±15kV ESD-Protected, +5V RS-232 Transceivers

Transcription

1 AVAILABLE MAX0E MAXE, MAXE/MAXE General Description The MAX0E MAXE, MAXE/MAXE line drivers/receivers are designed for RS- and V. communications in harsh environments. Each transmitter output and receiver input is protected against ±kv electrostatic discharge (ESD) shocks, without latchup. The various combinations of features are outlined in the Selector Guide. The drivers and receivers for all ten devices meet all EIA/TIA-E and CCITT V. specifications at data rates up to 0kbps, when loaded in accordance with the EIA/TIA-E specification. The MAXE/MAXE/MAXE are available in - pin SO packages, as well as a -pin SSOP that uses 0% less board space. The MAX0E/MAXE come in -pin TSSOP, narrow SO, wide SO, and DIP packages. The MAX0E comes in a 0-pin DIP/SO package, and needs no external charge-pump capacitors. The MAX0E comes in a -pin wide DIP package, and also eliminates external charge-pump capacitors. The MAX0E/MAX0E/MAX0E come in -pin SO, SSOP, and narrow DIP packages. The MAXE/MAXE operate with four µf capacitors, while the MAX0E/MAX0E/MAX0E/MAX0E/ MAXE/MAXE operate with four 0.µF capacitors, further reducing cost and board space. Applications Notebook, Subnotebook, and Palmtop Computers Battery-Powered Equipment Hand-Held Equipment Next-Generation Device Features For Low-Voltage Applications MAXE/MAXE/MAXE/MAXE/ MAXE: ±kv ESD-Protected Down to 0nA, +.0V to +.V, Up to Mbps, True RS- Transceivers (MAXE Available in a UCSP Package) For Low-Power Applications MAX/MAX/MAX: µa Supply Current, True +V to +.V RS- Transceivers with Auto-Shutdown For Space-Constrained Applications MAXE/MAXE: ±kv ESD-Protected, µa, 0kbps, +.0V/+.V, Dual RS- Transceivers with Internal Capacitors For Low-Voltage or Data Cable Applications MAX0E/MAXE: +.V to +.V, µa, Tx/Rx RS- Transceivers with ±kv ESD- Protected I/O and Logic Pins PART MAX0ECPE MAX0ECSE Ordering Information TEMP RANGE 0 C to +0 C 0 C to +0 C PIN-PACKAGE Plastic DIP Narrow SO Ordering Information continued at end of data sheet. Pin Configurations and Typical Operating Circuits appear at end of data sheet. AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc. Selector Guide PART NO. OF RS- DRIVERS NO. OF RS- RECEIVERS RECEIVERS ACTIVE IN SHUTDOWN NO. OF EXTERNAL CAPACITORS (µf) LOW-POWER SHUTDOWN MAX0E 0 (0.) No No MAX0E 0 None No No TTL TRI- STATE MAX0E 0 None Yes Yes MAX0E 0 (0.) Yes Yes MAX0E 0 (0.) No No MAX0E 0 (0.) No No MAXE 0 (0.) Yes Yes MAXE (0.) Yes Yes MAXE 0 () No No MAXE 0 () Yes Yes For pricing, delivery, and ordering information, please contact Maxim Direct at ---, or visit Maxim s website at -0; Rev ; /0

