MAX3222E/MAX3232E/MAX3237E/MAX3241E /MAX3246E

Transcription

1 9-98; Rev ; /7 ±kv ESD-Protected, Down to na,.v to.v, General Description The MAXE/MAXE/MAX7E/MAXE/ MAXE +.powered EIA/TIA- and V.8/V. communications interface devices feature low power consumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±kv using IEC -- Air-Gap Discharge, ±8kV using IEC -- Contact Discharge (±9kV for MAXE), and ±kv using the Human Body Model. The logic and receiver I/O pins of the MAX7E are protected to the above standards, while the transmitter output pins are protected to ±kv using the Human Body Model. A proprietary low-dropout transmitter output stage delivers true RS- performance from a +.V to +.V power supply, using an internal dual charge pump. The charge pump requires only four small.µf capacitors for operation from a +.V supply. Each device guarantees operation at data rates of kbps while maintaining RS- output levels. The MAX7E guarantees operation at kbps in the normal operating mode and Mbps in the MegaBaud operating mode, while maintaining RS-- compliant output levels. The MAXE/MAXE have two receivers and two transmitters. The MAXE features a µa shutdown mode that reduces power consumption in battery-powered portable systems. The MAXE receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only µa of supply current. The MAXE and MAXE are pin, package, and functionally compatible with the industry-standard MAX and MAX, respectively. The MAXE/MAXE are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX7E (five drivers/ three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shutdown mode in which all receivers remain active, while consuming only µa (MAXE/MAXE) or na (MAX7E). The MAXE, MAXE, and MAXE are available in space-saving SO, SSOP, TQFN and TSSOP packages. The MAX7E is offered in an SSOP package. The MAXE is offered in the ultra-small x UCSP package. Battery-Powered Equipment Cell Phones Cell-Phone Data Cables Notebook, Subnotebook, and Palmtop Computers Applications Printers Smart Phones xdsl Modems Next-Generation Device Features For Space-Constrained Applications MAX8E/MAX9E: ±kv ESD-Protected, +.V to +.V, RS- Transceivers in UCSP For Low-Voltage or Data Cable Applications MAX8E/MAX8E: +.V to +.V, µa, Tx/Rx, RS- Transceivers with ±kv ESD-Protected I/O and Logic Pins Ordering Information PART TEMP RANGE PIN- PACKAGE *Dice are tested at T A = + C, DC parameters only. **EP = Exposed pad. Ordering Information continued at end of data sheet. PKG CODE MAXECTP C to +7 C Thin QFN- EP** (mm x T- mm) MAXECUP C to +7 C TSSOP MAXECAP C to +7 C SSOP MAXECWN C to +7 C 8 Wide SO MAXECPN C to +7 C 8 Plastic DIP MAXEC/D C to +7 C Dice* MAXEETP - C to +8 C Thin QFN- EP** (mm x mm) MAXEEUP - C to +8 C TSSOP MAXEEAP - C to +8 C SSOP MAXEEWN - C to +8 C 8 Wide SO MAXEEPN - C to +8 C 8 Plastic DIP MAXECAE C to +7 C SSOP MAXECWE C to +7 C Wide SO MAXECPE C to +7 C Plastic DIP T- Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet. MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc. Covered by U.S. Patent numbers,,9;,79,;,777,77;,797,899;,89,;,897,77;,999,7; and other patents pending. Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at , or visit Maxim's website at

2 ±kv ESD-Protected, Down to na,.v to.v, ABSOLUTE MAXIMUM RATINGS to...-.v to +V to (Note )...-.V to +7V to (Note )...+.V to -7V + (Note )...+V Input Voltages T_IN, EN, SHDN, MBAUD to...-.v to +V R_IN to...±v Output Voltages T_OUT to...±.v R_OUT, R_OUTB (MAX7E/MAXE)...-.V to ( +.V) Short-Circuit Duration, T_OUT to...continuous Continuous Power Dissipation (T A = +7 C) -Pin SSOP (derate 7.mW/ C above +7 C)...7mW -Pin TSSOP (derate 9.mW/ C above +7 C)...7.7mW -Pin TQFN (derate.8mw/ C above +7 C)...7mW -Pin Wide SO (derate 9.mW/ C above +7 C)...7mW 8-Pin Wide SO (derate 9.mW/ C above +7 C)...7mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS 8-Pin PDIP (derate.mw/ C above +7 C)...889mW -Pin TQFN (derate.mw/ C above +7 C)...7mW -Pin TSSOP (derate.9mw/ C above +7 C)...879mW -Pin SSOP (derate 8.mW/ C above +7 C)...mW 8-Pin SSOP (derate 9.mW/ C above +7 C)...7mW 8-Pin Wide SO (derate.mw/ C above +7 C)...W 8-Pin TSSOP (derate.8mw/ C above +7 C)...mW -Pin TQFN (derate.mw/ C above +7 C)...mW x UCSP (derate.mw/ C above +7 C)...mW Operating Temperature Ranges MAX EC... C to +7 C MAX EE...- C to +8 C Storage Temperature Range...- C to + C Lead Temperature (soldering, s)...+ C Bump Reflow Temperature (Note ) Infrared, s...+ C Vapor Phase, s...+ C Note : and can have maximum magnitudes of 7V, but their absolute difference cannot exceed V. Note : This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC A, paragraph 7., Table for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. ( = +V to +.V, C C =.µf, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = + C.) (Notes, ) PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS ( = +.V or +V, T A = + C) Supply Current Shutdown Supply Current LOGIC INPUTS SHDN =, no load MAXE, MAXE, MAXE, MAXE. MAX7E.. SHDN = µa SHDN = R_IN =, T_IN = or (MAX7E) na Input Logic Low T_IN, EN, SHDN, MBAUD.8 V Input Logic High T_IN, EN, SHDN, MBAUD = +.V. = +.V. Transmitter Input Hysteresis. V Input Leakage Current RECEIVER OUTPUTS Output Leakage Current Output-Voltage Low T_IN, EN, SHDN MAXE, MAXE, MAXE, MAXE ±. ± T_IN, SHDN, MBAUD MAX7E (Note ) 9 8 R_OUT (MAXE/MAX7E/MAXE/ MAXE), EN =, receivers disabled I OUT =.ma (MAXE/MAXE/MAXE/ MAXE), I OUT =.ma (MAX7E) ma V µa ±. ± µa. V

