Topics and Abstracts: MEMs and Sensors Forum (Chairperson)

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Barbara Garrett
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1 (Chairperson) Session Chair Ms. Bettina WEISS SEMI (Global Headquarters), USA Vice President, Business Development and Product Management As Vice President of Business Development and Product Management, Bettina Weiss supports the diverse product needs of association members, as well as assesses strategic emerging opportunities for member company engagement in the extended global manufacturing supply chain. Weiss joined SEMI in 1996 and held a variety of positions in SEMI s International Standards department, including department lead, until From 2008 to 2012 she had global responsibility for SEMI's Photovoltaic/Solar Business Unit which then expanded into a broader business development role including the integration of SEMI Strategic Association Partners FlexTech and MEMS & Sensors Industry Group. In addition, since 2017, Weiss has been responsible for developing strategy and global implementation plans of SEMI s Smart Transportation vertical platform, with its current emphasis on the automotive electronics supply chain. Prior to joining SEMI, Weiss worked in sales and marketing positions at Metron Semiconductor and Varian Semiconductor in Munich, Germany. She holds a BA from the International School for Applied Languages in Munich, Germany, and is a certified translator for Anglo-American Law and Economics.

2 (09:05-09:20hrs) Mrs. LE Bich Loan Saigon Hi-Tech Park (SHTP), Vietnam Vice President MEMS Industry in Vietnam: A Proposal for Collaborations Ho Chi Minh city (Saigon) Vietnam, one of the largest Asian metropolitans located at the junction from the East to the West, from the North Asia to Australia. Ho Chi Minh City has been turning itself into the gateway for the semiconductor products to the US market from the Southeast Asia region. Since 1917, the MEMS/SENSORS FORUM Ho Chi Minh City has been operating to promote an international ecosystem in MEMS/SENSORS in Vietnam, to explore potential capabilities of the local resources: talented human resource, governmental development policy, facilities, educational exchange programs, and business opportunities. We are gathering and calling for investments and collaborations in R&D, training, technology transfer and manufacturing for MEMS industry in Saigon Hi-Tech Park, Ho Chi Minh City Vietnam where we have created an innovative ecosystem to welcome investors and start-ups from the Asia to Saigon Hi-Tech Park. Welcome to the MEMS/SENSORS FORUM Ho Chi Minh City on September 28th 2018 for further business exchange and grow-ups Mrs. Le Bich Loan has been the current Vice president of the Board of Management of Saigon Hi-tech Park, in charge of Investment promotion and Enterprise Support since June She is Senior officer, holding a duty as a Chairwoman of Hi-tech Enterprise Association, Vice president of HCMC Export Processing Zone Authority of Business Association (HBA) as well the member of Executive Board of HCMC Computing Association (HCA). Mrs. Loan held a Master degree in Business Law from the National University of Kishinev, Republic of Moldova. She is now being a PhD candidate at Ho Chi Minh City University of Economy and Law, Vietnam.

3 (09:20-09:45hrs) Dr. Raj KUMAR Infineon Technologies (Kulim) Sdn Bhd, Malaysia Senior Director & Head of Technology D SOUND: Silicon Microphone Technology for Superior Audio Quality This presentation briefly reviews various Silicon/MEMS based microphone technologies and presents overview of Infineon s DSOUND technology and its key features, including details of various applications, products and their performance. Presentation also outlines the key challenges of the developing and manufacturing sensors based on MEMS technology. Dr. Raj Kumar is a semiconductor industry executive with broad Technical and Functional experience covering MEMS, Power Discrete, Smart Power, CMOS, Bipolar, BCD, BiCMOS and Embedded Flash technologies. Raj joined Infineon Technologies in 2005 and has played a key role in start-up, ramp and growth of the IFKM fab under various capacities. He is currently heading technology department and responsible for various functions including Process Integration, Product Engineering, Unit Process Development, Technology Development, Transfers and Conversion Management, Frontend-Backend Integration. Before joining Infineon, Raj worked with the semiconductor industry in India and led establishing a MEMS fab. Raj has numerous publications in the journals of international repute and is a Senior Member of IEEE and life member of Indian Vacuum Society. Raj holds a doctoral degree in Semiconductor Technology and a Master degree in Electronic Science with majors in Device Physics and Microelectronics.