2 ABSOLUTE MAXIMUM RATINGS...-0.V to +V...( - 0.V) to +V...-V to +0.V Input Voltages T_IN...-0.V to ( + 0.V) R_IN...±0V Output Voltages T_OUT...( - 0.V) to ( + 0.V) R_OUT...-0.V to ( + 0.V) Short-Circuit Duration, T_OUT...Continuous Continuous Power Dissipation (T A = +0 C) -Pin Plastic DIP (derate 0.mW/ C above +0 C)...mW -Pin Narrow SO (derate.0mw/ C above +0 C)...mW -Pin Wide SO (derate.mw/ C above +0 C)...mW -Pin TSSOP (derate.mw/ C above +0 C)...mW 0-Pin Plastic DIP (derate.mw/ C above +0 C)...mW 0-Pin SO (derate 0.00mW/ C above +0 C)...00mW -Pin Narrow Plastic DIP (derate.mw/ C above +0 C)...0W -Pin Wide Plastic DIP (derate.mw/ C above +0 C)...W -Pin SO (derate.mw/ C above +0 C)...mW -Pin SSOP (derate.00mw/ C above +0 C)...0mW -Pin SO (derate.0mw/ C above +0 C)...W -Pin SSOP (derate.mw/ C above +0 C)...mW Operating Temperature Ranges MAX EC...0 C to +0 C MAX EE...-0 C to + C Storage Temperature Range...- C to + C Lead Temperature (soldering, 0s) C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = ±0% for MAX0E/0E/0E/E/E/E/E; = ±% for MAX0E/0E/0E; C C = 0.µF for MAX0E/0E/0E/0E/E/E; C C = µf for MAXE/E; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at T A = + C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS MAX0E/0E MAX0E 0E 0 Supply Current I CC No load, T A = + C MAXE/E 0 ma MAXE 0 MAXE MAX0E/0E 0 Shutdown Supply Current T A = + C, Figure MAXE/E 0 µa MAXE 0 LOGIC Input Pullup Current T_IN = 0V (MAX0E 0E/E/E/E) 00 µa Input Leakage Current T_IN = 0V to (MAX0E/0E/E) ±0 µa Input Threshold Low Input Threshold High Output-Voltage Low V IL V IH V OL T_IN; EN, SHDN (MAXE) or EN, SHDN (MAX0E 0E/E/E) T_IN EN, SHDN (MAXE) or EN, SHDN (MAX0E 0E/E/E) R_OUT; I OUT =.ma (MAX0E/0E/E) or I OUT =.ma (MAX0E/0E/E/E/E) V V V Output-Voltage High V OH EN = VCC, EN = 0V, 0V ROUT VCC, R_OUT; I OUT = -.0mA V Output Leakage Current MAX0E 0E/E/E/E outputs disabled ±0.0 ±0 µa Maxim Integrated

3 ELECTRICAL CHARACTERISTICS (continued) ( = ±0% for MAX0E/0E/0E/E/E/E/E; = ±% for MAX0E/0E/0E; C C = 0.µF for MAX0E/0E/0E/0E/E/E; C C = µf for MAXE/E; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at T A = + C.) PARAMETER SYMBOL EIA/TIA-E RECEIVER Input Voltage Range Input Threshold Low Input Threshold High Input Hysteresis Input Resistance EIA/TIA-E TRANSMITTER Output Voltage Swing Output Resistance T A = + C, = V T A = + C, = V CONDITIONS All parts, normal operation = V, no hysteresis in shutdown T A = + C, = V All drivers loaded with kω to ground (Note ) = = = 0V, V OUT = ±V MIN TYP MAX MAXE, SHDN = 0V, EN = 0.. All parts, normal operation MAXE (R, R), SHDN = 0V, EN = ± ± UNITS V V V V kω V Ω Output Short-Circuit Current ±0 ±0 ma TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay Receiver Output Enable Time Receiver Output Disable Time Transmitter Propagation Delay t PLHR, t PHLR t PLHT, t PHLT R L = kω to kω, C L = 0pF to 000pF, one transmitter switching C L = 0pF All parts, normal operation MAXE (R, R), SHDN = 0V, EN = MAX0E/0E/E/E/E normal operation, Figure MAX0E/0E/E/E/E normal operation, Figure R L = kω, C L = 00pF, all transmitters loaded µs kbps µs ns ns Transition-Region Slew Rate T A = + C, = V, R L = kω to kω, C L = 0pF to 000pF, measured from -V to +V or +V to -V, Figure 0 V/µs ESD PERFORMANCE: TRANSMITTER, RECEIVER Human Body Model ± ESD-Protection Voltage IEC000--, Contact Discharge ± Note : MAXEE and MAXEE tested IEC000--, with = Air-Gap ±%. Discharge ± Note : MAXEE tested with = ±%. kv Maxim Integrated

4 Typical Operating Characteristics (Typical Operating Circuits, =, T A = + C, unless otherwise noted.).0. MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω MAX0E-TOC.0. MAX0E/MAX0E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω MAX0E-TOC.0. MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω MAX0E-TOC VOH, -VOL (V).0..0 =.0V =.V VOH, -VOL (V).0..0 =.0V =.V VOH, -VOL (V).0..0 =.0V =.V..0 0 =.V LOAD CAPACITANCE (pf)..0 0 =.V LOAD CAPACITANCE (pf)..0 0 =.V LOAD CAPACITANCE (pf).0. MAXE/MAXE TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω MAX0E-TOC 0 MAXE/MAXE/MAXE TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω MAX0E-TOC VOH, -VOL (V).0..0 =.V SLEW RATE ( V/μs) 0 0 -SLEW RATE..0 =.V =.0V LOAD CAPACITANCE (pf) 0 0 +SLEW RATE LOAD CAPACITANCE (pf) Maxim Integrated