3 ±kv ESD-Protected, Down to na,.v to.v, ELECTRICAL CHARACTERISTICS (continued) ( = +V to +.V, C C =.µf, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = + C.) (Notes, ) PARAMETER CONDITIONS MIN TYP MAX UNITS Output-Voltage High RECEIVER INPUTS I OUT = -.ma Input Voltage Range - + V Input Threshold Low Input Threshold High T A = + C T A = + C = +.V.. = +.V.8. = +.V.. = +.V.. Input Hysteresis. V Input Resistance T A = + C 7 kω TRANSMITTER OUTPUTS Output Voltage Swing All transmitter outputs loaded with kω to ground (Note ) ± ±. V Output Resistance =, transmitter output = ±V k Ω Output Short-Circuit Current ± ma Output Leakage Current MOUSE DRIVABILITY (MAXE) Transmitter Output Voltage ESD PROTECTION R_IN, T_OUT T_IN, R_IN, R_OUT, EN, SHDN, MBAUD V C C = or +.V to +.V, V OU T = ± V, tr ansm i tter s d i sab l ed ( M AX E /M AX E /M AX E /M AX E ) TIN = TIN =, TIN =, TOUT loaded with kω to, TOUT and TOUT loaded with.ma each Human Body Model ± IEC -- Air-Gap Discharge (except MAX7E) ± IEC -- Contact Discharge (except MAX7E) ±8 IEC -- Contact Discharge (MAXE only) ±9 MAX7E Human Body Model ± IEC -- Air-Gap Discharge ± IEC -- Contact Discharge ±8 V V V ± µa ± V kv kv

4 ±kv ESD-Protected, Down to na,.v to.v, TIMING CHARACTERISTICS MAXE/MAXE/MAXE/MAXE ( = +V to +.V, C C =.µf, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = + C.) (Notes, ) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Maximum Data Rate Receiver Propagation Delay TIMING CHARACTERISTICS MAX7E ( = +V to +.V, C C =.µf, T A = T MIN to T MAX, unless otherwise noted. Typical values are at T A = + C.) (Note ) PARAMETER CONDITIONS MIN TYP MAX UNITS Maximum Data Rate Receiver Propagation Delay R L = kω, C L = pf, one transmitter switching, MBAUD = = +.V to +.V, R L = kω, C L = pf, one transmitter switching, MBAUD = = +.V to +.V, R L = kω, C L = pf, one transmitter switching, MBAUD = R_IN to R_OUT, C L = pf t PHL. t PLH. Receiver Output Enable Time Normal operation. µs Receiver Output Disable Time Normal operation. µs Transmitter Skew (Note 7) R L = kω, C L = pf, one transmitter T A = T MIN to T MAX (MAXE/MAXE/ MAXE) (Note ) switching T A = + C ( M AX E ) t PHL Receiver input to receiver output,. t PLH C L = pf. Receiver Output Enable Time Normal operation (except MAXE) ns Receiver Output Disable Time Normal operation (except MAXE) ns Transmitter Skew t PHL - t PLH (Note 7) ns Receiver Skew t PHL - t PLH ns Transition-Region Slew Rate V C C = +.V, T A = + C, R L = kω to 7kΩ, m easur ed fr om +.V to -.V or -.V to +.V, one tr ansm i tter sw i tchi ng C L = pf to pf t PHL - t PLH, MBAUD = ns t PHL - t PLH, MBAUD = Receiver Skew t PHL - t PLH ns = +.V, C L = pf MBAUD = R L = kω to 7kΩ, to pf Transition-Region Slew Rate +.V to -.V or MBAUD = V/µs -.V to +.V, C L = pf to pf, T A = + C MBAUD = Note :MAXE/MAXE/MAXE: C C =.µf tested at +.V ±%; C =.7µF, C, C, C =.µf tested at +.V ±%. MAX7E: C C =.µf tested at +.V ±%, C C =.µf tested at +.V ±%; C =.7µF, C, C, C =.µf tested at +.V ±%. MAXE: C-C =.µf tested at +.V ±%; C =.µf, C, C, C =.µf tested at +.V ±%. Note : MAXE devices are production tested at + C. All limits are guaranteed by design over the operating temperature range. Note :The MAX7E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are at the supply rails. Note : MAXEEUI is specified at T A = + C. Note 7: Transmitter skew is measured at the transmitter zero crosspoints. kbps µs V/µs kbps µs

