MC100EPT VНLVTTL/LVCMOS to LVPECL Translator
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1 3.3VНVTT/VCMOS to VPEC Translator The is a 10 Bit VTT/VCMOS to VPEC translator. Because VPEC (Positive EC) levels are used only +3.3 V and ground are required. The device has an OR ed enable input which can accept either VPEC (ENPEC) or TT/VCMOS inputs (ENTT). If the inputs are left open, they will default to the enable state. The device design has been optimized for low channel to channel skew 450 ps Typical Propagation Delay Maximum Frequency > 1.5 Gz Typical PEC Mode Operating Range: V CC = 3.0 V to 3.8 V with V EE = 0 V PNP VTT Inputs for Minimal oading Q Output Will Default IG with Inputs Open The Series Contains Temperature Compensation. Pb Free Packages are Available* QFP 32 FA SUFFI CASE 873A 32 A = Assembly ocation W = Wafer ot YY = Year WW = Work Week MARKING DIAGRAM* MC EPT622 AWYYWW 1 *For additional marking information, refer to Application Note AND2/D. Table 1. TRUT TABE ENPEC ENTT D Q ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. Semiconductor Components Industries, C, 5 April, 5 Rev. 3 1 Publication Order Number: /D
2 ENPEC Q0 Q1 Q2 Q3 Q4 ENTT D0 Q D1 Q1 D0 D Q5 Q6 D2 Q2 V EE D V CC Q7 D3 Q3 D3 D Q8 Q9 VCMOS/TT D4 Q4 VPEC D5 Q5 D6 Q6 D5 D6 D7 D8 D9 ENTT ENPEC V EE D7 Q7 Warning: All V CC,, and V EE pins must be externally connected to Power Supply to guarantee proper operation. Figure ead QFP Pinout (Top View) D8 D9 Q8 Q9 Figure 2. ogic Symbol Table 1. PIN DESCRIPTION Pin Function D0:9 Data Input (TT) Q0:9 Data Outputs (PEC) ENTT Enable Control (TT) ENPEC Enable Control (PEC) V CC, Positive Supply V EE Ground 2
3 Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection uman Body Model Machine Model Charged Device Model Value N/A N/A > 2 kv > 150 V > 2 kv Moisture Sensitivity, Indefinite Time Out of Drypack evel 2 Flammability Rating Oxygen Index: 28 to 34 U 94 V in Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC atchup Test 596 Devices Table 3. MAIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit V CC Power Supply V EE = 0 V 5 V V I Input Voltage V EE = 0 V V I V CC 5 to 0 V I out Output Current Continuous Surge T A Operating Temperature Range 40 to +85 C T stg Storage Temperature Range 65 to +150 C JA Thermal Resistance (Junction to Ambient) 0 lfpm lfpm 32 QFP 32 QFP JC Thermal Resistance (Junction to Case) Standard Board 32 QFP 12 to 17 C/W T sol Wave Solder <2 to C 265 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected ma ma C/W C/W Table 4. TT INPUT DC CARACTERISTICS V CC = 3.3 V, GND= 0.0 V, T A = 40 C to 85 C Symbol Characteristic Condition Min Typ Max Unit I I Input IG Current V IN = 2.7 V 25 A I I Input IG Current MA V IN = V CC A I I Input OW Current V IN = 0.5 V 0.6 ma V IK Input Clamp Voltage I IN = 18 ma V V I Input IG Voltage 2.0 V V I Input OW Voltage 0.8 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3