5 Typical Operating Characteristics (continued) (Typical Operating Circuits, =, T A = + C, unless otherwise noted.) SLEW RATE ( V/μs) 0 0 MAX0E/MAX0E/MAXE TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE. ALL TRANSMITTERS LOADED DATA RATE = 0kbps R L = kω.0 +SLEW RATE -SLEW RATE LOAD CAPACITANCE (pf) MAX0E-TOC OUTPUT VOLTAGE (V) MAX0E MAX0E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE 0kbps = +.V, R L = kω TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE 0kbps LOAD CAPACITANCE (pf) 0kbps 0kbps 0kbps 0kbps MAX0E TOC-0 SLEW RATE (V/μs) MAX0E MAX0E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE = +.V, R L = kω TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE FALL RISE LOAD CAPACITANCE (pf) MAX0E TOC-0 SUPPLY CURRENT (ma) MAX0E MAX0E SUPPLY CURRENT vs. LOAD CAPACITANCE = +.V, R L = kω TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE LOAD CAPACITANCE (pf) 0kbps 0kbps 0kbps MAX0E TOC-0 OUTPUT VOLTAGE (V) MAX0E MAX0E OUTPUT VOLTAGE vs. DATA RATE V OUT + = +.V, R L = kω TRANSMITTER AT FULL DATA RATE TRANSMITTERS AT / DATA RATE V OUT DATA RATE (kbps) MAX0E TOC-0 Maxim Integrated

6 Pin Descriptions MAX0E/MAXE DIP/SO/TSSOP,,,,, 0, PIN LCC,,, 0,,, 0,,, NAME C+, C-, C- T_OUT R_IN R_OUT T_IN N.C. FUNCTION Terminals for Positive Charge-Pump Capacitor + Voltage Generated by the Charge Pump Terminals for Negative Charge-Pump Capacitor - Voltage Generated by the Charge Pump RS- Driver Outputs RS- Receiver Inputs RS- Receiver Outputs RS- Driver Inputs Ground +.V to +.V Supply-Voltage Input No Connection Not Internally Connected MAX0E PIN DIP SO NAME FUNCTION,, T_IN RS- Driver Inputs, 0, 0 R_OUT RS- Receiver Outputs,, R_IN RS- Receiver Inputs,, T_OUT RS- Transmitter Outputs,, Ground +.V to +.V Supply-Voltage Input C+ Make no connection to this pin. 0,, C- Connect pins together., 0, - Voltage Generated by the Charge Pump. Connect pins together. C- Make no connection to this pin. + Voltage Generated by the Charge Pump,, Connect pins together. MAX0E PIN,, 0,,,,,,,,,,, 0 NAME FUNCTION T_OUT RS- Driver Outputs R_IN RS- Receiver Inputs R_OUT Receiver Outputs. All receivers are inactive in shutdown. T_IN Driver Inputs. Internal pullups to. Ground +.V to +.V Supply Voltage EN Receiver Enable Active Low SHDN Shutdown Control Active High Maxim Integrated

7 Pin Descriptions (continued) MAX0E PIN,,,,,,,,,, 0,, 0 NAME FUNCTION T_OUT RS- Driver Outputs R_IN RS- Receiver Inputs R_OUT Receiver Outputs. All receivers are inactive in shutdown. T_IN Driver Inputs. Internal pullups to. Ground +.V to +.V Supply Voltage C+, C- Terminals for Positive Charge-Pump Capacitor + Generated by the Charge Pump, C- Terminals for Negative Charge-Pump Capacitor - Generated by the Charge Pump EN Receiver Enable Active Low SHDN Shutdown Control Active High MAX0E PIN,,, 0,,,,,,,,, 0,, NAME FUNCTION T_OUT RS- Driver Outputs R_IN RS- Receiver Inputs R_OUT Receiver Outputs. All receivers are inactive in shutdown. T_IN Driver Inputs. Internal pullups to. Ground +.V to +.V Supply Voltage C+, C- Terminals for Positive Charge-Pump Capacitor + Generated by the Charge Pump, C- Terminals for Negative Charge-Pump Capacitor - Generated by the Charge Pump MAX0E PIN,, 0,,,,,,,,,, 0,, NAME FUNCTION T_OUT RS- Driver Outputs R_IN RS- Receiver Inputs R_OUT Receiver Outputs. All receivers are inactive in shutdown. T_IN Driver Inputs. Internal pullups to. Ground +.V to +.V Supply Voltage C+, C- Terminals for Positive Charge-Pump Capacitor + Generated by the Charge Pump, C- Terminals for Negative Charge-Pump Capacitor - Generated by the Charge Pump Maxim Integrated