5 ±kv ESD-Protected, Down to na,.v to.v, Typical Operating Characteristics ( = +.V, kbps data rate,.µf capacitors, all transmitters loaded with kω and C L, T A = + C, unless otherwise noted.) TRANSMITTER OUTPUT VOLTAGE (V) TRANSMITTER OUTPUT VOLTAGE (V) TRANSMITTER OUTPUT VOLTAGE (V) MAXE/MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE T TRANSMITTING AT kbps T TRANSMITTING AT.kbps V OUT+ V OUT- MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE TRANSMITTER AT kbps TRANSMITTERS AT.kbps MAX7E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = ) FOR DATA RATES UP TO kbps TRANSMITTER AT kbps TRANSMITTERS AT.kbps ALL TRANSMITTERS LOADED WITH kω + C L V OUT+ V OUT- V OUT+ V OUT- MAX7E toc MAX7E to MAX7E toc7 SLEW RATE (V/μs) SLEW RATE (V/μs) TRANSMITTER OUTPUT VOLTAGE (V) MAXE/MAXE SLEW RATE vs. LOAD CAPACITANCE +SLEW -SLEW FOR DATA RATES UP TO kbps MAXE SLEW RATE vs. LOAD CAPACITANCE MAX7E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE FOR DATA RATES UP TO kbps TRANSMITTER kbps TRANSMITTERS.kbps ALL TRANSMITTERS LOADED WITH kω + C L MAX7E toc SUPPLY CURRENT (ma) MAXE/MAXE OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCE T TRANSMITTING AT kbps T TRANSMITTING AT.kbps kbps kbps kbps V OUT + V OUT- MAX7E toc MAXE toc7a SUPPLY CURRENT (ma) TRANSMITTER OUTPUT VOLTAGE (V) MAX7E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = ) MAXE OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCE TRANSMITTER AT kbps TRANSMITTERS AT.kbps kbps Mbps TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE kω + C L LOAD, EACH OUTPUT Mbps kbps kbps Mbps.Mbps.Mbps Mbps MAX7E toc MAX7E toc MAX7E toc8

6 ±kv ESD-Protected, Down to na,.v to.v, SLEW RATE (V/μs) Typical Operating Characteristics (continued) ( = +.V, kbps data rate,.µf capacitors, all transmitters loaded with kω and C L, T A = + C, unless otherwise noted.) TRANSMITTER SKEW (ns) TRANSMITTER OUTPUT VOLTAGE (V) 8 MAX7E TRANSMITTER SKEW vs. LOAD CAPACITANCE (MBAUD = ) t PLH - t PHL TRANSMITTER AT kbps - TRANSMITTERS AT / DATA RATE - ALL TRANSMITTERS LOADED - WITH kω + C L MAX7E SLEW RATE vs. LOAD CAPACITANCE (MBAUD = ) MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE TRANSMITTER AT kbps TRANSMITTERS AT.kbps V OUT+ SR- SR- SR+ MAX7E toc9 MAX7E toc MAX7E toc SLEW RATE (V/μs) TRANSMITTER AT kbps TRANSMITTERS AT.kbps ALL TRANSMITTERS LOADED WITH kω + C L TRANSMITTER OUTPUT VOLTAGE (V) SLEW RATE (V/μs) 7 8 MAX7E SLEW RATE vs. LOAD CAPACITANCE (MBAUD = ) MAX7E TRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = ) TRANSMITTER AT kbps TRANSMITTERS AT.kbps ALL TRANSMITTERS LOADED WITH kω + pf SUPPLY VOLTAGE (V) V OUT + V OUT- MAXE SLEW RATE vs. LOAD CAPACITANCE SR+ V OUT- -SLEW, Mbps +SLEW, Mbps -SLEW, Mbps +SLEW, Mbps TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE kω + C L LOAD EACH OUTPUT MAX7E toc MAX7E toc MAX7E toc SUPPLY CURRENT (ma) SUPPLY CURRENT (ma) SUPPLY CURRENT (ma) MAX7E SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = ). MAX7E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = ) TRANSMITTER AT kbps TRANSMITTERS AT.kbps ALL TRANSMITTERS LOADED WITH kω AND pf SUPPLY VOLTAGE (V) MAXE OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCE TRANSMITTER AT kbps TRANSMITTERS AT.kbps kbps kbps kbps kbps kbps kbps TRANSMITTER AT kbps, kbps, kbps TRANSMITTERS AT.kbps ALL TRANSMITTERS LOADED WITH kω + C L MAX7E toc MAX7E toc MAX7E toc7