4 Table 5. PEC INPUT DC CARACTERISTICS V CC = 3.3 V, GND= 0.0 V, T A = 40 C to 85 C Symbol Characteristic Condition Min Typ Max Unit I I Input IG Current V IN = 2420 mv 150 A I I Input OW Current V IN = 1490 mv A V I Input IG Voltage mv V I Input OW Voltage mv NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. PEC OUTPUT DC CARACTERISTICS V CC = 3.3 V, GND = 0.0 V (Note 1) 40 C 25 C 85 C Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply Current ma V O Input igh Voltage (Note 2) mv V O Input ow Current (Note 2) mv NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with V CC. 2. All loading with 50 to V CC 2.0 V. Table 7. AC CARACTERISTICS V CC = 3.0 V to 3.8 V (Note 3) 40 C 25 C 85 C Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit f max Maximum Frequency (See Figure 3) Gz t P, Propagation Delay to Output (Figure 4, Note 4) t P D to Q ENPEC to Q ENTT to Q t JITTER Random Clock Jitter (RMS) (See Figure 3) ps ps t r / t f Output Rise/Fall Times (20% 80%) ps T SKEW Duty Cycle Skew (Note 5) D to Q ENPEC to Q ENTT to Q Channel 0 7 Channel ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Measured using a 2.4 V source, 50% duty cycle clock source. All loading with 50 to V CC 2.0 V V to 50% point of the output. 5. Duty cycle skew t P t P on the specific path. 4
5 OUTPUT AMPITUDE (mv) V CC = 3.3 V T A = 25 C V O (mv) V O (mv) RMS Jitter (ps) t P, t P (ps) FREQUENCY (Gz) Figure 3. Average Output Amplitude/Jitter (3.3 V, 25 C) t P t P ÉÉ RMS JITTER (ps) CANNE Figure 4. Average Propagation Delay (3.3 V, 25 C) Driver Device Q Q Z o = 50 Z o = 50 D D Receiver Device V TT V TT = V CC 2.0 V Figure 5. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D Termination of EC ogic Devices.) 5
6 ORDERING INFORMATION Device Package Shipping FA QFP Units / Tray FAG QFP 32 (Pb Free) 250 Units / Tray FAR2 QFP 32 2 / Tape & Reel FAR2G QFP 32 (Pb Free) 2 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D EC Clock Distribution Techniques AN1406/D Designing with PEC (EC at +5.0 V) AN1503/D ECinPS I/O SPiCE Modeling Kit AN1504/D Metastability and the ECinPS Family AN1568/D Interfacing Between VDS and EC AN1642/D The EC Translator Guide AND1/D Odd Number Counters Design AND2/D Marking and Date Codes AND8020/D Termination of EC ogic Devices AND8066/D Interfacing with ECinPS AND8090/D AC Characteristics of EC Devices 6
7 PACKAGE DIMENSIONS QFP FA SUFFI 32 EAD PASTIC PACKAGE CASE 873A 02 ISSUE A T 1 A1 32 A (0.008) AB T U Z U T, U, Z B B1 8 DETAI Y 17 V1 V P AE AE 9 SEATING PANE C AB AC E 9 Z S1 S G 0.10 (0.004) AC 8 M R W K DETAI AD 4 Q 0.20 (0.008) AC T U Z DETAI AD GAUGE PANE (0.010) F BASE META N ÉÉ ÉÉ J D 0.20 (0.008) M AC T U Z SECTION AE AE DETAI Y NOTES: 1. DIMENSIONING AND TOERANCING PER ANSI Y14.5M, CONTROING DIMENSION: MIIMETER. 3. DATUM PANE AB IS OCATED AT BOTTOM OF EAD AND IS COINCIDENT WIT TE EAD WERE TE EAD EITS TE PASTIC BODY AT TE BOTTOM OF TE PARTING INE. 4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM PANE AB. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PANE AC. 6. DIMENSIONS A AND B DO NOT INCUDE MOD PROTRUSION. AOWABE PROTRUSION IS (0.010) PER SIDE. DIMENSIONS A AND B DO INCUDE MOD MISMATC AND ARE DETERMINED AT DATUM PANE AB. 7. DIMENSION D DOES NOT INCUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SA NOT CAUSE TE D DIMENSION TO ECEED (0.020). 8. MINIMUM SODER PATE TICKNESS SA BE (0.0003). 9. EACT SAPE OF EAC CORNER MAY VARY FROM DEPICTION. MIIMETERS INCES DIM MIN MA MIN MA A BSC BSC A1 3. BSC BSC B BSC BSC B1 3. BSC BSC C D E F G 0. BSC BSC J K M 12 REF 12 REF N P BSC BSC Q R S BSC BSC S1 4. BSC BSC V BSC BSC V1 4. BSC BSC W 0. REF REF REF REF 7
8 ECinPS is a trademark of Semiconductor Components INdustries, C (SCIC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center Kamimeguro, Meguro ku, Tokyo, Japan Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative. /D
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