8 Pin Descriptions (continued) MAXE/MAXE/MAXE PIN,,,,,,,,,,,,, 0, 0,, NAME FUNCTION T_OUT RS- Driver Outputs R_IN RS- Receiver Inputs R_OUT Receiver Outputs. For the MAXE, receivers R and R are active in shutdown mode when EN =. For the MAXE and MAXE, all receivers are inactive in shutdown. T_IN Driver Inputs. Only the MAXE, MAXE, and MAXE have internal pullups to. Ground +.V to +.V Supply Voltage C+, C- Terminals for Positive Charge-Pump Capacitor + Voltage Generated by the Charge Pump, C- Terminals for Negative Charge-Pump Capacitor - Voltage Generated by the Charge Pump EN Receiver Enable Active Low (MAXE, MAXE) EN Receiver Enable Active High (MAXE) SHDN SHDN Shutdown Control Active High (MAXE, MAXE) Shutdown Control Active Low (MAXE) +.V 0V OR +.V DRIVE +.V +.V (0V) ( ) ARE FOR MAXE * μf FOR MAXE I SHDN C+ C- MAX0E MAXE MAXE C- MAXE T TO T T_IN T_OUT R TO R R_OUT EN (EN) SHDN (SHDN) R_IN +.V kω CAPACITORS MAY BE POLARIZED OR UNPOLARIZED Figure. Shutdown-Current Test Circuit (MAX0E, MAXE/MAXE/MAXE) EN INPUT NOTE: POLARITY OF EN IS REVERSED FOR THE MAXE +V RECEIVER OUTPUT C L = 0pF EN INPUT RECEIVER 0V 0V V OH +.V +0.V +V OUTPUT ENABLE TIME V OH - 0.V V R L = kω OL V OL + 0.V OUTPUT DISABLE TIME +.V Figure. Receiver Output Enable and Disable Timing (MAX0E/MAX0E/MAXE/MAXE/MAXE) Maxim Integrated

9 C+ C- MAX E C- T_ T_IN T_OUT C+ C- MAX E C- T_ T_IN T_OUT R_OUT R_ R_IN kω 00pF R_OUT R_ R_IN kω 0pF 0V () EN (EN) 0V () EN (EN) 0V () SHDN (SHDN) 0V () SHDN (SHDN) MINIMUM SLEW-RATE TEST CIRCUIT ( ) ARE FOR MAXE * μf FOR MAXE/MAXE MAXIMUM SLEW-RATE TEST CIRCUIT TRANSMITTER INPUT PULL-UP RESISTORS, ENABLE, AND SHUTDOWN ARE NOT PROVIDED ON THE MAX0E, MAX0E, AND MAXE. ENABLE AND SHUTDOWN ARE NOT PROVIDED ON THE MAX0E AND MAX0E. Figure. Transition Slew-Rate Circuit Detailed Description The MAX0E MAXE, MAXE/MAXE consist of three sections: charge-pump voltage converters, drivers (transmitters), and receivers. These E versions provide extra protection against ESD. They survive ±kv discharges to the RS- inputs and outputs, tested using the Human Body Model. When tested according to IEC000--, they survive ±kv contactdischarges and ±kv air-gap discharges. The rugged E versions are intended for use in harsh environments or applications where the RS- connection is frequently changed (such as notebook computers). The standard (non- E ) MAX0, MAX0, MAX0 MAX0, MAX, MAX, MAX, and MAX are recommended for applications where cost is critical. to ±0V Dual Charge-Pump Voltage Converter The to ±0V conversion is performed by dual charge-pump voltage converters (Figure ). The first charge-pump converter uses capacitor C to double the into +0V, storing the +0V on the output filter capacitor, C. The second uses C to invert the +0V into -0V, storing the -0V on the output filter capacitor, C. In shutdown mode, is internally connected to by a kω pull-down resistor, and is internally connected to ground by a kω pull up resistor. RS- Drivers With VCC = V, the typical driver output voltage swing is ±V when loaded with a nominal RS- receiver. The output swing is guaranteed to meet EIA/TIA-E and V. specifications that call for ±V minimum output levels under worst-case conditions. These include a kω load, minimum VCC, and maximum operating temperature. The open-circuit output voltage swings from ( - 0.V) to. Input thresholds are CMOS/TTL compatible. The unused drivers inputs on the MAX0E MAX0E, MAXE, MAXE, and MAXE can be left unconnected because pull up resistors to VCC are included on-chip. Since all drivers invert, the pull up resistors force the unused drivers outputs low. The MAX0E, MAX0E, and MAXE do not have pull up resistors on the transmitter inputs. Maxim Integrated