7 ±kv ESD-Protected, Down to na,.v to.v, TQFN PIN MAXE MAXE MAXE SO/ DIP TSSOP/ SSOP TQFN SO/DIP/ SSOP/ -PIN TSSOP -PIN TSSOP MAX7E SSOP/ SO/ TSSOP Pin Description *These pins have an active positive feedback resistor internal to the MAX7E, allowing unused inputs to be left unconnected. TQFN 9 * B EN F C F F C- 9 E C+ D C C, 7, 8,, 8, 9,,, 8, 7 9,,,, 7, 7, 8, 7,, 7,, 9,,, 7, 8 8, 9, 8, 9, 8 9,, 8, 9,,, 8,, 7*, 9*, *, *, * 9,,,,, 7, 8,, MAXE NAME FUNCTION F, E, D A, A, A, B, C C, B, A, A, A E, E, D T_OUT Receiver Enable. Active low. Positive Terminal of Voltage-Doubler Charge- Pump Capacitor +.V Generated by the Charge Pump Negative Terminal of Voltage-Doubler Charge- Pump Capacitor Positive Terminal of Inverting Charge-Pump Capacitor Negative Terminal of Inverting Charge-Pump Capacitor -.V Generated by the Charge Pump RS- Transmitter Outputs 7 R_IN R_OUT T_IN RS- Receiver Inputs TTL/CMOS Receiver Outputs TTL/CMOS Transmitter Inputs

8 ±kv ESD-Protected, Down to na,.v to.v, TQFN PIN MAXE MAXE MAXE SO/ DIP TSSOP/ SSOP TQFN SO/DIP/ SSOP/ -PIN TSSOP -PIN TSSOP MAX7E SSOP/ SO/ TSSOP TQFN Pin Description (continued) MAXE NAME FUNCTION 8 8 F Ground F +.V to +.V Supply Voltage 8 8 * B SHDN 9,,,,, 9,,, C, D, B, C, D, E, B, C, D, E * MBAUD, N.C. 9, R_OUTB EP EP EP Shutdown Control. Active low. No Connection. For MAXE, these locations are not populated with solder bumps. MegaBaud Control Input. Connect to for normal operation; connect to VCC for Mbps transmission rates. Noninverting Complementary Receiver Outputs. Always active. Exposed Pad. Solder the exposed pad to the ground plane or leave unconnected. 8

9 ±kv ESD-Protected, Down to na,.v to.v, C C.μF C+ C- C- C+ C- T_ IN R_ OUT MAXE MAXE MAX7E MAXE MAXE Detailed Description Dual Charge-Pump Voltage Converter The MAXE/MAXE/MAX7E/MAXE/ MAXE s internal power supply consists of a regulated dual charge pump that provides output voltages of +.V (doubling charge pump) and -.V (inverting charge pump) over the +.V to +.V range. The charge pump operates in discontinuous mode; if the output voltages are less than.v, the charge pump is enabled, and if the output voltages exceed.v, the charge pump is disabled. Each charge pump requires a flying capacitor (C, C) and a reservoir capacitor (C, C) to generate the and supplies (Figure ). RS- Transmitters The transmitters are inverting level translators that convert TTL/CMOS-logic levels to ±V EIA/TIA--compliant levels. The MAXE/MAXE/MAX7E/MAXE/ MAXE transmitters guarantee a kbps data rate with worst-case loads of kω in parallel with pf, providing compatibility with PC-to-PC communication software (such as LapLink ). Transmitters can be paralleled to drive multiple receivers or mice. The MAXE/MAX7E/MAXE/MAXE transmitters are disabled and the outputs are forced T_ OUT R_ IN kω MINIMUM SLEW-RATE TEST CIRCUIT Figure. Slew-Rate Test Circuits LapLink is a trademark of Traveling Software. C C C C pf (pf, MAX7E only).μf C+ C- C+ T_ IN R_ OUT MAXE MAXE MAX7E MAXE MAXE R_ IN into a high-impedance state when the device is in shutdown mode (SHDN = ). The MAXE/ MAXE/MAX7E/MAXE/MAXE permit the outputs to be driven up to ±V in shutdown. The MAXE/MAXE/MAXE/MAXE transmitter inputs do not have pullup resistors. Connect unused inputs to or. The MAX7E s transmitter inputs have a kω active positive-feedback resistor, allowing unused inputs to be left unconnected. MAX7E MegaBaud Operation For higher-speed serial communications, the MAX7E features MegaBaud operation. In MegaBaud operating mode (MBAUD = ), the MAX7E transmitters guarantee a Mbps data rate with worst-case loads of kω in parallel with pf for +.V < < +.V. For +V ±% operation, the MAX7E transmitters guarantee a Mbps data rate into worst-case loads of kω in parallel with pf. RS- Receivers The receivers convert RS- signals to CMOS-logic output levels. The MAXE/MAX7E/MAXE/ MAXE receivers have inverting three-state outputs. Drive EN high to place the receiver(s) into a highimpedance state. Receivers can be either active or inactive in shutdown (Table ). T_ OUT 7kΩ MAXIMUM SLEW-RATE TEST CIRCUIT 9 C C pf

