description/ordering information
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- Griffin Golden
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1 1.5 V, 1.8 V, 2.5 V, 2.85 V, 3.3 V, 5 V, and Adjustable Output Voltage Options Output Current of 800 ma Operates Down to 1.1-V Dropout DCY (SOT-223) PACKAGE (TOP VIEW) DRJ (QFN) PACKAGE (TOP VIEW) Specified Dropout Voltage at Multiple Current Levels 0.2% Line Regulation Maximum 0.4% Load Regulation Maximum Max V IN of 15 V KCS (TO-220) PACKAGE (TOP VIEW) INPUT ADJ/GND ADJ 1 8 NC *V IN 2 7 *V OUT V *V OUT IN 3 6 *V OUT *V 4 5 IN *V OUT INPUT ADJ/GND *VIN pins (2, 3, 4) must be connected together; VOUT pins (5, 6, 7) must be connected together. KTE (PowerFLEX ) PACKAGE (TOP VIEW) KTP (PowerFLEX /TO-252) PACKAGE (TOP VIEW) KTT (TO-263) PACKAGE (TOP VIEW) IN OUT ADJ/GND INPUT ADJ/GND INPUT ADJ/GND description/ordering information The TLV1117 is a positive low-dropout voltage regulator, designed to provide up to 800 ma of output current. The device is available in 1.5 V, 1.8 V, 2.5 V, 2.85 V, 3.3 V, 5 V, and adjustable output voltage options. All internal circuitry is designed to operate down to 1 V input-to-output differential. Dropout voltage is specified at a maximum of 1.3 V at 800 ma, decreasing at lower load currents. The low-profile surface-mount KTP package allows the device to be used in applications where space is limited. The TLV1117 requires a minimum of 10 F of output capacitance for stability. Output capacitors of this size or larger normally are included in most regulator designs. Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent current of the TLV1117 flows into the load, increasing efficiency. The TLV1117C device is characterized for operation over the virtual junction temperature range of 0 C to 125 C, and the TLV1117I device is characterized for operation over the virtual junction temperature range of 40 C to 125 C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. Copyright 2004, Texas Instruments Incorporated POST OFFICE BOX DALLAS, TEXAS
2 description/ordering information (continued) TJ VOTYP (V) TLV1117C ORDERING INFORMATION ORDERABLE PACKAGE PART NUMBER PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR Tube of 80 TLV CDCY Reel of 2500 TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of TLV CKTT Reel of TLV CKTTR PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR Tube of 80 TLV CDCY Reel of 2500 TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of TLV CKTT Reel of TLV CKTTR PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR Tube of 80 TLV CDCY 1.5 V SOT-223 (DCY) 1.8 V SOT-223 (DCY) 0 C to 125 C 2.5 V SOT-223 (DCY) Reel of 2500 TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of Reel of TLV CKTT TLV CKTTR PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR 2.85 V SOT-223 (DCY) Tube of 80 Reel of 2500 TLV CDCY TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of Reel of TLV CKTT TLV CKTTR PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR 3.3 V SOT-223 (DCY) Tube of 80 Reel of 2500 TLV CDCY TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of Reel of TLV CKTT TLV CKTTR TOP-SIDE MARKING *Complies with TO-252, variation AC. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at 2 POST OFFICE BOX DALLAS, TEXAS 75265