10 S C+ S S S C C C I L + R L + C I L - R L - S S S S C- C- V - f CLK PART f CLK (khz) MAX0E MAX0E 0 0 MAX0E 0E 00 MAXE/E MAXE 00 0 MAXE 0 Figure. Charge-Pump Diagram When in low-power shutdown mode, the MAX0E/ MAX0E/MAXE/MAXE/MAXE driver outputs are turned off and draw only leakage currents even if they are back-driven with voltages between 0V and V. Below -0.V in shutdown, the transmitter output is diode-clamped to ground with a kω series impedance. RS- Receivers The receivers convert the RS- signals to CMOS-logic output levels. The guaranteed 0.V and.v receiver input thresholds are significantly tighter than the ±V thresholds required by the EIA/TIA-E specification. This allows the receiver inputs to respond to logic levels, as well as RS- levels. The guaranteed 0.V input low threshold ensures that receivers shorted to ground have a logic output. The input resistance to ground ensures that a receiver with its input left open will also have a logic output. Receiver inputs have approximately 0.V hysteresis. This provides clean output transitions, even with slow rise/fall-time signals with moderate amounts of noise and ringing. In shutdown, the MAXE s R and R receivers have no hysteresis. Shutdown and Enable Control (MAX0E/MAX0E/MAXE/ MAXE/MAXE) In shutdown mode, the charge pumps are turned off, is pulled down to VCC, is pulled to ground, and the transmitter outputs are disabled. This reduces supply current typically to µa (µa for the MAXE). The time required to exit shutdown is under ms, as shown in Figure. Receivers All MAXE receivers, except R and R, are put into a high-impedance state in shutdown mode (see Tables a and b). The MAXE s R and R receivers still function in shutdown mode. These two awake-inshutdown receivers can monitor external activity while maintaining minimal power consumption. The enable control is used to put the receiver outputs into a high-impedance state, to allow wire-or connection of two EIA/TIA-E ports (or ports of different types) at the UART. It has no effect on the RS- drivers or the charge pumps. Note: The enable control pin is active low for the MAXE/MAXE (EN), but is active high for the MAXE (EN). The shutdown control pin is active high for the MAX0E/MAX0E/MAXE/MAXE (SHDN), but is active low for the MAXE (SHDN). 0 Maxim Integrated

11 The MAXE s receiver propagation delay is typically 0.µs in normal operation. In shutdown mode, propagation delay increases to µs for both rising and falling transitions. The MAXE s receiver inputs have approximately 0.V hysteresis, except in shutdown, when receivers R and R have no hysteresis. When entering shutdown with receivers active, R and R are not valid until 0µs after SHDN is driven low. When coming out of shutdown, all receiver outputs are invalid until the charge pumps reach nominal voltage levels (less than ms when using 0.µF capacitors). ±kv ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs have extra protection against static electricity. Maxim s engineers developed state-of-the-art structures to protect these pins against ESD of ±kv without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim s E versions keep working without latchup, whereas competing RS- products can latch and must be powered down to remove latchup. ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits: ) ±kv using the Human Body Model ) ±kv using the contact-discharge method specified in IEC000-- ) ±kv using IEC000-- s air-gap method. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test set-up, test methodology, and test results. Human Body Model Figure a shows the Human Body Model, and Figure b shows the current waveform it generates when discharged into a low impedance. This model consists of a 00pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a. resistor. V 0V 0V V 0V -V -0V MAXE 00μs/div SHDN Figure. MAXE and when Exiting Shutdown (0.µF capacitors) Table a. MAX0E/MAX0E/MAXE/ MAXE Control Pin Configurations SHDN EN OPERATION STATUS X = Don't care. Normal Operation Normal Operation Tx All Active All Active *Active = active with reduced performance Rx All Active All High-Z X Shutdown All High-Z All High-Z Table b. MAXE Control Pin Configurations SHDN EN OPERATION STATUS Tx 0 0 Shutdown All High-Z 0 Shutdown All High-Z 0 Normal Operation Normal Operation All Active All Active, High-Z High-Z High-Z Active Rx High-Z Active* High-Z Active Maxim Integrated