10 ±kv ESD-Protected, Down to na,.v to.v, PROTECTION DIODE Rx UART TO μp UART Tx LOGIC TRANSITION DETECTOR PROTECTION DIODE Rx Tx SHDN = ROUTB ROUT THREE-STATED EN = TIN SHDN = PREVIOUS RS- a) OLDER RS-: POWERED-DOWN UART DRAWS CURRENT FROM A ACTIVE RECEIVER OUTPUT IN SHUTDOWN. TOUT The complementary outputs on the MAX7E/ MAXE (R_OUTB) are always active, regardless of the state of EN or SHDN. This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where drops to zero in shutdown to accommodate peripherals such as UARTs (Figure ). MAX7E/MAXE b) NEW MAX7E/MAXE: EN SHUTS DOWN RECEIVER OUTPUTS B (EXCEPT FOR B OUTPUTS), SO NO CURRENT FLOWS TO UART IN SHUTDOWN. B B OUTPUTS INDICATE RECEIVER ACTIVITY DURING SHUTDOWN WITH EN HIGH. RIN Figure. Detection of RS- Activity when the UART and Interface are Shut Down; Comparison of MAX7E/MAXE (b) with Previous Transceivers (a) V/div V/div =.V C C =.μf μs/div SHDN TOUT TOUT Figure. Transmitter Outputs Recovering from Shutdown or Powering Up MAXE/MAX7E/MAXE/ MAXE Shutdown Mode Supply current falls to less than µa in shutdown mode (SHDN = low). The MAX7E s supply current falls tona (typ) when all receiver inputs are in the invalid range (-.V < R_IN < +.V). When shut down, the device s charge pumps are shut off, is pulled down to, is pulled to ground, and the transmitter outputs are disabled (high impedance). The time required to recover from shutdown is typically µs, as shown in Figure. Connect SHDN to if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX7E/MAXE). ±kv ESD Protection As with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAXE/MAXE/MAX7E/MAXE/MAXE have extra protection against static electricity. Maxim s engineers have developed state-of-the-art structures to protect these pins against ESD of ±kv without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim s E versions keep working without latchup, whereas competing RS- products can latch and must be powered down to remove latchup. Furthermore, the MAX7E logic I/O pins also have ±kv ESD protection. Protecting the logic I/O pins to ±kv makes the MAX7E ideal for data cable applications.

11 ±kv ESD-Protected, Down to na,.v to.v, Table. MAXE/MAX7E/MAXE/ MAXE Shutdown and Enable Control Truth Table SHDN EN T_OUT R_OUT HIGH- VOLTAGE DC SOURCE R C MΩ CHARGE-CURRENT- LIMIT RESISTOR Cs pf R D Ω DISCHARGE RESISTANCE STORAGE CAPACITOR Figure a. Human Body ESD Test Model HIGH- VOLTAGE DC SOURCE R C MΩ to MΩ CHARGE-CURRENT- LIMIT RESISTOR High impedance High impedance Cs pf R D Ω DISCHARGE RESISTANCE STORAGE CAPACITOR Active High impedance Figure a. IEC -- ESD Test Model R_OUTB (MAX7E/ MAXE) Active Active Active Active Active Active High impedance Active DEVICE- UNDER- TEST DEVICE- UNDER- TEST ESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAXE/MAXE/MAXE/MAXE are characterized for protection to the following limits: ±kv using the Human Body Model ±8kV using the Contact Discharge method specified in IEC -- ±9kV (MAXE only) using the Contact Discharge method specified in IEC -- ±kv using the Air-Gap Discharge method specified in IEC -- AMPERES I P % 9%.8% % t RL Ir TIME t DL CURRENT WAVEFORM Figure b. Human Body Model Current Waveform IPEAK % 9% % tr =.7ns to ns I ns ns PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Figure b. IEC -- ESD Generator Current Waveform t