4 (09:45-10:10hrs) Dr. Rakesh KUMAR GLOBALFOUNDRIES Singapore Pte Ltd, Singapore Senior Director, MEMS Technology Development Challenges in Development and Use of Process Design Kits for the MEMS Device Fabrication One of the major challenges in MEMS device fabrication is the lack of design enablement tools due to diversity of MEMS products and need for developing unique fabrication processes for their manufacturing. In contrast, IC foundries over the year have developed a very comprehensive suite of design enablement tools that can be offered to customers to design and manufacture a large range of products. This has mainly been responsible for the success of IC foundry model. Process design kit (PDK) is one such tool that helps IC designers to design circuits for variety of applications without knowing details of fabrication processes. A well characterized suite of device libraries, design rules, technology files and simulation models helps designers to seamlessly integrate their designs for fabrication in a foundry process. MEMS foundries, however, are far behind the IC foundries in offering a PDK for the MEMS devices fabrication. At GLOBALFOUNDRIES, our efforts have been to bring in a high degree of standardization into MEMS devices manufacturing by building common process modules, developing standard process flows and to provide MEMS PDK to our customers in a manner similar to IC fabrication. The MEMS PDK creates an interface between the foundry processes and the MEMS modeling and simulation tools. It consists of compact models higher-order finite element models or Verilog-A models, a design rule check (DRC) tool, standard cells (S-cells), parametric cells (P-cells) of reference devices, technology files corresponding to the MEMS and the CMOS processes, and reference designs with models vs. hardware correlations. We propose to use our MEMS PDK as an enablement tool to realize a single process platform for manufacturing of multiple products. There are still challenges as a MEMS PDK use is still limited to a family of products used for a specific application area. In-spite of this limitation, it is still a very useful tool that significantly increases chances of first time success of MEMS designs thus reducing costs and shortening time-to-market for our customers.

5 Rakesh Kumar is senior director of MEMS program at GLOBALFOUNDRIES, Singapore. He has over 29 years of experience in the development of semiconductor process technologies for CMOS, MEMS and Silicon based opto-electronics devices. Prior to joining GLOBALFOUNDRIES, he was deputy director of Semiconductor Process Technology Lab at A*STAR Institute of Microelectronics, Singapore where he was responsible for MEMS technology development and transfer to industry. His areas of expertise include copper/low-k interconnects and 3D wafer level packaging. He has authored and coauthored more than 90 research publications in journals and conferences. Rakesh Kumar received his B.S. (Hons), and Ph.D. degrees in electrical engineering from Punjab Engineering College, India, and Nanyang Technological University, Singapore, respectively.

6 (10:10-10:35hrs) Dr. David HAYNES Lam Research Corporation, USA Senior Director, CSBG Strategic Marketing Meeting the Demand for Automotive Chips Through Technical Innovation and Enhanced Fab Productivity The automotive segment is predicted to be one of the fastest growing electronic system markets through This is good news for automotive chipmakers and for the semiconductor capital equipment suppliers that continue to support them to add capacity in order to meet this demand. What is also interesting is the diversity of the applications that are driving this increased demand and the broad spectrum of devices needed to satisfy the technical requirements in this growing automotive sector. These include sensors such as MEMS devices, RADAR and ultrasonic sensors, optical and infrared image sensors, and LIDAR and chips to support vehicle connectivity and increasingly advanced infomatics and navigation systems. Furthermore, in electric and hybrid electric vehicles, there is an additional demand for advanced power modules and discrete devices to address applications from power management to rapid battery charging. And these more complex electronic systems are no longer limited to higher-end cars but are entering a range of vehicles with a significantly lower price point. This in turn is underpinning the increased demand; even for established devices such as inertial and pressure sensors, analogue ICs, and MCUs. Many of these devices can be readily fabricated by 200 mm fabs or 300 mm fabs that are running processes at technology nodes 28 nm. With established automotive-certified reliability, these fabs are well-positioned to capitalize on the growing demand. In this presentation, we provide an overview of how Lam Research is supporting these customers by offering a range of advanced productivity upgrades and solutions that enhance the capability of customer s fabs while also continuing to offer both new and refurbished 200 mm and 300 mm process equipment that allow them to add additional capacity and process capability. We also review why there is a considerable investment in new technologies aimed at delivering improved performance of automotive electronics, and as an example, we discuss the emergence of wideband gap semiconductors including SiC MOSFET and GaN High Electron Mobility Transistors (HEMT) devices in automotive applications.

David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.

7 David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications. In his professional career, David has accrued more than 20 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors with STS, SPTS and Oxford Instruments. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies. Building on this technical knowledge, David has a proven track record in developing strategic business partnerships; specialising in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide. David Joined Lam Research in June 2016 and is currently Senior Director, Strategic Marketing in the Customer Support Business Group.