3 TJ 0 C to 125 C VOTYP (V) TLV1117C ORDERING INFORMATION (continued) ORDERABLE PACKAGE PART NUMBER PowerFLEX (KTE) Reel of 2000 TLV CKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV CKTPR QFN (DRJ) Reel of 1000 TLV CDRJR Tube of 80 TLV CDCY Reel of 2500 TLV CDCYR TO-220 (KCS) Tube of 50 TLV CKCS Tube of TLV CKTT Reel of TLV CKTTR 5 V SOT-223 (DCY) ADJ TOP-SIDE MARKING PowerFLEX (KTE) Reel of 2000 TLV1117CKTER TLV1117C PowerFLEX/TO-252* (KTP) Reel of 2000 TLV1117CKTPR TV1117 QFN (DRJ) Reel of 1000 TLV1117CDRJR SOT-223 (DCY) Tube of 80 Reel of 2500 TLV1117CDCY TLV1117CDCYR V4 TO-220 (KCS) Tube of 50 TLV1117CKCS TLV1117C Tube of Reel of TLV1117CKTT TLV1117CKTTR *Complies with TO-252, variation AC. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at POST OFFICE BOX DALLAS, TEXAS
4 TJ VOTYP (V) TLV1117I ORDERING INFORMATION ORDERABLE PACKAGE PART NUMBER PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV IDRJR Tube of 80 TLV IDCY Reel of 2500 TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS Tube of TLV IKTT Reel of TLV IKTTR PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV IDRJR Tube of 80 TLV IDCY 1.5 V SOT-223 (DCY) 40 C to 125 C 1.8 V SOT-223 (DCY) Reel of 2500 TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS Tube of Reel of TLV IKTT TLV IKTTR PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV IDRJR 2.5 V SOT-223 (DCY) Tube of 80 Reel of 2500 TLV IDCY TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS 40 C to 125 C 2.85 V SOT-223 (DCY) 40 C to 125 C 3.3 V Tube of Reel of TLV IKTT TLV IKTTR PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV IDRJR Tube of 80 Reel of 2500 TLV IDCY TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS Tube of Reel of TLV IKTT TLV IKTTR PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV IDRJR SOT-223 (DCY) Tube of 80 TLV IDCY SOT-223 (DCY) Reel of 2500 TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS Tube of Reel of TLV IKTT TLV IKTTR TOP-SIDE MARKING *Complies with TO-252, variation AC. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at 4 POST OFFICE BOX DALLAS, TEXAS 75265
5 description/ordering information (continued) TJ 40 C to 125 C VOTYP (V) TLV1117I ORDERING INFORMATION (continued) ORDERABLE PACKAGE PART NUMBER PowerFLEX (KTE) Reel of 2000 TLV IKTER PowerFLEX/TO-252* (KTP) Reel of 2000 TLV IKTPR QFN (DRJ) Reel of 1000 TLV DRJR Tube of 80 TLV IDCY Reel of 2500 TLV IDCYR TO-220 (KCS) Tube of 50 TLV IKCS Tube of TLV IKTT Reel of TLV IKTTR 5 V SOT-223 (DCY) ADJ TOP-SIDE MARKING PowerFLEX (KTE) Reel of 2000 TLV1117IKTER TLV1117I PowerFLEX/TO-252* (KTP) Reel of 2000 TLV1117IKTPR TY1117 QFN (DRJ) Reel of 1000 TLV1117IDRJR SOT-223 (DCY) Tube of 80 Reel of 2500 TLV1117IDCY TLV1117IDCYR V2 TO-220 (KCS) Tube of 50 TLV1117IKCS TLV1117I Tube of Reel of TLV1117IKTT TLV1117IKTTR *Complies with TO-252, variation AC. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at DEVICE COMPONENT COUNT Transistors Diodes Resistors Capacitors JFET Tunnels (emitter R) POST OFFICE BOX DALLAS, TEXAS
6 functional block diagram VIN Thermal Limit _ + Current Limit + _ VOUT GND/ADJ (Fixed Voltage Version) GND/ADJ (Adjustable Version) absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Continuous input voltage V Operating virtual junction temperature C Storage temperature range, T stg C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 POST OFFICE BOX DALLAS, TEXAS 75265