12 ±kv ESD-Protected, Down to na,.v to.v, Table. Required Minimum Capacitor Values (V) C (µf) C, C, C (µf) MAXE/MAXE/MAXE. to.... to..7.. to...7 MAX7E/MAXE. to.... to.... to..7.. to... Table. Logic-Family Compatibility with Various Supply Voltages SYSTEM POWER-SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)... COMPATIBILITY Compatible with all CMOS families Compatible with all TTL and CMOS families C om p ati b l e w i th AC T and H C T C M OS, and w i th AC, H C, or C D C M O S For the MAX7E, all logic and RS- I/O pins are characterized for protection to ±kv per the Human Body Model. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure a shows the Human Body Model, and Figure b shows the current waveform it generates when discharged into a low impedance. This model consists of a pf capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a. resistor. TRANSMITTER OUTPUT VOLTAGE (V) =.V V OUT+ V OUT- V OUT+ V OUT LOAD CURRENT PER TRANSMITTER (ma) Figure a. MAXE Transmitter Output Voltage vs. Load Current Per Transmitter IEC -- The IEC -- standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAXE/ MAXE/MAX7E/MAXE/MAXE help you design equipment that meets level (the highest level) of IEC --, without the need for additional ESDprotection components. The major difference between tests done using the Human Body Model and IEC -- is higher peak current in IEC --, because series resistance is lower in the IEC -- model. Hence, the ESD withstand voltage measured to IEC -- is generally lower than that measured using the Human Body Model. Figure a shows the IEC -- model, and Figure b shows the current waveform for the ±8kV IEC -- level ESD Contact Discharge test. The Air- Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD tests all pins using a pf storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS- inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. MAXE-figa

13 ±kv ESD-Protected, Down to na,.v to.v, = +.V TO +.V C C Figure b. Mouse Driver Test Circuit MAXE Applications Information Capacitor Selection The capacitor type used for C C is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires.µf capacitors for.v operation. For other supply voltages, see Table for required capacitor values. Do not use values smaller than those listed in Table. Increasing the capacitor values (e.g., by a factor of ) reduces ripple on the transmitter outputs and slightly reduces power consumption. C, C, and C can be increased without changing C s value. However, do not increase C without also increasing the values of C, C, C, and CBYPASS to maintain the proper ratios (C to the other capacitors). When using the minimum required capacitor values, make sure the capacitor value does not degrade C+ C- TIN C- C+ TIN TIN ROUTB ROUTB ROUT ROUT ROUT ROUT ROUT EN C BYPASS TOUT 9 TOUT TOUT RIN RIN RIN RIN 7 RIN 8 7 SHDN C C COMPUTER SERIAL PORT excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor s equivalent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on and. Power-Supply Decoupling In most circumstances, a.µf bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as chargepump capacitor C. Connect bypass capacitors as close to the IC as possible. Operation Down to.7v Transmitter outputs meet EIA/TIA- levels of ±.7V with supply voltages as low as.7v. +V +V -V Tx MOUSE

14 ±kv ESD-Protected, Down to na,.v to.v, Transmitter Outputs Recovering from Shutdown Figure shows two transmitter outputs recovering from shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS- levels (one transmitter input is high; the other is low). Each transmitter is loaded with kω in parallel with pf. The transmitter outputs display no ringing or undesirable transients as they come out of shutdown. Note that C C Figure 7. Loopback Test Circuit TIN TOUT ROUT.μF C+ C- C- C+ T_ IN R_ OUT =.V C C =.μf μs/div Figure 8. MAXE Loopback Test Result at kbps MAXE MAXE MAX7E MAXE MAXE T_ OUT R_ IN C C pf V/div V/div V/div the transmitters are enabled only when the magnitude of exceeds approximately -.V. Mouse Drivability The MAXE is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manufacturers such as Microsoft and Logitech. The MAXE successfully drove all serial mice tested and met their current and voltage requirements. TIN TOUT ROUT =.V, C C =.μf μs/div Figure 9. MAXE Loopback Test Result at kbps +V +V -V +V =.V C C =.μf ns/div T_IN V/div V/div V/div T_OUT + pf R_OUT Figure. MAX7E Loopback Test Result at kbps (MBAUD = )

