Pixeldetector Modules in Multi Chip Module - Deposited Technology

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1 Pixeldetector Modules in Multi Chip Module - Deposited Technology Tobias Flick (K.-H. Becks, P. Gerlach, Ch. Grah, P.Mättig) University of Wuppertal 8th Topical Seminar on Innovative Particle and Radiation Detectors Siena, October 2002 BUMP

2 Contents LHC and the ATLAS-Detector Pixel-Detector-Modules & MCM-D technology MCM-D Option: equal-sized-(bricked)-sensors First electrical measurements Equal-sized-bricked hybrids in testbeam Outlook

3 The Large Hadron Collider

4 The ATLAS Pixeldetector ~ 1.2 m

5 Concept of hybride pixels Different concepts: Will be used in ATLAS Pixel detector: FE Interconnect Sensor FE Bump Bonding: Connection between sensor and electronic Developed in context of ATLAS pixel-detector: FE FE Interconnect Sensor

6 40 m µ ATLAS Pixeldetector Module in MCM-D - Technology Temperature Sensor Module Controller Chip 16 Frontend Readout Chips 78,6 mm Sensor Connections to outer world 24,4 mm front end chip signal lines AVcc AVdd AGnd DVdd cont.: I/O-signal line DGnd inactive area 2 mm

7 MCM-D Process-Flow a) b) c) d) e) f) g) h)

8 Feed-through's BCB etched for visualisation µ

9 Module Prototypes

10 Status of development Module prototype built Worked fine Sensor survived Particle signals not worsened High quality intra-module connections Currently working on Process development (optimized powerbus realized ) Design using all opportunities: Using equal-sized-bricked sensors Serial powering of chips in the module Integrate resistors into the deposited layers (integrated resistors)

11 Covering the Gap (stand. solution) FE Interconnect Sensor FE Different sensor cell sizes Connect two sensor cells on the sensor (with the sensor s metallization) 600µm x 50µm 400µm x 50µm enlarged pixel / ganged pixel higher noise due to larger pixel size

12 MCM-D Option: Equal-Sized-Bricked Sensor The interconnect structure in between the sensor and the bump bonds allows adequate routing. FE FE Interconnect Sensor increases spatial resolution in z by factor 2, in case of double hits µm x 51.25µm

13 Equal-Sized-Bricked (2) First test-structures actual design of an equal-sized-bricked detector

14 Aug 02: First equal sized bricked single chip devices hybridised Sensor and Front-End of the ATLAS pixel project Prototype 2 Sensor (ESB design by T.Rohe, now PSI) Front End I1, first ATLAS Pixel Deep Submicron Prototype MCM-D, bumping and flip-chip processed at IZM, Berlin Overlap of routing-structures avoided

15 Threshold Measurement equal-sized-bricked Sensor

16 Measurements equal-sized-bricked (2) 278±45 e - 262±85 e - MCM-D equal-sized-bricked MCM-D standard sensor

17 Test beam: equal-sized-bricked 27. August 02: first testbeam

18 col vs row equal-sized-bricked (PG) First view on ESB Testbeam data col row

19 Predicted hit position center (bricked direction) yloc equal-sized-bricked (ZZG) 500 histo1 Entries Mean RMS entries/bin yloc

20 Pro s & Con s of the MCM-D Concept High quality signal distribution (not presented here) One assembly technology, compatible with Under bump metallization & flip chip High resistive silicon as substrate Soldering of SMDs Easy handling (no damageable wire-bonds) Option of routings between sensor- and electronic-cells ( equal-sized-bricked sensors) Yield of the interconnect production couples to sensor costs & needs No easy prototyping (wafer level process) no bricolage Long turn around time

21 Conclusions & Outlook The first devices using all benefits of the MCM-D technology were built. These equal-sized-bricked hybrid pixel detectors show very high and uniform performance. A more detailed analysis of the test beam data is in progress. More electrical measurements will be performed.

Studies on MCM D interconnections

Studies on MCM D interconnections Speaker: Peter Gerlach Department of Physics Bergische Universität Wuppertal D-42097 Wuppertal, GERMANY Authors: K.H.Becks, T.Flick, P.Gerlach, C.Grah, P.Mättig Department