8 (10:55-11:20hrs) Dr. Chinghan HUANG ASE Group, Taiwan Senior Manager Packaging Solutions for Sensors in this Smart Age TBA TBA

9 (11:20-11:45hrs) Mr. Venkatesh MADHAVEN Silterra Malaysia Sdn Bhd, Malaysia Director of Technology Development Truly Monolithic "MEMS on CMOS" Devices for Timing and Sensing Applications Micro Electro Mechanical Systems (MEMS) generally refers to electronic devices with miniaturized moving elements. The moving elements could be physical structures,microwave/sound/radio frequency waves, fluids or photons. The conceptual origin of these devices date back to 1950 s, however only in the last three decades MEMS technologies witnessed enormous growth due to its compactness and yet superior performance, compared to the bulky electromechanical components. MEMS devices can be spotted in various application domains like Military, Space, Automotive, Commercial, Medical, Life Science, Optical, Wireless communication etc.. Today each human being is surrounded by an average of 25 MEMS sensor devices and this number is expected to grow due to the initiatives in the development of SMART cities & Internet of Things (IoT). In this talk we shall introduce MEMS device working principle, fundamental classifications based on applications and market perspective. The talk will also focus on the emerging MEMS sensors for IoT applications, and the challenges imposed by the sensor industries to include multitude functionality within a single device and yet not to compromise on power consumption, form factor and cost of the devices. This presentation will highlight the device manufacturing challenges and SilTerra s initiative in standardizing the manufacturing methods for MEMS sensors on CMOS platform. Venkatesh is currently working as Director of Technology Development at Silterra Malaysia. He has over 23 years of experience in the semiconductor and hard disk media industry. Venkatesh leads the MEMS & Sensors development in Silterra that includes Optical MEMS (Micromirrors/Bolomoters), RFMEMS (Surface Acoustic Wave/Bulk Acoustic Wave), pmut & Sensors. He has also led the development team for deep trench Discrete Power Devices. Venkatesh received his bachelor s degree in engineering from University Teknologi Malaysia. He has co-authored papers in peer reviewed journals and has obtained 2 patents. Venkatesh maintains a keen interest in Display Imaging and is a certified display calibrator with Imaging Science Foundation (ISF) and is a THX Certified Professional in Display Calibration.

10 (11:45-12:10hrs) Mr. Nigel BEDDOE Xcerra Corporation, Malaysia Global Business Development Director, Handler Group Gas and Humidity Sensors Today and the Challenges of Accurately Testing in High Parallelism TBA Nigel Beddoe is the Global Business Development Director for Xcerra s Handler Group. After graduating from the University of Wales in Electrical and Electronic Engineering, Nigel Beddoe has been in the Semiconductor Final Test environment since In his positions at previous companies such as Inmos (UK) and STMicroelectronics (Malaysia,), he gained experience using a variety of semiconductor test solutions for the complete testing process flow through to finishing. Since 2000, Nigel Beddoe has been with Multitest, an Xcerra company, as a provider of semiconductor test cell solutions. He has been in the business development role for the past four years with most of his time developing the fast growing Asian MEMS markets with fully integrated test cell solutions.

11 (13:10-13:35hrs) Mr. Jochen KREHL SICK AG, Germany Head of Industry Cluster Electronics & Solar Industry 4.0 Transformation with Disruptive and Intelligent Sensors Solutions Networked production and control processes in complex machine environments will determine the future in Industry 4.0. SICK, however, is already laying the foundation for dynamic, real-time-optimized, and selforganized industry processes today. As providers of data, sensors are essential for Smart Factories. And as sensor experts, SICK AG understands the responsibility they bear. That is why the company has been committed to its tagline of Sensor Intelligence. since In his presentation Jochen Krehl is displaying SICKs Industry 4.0 transformation with disruptive and intelligent sensors solutions in the electronic environment. Jochen Krehl, Head of Electronics & Solar in Global Industry Centre Factory Automation at SICK AG. With his team, he is taking care of the industry segment "Electronics & Solar" at SICK. This includes the development of market strategies for the electronics industry as well as the support of major international customers focusing on semiconductor backend industry, production of consumer electronics, home appliance, solar and battery production. Prior to joining SICK, Jochen Krehl spent several years with Festo AG (another major international manufacturer of automation solutions) in the display and solar industry team and key account management in China.

12 (13:35-14:00hrs) Mr. Manoharan GURUSAMY Amkor Technology Singapore Holding Pte Ltd, Singapore Technical Program Manager Growing IoT From Sensor to SiP MEMS, 3D Sensing and SiP This presentation covers the building blocks of Internet of Things, Evolution of MEMS and Sensor packaging, MEMS and Sensor Integration and packaging solutions for the Internet of Things. Gurusamy Manoharan joined Amkor in 2014 and serving as Technical Program Manager, manages New Product Introductions for customers with Amkor factory teams. Prior to joining Amkor, Gurusamy Manoharan was managing Wirebond and Inline system projects in ASM Technology Singapore. Gurusamy Manoharan holds a B.E. Electronics & Instrumentation Engineering from University of Madras, India and M.Sc. Electrical Engineering major in Microelectronics from National University of Singapore. He also obtained PMP certification from Project Management Institute.