15 ±kv ESD-Protected, Down to na,.v to.v, Figure a shows the transmitter output voltages under increasing load current at +.V. Figure b shows a typical mouse connection using the MAXE. High Data Rates The MAXE/MAXE/MAX7E/MAXE/ MAXE maintain the RS- ±V minimum transmitter output voltage even at high data rates. Figure 7 shows a transmitter loopback test circuit. Figure 8 shows a loopback test result at kbps, and Figure 9 shows the same test at kbps. For Figure 8, all transmitters were driven simultaneously at kbps into RS- loads in parallel with pf. For Figure 9, a single transmitter was driven at kbps, and all transmitters were loaded with an RS- receiver in parallel with pf. The MAX7E maintains the RS- ±.V minimum transmitter output voltage at data rates up to Mbps. Figure shows a loopback test result at Mbps with MBAUD =. For Figure, all transmitters were loaded with an RS- receiver in parallel with pf. Interconnection with V and V Logic The MAXE/MAXE/MAX7E/MAXE/ MAXE can directly interface with various V logic families, including ACT and HCT CMOS. See Table for more information on possible combinations of interconnections. Table. Reliability Test Data Temperature Cycle TEST CONDITIONS DURATION T A = - C to +8 C, T A = - C to + C UCSP Reliability The UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it. Mechanical stress performance is a greater consideration for a UCSP package. UCSPs are attached through direct solder contact to the user s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be considered. Table shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through environmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in Application Note 89: Wafer-Level Packaging (WLP) and Its Applications. cycles, 9 cycles FAILURES PER SAMPLE SIZE Operating Life T A = +7 C hours / Moisture Resistance T A = + C to + C, 9% RH hours / Low-Temperature Storage T A = - C hours / Low-Temperature Operational T A = - C hours / Solderability 8-hour steam age / ESD ±kv, Human Body Model / High-Temperature Operating Life /, / T J = + C 8 hours /

16 ±kv ESD-Protected, Down to na,.v to.v, Pin Configurations SHDN TOUT C- C+ EN RIN ROUT TIN TIN TOUT C- C+ 9 RIN ROUT TSSOP/SSOP N.C. N.C. MAXE N.C. TOUT C- C+ N.C. RIN ROUT TIN ROUT TOUT C- C+ 9 RIN N.C. TSSOP TIN N.C. MAXE TOUT RIN C+ C- C+ MAXE ROUT TIN TIN ROUT RIN TOUT C- SO/DIP/SSOP/TSSOP C+ C- EN ROUT SHDN ROUTB ROUTB ROUT ROUT ROUT ROUT TIN TIN TIN TOUT TOUT TOUT RIN RIN RIN RIN RIN C- C+ SSOP/SO/TSSOP TQFN MAXE TOP VIEW C+ C- TIN TIN MBAUD TIN ROUT ROUT TIN ROUT TIN ROUTB SHDN EN TOUT RIN TOUT RIN RIN TOUT TOUT TOUT C- C+ SSOP MAX7E SHDN TOUT C- C+ EN RIN ROUT TIN TIN TOUT C- C+ 9 ROUT RIN SO/DIP MAXE N.C. C- C+ C+ VCC N.C. 9 N.C. TIN TIN TIN ROUT ROUT ROUT N.C ROUT ROUT ROUTB ROUTB SHDN EN C- 8 7 TOUT TOUT TOUT RIN RIN RIN RIN MAXE RIN TOP VIEW

17 ±kv ESD-Protected, Down to na,.v to.v, TOP VIEW SHDN EN TOUT C+ RIN C+ ROUT N.C. TIN TIN EXPOSED PAD B: SHDN C: ROUT D: TIN E: TIN B: EN E: TIN BUMPS B, B, C, C, C, D, D, D, E, AND E NOT POPULATED MAXE TQFN TOP VIEW (BUMPS ON BOTTOM) ROUT ROUT C- C- C+ A B C D E F ROUT N.C. ROUT RIN TOUT TOP VIEW Pin Configurations (continued) C+ A A A A A B C D E F ROUT B E F C+ UCSP RIN MAXE F C- RIN F TOUT C- C- RIN EXPOSED PAD C+ C- ROUT TIN 9 MAXE TQFN 7 B C D E F RIN RIN RIN TOUT TOUT TOUT 8 7 TIN ROUT RIN TOUT

18 ±kv ESD-Protected, Down to na,.v to.v, Typical Operating Circuits C BYPASS C.μF C.μF TTL/CMOS INPUTS TTL/CMOS OUTPUTS +.V C+ C+ TIN TIN ROUT ROUT EN 7 MAXE *C CAN BE RETURNED TO EITHER OR GROUND. 7 TOUT TOUT 8 RIN RIN 9 SHDN 8 C*.μF C.μF NOTE: PIN NUMBERS REFER TO SO/DIP PACKAGES. MAXE PINOUT REFERS TO SO/DIP PACKAGES. MAXE PINOUT REFERS TO TSSOP/SSOP/SO/DIP PACKAGES RS- OUTPUTS RS- INPUTS C BYPASS C.μF C.μF TTL/CMOS INPUTS TTL/CMOS OUTPUTS +.V 9 C+ C- C- C+ C- C- TIN TIN ROUT ROUT SEE TABLE FOR CAPACITOR SELECTION. MAXE TOUT TOUT 7 RIN RIN 8 C*.μF C.μF RS- OUTPUTS RS- INPUTS 8

