. Vin=475 mv GHz 28 Gb/s Parameter Description Min Typ Max Min Typ Max S21 (db) Small Signal Gain TBD 25 S11 (db) Input Match S22 (db) Output Match Amplitude (V) Eye Amplitude TBD 8.0 Jitter (ps) Added RMS Jitter 0.8 TBD Tr / Tf (ps) Rise / Fall Time 8 TBD Product Highlights Quad 8 V Outputs 0.8 ps added RMS jitter 8 ps rise / fall time 25 db gain to > 30 GHz <10 W power dissipation Ultra-small package Hermetically sealed GR357 compliant Preliminary OA3MHQM: PAGE 1 of 5

2 Typical module performance: s-parameters Typical module performance: 28 Gb/s Tr=Tf=9.60 ps Ea=7.90 V Jitter=809 fs rms Source: Jitter=399 fs rms, Ea=477 mv, Tr=8.89 ps, Tf=8.53 ps OA3MHQM: PAGE 2 of 5

3 Physical Characteristics OA3MHQM Physical Size YQ YI XQ XI Caution, ESD Sensitive Unpack and handle only in an ESD-safe environment OA3MHQM: PAGE 3 of 5

4 Supplemental Specifications Typical Operating Conditions Absolute Max Ratings* Parameter Description Min Typ Max Vd 1 _Y, Vd 1 _X Drain Bias Voltage FET1-6 V 8 V -1 V/9 V Id 1 _Y, Id 1 _X Drain Bias Current FET1-280 ma 360 ma 500 ma Vd 2 _YI, Vd 2 _YQ, Vd 2 _XI, Vd 2 _XQ Drain Bias Voltage FET2-7.5 V 8 V -1 V/9 V Id 2 _YI, Id 2 _YQ, Id 2 _XI, Id 2 _XQ Drain Bias Current FET2-220 ma 280 ma 350 ma Vg 1 _Y, Vg 1 _X Gate Bias Voltage FET1-1 V -0.3 V 0.5 V -4 V/0.6 V Vg 2 _YI, Vg 2 _YQ, Vg 2 _XI, Vg 2 _XQ Gate Bias Voltage FET2-3 V -0.8 V 0.5 V -4 V/0.6 V P in Input Power (CW) dbm I g Gate Current FET1, FET ma P dc Power Dissipation - 10 W 15 W T BS Backside Case Temp -5 ºC ºC +125 ºC T store Storage Temperature ºC/+150 ºC V DC_Output DC RF Outputs Vd 2 _xx ±16 V V DC_Input DC RF Inputs Vg 1 _xx ±16 V Lead Soldering ºC for 5 sec *Operation beyond the values listed under the Absolute Maximum Ratings may cause permanent damage to the device. Prolonged operation at conditions outside those indicated in Typical Operating Conditions may affect device reliability. **Combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation listed above. Pin Definition Pin Function Notes RFin RF input sides YQ, YI, XI & XQ GPPO RFout RF output sides YQ, YI, XI & XQ GPPO 1: (Vg 1 _X) 1st stage gate bias, Side XI & XQ Set at typical operating specification, adjust for desired eye crossover and jitter 2: (Vd 1 _X) 1st stage drain bias, Side XI & XQ Set at typical operating specification 3: (Gnd) Supply ground Connect to power supply ground 4: (Vg 2 _XI) 2nd stage gate bias, Side XI Set at typical operating specification, adjust for desired eye crossover and jitter 5: (Vd 2 _XI) 2nd stage drain bias, Side XI Set at typical operating specification, adjust for desired eye amplitude 6: (Vg 2 _XQ) 2nd stage gate bias, Side XQ Set at typical operating specification, adjust for desired eye crossover and jitter 7: (Vd 2 _XQ) 2nd stage drain bias, Side XQ Set at typical operating specification, adjust for desired eye amplitude 8: (Vd 2 _YI) 2nd stage drain bias, Side YI Set at typical operating specification, adjust for desired eye amplitude 9: (Vg 2 _YI) 2nd stage gate bias, Side YI Set at typical operating specification, adjust for desired eye crossover and jitter 10: (Vd 2 _YQ) 2nd stage drain bias, Side YQ Set at typical operating specification, adjust for desired eye amplitude 11: (Vg 2 _YQ) 2nd stage gate bias, Side YQ Set at typical operating specification, adjust for desired eye crossover and jitter 12: (Gnd) Supply ground Connect to power supply ground 13: (Vd 1 _Y) 1st stage drain bias, Side YI&YQ Set at typical operating specification 14: (Vg 1 _Y) 1st stage gate bias, Side YI&YQ Set at typical operating specification, adjust for desired eye crossover and jitter OA3MHQM: PAGE 4 of 5

5 Module Handling Recommendations Centellax modules are designed to achieve high levels of performance when handled appropriately. As a result, specific handling precautions must be observed for device reliability and optimum performance. General Information 1. Read and follow the operating instructions. Do not exceed the minimum and maximum specifications, especially RF input power, DC bias, and environmental operating conditions. 2. Use ESD protection at all times. Ensure ESD protection is in place before handling RF input and output connectors. Ground cable conductor pins before use to remove static buildup. 3. The module must be mounted with a good thermal connection to a heatsink, sufficient to keep the backside case temperature within the specified absolute maximum ratings. Additional airflow cooling can also be used to maintain the case temperature within the specified ratings. 4. DC bias pins may be soldering to connecting bias leads or PCB. Do not exceed 260ºC soldering temperature or expose the bias pin to this temperature for more than 5 seconds. 5. Do not allow contamination to be introduced into the connectors. 6. Though it is always recommended to apply gate bias first before applying drain bias, the module is robust and so specific biasing sequencing is not necessary. 7. Do not drop or shake. Minimize vibration and handle with care. 8. There are no user-serviceable parts within. Return damaged equipment for factory-authorized repair. Refer to warranty for more information. OA3MHQM: PAGE 5 of 5