12 R C MΩ R D 00Ω CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE I P 00% 0% Ir PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) HIGH- VOLTAGE DC SOURCE Cs 00pF STORAGE CAPACITOR DEVICE UNDER TEST AMPERES.% 0% 0 0 t RL TIME t DL CURRENT WAVEFORM Figure a. Human Body ESD Test Model Figure b. Human Body Model Current Waveform R C 0MΩ to 00MΩ CHARGE-CURRENT- LIMIT RESISTOR R D 0Ω DISCHARGE RESISTANCE I 00% 0% HIGH- VOLTAGE DC SOURCE Cs 0pF STORAGE CAPACITOR DEVICE UNDER TEST IPEAK 0% Figure a. IEC000-- ESD Test Model tr = 0.ns to ns 0ns t 0ns IEC000-- The IEC000-- standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX0E/MAX0E MAXE, MAXE/MAXE help you design equipment that meets level (the highest level) of IEC000--, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IEC000-- is higher peak current in IEC000--, because series resistance is lower in the IEC000-- model. Hence, the ESD withstand voltage measured to IEC000-- is generally lower than that measured using the Human Body Model. Figure b shows the current waveform for the kv IEC000-- level-four ESD contact-discharge test. Figure b. IEC000-- ESD Generator Current Waveform The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD tests all pins using a 00pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protection during manufacturing, not just RS- inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. Maxim Integrated

13 Applications Information Capacitor Selection The capacitor type used for C C is not critical for proper operation. The MAX0E, MAX0 MAX0E, MAXE, and MAXE require 0.µF capacitors, and the MAXE and MAXE require µf capacitors, although in all cases capacitors up to 0µF can be used without harm. Ceramic, aluminumelectrolytic, or tantalum capacitors are suggested for the µf capacitors, and ceramic dielectrics are suggested for the 0.µF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., x) nominal value. The capacitors effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on and. Use larger capacitors (up to 0µF) to reduce the output impedance at and. This can be useful when stealing power from or from. The MAX0E and MAX0E have internal charge-pump capacitors. Bypass to ground with at least 0.µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the chargepump capacitors (C C). and as Power Supplies A small amount of power can be drawn from and, although this will reduce both driver output swing and noise margins. Increasing the value of the charge-pump capacitors (up to 0µF) helps maintain performance when power is drawn from or. Driving Multiple Receivers Each transmitter is designed to drive a single receiver. Transmitters can be paralleled to drive multiple receivers. Driver Outputs when Exiting Shutdown The driver outputs display no ringing or undesirable transients as they come out of shutdown. High Data Rates These transceivers maintain the RS- ±.0V minimum driver output voltages at data rates of over 0kbps. For data rates above 0kbps, refer to the Transmitter Output Voltage vs. Load Capacitance graphs in the Typical Operating Characteristics. Communication at these high rates is easier if the capacitive loads on the transmitters are small; i.e., short cables are best. Table. Summary of EIA/TIA-E, V. Specifications PARAMETER CONDITIONS EIA/TIA-E, V. SPECIFICATIONS Driver Output Voltage 0 Level Level kω to kω load to +V kω to kω load -V to -V Driver Output Level, Max No load ±V Data Rate kω R L kω, C L 00pF Up to 0kbps Receiver Input Voltage 0 Level Level +V to +V -V to -V Receiver Input Level ±V Instantaneous Slew Rate, Max kω R L kω, C L 00pF 0V/µs Driver Output Short-Circuit Current, Max Transition Rate on Driver Output 00mA V. ms or % of the period EIA/TIA-E % of the period Driver Output Resistance -V < V OUT < +V 00Ω Maxim Integrated

14 Table. DB Cable Connections Commonly Used for EIA/TIA-E and V. Asynchronous Interfaces PIN CONNECTION Received Line Signal Detector (sometimes called Carrier Detect, DCD) Handshake from DCE Receive Data (RD) Data from DCE Transmit Data (TD) Data from DTE Data Terminal Ready Handshake from DTE Signal Ground Reference point for signals Data Set Ready (DSR) Handshake from DCE Request to Send (RTS) Handshake from DTE Clear to Send (CTS) Handshake from DCE Ring Indicator Handshake from DCE Pin Configurations and Typical Operating Circuits (continued) TOP VIEW INPUT 0.μF.V C+.V V C+ C- C- TO +0V VOLTAGE DOUBLER +0V TO -0V VOLTAGE INVERTER +0V -0V V C- C- MAX0E MAXE TOUT RIN ROUT TIN 0 TIN TIN T T TOUT TOUT RS- TOUT 0 TIN RIN ROUT ROUT R RIN DIP/SO/TSSOP ROUT R RIN RS- PIN NUMBERS ON TYPICAL OPERATING CIRCUIT REFER TO DIP/SO/TSSOP PACKAGE, NOT LCC. *.0μF CAPACITORS, MAXE ONLY. Maxim Integrated