13 (14:00-14:25hrs) Mr. Elia GIUSTI Mircrotest, Italy Sales Engineer Manager High Performance MEMS Microphone Testing Methodology The increasing market requirements make even more challenging the testing methodology for the MEMS microphone. The aim of this work is to explain how to test high performance devices with a high productivity industrial solution. MEMS microphones target all audio applications where small size, high sound quality, reliability and affordability are key requirements. At the time of the first mems microphone typical SNR values were around 60 db(a) and it was enough to use a single speaker even for multisite parallel testing solutions. A single acoustic chamber with a single speaker was capable to generate the target SPL without any feedback on the applied sound pressure for any of the devices under test. Today, Microtest has developed an innovative solution. Instead of a single speaker without feedback we designed a system with many singularized acoustic chambers. Each chamber contains both the Device Under Test and a reference device. Each reference device can be changed accordingly with the DUT, allowing the maximum flexibility and precision thanks to the feedback loop provided by the fact that we have a reference device for every DUT. Another key feature is the total modularity of the system. It can range from prototype applications to high parallelism applications. We provide a tester that can be fully integrated with handlers on the market. We also provide a complete test solution (tester+ handler) designed with our partner in charge of the handler part. Thanks to these innovations the key performances of our system are: High parallelism High Sound Pressure Level Low THD Capability to measure high SNR mics

Elia Giusti is Sales Engineer Manager in Microtest s.r.l. (Altopascio, Lucca, Italy), high tech company which develops and manufactures ATEs; other key business are HW&SW development and Semiconductor test & design solutions.

14 Elia Giusti is Sales Engineer Manager in Microtest s.r.l. (Altopascio, Lucca, Italy), high tech company which develops and manufactures ATEs; other key business are HW&SW development and Semiconductor test & design solutions. He graduated in 2012 in one of the leading Italian universities, the university of Pisa, in electronic engineering. He has 5 years of working experience in semiconductor testing. He started his career as a test engineer and later has moved to sales department. Currently he is heading the sales force of Microtest, selling innovative solutions worldwide. Elia believes that people are the most valuable asset and empower his junior sales engineers to improve each day in order to achieve the excellence. In his free time Elia enjoy riding his mountain bike and go skiing. To Elia the key of the success passes through the creation of a friendly but still empowering environment.

15 (14:25-14:50hrs) Dr. Heinrich STEGER Polytec GmbH, Germany Manager, Strategic Product Marketing Dynamic Characterization of MEMS Devices Using Advanced Optical Measurement Techniques The mechanical performance of a MEMS device has to be carefully characterized during the development process. This presentation will provide a comprehensive overview of the current optical measurement techniques available to measure dynamic response of microstructures. These techniques include: strobe video microscopy, white light interferometry, digital holographic microscopy, and laser Doppler vibrometry. The new Polytec Micro System Analyzer provides a complete combination of measurement techniques for full 3D dynamic characterization of MEMS. This includes laser Doppler vibrometry (LDV), a technology widely used by for MEMS research. Example measurements using LDV will be presented that show dynamic response measurements on MEMS micro mirror arrays, RF devices at the wafer level, inertial sensors, ultrasonic transducers, and SAW devices. Other recent developments in technology extend the usage to 3-axis response (motion along X, Y, and Z axes) and frequency bandwidth to 2.4 GHz. In addition to discussing application examples, the presentation will also provide an update on the latest tool developments for MEMS device optical dynamic characterization techniques, as well as emerging use cases and the latest performance requirements. Heinrich Steger studied Physics at Bonn University and Applied Science at Sheffield Hallam University he received a Diploma in Physics from Bonn University and in 1994 he received a PhD from Freiburg University. After different positions in the IT industry he joined Polytec GmbH in 2003 as Product Manager in the Business Unit Laser Measurement Systems. Since 2006 he is Manager Strategic Product Marketing in the Business Unit Optical Measurement Systems at Polytec. His special interest is the development and application of optical instrumentation for the characterization of the mechanical properties of MEMS as frequency response, modal analysis and surface topography.

Topics and Abstracts: MEMs and Sensors Forum (09:05-09:20hrs)

Topics and Abstracts: MEMs and Sensors Forum (09:05-09:20hrs) (09:05-09:20hrs) Mrs. LE Bich Loan Saigon Hi-Tech Park (SHTP), Vietnam Vice President MEMS Industry in Vietnam: A Proposal for Collaborations Ho Chi Minh city (Saigon) Vietnam, one of the largest Asian