7 package thermal data (see Note 1) PACKAGE BOARD JP* JC JA PowerFLEX (KTE) High K, JESD C/W 23 C/W PowerFLEX/TO-252 (KTP) High K, JESD C/W 28 C/W QFN (DRJ) High K, JESD 51-5 TBD TBD SOT (DCY) High K, JESD C/W 53 C/W High K, JESD 51-5 TBD TBD TO-220 (KCS) High K, JESD C/W 19 C/W *For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θjp is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), θja, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) TA)/θJA. Operating at the absolute maximum TJ of 150 C can affect reliability. recommended operating conditions MIN MAX UNIT TLV TLV TLV VIN Input voltage TLV V TLV TLV TLV IOUT Output current 0.8 A TJ Operating virtual junction temperature range TLV1117C TLV1117I The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout (for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following: VIN(min) = VOUT(max) + rated current) C POST OFFICE BOX DALLAS, TEXAS
8 TLV1117C electrical characteristics, T J = 0 C to 125 C, all typical values are at T J = 25 C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output voltage, VOUT VIN VOUT = 2 V, IOUT = 10 ma, TJ = 25 C IOUT = 10 ma to 800 ma, VIN VOUT = 1.4 V to 10 V TLV VIN = 3.5 V, IOUT = 10 ma, TJ = 25 C VIN = 2.9 V to 10 V, IOUT = 0 to 800 ma VIN = 3.8 V, IOUT = 10 ma, TJ = 25 C VIN = 3.2 V to 10 V, IOUT = 0 to 800 ma VIN = 4.5 V, IOUT = 10 ma, TJ = 25 C VIN = 3.9 V to 10 V, IOUT = 0 to 800 ma TLV TLV TLV V VIN = 4.85 V, IOUT = 10 ma, TJ = 25 C VIN = 4.25 V to 10 V, IOUT = 0 to 800 ma TLV VIN = 4.1 V, IOUT = 0 to 500 ma VIN = 5 V, IOUT = 10 ma, TJ = 25 C VIN = 4.75 V to 10 V, IOUT = 0 to 800 ma VIN = 7 V, IOUT = 10 ma, TJ = 25 C VIN = 6.5 V to 12 V, IOUT = 0 to 800 ma TLV TLV IOUT = 10 ma, VIN VOUT = 1.5 V to V TLV % IOUT = 0 ma, VIN = 2.9 V to 10 V TLV IOUT = 0 ma, VIN = 3.2 V to 10 V TLV Line regulation IOUT = 0 ma, VIN = 3.9 V to 10 V TLV Load regulation Dropout voltage, VDO (see Note 2) IOUT = 0 ma, VIN = 4.25 V to 10 V TLV IOUT = 0 ma, VIN = 4.75 V to 15 V TLV IOUT = 0 ma, VIN = 6.5 V to 15 V TLV IOUT = 10 ma to 800 ma, VIN VOUT = 3 V TLV % IOUT = 0 to 800 ma, VIN = 2.9 V TLV IOUT = 0 to 800 ma, VIN = 3.2 V TLV IOUT = 0 to 800 ma, VIN = 3.9 V TLV IOUT = 0 to 800 ma, VIN = 4.25 V TLV IOUT = 0 to 800 ma, VIN = 4.75 V TLV IOUT = 0 to 800 ma, VIN = 6.5 V TLV IOUT = 100 ma IOUT = 500 ma V IOUT = 800 ma Current limit VIN VOUT = 5 V, TJ = 25 C A Minimum load current VIN = 15 V TLV ma Quiescent current VIN 15 V All fixed voltage options mv mv 5 10 ma Thermal regulation 30 ms pulse, TA = 25 C %/W Ripple rejection VIN VOUT = 3 V, Vripple = 1 Vpp f = 120 Hz db All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. NOTE 2: Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mv below the value of VOUT, measured at VIN = VOUT(nom) V. 8 POST OFFICE BOX DALLAS, TEXAS 75265
9 TLV1117C electrical characteristics, T J = 0 C to 125 C, all typical values are at T J = 25 C (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ADJUSTMENT pin current µa Change in ADJUSTMENT pin current IOUT = 10 ma to 800 ma, VIN VOUT = 1.4 V to 10 V µa Temperature stability TJ = full range 0.5 % Long-term stability 1000 hrs, no load TA = 125 C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 khz, % All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. POST OFFICE BOX DALLAS, TEXAS