15 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 0.μF INPUT TIN TIN ROUT RIN TOUT C+ () MAX0E C- () 0 DIP/SO PIN NUMBERS IN () ARE FOR SO PACKAGE. 0 0 TIN TIN ROUT ROUT T T R R ROUT RIN TOUT C- (C-) C- (C+) () (C-) DO NOT MAKE () CONNECTION TO C+ THESE PINS () C- (0) INTERNAL -0V POWER SUPPLY INTERNAL +0V () POWER SUPPLY TOUT TOUT RIN RIN C- C- () 0 () RS- RS- Maxim Integrated

16 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 0.μF INPUT TOUT TOUT TOUT TOUT RIN ROUT TIN MAX0E 0 RIN ROUT TIN SHDN EN TOUT RIN TIN TIN TIN TIN TIN T T T T T TOUT TOUT TOUT TOUT TOUT RS- TIN ROUT RIN 0 ROUT TIN TIN ROUT R RIN 0 DIP ROUT RIN ROUT ROUT R R RIN RIN RS- ROUT R RIN ROUT R RIN 0 EN SHDN Maxim Integrated

17 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 0.μF INPUT 0.μF.V TOUT TOUT TOUT RIN ROUT TIN TIN C+ 0 MAX0E 0 TOUT RIN ROUT SHDN EN TIN TIN ROUT RIN 0.μF.V 0.μF V 0 C+ TO +0V C- VOLTAGE DOUBLER +0V TO -0V C- VOLTAGE INVERTER TIN T TOUT TIN T TOUT TIN T TOUT TIN T TOUT 0.μF V RS- C- C- ROUT R RIN DIP/SO/SSOP ROUT R RIN RS- ROUT R RIN 0 EN SHDN Maxim Integrated

18 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 0.μF INPUT 0.μF.V 0.μF.V 0.μF V 0 C+ C- C- TO +0V VOLTAGE DOUBLER +0V TO -0V VOLTAGE INVERTER 0.μF V TOUT TOUT TOUT RIN ROUT TIN TIN C+ 0 MAX0E 0 TOUT RIN ROUT TIN TOUT TIN TIN ROUT RIN TIN TIN TIN TIN TIN T T T T T TOUT TOUT TOUT TOUT TOUT 0 RS- C- C- ROUT R RIN DIP/SO/SSOP ROUT R RIN RS- ROUT R RIN Maxim Integrated

19 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 0.μF INPUT 0.μF.V 0.μF.V 0.μF V 0 C+ TO +0V C- VOLTAGE DOUBLER +0V TO -0V C- VOLTAGE INVERTER 0.μF V TOUT TOUT RIN ROUT TIN ROUT RIN MAX0E 0 TOUT RIN ROUT TIN TOUT TIN TIN TIN TIN TIN Ω T T T TOUT TOUT TOUT RS- C+ 0 ROUT RIN TIN ROUT T R TOUT RIN 0 C- C- DIP/SO/SSOP ROUT ROUT R R RIN RIN RS- ROUT R RIN Maxim Integrated

20 Pin Configurations and Typical Operating Circuits (continued) TOP VIEW INPUT.V TOUT TOUT TOUT RIN ROUT TIN TIN ROUT RIN 0 MAXE MAXE MAXE 0 TOUT RIN ROUT SHDN (SHDN) EN (EN) RIN ROUT TIN TIN ROUT 0.μF.V V 0 C+ C- C- TIN TIN TIN TIN ROUT TO +0V VOLTAGE DOUBLER +0V TO -0V VOLTAGE INVERTER T T T T R TOUT TOUT TOUT TOUT RIN V RS- C+ RIN C- ROUT R RIN C- SO/SSOP ROUT R RIN RS- ROUT R RIN ROUT RIN R ( ) ARE FOR MAXE ONLY *.0μF CAPACITORS, MAXE ONLY EN (EN) SHDN (SHDN) 0 0 Maxim Integrated

