(400 Volts Peak) COUPLER SCHEMATIC STANDARD THRU HOLE

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1 GlobalOptoisolator (00 Volts Peak) The MOC0, MOC02 and MOC0 devices consist of gallium arsenide infrared emitting diodes optically coupled to a monolithic silicon detector performing the function of a Zero Voltage Crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from Vac lines, such as solid state relays, industrial controls, motors, solenoids and consumer appliances, etc. Simplifies Logic Control of Vac Power Zero Voltage Crossing dv/dt of 2000 V/µs Typical, 000 V/µs Guaranteed To order devices that are tested and marked per VDE 088 requirements, the suffix V must be included at end of part number. VDE 088 is a test option. Recommended for /20 Vac(rms) Applications: Solenoid/Valve Controls Temperature Controls Lighting Controls E.M. Contactors Static Power Switches AC Motor Starters AC Motor Drives Solid State Relays MAXIMUM RATINGS (TA = 2 C unless otherwise noted) Rating Symbol Value Unit INFRARED EMITTING DIODE Reverse Voltage VR Volts Forward Current Continuous IF 0 ma Total Power TA = 2 C PD 20 mw Negligible Power in Output Driver Derate above 2 C. mw/ C OUTPUT DRIVER Off State Output Terminal Voltage VDRM 00 Volts Peak Repetitive Surge Current ITSM A (PW = 00 µs, 20 pps) Total Power TA = 2 C Derate above 2 C TOTAL DEVICE Isolation Surge Voltage() (Peak ac Voltage, 0 Hz, Second Duration) Total Power TA = 2 C Derate above 2 C PD 0.7 mw mw/ C VISO 700 Vac(pk) PD mw mw/ C Junction Temperature Range TJ 0 to +00 C Ambient Operating Temperature Range(2) TA 0 to +8 C Storage Temperature Range(2) Tstg 0 to +0 C Soldering Temperature (0 s) TL 20 C STANDARD THRU HOLE COUPLER SCHEMATIC 2 ZERO CROSSING CIRCUIT. ANODE 2. CATHODE. NC. MAIN TERMINAL. SUBSTRATE. DO NOT CONNECT. MAIN TERMINAL. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.. For this test, Pins and 2 are common, and Pins, and are common.

2 I MOC0, MOC02, MOC0 ELECTRICAL CHARACTERISTICS (TA = 2 C unless otherwise noted) INPUT LED Characteristic Symbol Min Typ Max Unit Reverse Leakage Current (VR = V) Forward Voltage (IF = 0 ma) IR µa VF.. Volts OUTPUT DETECTOR (IF = 0 unless otherwise noted) Leakage with LED Off, Either Direction (Rated VDRM () ) Peak On State Voltage, Either Direction (ITM = 00 ma Peak) IDRM 2 00 na VTM.8 Volts Critical Rate of Rise of Off State Voltage() dv/dt V/µs COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = V(2)) MOC0 MOC02 MOC0 Holding Current, Either Direction IH 20 µa Isolation Voltage (f = 0 Hz, t = sec) VISO 700 Vac(pk) ZERO CROSSING Inhibit Voltage (IF = Rated IFT, MT MT2 Voltage above which device will not trigger.) Leakage in Inhibited State (IF = Rated IFT, Rated VDRM, Off State) IFT 0 ma VIH 20 Volts IDRM2 00 µa. Test voltage must be applied within dv/dt rating. 2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between IFT 2. ( ma for MOC0, 0 ma for MOC02, ma for MOC0) and absolute max IF (0 ma).. This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load driving thyristor(s) only. TYPICAL ELECTRICAL CHARACTERISTICS TA = 2 C TM, ON-STATE CURRENT (ma) OUTPUT PULSE WIDTH 80 µs IF = 0 ma f = 0 Hz TA = 2 C NORMALIZED IFT NORMALIZED TO TA = 2 C VTM, ON STATE VOLTAGE (VOLTS) Figure. On State Characteristics Figure 2. Trigger Current versus Temperature

3 I 00 I MOC0, MOC02, MOC0. DRM, PEAK BLOCKING CURRENT (na) IF = DRM2, NORMALIZED IF = RATED IFT Figure. IDRM, Peak Blocking Current versus Temperature Figure. IDRM2, Leakage in Inhibit State versus Temperature IFT, NORMALIZED. NORMALIZED TO. TA = 2 C I FT, NORMALIZED LED TRIGGER CURRENT NORMALIZED TO: PWin 00 µs TA = 2 C PWin, LED TRIGGER PULSE WIDTH (µs) 00 Figure. Trigger Current versus Temperature Figure. LED Current Required to Trigger versus LED Pulse Width +00 Vdc PULSE INPUT MERCURY WETTED RELAY RTEST CTEST D.U.T. R = 0 kω X00 SCOPE PROBE. The mercury wetted relay provides a high speed repeated pulse to the D.U.T x scope probes are used, to allow high speeds and voltages.. The worst case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. RC is measured at this point and recorded. APPLIED VOLTAGE WAVEFORM 22 V Vmax = 00 V 0 VOLTS dv dt 0. V max RC 22 RC RC Figure 7. Static dv/dt Test Circuit

4 MOC0, MOC02, MOC0 VCC Rin 2 MOC0/ 02/ Ω LOAD HOT 20 Vac NEUTRAL * For highly inductive loads (power factor < 0.), change this value to 0 ohms. Typical circuit for use when hot line switching is required. In this circuit the hot side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, ma for the MOC0, 0 ma for the MOC02, or ma for the MOC0. The 9 ohm resistor and 0.0 µf capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load used. Figure 8. Hot Line Switching Application Circuit 20 Vac VCC Rin 2 MOC0/ 02/ 0 R D 0 Ω SCR SCR Suggested method of firing two, back to back SCR s, with a Motorola triac driver. Diodes can be N00; resistors, R and R2, are optional 0 ohms. NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. R2 D2 LOAD Figure 9. Inverse Parallel SCR Driver Circuit

5 MOC0, MOC02, MOC0 PACKAGE DIMENSIONS A B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, CONTROLLING DIMENSION: INCH.. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. T SEATING PLANE F PL E PL N C L K G M D PL 0. (0.00) M T A M B M J PL 0. (0.00) M T B M A M INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D E F G 0.00 BSC 2. BSC J K L 0.00 BSC 7.2 BSC M 0 0 N STYLE : PIN. ANODE 2. CATHODE. NC. MAIN TERMINAL. SUBSTRATE. MAIN TERMINAL THRU HOLE A B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, CONTROLLING DIMENSION: INCH. F PL E PL G H D PL C L K PL 0. (0.00) M T A M B M J T SEATING PLANE 0. (0.00) M T B M A M SURFACE MOUN T INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D E F G 0.00 BSC 2. BSC H J K L 0.20 BSC 8. BSC S *Consult factory for leadform option availability

6 MOC0, MOC02, MOC0 F PL T SEATING PLANE A B N C G K L J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, CONTROLLING DIMENSION: INCH.. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D E F G 0.00 BSC 2. BSC J K L N D PL E PL 0. (0.00) M T A M B M 0. LEAD SPACING

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