10 TLV1117I electrical characteristics, T J = -40 C to 125 C, all typical values are at T J = 25 C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output voltage, VOUT VIN VOUT = 2 V, IOUT = 10 ma, TJ = 25 C IOUT = 10 ma to 800 ma, VIN VOUT = 1.4 V to 10 V TLV VIN = 3.5 V, IOUT = 10 ma, TJ = 25 C VIN = 2.9 V to 10 V, IOUT = 0 to 800 ma VIN = 3.8 V, IOUT = 10 ma, TJ = 25 C VIN = 3.2 V to 10 V, IOUT = 0 to 800 ma VIN = 4.5 V, IOUT = 10 ma, TJ = 25 C VIN = 3.9 V to 10 V, IOUT = 0 to 800 ma VIN = 4.85 V, IOUT = 10 ma, TJ = 25 C VIN = 4.25 V to 10 V, IOUT = 0 to 800 ma VIN = 5 V, IOUT = 10 ma, TJ = 25 C VIN = 4.75 V to 10 V, IOUT = 0 to 800 ma VIN = 7 V, IOUT = 10 ma, TJ = 25 C VIN = 6.5 V to 12 V, IOUT = 0 to 800 ma TLV TLV TLV TLV TLV TLV IOUT = 10 ma, VIN VOUT = 1.5 V to V TLV % IOUT = 0 ma, VIN = 2.9 V to 10 V TLV IOUT = 0 ma, VIN = 3.2 V to 10 V TLV Line regulation IOUT = 0 ma, VIN = 3.9 V to 10 V TLV Load regulation Dropout voltage, VDO (see Note 2) IOUT = 0 ma, VIN = 4.25 V to 10 V TLV IOUT = 0 ma, VIN = 4.75 V to 15 V TLV IOUT = 0 ma, VIN = 6.5 V to 15 V TLV IOUT = 10 ma to 800 ma, VIN VOUT = 3 V TLV % IOUT = 0 to 800 ma, VIN = 2.9 V TLV IOUT = 0 to 800 ma, VIN = 3.2 V TLV IOUT = 0 to 800 ma, VIN = 3.9 V TLV IOUT = 0 to 800 ma, VIN = 4.25 V TLV IOUT = 0 to 800 ma, VIN = 4.75 V TLV IOUT = 0 to 800 ma, VIN = 6.5 V TLV IOUT = 100 ma IOUT = 500 ma V IOUT = 800 ma Current limit VIN VOUT = 5 V, TJ = 25 C A Minimum load current VIN = 15 V TLV ma Quiescent current VIN 15 V All fixedvoltage options V mv mv 5 15 ma Thermal regulation 30-ms pulse, TA = 25 C %/W Ripple rejection VIN VOUT = 3 V, Vripple = 1 Vpp f = 120 Hz db All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. NOTE 2: Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mv below the value of VOUT, measured at VIN = VOUT(nom) V. 10 POST OFFICE BOX DALLAS, TEXAS 75265
11 TLV1117I electrical characteristics, T J = 40 C to 125 C, all typical values are at T J = 25 C (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ADJUSTMENT pin current µa Change in ADJUSTMENT pin current IOUT = 10 ma to 800 ma, VIN VOUT = 1.4 V to 10 V µa Temperature stability TJ = full range 0.5 % Long-term stability 1000 hrs, no load TA = 125 C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 khz, % All characteristics are measured with a 10-µF capacitor across the input and a 10-µF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. GRAPHS (): Figure 1. Short-Circuit Current vs (V IN V OUT ) Figure 2. Load Regulation vs Temperature Figure 3. Ripple Rejection vs Frequency (ADJ Version) Figure 4. Ripple Rejection vs Current (ADJ Version) Figure 5. Temperature Stability Figure 6. ADJ Pin Current vs Temperature Figure 7. TLV Load Transient Response Figure 8. TLV Line Transient Response Figure 9. TLV Load Transient Response Figure 10. TLV Line Transient Response Figure 11. TLV Load Transient Response Figure 12. TLV Line Transient Response POST OFFICE BOX DALLAS, TEXAS