19 ±kv ESD-Protected, Down to na,.v to.v, Typical Operating Circuits (continued) +.V.μF.μF LOGIC INPUTS LOGIC OUTPUTS C BYPASS C+ C- C- C+ C- TIN TIN TIN TIN TIN ROUTB ROUT ROUT ROUT EN R R R T T T MAX7E T T TOUT TOUT RIN 8 7 TOUT 7 TOUT TOUT RIN 9 RIN MBAUD SHDN C*.μF.μF RS- OUTPUTS RS- INPUTS +.V C.μF C.μF TTL/CMOS INPUTS TTL/CMOS OUTPUTS *C CAN BE RETURNED TO EITHER OR GROUND. C BYPASS C+ C- C+ TIN TIN TIN ROUTB ROUTB ROUT ROUT ROUT ROUT ROUT EN MAXE TOUT 9 TOUT TOUT 7 RIN RIN RIN RIN 7 RIN 8 SHDN C*.μF C.μF RS- OUTPUTS RS- INPUTS

20 ±kv ESD-Protected, Down to na,.v to.v, Typical Operating Circuits (continued) +.V C.μF C.μF TTL/CMOS INPUTS TTL/CMOS OUTPUTS C BYPASS F F E D E E D C B A A A B C+ C- C- C+ TIN TIN TIN ROUT ROUT ROUT ROUT ROUT EN F RIN RIN RIN RIN RIN SHDN C *C CAN BE RETURNED TO EITHER OR GROUND. F MAXE TOUT TOUT TOUT F C F E D A A A B B C*.μF C.μF RS- OUTPUTS RS- INPUTS

21 ±kv ESD-Protected, Down to na,.v to.v, PART NO. OF DRIVERS/ RECEIVERS Selector Guide LOW-POWER SHUTDOWN GUARANTEED DATA RATE (bps) MAXE / k MAXE / k MAX7E (Normal) MAX7E (MegaBaud) / k / M MAXE / k MAXE / k Chip Information TRANSISTOR COUNT: MAXE/MAXE: 9 MAX7E: MAXE: MAXE: 8 PROCESS: BICMOS Ordering Information (continued) PART TEMP RANGE PIN- PACKAGE MAXECTE C to +7 C Thin QFN- EP** (mm x mm) MAXECUE C to +7 C TSSOP MAXECUP C to +7 C TSSOP MAXEEAE - C to +8 C SSOP MAXEEWE - C to +8 C Wide SO MAXEEPE - C to +8 C Plastic DIP MAXEETE - C to +8 C Thin QFN- EP** (mm x mm) MAXEEUE - C to +8 C TSSOP MAXEEUP - C to +8 C TSSOP MAX7ECAI C to +7 C 8 SSOP MAX7EEAI - C to +8 C 8 SSOP MAXECAI C to +7 C 8 SSOP MAXECWI C to +7 C 8 Wide SO MAXECUI C to +7 C 8 TSSOP MAXECTJ C to +7 C Thin QFN MAXEEAI - C to +8 C 8 SSOP MAXEEWI - C to +8 C 8 Wide SO MAXEEUI - C to +8 C 8 TSSOP MAXECBX-T C to +7 C x UCSP MAXEEBX-T - C to +8 C x UCSP PKG CODE T- T- Requires solder temperature profile described in the Absolute Maximum Ratings section. UCSP Reliability is integrally linked to the user s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this datasheet for more information. **EP = Exposed pad.

22 ±kv ESD-Protected, Down to na,.v to.v, Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to QFN THIN.EPS

23 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to

24 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to TSSOP.mm.EPS

25 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to PACKAGE OUTLINE, x UCSP -8 K L,UCSP.EPS

26 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to N e TOP VIEW D FRONT VIEW B A E A H C L SIDE VIEW -8 INCHES MILLIMETERS DIM MIN MAX MIN MAX A.9... A.... B C.9... e..7 E H L....7 VARIATIONS: DIM D D D INCHES MIN MAX MIN MAX N MS AA AB.9... AC PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE,." SOIC APPROVAL MILLIMETERS D AD D AE DOCUMENT CONTROL NO. REV. - B SOICW.EPS

27 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to e D B N E A A DIM A A B C D E e H L INCHES MILLIMETERS MIN MAX MIN MAX SEE VARIATIONS BSC. BSC NOTES:. D&E DO NOT INCLUDE MOLD FLASH.. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED. MM (.").. CONTROLLING DIMENSION: MILLIMETERS.. MEETS JEDEC MO.. LEADS TO BE COPLANAR WITHIN. MM. H L PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, SSOP,. MM DOCUMENT CONTROL NO. - C 7 D D D D D APPROVAL INCHES MIN MAX MILLIMETERS MIN MAX C L L REV. N L L 8L SSOP.EPS

28 ±kv ESD-Protected, Down to na,.v to.v, Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to PDIPN.EPS 8

29 ±kv ESD-Protected, Down to na,.v to.v, REVISION NUMBER REVISION DATE DESCRIPTION Revision History PAGES CHANGED /7 Corrected Package Information 8 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, San Gabriel Drive, Sunnyvale, CA Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.