21 Ordering Information (continued) PART TEMP RANGE PIN-PACKAGE MAX0ECUE 0 C to +0 C TSSOP MAX0ECWE 0 C to +0 C Wide SO MAX0EC/D 0 C to +0 C Dice* MAX0EEPE -0 C to + C Plastic DIP MAX0EESE -0 C to + C Narrow SO MAX0EEUE -0 C to + C TSSOP MAX0EEWE -0 C to + C Wide SO MAX0ECPP 0 C to +0 C 0 Plastic DIP MAX0ECWP 0 C to +0 C 0 SO MAX0EEPP -0 C to + C 0 Plastic DIP MAX0EEWP -0 C to + C 0 SO MAX0ECPG 0 C to +0 C Wide Plastic DIP MAX0EEPG -0 C to + C Wide Plastic DIP MAX0ECNG 0 C to +0 C Narrow Plastic DIP MAX0ECWG 0 C to +0 C SO MAX0ECAG 0 C to +0 C SSOP MAX0EENG -0 C to + C Narrow Plastic DIP MAX0EEWG -0 C to + C SO MAX0EEAG -0 C to + C SSOP MAX0ECNG 0 C to +0 C Narrow Plastic DIP MAX0ECWG 0 C to +0 C SO MAX0ECAG 0 C to +0 C SSOP MAX0EENG -0 C to + C Narrow Plastic DIP MAX0EEWG -0 C to + C SO MAX0EEAG -0 C to + C SSOP PART TEMP RANGE PIN-PACKAGE MAX0ECNG 0 C to +0 C Narrow Plastic DIP MAX0ECWG 0 C to +0 C SO MAX0ECAG 0 C to +0 C SSOP MAX0EENG -0 C to + C Narrow Plastic DIP MAX0EEWG -0 C to + C SO MAX0EEAG -0 C to + C SSOP MAXECWI 0 C to +0 C SO MAXECAI 0 C to +0 C SSOP MAXEEWI -0 C to + C SO MAXEEAI -0 C to + C SSOP MAXECWI 0 C to +0 C SO MAXECAI 0 C to +0 C SSOP MAXEEWI -0 C to + C SO MAXEEAI -0 C to + C SSOP MAXECPE 0 C to +0 C Plastic DIP MAXECSE 0 C to +0 C Narrow SO MAXECWE 0 C to +0 C Wide SO MAXEC/D 0 C to +0 C Dice* MAXEEPE -0 C to + C Plastic DIP MAXEESE -0 C to + C Narrow SO MAXEEWE -0 C to + C Wide SO MAXECWI 0 C to +0 C SO MAXECAI 0 C to +0 C SSOP MAXEEWI -0 C to + C SO MAXEEAI -0 C to + C SSOP *Dice are specified at TA = + C. Maxim Integrated

22 Chip Topographies MAX0E/MAXE MAXE/MAXE/MAXE C+ TOUT TOUT TOUT TOUT RIN C- ROUT SHDN (SHDN) C- TOUT RIN 0." (.mm) RIN ROUT TIN TIN ROUT RIN EN (EN) RIN ROUT TIN 0." (.0mm) ROUT TIN ROUT TIN RIN TOUT RIN 0.00" (.0mm) TIN ROUT C+ C- C- 0." (.mm) ( ) ARE FOR MAXE ONLY TRANSISTOR COUNT: SUBSTRATE CONNECTED TO TRANSISTOR COUNT: SUBSTRATE CONNECTED TO Chip Information MAX0E/MAX0E/MAX0E/MAX0E TRANSISTOR COUNT: SUBSTRATE CONNECTED TO Maxim Integrated

23 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to PDIPN.EPS Maxim Integrated

24 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to SSOP.EPS INCHES MILLIMETERS E H DIM A A B C D E e H L MIN MAX MIN MAX SEE VARIATIONS BSC 0. BSC D D D D D INCHES MIN MAX MILLIMETERS MIN MAX N L L 0L L L N A e D B A L C NOTES:. D&E DO NOT INCLUDE MOLD FLASH.. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED. MM (.00").. CONTROLLING DIMENSION: MILLIMETERS.. MEETS JEDEC MO0.. LEADS TO BE COPLANAR WITHIN 0.0 MM. TITLE: PACKAGE OUTLINE, SSOP,. MM APPROVAL DOCUMENT CONTROL NO. REV. -00 C Maxim Integrated

25 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to N E H INCHES MILLIMETERS DIM MIN MAX MIN MAX A A B C e E H L SOICW.EPS TOP VIEW D VARIATIONS: INCHES MILLIMETERS DIM MIN MAX MIN MAX N MS0 D AA D AB D AC D AD D AE A C e FRONT VIEW B A L SIDE VIEW 0 - TITLE: PACKAGE OUTLINE,.00" SOIC APPROVAL DOCUMENT CONTROL NO. REV. -00 B TSSOP.0mm.EPS Maxim Integrated

26 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 0 Rio Robles, San Jose, CA USA Maxim Integrated The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.