12 APPLICATION INFORMATION 1N4002 (See Note D) TLV1117 ADJ VI INPUT VO 10 µf (see Note C) IADJ ADJ/GND VREF R1 100 µf (see Note A) CADJ (See Note B) R2 VOUT is calculated as: V OUT V REF 1 R2 (I R1 ADJ R2) Since IADJ typically is 55 µa, it is negligible in most applications. NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-µF tantalum or 50-µF aluminum B. electrolytic, with either one having an ESR between 0.3 Ω and 22 Ω. Larger COUT values benefit the regulator by improving transient response and loop stability. CADJ can be used to improve ripple rejection. Ensure that the impedance of CADJ X CADJ 1 is < R1 to prevent the ripple from being amplified. If CADJ is used, then a larger COUT is 2 f ripple C ADJ required (22-µF tantalum or 150-µF aluminum electrolytic). C. CIN is recommended if TLV1117 is not located near the power-supply filter. D. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND. Figure 13. Basic Adjustable Regulator 12 POST OFFICE BOX DALLAS, TEXAS 75265
13 MECHANICAL DATA MPDS094A APRIL 2001 REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 4 3,10 (0.122) 2,90 (0.114) 0,10 (0.004) M 7,30 (0.287) 3,70 (0.146) 6,70 (0.264) 3,30 (0.130) Gauge Plane 2,30 (0.091) ,60 (0.181) 0,84 (0.033) 0,66 (0.026) 0,10 (0.004) M ,25 (0.010) 0,75 (0.030) MIN 1,80 (0.071) MAX 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,10 (0.0040) 0,02 (0.0008) 0,08 (0.003) /B 06/2002 NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX DALLAS, TEXAS 75265
14 MECHANICAL DATA MPFM001E OCTOBER 1994 REVISED JANUARY 2001 KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT (9,52) (9,27) (9,14) (8,89) (5,59) NOM (2,03) (1,78) (1,27) (1,02) (0,25) NOM (10,67) (10,41) (7,49) NOM (8,13) (7,87) (9,14) (8,89) Thermal Tab (See Note C) (2,54) (5,08) (0,63) (0,79) (0,25) M Seating Plane (0,10) (0,13) (0,03) (0,25) NOM Gage Plane (1,04) (0,79) (0,25) /F 12/00 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the thermal tab. D. Dimensions do not include mold protrusions, not to exceed (0,15). E. Falls within JEDEC MO-169 PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX DALLAS, TEXAS
15 MECHANICAL DATA MPSF001F JANUARY 1996 REVISED JANUARY 2002 KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE (6,17) (5,91) (5,79) (5,54) (2,03) (1,78) (1,27) (1,02) (3,30) NOM (0,25) NOM (9,68) (9,42) (5,46) NOM (6,27) (6,02) (7,29) (7,03) Thermal Tab (See Note C) (2,54) (2,29) (0,81) MAX Seating Plane (2,29) (4,57) (0,79) (0,63) (0,25) M (0,13) (0,02) (0,10) (0,25) NOM Gage Plane (1,19) (0,94) (0,25) /M 01/02 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the thermal tab. D. Dimensions do not include mold protrusions, not to exceed (0,15). E. Falls within JEDEC TO-252 variation AC. PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX DALLAS, TEXAS
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18 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio Data Converters dataconverter.ti.com Automotive DSP dsp.ti.com Broadband Interface interface.ti.com Digital Control Logic logic.ti.com Military Power Mgmt power.ti.com Optical Networking Microcontrollers microcontroller.ti.com Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box Dallas, Texas Copyright 2004, Texas Instruments Incorporated
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